1. ROBERTO R. REYES
North Brunswick, NJ 08902 732.690.0487
www.linkedin.com/in/roberto-reyes-53706a30 rreyes2157@hotmail.com
PROCESS ENGINEER
SEMICONDUCTOR PROCESSING AND FABRICATION OF III-V SUBSTRATES
Experienced in development and fabrication processing of 2” and 3” InP wafers for Telecom, intelligence,
surveillance and reconnaissance (ISR) and sensor devices in cleanroom environment. Known for working
effectively with processing and research teams in process integration and in running experiments based
on existing parameters and tool set. Develop new recipe from experimental parameters to be integrated
in existing process procedures, making recommendations for process improvements and
implementations. Train and support new team members. Troubleshoot and resolve problems with process
team and engineers.
PROFESSIONAL EXPERIENCE
UNITED TECHNOLOGIES CORPORA TION AEROSPACE SYSTEM, Princeton, NJ 2013 – 2015
Senior Process Technician
Processed 3” InP wafer devices used for SWIR (short wave infrared) cameras mounted on UAV
unmanned aerial vehicle (UAV), manned aerial vehicle (MAV) and handheld cameras to improve images
and Focal Point Array used in Thermal Imaging. Worked in InP wafer processing production lab. Worked
extensively with 3”InP, including metal deposition, mounting wafers on glass pucks, performing lapping
and CMP (chemical-mechanical polishing), selective wet etch / dry etch, contact alignment
photolithography, metal lift off, and solvent cleaning.
 Recorded and logged process procedures accurately by using Microsoft Access database and PMEMS
datasheets.
 Ensured that dark current parameters were achieved by measuring electrical (dark current) test on
Post diffusion wafers after EPI growth.
UNIVERSAL DISPLAY CORP., Ewing, NJ 2012 – 2013
Research Technician
Worked in Organic Light Emitting Device (OLED) lab. Performed deposition of organic and metal materials
on treated glass substrates using Tokki Evaporators. Maintained vacuum deposition equipment including
vacuum pumps, vacuum deposition chambers and other associated supporting equipment. Interfaced
with other team members scheduling fabrication runs.
 Assured consistency while running process recipe by programming fabrication recipes through PC
interface and custom software.
 Guaranteed proper stack thickness by monitoring deposition processes with manual intervention when
necessary.
 Enabled comparison between recipes by recording and logging fabrication procedures using Microsoft
Access database and hardcopy datasheets.
MULTIPLEX INC., South Plainfield, NJ 2011 – 2012
Process Engineer
Worked in EML (Electro-absorption modulated laser) Wafer Fabrication Department, processing 2” InP
wafers for Telecommunication applications. Performed metal deposition (Au, Pt, AuBe, Ge and Ti) on InP
and InGaAs wafers, metal lift off and wafer inspection. Performed CMP (chemical-mechanical polishing)
on InP wafers. Handled equipment troubleshooting problems.
 Ensured that adequate inventory was on hand by monitoring consumption of metal and gas usage.

2. ALCATEL-LUCENT TECHNOLOGIES BELL LABS, Murray Hill, NJ 2000 – 2011
Member of the Technical Staff I
Worked in High Speed Electronics and Optoelectronics Research Department. Performed qualifications of
newly installed capital equipment such as 6-pocket CHA evaporators, Ebara High Vacuum pumps, Unaxis
RIE Etchers and CVD Systems. Installed gas lines MFCs for etching experiments, process fabrication,
development and improvement. Performed qualifications of newly installed equipment’s e-beam metal
evaporators and sputtering tool on III-V substrates. Performed dry etch on III-V substrates on ICP-RIE
and Dielectric etchers as well as selective wet etch on InGaAs and InP wafers. Performed SiO2, nitride
deposition (thin-film deposition) on III-V substrates.
 Developed new recipes by aiding with process integration and assisting other engineers in running
experiments on InP HBTs and OEICs.
 Improved circuit yields as well as developed new technologies in line with business unit and customer
needs by performing experiments and process improvements.
 Met customer demand and within scope of ISO standards by adhering to ISO and Statistical Process
Control (SPC) for technology transfer.
 Achieved High Performance and High Uniformity InP HBT Technology in support of company SBU by
processing 3” InP wafers for high-speed optical telecommunication systems.
 Facilitated process technology that cooperated at static frequency of 150GHz by developing DARPA
TFAST project, 0.25um InP DHBT.
 Ensured wafer devices were within specifications of set parameters by performing metal lift off, solvent
cleaning and wafer level inspection.
 Calibrated, improved and initiated process recipe for multiple metal stacks for deposition of Ti, Au, Pt,
Pd, Au-Be (1%), Cr, NiCr, and W film, ensuring proper metal thickness was obtained using CHA and Airco
evaporators.
 Minimized downtime by performing maintenance and installation of vacuum pumps, chillers, heat
exchangers, dry etchers, evaporators and chemical hoods.
 Improved device performance by setting up and performing electrochemistry (metal plating)
experiments and processes on existing procedure on III-V substrates.
ADDITIONAL EXPERIENCE
LUCENT TECHNOLOGIES BELL LABS, Murray Hill, NJ
Technician / SEDM (Senior Electron Device Mechanic)
ANADIGICS INC., Warren, NJ
Wafer Fabrication Operator
AT&T BELL LABS, Murray Hill, NJ
SEDM
TECHNICAL SKILLS
Languages: English and Tagalog
Applications: Microsoft Office
Databases: Microsoft Access
Specialized Equipment & Tools: CHA and Temescal eBeam Evaporators; Uniaxis ICP RIE and
Dielectric Etchers; Karl Suuss MJB3 Aligners;Sputtering Tool;
Alessi Prober RIE, Dielectric etchers
EDUCATION
Bachelor of Science in Chemical Engineering
New Jersey Institute of Technology (NJIT), Newark, NJ