Airfast 3 RF Power Transistors Advance Cellular Infrastructure for Smart Cities
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At European Microwave Week, NXP announced Airfast third generation LDMOS RF power transistors. Click through and explore how NXP is addressing the explosive growth of mobile traffic with our industry leading RF power transistor performance.
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Airfast 3 RF Power Transistors Advance Cellular Infrastructure for Smart Cities
- 1. EXTERNAL USE0 RF POWER TRANSISTORS ADVANCE CELLULAR INFRASTRUCTURE NXP AIRFAST THIRD GENERATION
- 2. PUBLIC 1 Explosive Growth in Connected Devices 2015 20182016 25 22 20 19 17 15 28 2017 2019 2020 2021 Customers Facing… • Skyrocketing data rates • Multiple wireless standards • Increasing network complexity • Stringent power requirements • Worldwide rise in IP traffic Mobile Broadband for Evolving Cellular Market • Reduced energy consumption • Shrinking equipment footprint • Reduced time-to-market Connected Devices vs. Global Mobile Traffic #ConnectedDevices(Billions) Global Mobile Traffic (Monthly Exabytes) Source: Ericsson, June 2016 11 20 29 35 53 75 95
- 3. EXTERNAL USE2 CELLULAR MARKET CHALLENGES
- 4. EXTERNAL USE3 • Capacity, data rates, subscribers − Ever increasing need for data − Smart devices increasing Internet traffic • Reduce equipment size − Smaller footprint to reduce installation costs • Network infrastructure evolution − Network infrastructure evolution from passive antennas to active antennas − Reduced power consumption requirement (5G power consumption 90% less than 4G with 10x capacity) • Multiple standards to support − 2G/GSM/GPRS/EDGE − UMTS/3G/TD-SCDMA − TDD-LTE/FDD-LTE − 4G / LTE-A • Reduce CAPEX/OPEX − Higher gain/higher efficiency − Higher capacity/higher bandwidth requirement Cellular Market Challenges
- 5. EXTERNAL USE4 NXP AIRFAST THIRD GENERATION PRODUCTS
- 6. EXTERNAL USE5 NXP Airfast RF Products – A Timeline
- 7. EXTERNAL USE6 Airfast Third-Generation RF Power Solutions
- 8. EXTERNAL USE7 NXP Solutions: Announcing Airfast Third-Generation Products High Efficiency Ultra Wide Band Reduced Solution Size Ground breaking LDMOS efficiency – up to 53% and 4% greater than previous generations Multi-band solutions – targeting up to 90 MHz full- signal bandwidth applications New line of Air cavity plastic packages with Cu based flanges – space savings up to 30% Innovations in thermal performance – up to 20% improvement Airfast 3 A3T18H450W23S A3T18H360W23S A3T21H450W23S A3T26H200W24S Thermal Performance
- 9. EXTERNAL USE8 SMART CONNECTED INFRASTRUCTURE APPLICATIONS
- 10. EXTERNAL USE9 Airfast 3 and Smart Connected Infrastructure A3T18H450W23S • 51% efficiency • 17.2 dB gain • Peak Power 57.4 dBm • ACP-1230S-4L2S A3T21H450W23S • 49.5% efficiency • 15.5 dB gain • Peak Power 57.4 dBm • ACP-1230S-4L2S A3T18H360W23S • 53% efficiency • 17.5 dB gain • Peak Power 55.9 dBm • ACP-1230S-4L2S A3T26H200W24S • 50% efficiency • 16.3 dB gain • Peak Power 52.7 dBm • NI-880XS-4L2L Cellular Base stations Smart Connected Cars Smart Infrastructure Smart Networks Smart Cities Smart Home