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• Characterize Visco-Elastic properties.
• Storage Modulus E’ (elastic response) and Loss
Modulus E’’ (viscous response) of polymers are
measured as a function of T or time as the
polymer is deformed under an oscillatory load
(stress) at a controlled (programmed) T in
specified atmosphere.
• DMTA can be applied to determine the glass
transition of polymers or the response of a
material to application and removal of a load.
• DMA is based on two important concepts of
stress and strain.
• Stress σ = F/A
• Stain γ = ∆Y/Y
• The modulus (E), a measure of stiffness, can be
calculated from the slope of the stress-strain plot.
This modulus is dependent on temperature and
applied stress.
An example of a typical
stress versus strain plot.
• DMA instruments apply sinusoidally oscillating stress to
samples and causes sinusoidal deformation. The
relationship between the oscillating stress and strain
becomes important in determining viscoelastic
properties of the material.
• Stress and strain can be expressed with:
Where,
σo = maximum stress applied
ω = frequency of applied stress, and t = time
(a)The applied stress and measured strain are in phase
for an ideal elastic material.
(b)The stress and strain are 90o out of phase for a purely
viscous material.
(c)Viscoelastic materials have a phase lag less than 90o.
• The phase angle between
the stress and strain tells us
a great deal about the
viscoelasticity of the
material.
• For one, a small phase angle
indicates that the material is
highly elastic; a large phase
angle indicates the material
is highly viscous.
• The elastic response of the
material is analogous to
storage of energy in a
spring, while the viscosity of
material can be thought of
as the source of energy loss.
Key viscoelastic terms that can be calculated with DMA.
Term Equation Significance
Complex modulus
(E*)
E* = E’ + iE” Overall modulus
representing
stiffness of material;
combined elastic and
viscous components
Elastic modulus (E’) E’ = (σo/γo)cosδ Storage modulus;
measures stored
energy and
represents elastic
portion
Viscous modulus
(E”)
E” = (σo/γo)sinδ Loss modulus;
contribution of
viscous component
on polymer that
flows under stress
Loss tangent (tanδ) Tanδ = E”/E’ Damping or index of
viscoelasticity;
compares viscous
and elastic moduli
The sample is clamped into a
frame and is heated by the
furnace. The sample in the
furnace is applied the stress from
the force generator via probe. To
make the strain amplitude
constant, the stress is applied as
the sinusoidal force. The
deformation amount generated by
the sinusoidal force is detected.
Viscoelastic values such as
elasticity and viscosity is
calculated from the applied stress
and the strain and plotted as a
function of temperature or time.
Temperature sweep
Time scans
Frequency scans
• The frequency and amplitude of oscillating stress is
held constant while the temperature is increased.
• The results of temperature sweeps are displayed as
storage and loss moduli as well as tan delta as a
function of temperature.
• The temperature of the sample is held constant, and properties
are measured as functions of time.
• This experiment is commonly used when studying curing of
thermosets, materials that change chemically upon heating.
• Data is presented graphically using modulus as a function of
time; curing profiles can be derived from this information.
• It tests a range of frequencies at a constant temperature to
analyze the effect of change in frequency on temperature-
driven changes in material.
• This type of experiment is typically run on fluids or polymer
melts.
• The results are displayed as modulus and viscosity as
functions of log frequency.
displays the important
components of the DMA, including the
motor and driveshaft used to apply
torsional stress as well as the linear
variable differential transformer (LVDT)
used to measure linear displacement.
The carriage contains the sample and is
typically enveloped by a furnace and
heat sink. General schematic
of DMA analyzer
Different fixtures can be used to hold the samples in
place and should be chosen according to the type of
samples analyzed.
• Depending on the material to analyze, the specimen can be
prepared in different ways: Molding, Cutting.
Cutting
Vernier
caliper
micrometer
• As a general rule, common specimen dimensions range
from a few millimeters to a few centimeters. The use of a
caliper is then advised. The use of a micrometer is preferred
to measure film thickness.
• The DMA can be either stress or strain controlled: strain-
controlled analyzers move the probe a certain distance
and measure the stress applied; strain-controlled
analyzers provide a constant deformation of the sample.
• DMA analyzers can also apply stress or strain in two
manners—axial and torsional deformation
applies a linear
force to the sample and is typically
used for solid and semisolid
materials to test flex, tensile
strength, and compression. Axial
instrument should not be used for
fluid samples with viscosities below
500 Pa-s.
applies force in a twisting
motion; this type of analysis is used for liquids and
polymer melts but can also be applied to solids.
Torsional analyzers cannot handle materials with high
modulus.
As the temperature of a polymer
increases, the material goes through
a number of minor transitions (Tγ
and Tβ) due to expansion; at these
transitions, the modulus also
undergoes changes. The glass
transition of polymers (Tg) occurs
with the abrupt change of physical
properties within 140-160 oC; at
some temperature within this range,
the storage (elastic) modulus of the
polymer drops dramatically. As the
temperature rises above the glass
transition point, the material loses
its structure and becomes rubbery
before finally melting
The glass transition temperature can be determined using
either the storage modulus, complex modulus, or tan δ (vs
temperature). When using the storage modulus, the
temperature at which E’ begins to decline is used as the Tg.
Tan δ and loss modulus E” show peaks at the glass
transition; either onset or peak values can be used in
determining Tg.
• Dynamic mechanical analysis is an essential
analytical technique for determining the viscoelastic
properties of polymers.
• Due to its use of oscillating stress, this method is able
to quickly scan and calculate the modulus for a range
of temperatures.
• This analytical method is able to accurately predict
the performance of materials in use.
• Fast analysis time (typically 30 minutes).
• Easy sample preparation.
• Characterization of printed circuit board materials by
DMA.
• It finds application in Research and Development for
material lifetime predictions.
• The modulus value is very dependent on sample
dimensions, which means large inaccuracies are
introduced if dimensional measurements of samples
are slightly inaccurate.
• Oscillating stress converts mechanical energy to heat
and changes the temperature of the sample.
Graphical representation of the
relationship between primary glass
transition temperature and
polymeric ratio of sequential
interpenetrating polymer networks
composed of (poly
methylmethacrylate) and
polyurethane
Graphical representation of the
relationship between modulus
and temperature for a viscoelastic
polymer system
http://www.netzsch-thermal-analysis.com/en/products-
solutions/dynamic-mechanical-thermal-analysis.html
http://www.anton-paar.com/ca-en/products/details/dynamic-
mechanical-thermal-analysis-dmta-1/
http://www.hitachi-hitec-
science.com/en/products/thermal/tec_descriptions/dma.htm
l
http://cnx.org/contents/65a787ea-d9bf-487b-b748-
e005fa9c476d/Dynamic_Mechanical_Analysis
Presentation dynamic mechanical analysis (dma)

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Presentation dynamic mechanical analysis (dma)

  • 1.
  • 2. • Characterize Visco-Elastic properties. • Storage Modulus E’ (elastic response) and Loss Modulus E’’ (viscous response) of polymers are measured as a function of T or time as the polymer is deformed under an oscillatory load (stress) at a controlled (programmed) T in specified atmosphere. • DMTA can be applied to determine the glass transition of polymers or the response of a material to application and removal of a load.
  • 3.
  • 4. • DMA is based on two important concepts of stress and strain. • Stress σ = F/A • Stain γ = ∆Y/Y • The modulus (E), a measure of stiffness, can be calculated from the slope of the stress-strain plot. This modulus is dependent on temperature and applied stress.
  • 5. An example of a typical stress versus strain plot. • DMA instruments apply sinusoidally oscillating stress to samples and causes sinusoidal deformation. The relationship between the oscillating stress and strain becomes important in determining viscoelastic properties of the material. • Stress and strain can be expressed with: Where, σo = maximum stress applied ω = frequency of applied stress, and t = time
  • 6. (a)The applied stress and measured strain are in phase for an ideal elastic material. (b)The stress and strain are 90o out of phase for a purely viscous material. (c)Viscoelastic materials have a phase lag less than 90o.
  • 7. • The phase angle between the stress and strain tells us a great deal about the viscoelasticity of the material. • For one, a small phase angle indicates that the material is highly elastic; a large phase angle indicates the material is highly viscous. • The elastic response of the material is analogous to storage of energy in a spring, while the viscosity of material can be thought of as the source of energy loss. Key viscoelastic terms that can be calculated with DMA. Term Equation Significance Complex modulus (E*) E* = E’ + iE” Overall modulus representing stiffness of material; combined elastic and viscous components Elastic modulus (E’) E’ = (σo/γo)cosδ Storage modulus; measures stored energy and represents elastic portion Viscous modulus (E”) E” = (σo/γo)sinδ Loss modulus; contribution of viscous component on polymer that flows under stress Loss tangent (tanδ) Tanδ = E”/E’ Damping or index of viscoelasticity; compares viscous and elastic moduli
  • 8. The sample is clamped into a frame and is heated by the furnace. The sample in the furnace is applied the stress from the force generator via probe. To make the strain amplitude constant, the stress is applied as the sinusoidal force. The deformation amount generated by the sinusoidal force is detected. Viscoelastic values such as elasticity and viscosity is calculated from the applied stress and the strain and plotted as a function of temperature or time.
  • 9. Temperature sweep Time scans Frequency scans • The frequency and amplitude of oscillating stress is held constant while the temperature is increased. • The results of temperature sweeps are displayed as storage and loss moduli as well as tan delta as a function of temperature.
  • 10. • The temperature of the sample is held constant, and properties are measured as functions of time. • This experiment is commonly used when studying curing of thermosets, materials that change chemically upon heating. • Data is presented graphically using modulus as a function of time; curing profiles can be derived from this information. • It tests a range of frequencies at a constant temperature to analyze the effect of change in frequency on temperature- driven changes in material. • This type of experiment is typically run on fluids or polymer melts. • The results are displayed as modulus and viscosity as functions of log frequency.
  • 11. displays the important components of the DMA, including the motor and driveshaft used to apply torsional stress as well as the linear variable differential transformer (LVDT) used to measure linear displacement. The carriage contains the sample and is typically enveloped by a furnace and heat sink. General schematic of DMA analyzer
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  • 13. Different fixtures can be used to hold the samples in place and should be chosen according to the type of samples analyzed.
  • 14. • Depending on the material to analyze, the specimen can be prepared in different ways: Molding, Cutting. Cutting Vernier caliper micrometer • As a general rule, common specimen dimensions range from a few millimeters to a few centimeters. The use of a caliper is then advised. The use of a micrometer is preferred to measure film thickness.
  • 15. • The DMA can be either stress or strain controlled: strain- controlled analyzers move the probe a certain distance and measure the stress applied; strain-controlled analyzers provide a constant deformation of the sample. • DMA analyzers can also apply stress or strain in two manners—axial and torsional deformation applies a linear force to the sample and is typically used for solid and semisolid materials to test flex, tensile strength, and compression. Axial instrument should not be used for fluid samples with viscosities below 500 Pa-s.
  • 16. applies force in a twisting motion; this type of analysis is used for liquids and polymer melts but can also be applied to solids. Torsional analyzers cannot handle materials with high modulus.
  • 17. As the temperature of a polymer increases, the material goes through a number of minor transitions (Tγ and Tβ) due to expansion; at these transitions, the modulus also undergoes changes. The glass transition of polymers (Tg) occurs with the abrupt change of physical properties within 140-160 oC; at some temperature within this range, the storage (elastic) modulus of the polymer drops dramatically. As the temperature rises above the glass transition point, the material loses its structure and becomes rubbery before finally melting
  • 18. The glass transition temperature can be determined using either the storage modulus, complex modulus, or tan δ (vs temperature). When using the storage modulus, the temperature at which E’ begins to decline is used as the Tg. Tan δ and loss modulus E” show peaks at the glass transition; either onset or peak values can be used in determining Tg.
  • 19. • Dynamic mechanical analysis is an essential analytical technique for determining the viscoelastic properties of polymers. • Due to its use of oscillating stress, this method is able to quickly scan and calculate the modulus for a range of temperatures. • This analytical method is able to accurately predict the performance of materials in use. • Fast analysis time (typically 30 minutes). • Easy sample preparation.
  • 20. • Characterization of printed circuit board materials by DMA. • It finds application in Research and Development for material lifetime predictions. • The modulus value is very dependent on sample dimensions, which means large inaccuracies are introduced if dimensional measurements of samples are slightly inaccurate. • Oscillating stress converts mechanical energy to heat and changes the temperature of the sample.
  • 21. Graphical representation of the relationship between primary glass transition temperature and polymeric ratio of sequential interpenetrating polymer networks composed of (poly methylmethacrylate) and polyurethane Graphical representation of the relationship between modulus and temperature for a viscoelastic polymer system