MEMS Journal -- Market Intelligence Services

The Largest MEMS Publication in the World
“Understand how the marketplace perceives your
company, track and anticipate competitor moves,
optimally assign your workforce, identify profitable
product and service opportunities, avoid poor
product launches, minimize risks and surprises”

Market Intelligence
Services

CONFIDENTIALITY AND DISCLAIMER NOTICE
This document and its associated attachments contain information that is confidential and proprietary to MEMS Journal, Inc. If
you are not the intended recipient of this document, please notify MEMS Journal immediately by email or telephone, delete the
original document, emails and attachment files from your computer system and destroy any hard copies of this document and its
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any parties is prohibited. The content of this document is for information purposes only and is not intended to provide tax, legal
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responsibility. The information does not constitute a solicitation of any order to buy or sell any securities.
For further questions, please contact us at info@memsjournal.com.

Market Intelligence
Services
About MEMS Journal, Inc.
MEMS Journal, Inc. was founded in 2003 and currently has 28,700+ subscribers
worldwide. We are the only independent publication with an exclusive focus and
comprehensive coverage on the latest developments in the MEMS industry. We
are the largest MEMS publication in the world.
Our Weekly Newsletter is specifically designed for MEMS professionals and
reports on the top MEMS stories from 7000+ sources worldwide. We cover the
most critical developments in the MEMS industry to ensure that our subscribers
explore and take advantage of the latest client development, investment,
commercialization and partnership opportunities. At this time, our subscribers
include most of the leading executives, engineers and researchers in the MEMS
community.
Our marketing services include:
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Comprehensive sales and marketing program reviews
Brand identity and positioning
Brand awareness surveys and evaluations
Market research reports
Direct industry introductions and business development
Partnership development
Public and media relations
Advertising tracking systems
Social media marketing and community development
Content development and “ghost writing”
Dedicated email blasts
Whitepaper distributions
Events and workshops
Webinars
Advertising
Sales channel development and enhancement

Proprietary and Confidential

Copyright 2014 MEMS Journal, Inc.

Page 2 of 33

Market Intelligence
Services
Market Intelligence
Facts and Considerations
MEMS Journal has been in business since 2003 and has conducted marketing
and market intelligence campaigns for 145+ companies and organizations
worldwide.
The following are our observations about the current state of how companies and
organizations in the MEMS, microsystems, sensors and semiconductor industries
approach market intelligence:
 ~75% of all companies and organizations do not have an active and ongoing
market intelligence effort in place
 ~85% do not have a clear understanding of their competition’s main
weaknesses
 ~70% of all sales people do not understand the real reasons why they have
lost a potential sale
 ~65% of all marketing programs and budgets are wasted because the
language is not optimized based on a clear understanding of the customers’
true needs and priorities
 ~90% of all products are developed and launched without sufficient
information about the customer base and competitive offerings



Page 3 of 33

Market Intelligence
Services
Top Seven Business Benefits
Market Intelligence
When you clearly understand your company’s optimal position marketplace, you reap a range of
business benefits, including the following:
1) Higher profits: When you better understand which parts of your products and services your
customers value most, you can focus on these items and improve your profitability. Also, by
performing marketing intelligence studies and surveys before developing and launching new
products, you will be able to dramatically reduce your R&D expenses and avoid costly marketing
campaigns.
2) Premium pricing: Don’t compete on price, compete on value. When you truly understand
your customers’ needs and priorities, you will be able to justify the higher price of your products
and services.
3) Lower cost of sales: If clearly understand your potential clients’ needs and priorities, your
sales team will be able to steer the conversation the right direction and dramatically accelerate
the sales cycle.
4) Lower cost of promotion: Based on your clear understanding of the customers and
competitive offering, you will be able to adjust your marketing messaging accordingly and
engage your customers more effectively. This will increase the cost-effectiveness of your
investments into marketing programs.
5) Higher market share: By continually and consistently, surveying your customers, prospects,
competitors, as well as current and potential partners, you will be able to maintain an edge in the
marketplace. With time, your market share will increase and you will take more business away
from your competitors.
6) Premium pricing and reputation: Well-established brands acquire loyal customers who
recruit more customers to the brand, increasing the brand’s share of market while reducing
customer-development costs and building immunity to competitive attacks.
7) Lower recruiting costs: Great brands attract passionate employees, who pass their
enthusiasm to satisfied consumers, who in turn make employees’ jobs more enjoyable, reducing
employee turnover as a result. Your recruiting costs will also be lower and you will be able to
attract higher quality talent to your organization.



Page 4 of 33

Market Intelligence
Services
Market Intelligence Service Plans
Level

Annual Program - Package Features

Diamond - $85,000

• comprehensive review of your current market intelligence program
• report and recommendations to improve your market intelligence
operations
• ongoing strategic marketing advice and recommendations
• ongoing monitoring of your competitors (quarterly reports)
• ongoing monitoring of your product marketplace (quarterly reports)
• thirty (30) interviews with your potential customers
• ten (10) interviews with your potential partners
• three (3) market research surveys on your behalf with our 28,700+
subscribers (typically yields 80-300 replies per each survey)

Platinum - $55,000

operations
• twenty (20) interviews with your potential customers
• five (5) interviews with your potential partners
• two (2) market research surveys on your behalf with our 28,700+

Gold - $35,000

operations
• fifteen (15) interviews with your potential customers
• one (1) market research survey on your behalf with our 28,700+

Silver - $15,000

• ten (10) interviews with your potential customers
• one (1) market research survey on your behalf with our 28,700+



Page 5 of 33

Market Intelligence
Services
Other Market Research Services
 Custom market research based on your area of interest and focus
 Identification of profitable product and service opportunities through our
extensive industry network of 5,250+ professionals
 Scouting for emerging trends and applications at industry events and
tradeshows – MEMS Journal is directly involved in 40-45 industry events
every year
 Focus groups, seminars and road shows
 Identification of new product and service opportunities through a direct
network of well established industry contacts
 IP and technology due diligence including introductions and access to many
highly specialized experts
 Introductions of potential acquirers or licensors of your IP and patents
 Continual monitoring of specific market segments and technologies
 SWOT (Strengths, Weaknesses, Opportunities, and Threats) analysis
 Periodic market specific intelligence reports to keep track of competitors and
identify business development opportunities



Page 6 of 33

Market Intelligence
Services
Feedback on MEMS Journal
"MEMS Journal did a great job with marketing NanoGetters and MEMS foundry services. First, they assessed our
current market positioning and existing marketing practices. From there, they developed for us a comprehensive
report and strategic marketing plan. They also helped us put on a webinar in April of 2011. The event attracted
nearly 300 participants, many from leading MEMS companies. We look forward to continuing to work with MEMS
Journal and we recommend their services highly to other MEMS companies." Doug Sparks, President and
Founder, NanoGetters
*****************************************************
“MEMS Journal is an extremely valuable marketing partner for us. We began working with them about a year ago
on a pilot project and have quickly expanded the program from there. They have been able to deliver a steady
stream of new business leads to us. If you want to expand your business and visibility in the MEMS sector, you
should work with MEMS Journal. They have excellent reach and produce solid results. We recommend MEMS
Journal's marketing services highly to companies with both new or established MEMS products and services.”
Izabela Mijic-Yovan, Marketing Coordinator, Polytec
*****************************************************
"We began to work on marketing projects with MEMS Journal in January of 2011 and our experience has been
great so far. Our company is a provider of MEMS design software and services, and we need to continually
connect with new potential customers who may benefit by using our products. One of the MEMS Journal initiatives
that worked well for us was a webinar that focused on some of the MEMS design considerations that our current
and potential customers typically face. Through the webinar, we were able to connect with hundreds of potential
customers and this has already led to some new business for our company. MEMS Journal assisted us with
webinar topic selection, materials preparation, webinar promotion as well as all of the associated logistics. Based
on our experience, we'd highly recommend MEMS Journal's marketing services to other MEMS companies." Joe
Johnson, Business Development Manager, IntelliSense
*****************************************************
“MEMS Journal's technical and business knowledge and connections in the MEMS space make them an excellent
resource for anyone wishing to take advantage of the opportunities in this market. They provide excellent value and
high quality, with creativity and flexibility in providing an optimal mix of services. Their team is thorough and
responsive – a great partner to have on your team.” Dan Hamon, Vice President and General Manager, Tanner
EDA
*****************************************************
"MEMS Journal has been a great marketing partner for ClassOne Equipment. We've been working with M J since
2009 and they have delivered lots of good visibility for us including new business leads. We are the leading
supplier of refurbished equipment from Suss, EVG, Semitool STS, Hitachi, and KLA-Tencor. These tools fall right
into MEMS wafer fabrication and inspection processes, so expanding our visibility with MEMS research institutes,
startup companies, and fabs is a natural fit for ClassOne. We plan to continue working with MEMS Journal! We
recommend MJ's services to other companies that want to boost their brand and advertising into MEMS and related
market sectors." Byron Exarcos, President, ClassOne Equipment



Page 7 of 33

Market Intelligence
Services
Feedback on MEMS Journal (continued)
"As an international software provider, we have thousands of customers worldwide and utilize many marketing
channels to connect with our current and potential customers. We use specific metrics to precisely measure
performance of all of our marketing and advertising channels. As such, we have been working with MEMS Journal
since 2007 and they have consistently proven themselves to be one of our key marketing channels. Specifically for
the MEMS and microsystems market, MEMS Journal has been outstanding. W e've gradually expanded our
marketing programs with them and a number of MJ's services such as email advertising, webinars and whitepaper
distributions proved to be highly effective for us. MEMS Journal's team is dedicated, focused and responsive to our
needs and we'd recommend them and their services to other companies who are looking to expand their presence
in the MEMS and microsystems market." Bernt Nilsson, Sr. Vice President of Marketing, COMSOL
*****************************************************
"MEMS Journal has been solid, reliable, energetic, and productive partner for Tegal Corporation's marketing efforts
ever since we first began working together, starting in 2006. We've increasingly upped the ante with MEMS Journal
along the way as a result of their proving time and again the value he brings to Tegal's marketing programs.
Someone (a Sales VP) once told me the only reason marketing programs exist is to bring in sales leads, and by that
measure MEMS Journal has delivered in spades. We have seen scores of new customer leads come in as a result
of the webinars MEMS Journal led for us, and as a result of online advertising and conference sponsorships with
the MEMS Journal (which also publishes a weekly "must read" newsletter much-admired in the MEMS community).
Above all, their team’s enthusiasm for projects is contagious, they get the job done, and they are meticulous about
the follow-up, which is why I will continue working with MEMS Journal and why I so highly recommend MEMS
Journal's services." Paul Werbaneth, VP Marketing and Applications, Tegal Corporation
*****************************************************
"I've been working with MEMS Journal since 2005 on various marketing and business development projects for
many companies. I am a strong advocate of the MEMS Journal and the benefits that their company provides. Their
service is great and the value they provide are extremely helpful. In my experience, the MEMS Journal offers one
of the highest returns on investment for marketing programs in the MEMS Industry." David Harris, Director of
Business Development, Advanced MicroSensors Corporation
*****************************************************
“As a leading MEMS foundry, Innovative Micro Technology needs a marketing partner that has a comprehensive
set of offerings that meet our continually evolving requirements and priorities. Over the past 4-5 years, MEMS
Journal and Mike Pinelis have fulfilled this role wonderfully, and we envision a long-term, mutually beneficial
relationship with them. Through our marketing programs with MEMS Journal, we get steady stream of new leads
and relationships, speaking engagements at MEMS events, media and public relations counsel, and insightful
market research. IMT considers MEMS Journal to be an integral marketing resource, and should be for any
company in the MEMS community.” Ted Chi, Director of Marketing and Sales, Innovative Micro Technology



Page 8 of 33

Market Intelligence
Services
Selected List of MEMS Journal’s Customers
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EV Group
IMT
QSecure
MIG
OAI
DWFritz
Coventor
COMSOL
SAES
MANCEF
Baolab
NSTI
HSystems
MEMSTech
AKN


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




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

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


MEPTEC
FLX Micro
SUSS
Micralyne
SiTime
BMC
Springer
Bosch
Tyndall
Vectron
DALSA
Miradia
Siimpel
Akustica
Analog Devices

245+ clients in the past 10 years…



Page 9 of 33

Market Intelligence
Services
Market Survey Results
(sample)
The following pages provide high level data from a market research and intelligence survey that MEMS Journal
has conducted for one of our customers. Please note that while individual email addresses, phone numbers, and
other detailed data have been removed from this document, the customer received a complete report that was ~200
pages long.
The survey provided the following benefits to the customer:







Comprehensive feedback from MEMS Journal’s 27,800+ MEMS focused subscribers. We are the largest
MEMS publication worldwide.
Continual supply of market research and intelligence data. Throughout this campaign, we generated
~120 pages of direct feedback from the customer’s potential clients who have outlined their needs and
priorities (specifically, as these related to the customer’s core product and service offerings). The customer
was then able to use this data to update and adjust their marketing and product development efforts.
In addition to market intelligence, generation of fresh business leads to the customer and their sales and
marketing team. In this case, the customer received 151 new business leads in the span of four (4)
months. The customer and their distributors received pre-screened leads that came to them on a continual
basis throughout this program.
Savings of time. Instead of going to more tradeshows and conferences (which would have cost the
customer more time and money), this program resulted in lots of new market intelligence and business
leads coming directly to the customer.

In this specific example, the campaign was primarily focused on North America.



Page 10 of 33

Market Intelligence
Services
Type of Organization or Company
R&D 26%, General Areas 26%, Manufacturing 18%, Academia 15%, Services 12%, Misc. 3%

R&D
General Areas
Manufacturing
Academia
Services
Misc.



Page 11 of 33

Market Intelligence
Services
Geographical Distribution: Summary
Continental Distribution
Location of Respondents

Number of Respondents
(Out of Total 151)

North America

94

Europe

37

Asia

11

Rest of World

9

Continental Distribution
100
90
80
70
60
50
40
30
20
10
0

(Out of Total 151)

North
America


Europe

Asia

Rest of
World


Page 12 of 33

Market Intelligence
Services
North America Distribution

Number of Respondents (Out of Total 94)

Alberta

2

Ontario

1

Quebec

3

Mexico

2

Arizona

2

California

32

Colorado

1

Delaware

1

Florida

2

Georgia

5

Idaho

1

Indiana

1

Kentucky

1

Maryland

1

Massachusetts

8

Michigan

1

Minnesota

1

Nevada

1

New Jersey

2

New Mexico

2

New York

3

Ohio

1

Oregon

1

Pennsylvania

3

South Carolina

1

Texas

12

Utah

2

Washington

1



Page 13 of 33



Washington

Utah

Texas

South Carolina

Pennsylvania

Oregon

Ohio

New York

New Mexico

New Jersey

Nevada

Minnesota

Michigan

Massachusetts

Maryland

Kentucky

Indiana

Idaho

Georgia

Florida

Delaware

Colorado

California

Arizona

Mexico

Quebec

Ontario

Alberta

Market Intelligence
Services

North America Distribution (continued)

North America Distribution

35

30

25

20

15

10

5

0

Page 14 of 33

Market Intelligence
Services
Europe Distribution


Austria

1

France

7

Germany

12

Greece

1

Ireland

1

Italy

2

Netherlands

2

Scotland

1

Spain

2

Switzerland

4

UK

4

Europe Distribution
14
12
10

8
6
4

(Out of Total 37)

2
0



Page 15 of 33

Market Intelligence
Services
Asia Distribution


China

7

South Korea

3

Taiwan

1

Asia Distribution
8
7
6
5
4

(Out of Total 11)

3
2
1
0

China


South Korea

Taiwan


Page 16 of 33

Market Intelligence
Services
Rest of World Distribution


India

4

Israel

3

Singapore

2

Rest of World Distribution
4.5
4

3.5
3
2.5

(Out of Total 9)

2
1.5
1
0.5
0

India


Israel

Singapore


Page 17 of 33

Market Intelligence
Services
Geographical Distribution: North America
Title/Position

Organization

Country

State

MNTF Coordinator

University of Alberta

Canada

AB

Managing Partner

Strifler & Assocoates

Canada

AB

President

Williston Consulting

Canada

ON

Sales manager

Teledyne DALSA

Canada

PQ

account Mgr

Canada

QC

Canada

QC

Advisor

Teledyne DALSA
Teledyne DALSA
Semiconductor
Instituto Politecnico
Nacional

Mexico

DF

researcher

INAOE

Mexico

PU

MEMS

Freescale

USA

AZ

Manager, MEMS Development

USA

AZ

Mgr, Advanced Technology

Freescale
R&D - BridgeWave
Comm.

USA

CA

VP Design Engineering

Microfabrica

USA

CA

Consultant

GC Consulting

USA

CA

research staff

Bruker

USA

CA

mgr

wd

USA

CA

mechanical engineer

bio-rad lab

USA

CA

Account Technology Director

USA

CA

USA

CA

USA

CA

C.E.O.

Intermolecular
Silicon
Microstructures Inc
Philips Lumileds
Lighting Co.
Yield Engineering
Systems

USA

CA

Technology Director

AMEC

USA

CA

Director

Pacrim Tech

USA

CA

Engineer
MEMS, Business Development
Manager

Oracle

USA

CA

Micrel,Inc.
A.M.Fitzgerald &
Associates

USA

CA

USA

CA

USA

CA

MEMS Des&Dev Mgr
Senior Member of Research
Staff

Intermolecular
Meggitt Sensing
Systems
Palo Alto Research
Center

USA

CA

USA

CA

Product Manager

STATSChipPAC

USA

CA

PCB Technology

Apple

USA

CA

VP Business development

Invenios

USA

CA

Engineer

Cisco

USA

CA

MEMS Integration Engineer

MEMS Design Manager
Sr. Staff Development
Engineer

Engineer
Director, Account Technology



Page 18 of 33

Market Intelligence
Services
Research Assistant

UC Irvine

USA

CA

Director, MEMS Fabrication

USA

CA

Staff Engineer

Invensense Inc.
Fairchild
Semiconductor

USA

CA

Director

Genapsys

USA

CA

Mgr, Advanced Packaging

Cisco

USA

CA

Director of Operations

InvenSense

USA

CA

Director of R&D

SMI

USA

CA

sr. acct. mgr.
Lead Package Design
Engineer

classone equipment

USA

CA

GE

USA

CA

Corporate Engineer

mCube
Advanced
Microsystems

USA

CA

USA

CO

USA

DE

CEO

AL
Intelligent Micro
Patterning LLC

USA

FL

Eng

Plasma ther

USA

FL

Graduate student

Georgia Tech

USA

GA

Student

Georgia Tech

USA

GA

GRA

Georgia tech

USA

GA

PhD Student

Georgia Tech

USA

GA

PHD Candidate

Georgia Tech

USA

GA

President

DFX Solutions, Inc.

USA

ID

Research Engineer

Purdue University

USA

IN

Dir Operations CeNSE

University of Kentucky

USA

KY

engineer

nasa

USA

MD

MEMS eng mgr

Symmetricm

USA

MA

Staff Scientist
Manager of Applications
Engineering

Harvard University

USA

MA

Coventor Inc.

USA

MA

Technical Staff

MSSA, Inc

USA

MA

engineering manager

fab engineering

USA

MA

Reearch Scientist

MIT

USA

MA

VP of Operations

Qualtre

USA

MA

Student

MIT

USA

MA

EVP

Hanking

USA

MI

Engineer

Seagate Technology

USA

MN

VP, Research

Gartner

USA

NV

Director R&D

Johnson & Johnson
Kulite Semiconductor
Products

USA

NJ

USA

NJ

Cornell University
MCB Clean Room
Solutions, LLC

USA

NY

USA

NY

President
Research

Staff Development Engineer
Research Staff
CTO


Page 19 of 33

Market Intelligence
Services

Senior Scientist

Cornell NanoScale
Facility
Sandia National
Laboratory

USA

NM

consultant

J Allen Consulting

USA

NM

manager

DNV

USA

OH

Editor

Techfocus Media

USA

OR

VP Sales & Marketing
co-Director - Nanofabrication
Facility

Akrion Systems

USA

PA

Penn State

USA

PA

physics professor

Grove City College

USA

PA

Process Engineer

formulation

USA

SC

Integration Engineer

Novati

USA

TX

Staff Engineer

Novati Technologies

USA

TX

eng

samsung

USA

TX

CTO
200mm Global Product /
Marketing Manager

Sachem Inc

USA

TX

Applied Materials

USA

TX

Working Group Manager

GSA

USA

TX

Consultant
200mm Global Product /
Marketing Manager

R W Gooch

USA

TX

Applied Materials

USA

TX

Sutduent

UT Dallas

USA

TX

President

VISM Corp.

USA

TX

Integration Engineer

SVTC

USA

TX

GRA

Nanofab

USA

TX

Assoc. Dir.

Utah Nanofab

USA

UT

RA

University of Utah

USA

UT

ceo

sensors in motion

USA

WA

Research Support Specialist



USA

NY

Page 20 of 33

Market Intelligence
Services
Geographical Distribution: Europe
Title/Position

Organization
Vienna University of
Technology

Country

process engineer
Head of Sensors &
Microtehnology Unit
Director Euroepan
Operations and Foundry
Program

ESIEE paris
ONERA - The French
Aerospace Lab

France

Coventor

France

Mems design Engineer

France

Research department head

Schlumberger Mems-Tc
Institut d'Electronique
Fondamentale

Engineer

LAAS-CNRS

France

engineer

FEMTO-ST, CNRS

France

Director

Germany

Project Manager

EPCOS AG (part of TDK)
endress+Hauser
GmbH+Co.KG

Engineer

IHP

Germany

Project Manager

CiS Forschungsinstitut

Germany

Senior Scientist

Fraunhofer IZM

Germany

R&D Manager

FhG IPMS

Germany

Process Specialist Etch

IFW Dresden

Germany

Researcher

Germany

Dipl.-Ing.

TU Chemnitz
Ilmenau University of
Technology, IMN
MacroNano

Researcher

University of Ulm

Germany

Research Engineer

Germany

Univ. Prof.

Fraunhofer IZM
Westf. WilhelmsUniversität Münster,
Germany

Physicist researcher

NCSR Demokritos

Greece

consultant

Ashgrove consulting

Ireland

Manager

STM

Italy

technologist

kessler Foundation

Italy

-

Oce

Netherlands

Senior Scientist

TNO

Netherlands

Research Fellow

University of Edinburgh

Scotland

Professor

IMB-CNM, CSIC

Spain

Scientific Research

IMB-CNM (CSIC)

Spain

Technologist

Karmic Sarl

Switzerland

Lecturer

FHNW-HLS-LIMA

Switzerland

PhD student



Austria

France

France

Germany

Germany

Germany

Page 21 of 33

Market Intelligence
Services
head of market r&d

Endress+Hauser

Switzerland

.
Reader in Experimental
Physics

Rolex SA

Switzerland

Cardiff University

UK

Researcher

Univeristy of Edinburgh
Applied Microengineering
Ltd

UK

Linde Electronics

UK

Technical Director
Manager new product
Development and
Commercialisation



UK

Page 22 of 33

Market Intelligence
Services
Geographical Distribution: Asia
Title/Position

Organization

Country

consultant
Assistant
Chief
Engineer

SAE

China

China Electronics Technology Group
Corporation The 49th Research Institute

China

PH.D student

Northwestern polytechnical university

China

PH.D
Master of
Science

Northwetern Polytechnical University

China

Peking University

China

Professor

Southeast University

China

professor

Suzhou Inst of Nanotech

China

Manager

R&D

South Korea

Researcher

Dongbu HiTek

South Korea

CEO

MEMS Solution Inc

South Korea

Prof.

National Cheng Kung University

Taiwan



Page 23 of 33

Market Intelligence
Services
Geographical Distribution: Rest of World
Title/Position

Country

SRF

Organization
Central Electronics Engineering Research
Institute (CEERI- CSIR)

lecturer

jecrc

India

Professor

Indian Institute of Technology

India

Assoc Professor

IIT Kharagpur

India

Associate Professor

School of Mech. Eng. Tel Aviv Univesity

Israel

CEO

IMH Israeli MEMS House

Israel

VP Eng.
Sr Product
Marketing Manager

Maradin

Israel

KLA-Tencor

Singapore

Senior Scientist

Institute of Microelectronics

Singapore



India

Page 24 of 33

Market Intelligence
Services
Interviews with Potential Customers
(samples)
The following pages provide samples of interviews with potential customers for a specific product or service. In this
case, the focus was on through substrate vias (TSVs) and 3D packaging solutions. Also, in this case, the interviews
were shorter because our client wanted to have more interviews and feedback. As such, ~40 one-page interviews
were collected as part of this study.
The interviews provided the following benefits to the customer:





Detailed feedback from potential customers and partners.
Identification of challenges and “pain points” facing customers
Enhanced understanding of how potential customers currently use existing solutions
Enhanced understanding of the competitive landscape

For this particular study, our client wanted the interviews to be conducted via email and they also wanted to see the
“raw” and unedited replies from the respondents.



Page 25 of 33

Market Intelligence
Services
Interview Sample #1
Name & Title:
Name Removed (sample), Assistant Manager
Organization & Location:
Asahi Glass Co., Ltd./Technology Development General Div., AGC Electronics -Tokyo, Japan
Contact Number & Email:
Phone Number and Email Address Removed (sample)
Please describe in detail about what your company does and how it relates to 3D Packaging and/or TSVs. Please
include the types of companies who are your main customers, as well as companies that are your main suppliers.
We produce several glass materials for semiconductor packaging, as some examples, which are glass frit
for hermetic sealing, carrier glass for silicon processing, and cover glass for sensor. Foundries
and memory makers are our main customer in terms of carrier glass. And glass frit is used by several
industries.
Please describe in detail your personal involvement (vs. your company or organization in general) with 3D
packaging technologies and/or processes.
I’m responsible for marketing to establish new business or new products. Currently I’m focusing 3D
integration for semiconductor market. Especially 3D integrated packaging using interposer is very
interesting. I have also experience about chip bonding technology.
Please describe in detail your personal involvement with TSV processes and/or technologies
In terms of TSV, I expect our carrier glass is used for silicon thinning process. Furthermore, I’m also
involved TGV (through glass via, not TSV) development. I’m looking for some application for this.
For your ongoing 3D packaging and/or TSV projects, what are the main challenges (business and/or
technical) that you are encountering? What’s causing most of your challenges and why.
TGV technology. Fine pitch hole drilling and metallization process for this. To look for possible
application for this, I’d like to connect some people from packaing industry.
Are you personally a buyer or a seller of 3D packaging or TSV technologies or services? Which specific 3D
packaging technologies or services do you primarily buy or sell? If you both buy and sell, please include
information for both.
We are material company. We sell some glass to packaging makers.



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Market Intelligence
Services
Interview Sample #2
Name & Title:
Name Removed (sample), Architect
Cadence Design Systems - Chelmsford, MA
Please describe in detail about what your company does and how it relates to 3D Packaging and/or TSVs.
Please include the types of companies who are your main customers, as well as companies that are your main
suppliers.
Cadence Design Systems is a EDA tool provider. Our tool set includes circuit schematic design, physical
layout automation, model extraction and simulation. The tool set covers from IC, packaging and PCB. So
our customer uses the tool to design their packaging, 2D or 3D and design the TSVs. Intel, IBM, and Cisco
are our main customers among many others. We use many software tools from Microsoft, Intel and use
computing facilities from Dell, IBM and Lenovo
I am in SPB division which stands for Silicon-Packaging-Board and working on interconnect model
extraction which includes packaging interconnect characterization and is used for signal integrity analysis.
When design packaging interposer, the TSV needs to be designed together as well. Due to the material
complexity and complicated electromagnetic behavior, the accurate characterization is required which
requires advanced analyze methodology numerically and theoretically and which is one of my working
area.
For your ongoing 3D packaging and/or TSV projects, what are the main challenges (business and/or technical) that
you are encountering? What’s causing most of your challenges and why.
In my area, acquiring the accurate physical structure in 3D and accurate material specification are the first
things. Given these information, how to accurately and effectively characterize the packaging interconnect
and TSV’s electrical behavior are big challenges.
packaging technologies or services do you primarily buy or sell? If you both buy and sell, please include information
for both.
Basically I am using Microsoft software to design EDA software on Lenovo’s computer.



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Market Intelligence
Services
Interview Sample #3
Name & Title:
Name Removed (sample), Sr. Director, Technical Sourcing
Infinera - Sunnyvale, CA
Network Transport Equipment We build optical transport systems and software that install in the Service
Provider and Cable Systems networks (e.g. Level 3, Cable & Wireless, Duestche Telecom, etc.) for the
networking transport of their backbone and core networks. Our systems contain ASICs that help with the
switching and routing functions at high bandwidths – 1 Tb/s and above. So, we are exploring new
technologies to package our complex products using multi-die solutions such as TSV and 3D packaging
technologies.
Technical Sourcing – Operations We work with our Architecture & Engineering teams to source various
suppliers to select and qualify high end 2.5D and 3D packaging technology solutions.
Because high speed BW is a big factor, we are currently exploring die stacking and related TSV
technologies for our applications.
BW, cost, power, real estate. The biggest challenge is BW performance at low power. Our ASIC
requirements need 20Gb of ext DRAM operating at 1.2-1.5Tbps -> with a power budget of 80-90W
for both.
Yes, I am part of the team that decides on the selecting & buying this technology solution.



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Market Intelligence
Services
Interview Sample #4
Name & Title:
Name Removed (sample), Principal Engineer
Intel Corp. - Santa Clara, CA
Microprocessors and many other products across multiple market segments
Defining interface between Host (my company’s design) and Memory device (external vendor’s design). The
system is in a 3D packaging.
TSV used in stacked memory
Multi-discipline co-optimization between on-chip circuit, interconnect, packaging, thermal/mechanical
variables
for both.
No



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Market Intelligence
Services
Interview Sample #5
Name & Title:
Name Removed (sample), Staff Engineer 3D Packaging Technologies
Organization:
Invensas Corp.
Please describe in detail what your company does and how it relates to 3D Packaging and/or TSVs. Please include
the types of companies who are your main customers, as well as companies that are your main suppliers.
Invensas Corp., headquartered in San Jose, California, develops, invests in, licenses and delivers
innovative miniaturization technologies and products for next-generation electronic devices. The
company’s micro-electronics solutions enable smaller, higher-functionality devices through chipscale and
wafer-level packaging, silicon-level interconnect and 3D packaging. Samsung and Hynix are main
customers.
Packaging technologies and/or processes
Involved in 3D packaging technology development. Lead engineer in reliability and failure analysis on
all of the 3D packaging projects. Provide support in materials design and selection, characterization.
Are you personally a buyer or a seller of 3D packaging technologies or services? Which specific 3D packaging
technologies or services do you primarily buy or sell? If you both buy and sell, please include information for both.
Invensas is a seller of 3D packaging technologies, mostly in DRAM with multiple memory chips in a single
package.
Please describe in detail your personal involvement with TSV processes and/or technologies.
Technology development. Reliability and failure analysis. Materials interaction analysis,
characterization.
Are you personally a buyer or a seller of TSV technologies or services? Which specific TSV technologies or
services do you primarily buy or sell? If you both buy and sell, please include information for both.
Invensas acquired the patent assets of ALLVIA, Inc. In addition, Invensas has entered into a two-year
collaborative partnership with ALLVIA to further develop technology and intellectual property (IP) in the 3dimensional integrated circuit (3D-IC) packaging space. The majority of the 64 acquired patents and patent
applications from ALLVIA relate to 3D-IC, including through-silicon via (TSV) technology and silicon
interposer technology, which is often known as 2.5D. This IP portfolio purchase, along with our
collaboration on further 3D-IC development marks another important step on Invensas’ path of continued
innovation in vital next-generation packaging technologies



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Market Intelligence
Services
Interview Sample #6
Name & Title:
Name Removed (sample), Manager, Assembly and Packaging Designs
Maxim Integrated Products - Dallas, TX
Analog Mix Signal IC designs for multiple markets. We design and develop product for hand held,
automotive, consumer, industrial, power and energy market along with many other in communication
related areas as well.
Working with the team of wafer level packaging to extend the development of the thru silicon via enabled
devices to take it to the next level of integration if IPD and fanout WLP as well as conventional epoxy
molded packaging.
Personally I am involved in packaging side of the TSV wafers. So process development is done and we
characterize the TSV performance based on the standard packaging development and assembly process
development need and its interaction with respect to packaging process, material sets and long term
reliability of the TSV in a given package.
Getting right set of materials for given packaging technology using the TSV based devices. Stress inside
the package specially seen at the via structure due to molding process under thermal excursions, is a
major challenge.
for both.
Yes -- for Assembly side of it for both development as well as assembly services.



Page 31 of 33

Market Intelligence
Services
Interview Sample #7
Name & Title:
Name Removed (sample), Principal Engineer
Semiconductor Manufacturing International Corp - Shanghai, China
SMIC is a leading foundry in mainland China. We provide 40nm – 0.35um tech node logic and other device
fabrication services.
We have a TSV project in progress now.
Our customer wants us to implement TSV on their CIS devices.
Our TSV project is still in development progress. I’m the owner of plating process of TSV, with Raider-S of
AMAT.
Base on the customers’ requirements and current process development status, we started with 8’ wafers
for TSV.
So maybe there’s less relations to packaging. But almost every foundry do the same TSV development as
us. Foundry likes via-middle TSV process.
Our TSV project is still in development progress. I’m the owner of plating process of TSV, with Raider-S of
AMAT.
Plating is the main challenge of our project. We’re trying MSA based chemistries and the tool might also
has something to improve.
And, overburden after plating will be a big cost challenge to us.
for both.
No, I’m not involved of 3D packaging purchase or sales.



Page 32 of 33

Market Intelligence
Services
Interview Sample #8
Name & Title:
Name Removed (sample), Director of Business Development
Ziptronix - Austin, TX
Ziptronix is a pioneer in the development of low-temperature direct bond technology for a variety of
semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors,
memories and 3D integrated circuits. Its patented, scalable 3D-integration technology, including ZiBondTM
and DBI®, provides the lowest-cost bonding solution for 3D technology, while enabling size reduction, yield
enhancement, lower production costs and power consumption, and increased system performance. The
company holds more than 35 U.S. patents and more than 20 international patents in nine foreign countries
and Europe. It has more than 45 U.S. and international patent applications pending. Ziptronix licenses its
technology throughout the semiconductor supply chain, including OEMs, IDMs and some fabrication and
assembly facilities, and operates a back-end-of-line R&D facility with 6,000 square feet (557m2) of Class
100/1000 cleanroom space at its headquarters in Research Triangle Park, N.C. Examples of potential
customers are IDM’s such as Sony, TI, Samsung or IBM, although most of our customers don’t allow us to
reveal their names. In addition, we work with fabless customers as well.
3D has been my primary focus since 2007, even before I joined Ziptronix. I was the Business Development
Manager with SUSS MicroTec. After that I was the Director of Business Development for Alchimer (3D
company that licenses technology for high aspect ratio TSV’s). I joined Ziptronix in mid- 2010 and have
been the Director for Business Development for them ever since.
For the past two and a half years, I have been working to license a technology than can work in conjunction
or potentially in place of TSV’s. Ziptronix DBI ® technology connects substrates at the die or wafer level at
pitches as small or smaller than 1um. Prior to that I worked to license Alchimer technology for enabling a
high aspect ratio TSV (seed, barrier and isolation layers prior to electroplating).
Ongoing challenges are issues with Known Good Die or yield that sometimes limit customers abilities to
make the integration at the wafer level rather than the die level.
for both.
I primarily sell 3D technology licenses and some manufacturing services.


Page 33 of 33

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