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(1)Enhancement of Thermo-mechanical Behavior of IGBT Modules through Engineered Threshold Voltages
Mohsen Akbari
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Vor 4 Jahren
Tags
fea
fem
reliability
power module
non-uniform temperature
chip design
thermal analysis
#temperature
#chip
#semiconductor
#temperature gradient
finite element method
#fem
#thermal analysis
#bond wire
#thermal management
#thermal modelling
#mosfet
#igbt
threshold voltage
chip structure
thermal model
sic
si
mosfet
igbt
igbt power module
thermal stress
temperature
Mehr anzeigen