How To Participate

1. Consume. Collaborate. Contribute.Consume. Collaborate. Contribute.
ODSA: Business Workstream
ODSA Project Workshop
March 28, 2019

2. Consume. Collaborate. Contribute.
ODSA: A New Server Subgroup (Incubation)
• Extending Moore’s Law
• Domain-Specific Accelerators: Programmable ASICs to accelerate high-
intensity workloads (e.g. Tensorflow, Network Flow Processor, Antminer…)
• Chiplets: Build complex ASICs from multiple die, instead of as monolithic
devices, to reduce development time/costs and manufacturing costs.
• Open Domain-Specific Architecture: An architecture to build accelerators
• Today: All multi-chiplet products are based on proprietary interfaces
• Tomorrow: Select best-of-breed chiplets from multiple vendors
• Incubating a new group, to define a new open interface, build a PoC

3. Consume. Collaborate. Contribute.
How to Participate
Please Help! : Join a Workstream
Join Interface/Standards:
(Mark Kuemerle/Aaron Sullivan)
Develop
Packaging +
Socket, Dev Board
Provide FPGA IP
Provide
ODSA
chiplets
Provide PHY
technology
Join the PoC, Build fast:
(Quinn Jacobson/Jawad Nasrullah)
Join Business, IP and workflow:
(Sam Fuller/Jeff McGuire)
Develop software Define test and
assembly workflow
Provide Chiplet IP
Workstream contact information at the ODSA wiki
Define
Architectural
Interface

4. Consume. Collaborate. Contribute.
Possible inputs & outputs
new or evolved entities
Intellectual property
VC Capital Investment
Resources (secondment)
Product Requirements
Standards contribution
Chiplets
End product Chips
Design Services
Open Standards
Support
Qualification
Annual Membership fee(s)

5. Consume. Collaborate. Contribute.
“entity” spectrum..
Existing
Company;
Traditional
Model(s)
Test Lab
e.g.
UNH-IOL
Trade
Organization
e.g. JEDEC
Functional
Alliance /
Advocacy
Group e.g.
SEMI
Silicon
Aggregator
e.g. Open-
Silicon
Co-development /
Strategic alliance
e.g. Micro/Intel,
HP/Intel
New
Company

6. Consume. Collaborate. Contribute.
Some comparisons – Red Hat
Q. How could a company’s
market cap grow to $34Bn
while giving away free software
?
A. Per form 10Q (2000)
1. Subscription revenue (sw sales,
tools, support, maintenance)
2. Services revenue (open source
consultancy, NRE development
fees, training)

7. Consume. Collaborate. Contribute.
Some comparisons – The Open Compute Project (OCP)
OCP is a 501(c) non-profit
organization, founded in
2011
Q. Besides the core team
members (e.g. Microsoft,
Facebook), is there
measurable benefit to the
industry?
A. See the IHS Markit OCP
market impact study..
$6Bn 59%
OCP revenue from non-core
Team members by 2021
5-year compound annual
Growth rate (CAGR)
Adoption primarily motivated by:-
• Cost Reductions
• Power Efficiency
• Standardization
• Ease of deployment

8. Consume. Collaborate. Contribute.
Some comparisons – LinkedIn
LinkedIn realized (just as eBAY
did) the “value of the network”
Revenue would not even be
considered until the network
foundation was built
The (free) network service
enables revenue

9. Consume. Collaborate. Contribute.
Silicon flow is more complex than software (duh..)
Architectural
analysis
RTL
design
RTL
verification
Synthesis
STA
Physical
Design
Verification
DRC/LVS/NAC
• VHDL
• System Verilog
• CDL
• Cadence e.g. Xcelium
• Synopsys
• Functional emulation
• Mentor Tessent DFT
• Cadence e.g. Xcelium &
• QRC extraction - Quantus
• Add CTS
• Cadence e.g. Innovus, Voltus
• Apache –ERC, IP drop
• Mentor Calibre, Synopsys ICV
• Cadence PVS
PRD
GDS II
Software / Silicon descriptions analogous
Silicon descriptions are unique and divergent e.g. performance / power /
area constraints, Implications, foundry PDKs per process node, standard cell
libraries, memory compilers, “hard IP” versus soft IP

10. Consume. Collaborate. Contribute.
Technology and Value Flows
New or existing Entity
Commercial Partners
VC’s
Technology, IPR
License fee
Product Requirements,
Seconded Resources,
standards input,
Annual membership fee
Investment $’s
Commercial Partners
Chiplets
Services
OEM
Chip shipment
Chip payment
Per chip royalty
Chip shipment
Chip payment
Standards bodies,
e.g. OCP, Jedec, OIF

11. Consume. Collaborate. Contribute.Consume. Collaborate. Contribute.
Survey- Early Look

12. Consume. Collaborate. Contribute.
ODSA Survey
• The ODSA Working Group is organized as part of the Open Compute Project (OCP) to
develop standards for the development of multi-vendor system-in-package solutions
based on chiplet technology.
• This survey intends to gather your input as a technology provider or user on the upcoming
potential chiplet market and the business aspects of chiplet technology. If chiplets are
available in a market place, they can be used for building system-in-package (SIP) type
devices by any design and manufacturing entity. Such a market for chiplets has a
potential for new business channels for chip makers as well as system makers. Please let
us know your thoughts on the following questions:
• chiplet: A silicon chip offering that is intended to be combined with other chiplets
(potentially from other vendors) within a single semiconductor device package.
• SIP device: A packaged semiconductor device composed of more than one chiplet/die
operating as a System (or subsystem) in Package (SIP), where the chiplet/die in the
device may come from separate producers. The term multi-chip module (MCM) may have
an identical meaning.

13. Consume. Collaborate. Contribute.
Survey Sections
• Overview
⎻ Background on survey taker and views on the market for this technology
• SIP Technology Drivers
⎻ What drives the consideration of use of SIP technology and what building blocks
are needed?
• SIP Technology Blockers
⎻ What will stand in the way of rapid adoption of this technology?
• Supply Chain Considerations
⎻ What will be needed to ensure that the supply chain can function (efficiently)?

14. Consume. Collaborate. Contribute.
Interesting Initial Findings

15. Consume. Collaborate. Contribute.
New Industry & Technology Drivers

16. Consume. Collaborate. Contribute.
Standard Interfaces Between Chiplets

17. Consume. Collaborate. Contribute.
On-Die Diagnostics Coverage

18. Consume. Collaborate. Contribute.
Die Testing and KGD Standards

19. Consume. Collaborate. Contribute.
Fault Coverage

20. Consume. Collaborate. Contribute.
THANK
YOU