Paul Ahern
4 SlideShares 6 Followers 2 Folgens
Personal Information
Unternehmen/Arbeitsplatz
Ireland Ireland
Beruf
Senior Staff Engineer at Invention Investment Ireland
Branche
Venture Capital / Private Equity
Webseite
ie.linkedin.com/in/paulahern1/
Info
I am a material scientist & reliability engineer with 15 years’ engagement with blue-chip global multinationals in the areas of research & development, semiconductors manufacturing, telecommunications reliability and laboratory start-up, management and analysis. Semiconductor Physics & Processing: - 200mm & 300mm VLSI/ULSI wafer processing & integration. - Strained Si, high & low K dielectrics, copper processing and barrier layer chemistry. - Fab microcontamination root cause, detection & containment. - Primavera 5/6, Fab Install & Qualification, Project management. Telecommunications Reliability: - Design for Reliability (DfR) - Telcordia/IPC/JEDEC/MIL-STD standard testing requirements.
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resonator inertial sensor thin films mems gyroscope piezoelectricity accelerometer microfabrication ultrasonic actuators silicon sensors
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Dokumente

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Paul Ahern - Copper/ low-K Interconnect Technology

Vor 10 Jahren • 2661 Aufrufe

Paul Ahern - Time of Flight Secondary Ion Mass Spectroscopy [ToF-SIMS] theory & practice

Vor 10 Jahren • 2002 Aufrufe

Paul Ahern - Overview of Micro & Nano Transducers

Vor 10 Jahren • 1671 Aufrufe

Paul Ahern - Piezoelectric Energy Harvesting Review

Vor 10 Jahren • 6890 Aufrufe

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(5)
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Intel 14nm aug11

lopatto • Vor 9 Jahren

Transducers

popet • Vor 12 Jahren

Advances in Characterization Of nanomaterials

tabirsir • Vor 13 Jahren

Characterization of bionanomaterials

tabirsir • Vor 13 Jahren

Surface and Materials Analysis Techniques

Robert Cormia • Vor 12 Jahren
Personal Information
Unternehmen/Arbeitsplatz
Ireland Ireland
Beruf
Senior Staff Engineer at Invention Investment Ireland
Branche
Venture Capital / Private Equity
Webseite
ie.linkedin.com/in/paulahern1/
Info
I am a material scientist & reliability engineer with 15 years’ engagement with blue-chip global multinationals in the areas of research & development, semiconductors manufacturing, telecommunications reliability and laboratory start-up, management and analysis. Semiconductor Physics & Processing: - 200mm & 300mm VLSI/ULSI wafer processing & integration. - Strained Si, high & low K dielectrics, copper processing and barrier layer chemistry. - Fab microcontamination root cause, detection & containment. - Primavera 5/6, Fab Install & Qualification, Project management. Telecommunications Reliability: - Design for Reliability (DfR) - Telcordia/IPC/JEDEC/MIL-STD standard testing requirements.
Tags
resonator inertial sensor thin films mems gyroscope piezoelectricity accelerometer microfabrication ultrasonic actuators silicon sensors
Mehr anzeigen