1. Welcome to Andwin Circuits
http://www.andwinpcb.com

2. CONTENTS
目录
1 公司简介 Company Profile
3 技术能力Technical capabilities
2 组织构架图Organizational Chart
7 工艺流程 Fabrication flow chart
6 设备展示Equipments
4 产品结构Products Configuration
5 产品展示Products
8 企业精神Enterprise spirit

3. Company Profile
Andwin Circuits as a industry leading of PCB
manufacturer with in 12 Years.
Specializing in Multilayer PCB, Rigid flex PCB, HDI PCB,
controlled impedance PCB and Radio Frequency Circuit
quick turn prototype to mass products.
Also,we provide one-stop PCB solution from
Components source to PCB assembly. This allows our
customers to get-to-market faster, affordably, and more
efficiently. Partner with us today and accelerate your
innovative development projects.
AndWin is named as our ideal of “win and win”,
Means we are able to be the best partner of yours, Base
on the “Excellent quality”, “On time delivery”and
“Reasonable price”!
Please believe our good service that will help you to
provide The best service for your customer, You and us
will continue to be successful!
Company Profile

4. 艾迪微电路有限公司Andwin Circuits.
NO.121,CuiGangXi RD,FuYong,BaoAn,
Shenzhen,GuangDong,China
●
♦Location
Andwin Circuits MCPCB Factory.
1F/2,XinEr Industrial park,ShaJing,
BaoAn,Shenzhen,GongDong,China

5. ♦Milestones
• June 2012 ISO13485
• May 2011 Russia office start
• Apr.2011 Andwin PCB assembly Division
established
• Mar.2010 New manufacturing area
• June 2008 TS16949:2009
• Mar.2008 AAA Customs High Credit
Enterprise
• Oct.2007 Top 100 SMES in Innovation
• Sep.2007 Office Shang Hai established
• Sep.2007 Join Shenzhen PCB Industry
Assiciation
• July.2007 CQC
• May.2007 Clear Production
Feb.2006 MCPCB Division established
• Sep.2005 Load Production
• May 2005 UL Certifiaction
• Aug. 2004 The area D expansion
• May 2004 TS16949:2002
• May 2004 ISO14001:2004
• May 2004 ISO9001:2000
• Mar. 2004 Shenzhen Environmental
Protection Advanced Unit
• Mar. 2004 Shenzhen Bao An Office start to
operate
• Jan. 2003 Andwin Circuits set up

6. ♦Certification

7. ♦Main Customers
http://www.andwinpcb.com

8.  Response Fast ( always in 3 Hours)
 Fast delivery and Quality guarantee 100%
 Payment net 30 days availabe for old customers
 Based on high quality raw materials
 More than 12 Years in PCB Industry
 Engineers are 15+ Years PCB experience
 100% DRC(Design rule Checking)
 100% AOI (Automatic Optic Inspection)
 100% Electronic Test( E-Test)
♦Our Advantage

9. 总经理
General Manager
副总经理
Vice General Manager
财务部
Financial
Dept
副总经理
Vice General Manager
总工程师
Chief Engineer
副总经理
Vice General Manager
市场部
Marketing
Dept
品质部
Q A Dept
物料部
P M C
工程部
Engineering
Dept
生产计划部
P P C
维修部
Maintenance
Dept
采购部
Purchase
Dept
人事部
Personnel
Dept
生产部
Production
Dept
总经办
Executive
文控部
Document
Dept
工艺技术部
Technical
Dept
Organization chart

10. 序号Serial 项目 Technical parameters 技术能力Technical capabilities
1 层数 Layers 1-48 layers
2 最大板尺寸 Max. board size 450x660mm （18"x26"）
3 最小板厚 Min board thickness
4层0.38mm 15mil
6层0.55mm 22mil
8层0.80mm 32mil
10层1.00mm 40mil
4 最高铜厚 Copper Cald(Max.) 6 oz(outer)/ 4 oz(inner)
5 最小线宽 / 线隙 Min line Width/Space 0.075mm 3mil
6 最小孔径 Min hole size 0.15mm 6mil
7 孔壁铜厚 PTH hole thickness 0.025mm 1mil
8 金属孔孔径公差 PTH hole dia.tolerance ±0.075mm 3mil
9 非金属孔孔径公差 Non PTH hole dia.tolerance ±0.05mm 2mil
10 孔位公差 Hole position deviation ±0.05mm 2mil
11 外形公差 Outline tolerance ±0.10mm 4mil
Technical capabilities 1

11. 序号Serial 项目Technical parameters 技术能力Technical capabilities
12 最小绿油桥 Min S/M Pitch 0.075mm 3mil
13 板弯/板曲 Twist and Bow ≤1.0%
14 绝缘电阻 Insulation Resistance ＞1012Ω
15 测试电压 Test Voltage 50～300V
16 抗电强度 Electric strength ＞1.3KV/mm
17 耐电流 Current breakdown 10A
18 剥离强度 Peel strength 1.4N/mm
19 阻焊剂硬度 Soldermask abrasion ＞6H
20 抗热冲击 Thermal stress 288℃ 20Sec
21 防火等级 Flammability 94V-0
22 阻抗控制 Impedance control +/-10%(Differential)
23 盲/埋孔 Blind/Buried via √
24 表面处理 Surface Finished
ENIG，ImAg，ImSn，OSP，Leaded HAL，
Leaded Free HAL(SN100C)，Finish Gold
25 板材 Materical
FR-4(Tg140°c,Tg170°c,Halogen Free )
Rogers,Alunminum/coper, Based, CEM-3, Getek,
Teflon
Technical capabilities 2

12. Product mix
其它Others
电源Power
消费类Consume
医疗Medical
通信Communication
1 Products application diagram
3
Products layers diagram
≥10L
8L
6L
DS
4L
2
Products material diagram
高频板
High Frenquency
FR4, H-Tg
铝基板/陶瓷板Aluminum
copper/Ceramic board

13. Products 3
8-layer Multilayer Gold finger PCB
Layer Count: 12
Outline Tolerance: +/-0.13mm
BaseMaterial: FR4 TG170
Surface Finishing: ENIG Au 3 U”
Special: Flat routing
12-layer Multialyer PCB
Layer Count: 8
Outline Tolerance: +/-0.13mm
BaseMaterial: FR4 TG170
Surface Finishing: ENIG Au 3 U”
Special: Long/short Gold finger 30 U”
6-layer Multilayer PCB
Layer Count:
Outline Tolerance: +/-0.13mm
BaseMaterial: FR4 TG170
Surface Finishing: ENIG Au 2 U”
Special: Blind Via L2 - L5
4-layer Multilayer PCB
Layer Count: 4
Outline Tolerance: +/-0.13mm
BaseMaterial: FR4 + Rogers 4350
Surface Finishing: ENIG Au 3 U”
Special: ROGERS +FR4 Mix Lamination
Layer Count: 18
Thickness: 6.0 mm
BaseMaterial: FR4 TG180
Surface Finishing: ENIG Au 4 U”
Special: 18 Layers , Military Application
18-layer Multilayer PCB4-layer Multilayer PCB
Layer Count:
Thickness: 1.6mm
BaseMaterial: FR4 TG170
Surface Finishing: ENIG Au 2 U”
Special: Blind Via L2 - L3 ,Gold finger

14. Products 1
6-layer Flex-rigid Print Board
Layer Count: 6
Outline Tolerance:±0.1mm
BaseMaterial:FR4 2layer 4layer
Surface Finishing:lmmersion
Au0.025-0.07um
6-layer Flex-rigid Print Board
Layer Count: 6
Outline Tolerance:±0.1mm
BaseMaterial:FR4 2layer 4layer
Surface Finishing:lmmersion
Au0.025-0.07um
4-layer Flex-rigid Print Board
Layer Count: 4
Outline Tolerance:±0.1mm
BaseMaterial:FR4 2layer, PI 2layer
Surface Finishing:lmmersion
Au0.025-0.07um
4-layer Flex-rigid Print Board
Layer Count: 4
Outline Tolerance:±0.1mm
BaseMaterial:FR4 4layer, PI 2layer
Surface Finishing:
ENEPIG :0.07-0.15um
8-layer HDI Flex-rigid Print Board
Layer Count: 8
Outline Tolerance:±0.1mm
BaseMaterial:FR4 4layer, PI 4layer
Surface Finishing:lmmersion
Au0.025-0.07um
14-layer Flex-rigid Print Board
Layer Count: 14
Outline Tolerance:±0.1mm
BaseMaterial:FR4 6layer, PI 8layer
Surface Finishing:lmmersion
Au0.025-0.07um

15. Products 2
6-layer HDI Flex-rigid Print Board
Layer Count: 6
Outline Tolerance:±0.1mm
BaseMaterial:FR4 4layer, PI 2layer
Surface Finishing:lmmersion
Au0.025-0.07um
4-layer HDI Flex-rigid Print Board
Layer Count: 4
Outline Tolerance:±0.1mm
BaseMaterial:FR4 2layer, PI 2layer
Surface Finishing:lmmersion
Au0.025-0.07um
4-layer Flex-rigid Print Board(COB)
Layer Count: 4
Outline Tolerance:±0.1mm
BaseMaterial:FR4 4layer, PI 2layer
Surface Finishing:lmmersion
NI/PA :0.07-0.15um
4-layer Flex-rigid Print Board(COB)
Layer Count: 4
Outline Tolerance:±0.1mm
BaseMaterial:FR4 4layer, PI 2layer
Surface Finishing:lmmersion
NI/PA :0.07-0.15um
4-layer Flex-rigid Print Board(COB)
Layer Count: 4
Outline Tolerance:±0.1mm
BaseMaterial:FR4 4layer, PI 2layer
Surface Finishing:lmmersion
NI/PA :0.07-0.15um
2-layer Capacitive Screen PCB
Layer number: 2
Base material： : non-adhesive ED
copper
Min track width/gap：0.06/0.06mm
Outline tol：±0.1mm
Surface treatment：ENIG

16. Products 3
2-layer Metal core Board (MCPCB)
Au
Layer Count: 2
Outline Tolerance: +/-0.13mm
BaseMaterial: Aluminum
Surface Finishing: ENIG
Au0.025-0.07um
2-layer Metal core Board (MCPCB)
Au
Layer Count: 2
Outline Tolerance: +/-0.13mm
BaseMaterial: Aluminum
Surface Finishing: ENIG
Au0.025-0.07um
1-layer Metal core Board (MCPCB)
1-layer Metal core Board (MCPCB)
COB
Layer Count: 1
Outline Tolerance: +/-0.2MM
BaseMaterial: Copper
Surface Finishing: Plate sliver
Layer Count: 1
Outline Tolerance: +/-0.13mm
BaseMaterial: Aluminum
Surface Finishing: ENIG
Thermal conductivity : 3W/m.k
1-layer Metal core Board (MCPCB)
Layer Count: 1
Outline Tolerance: +/-0.13mm
BaseMaterial: MIRO CoM AL
Surface Finishing: ENIG
Thermal conductivity : 235 W/m.k
2-layer Metal core Board (MCPCB)
Au
Layer Count: 1
Outline Tolerance: +/-0.13mm
BaseMaterial: Aluminum
Surface Finishing: Plate sliver
Thermal conductivity: 375 W/m.k

17. Equipments 1
自动光学检测 AOI 压合 Lamination 沉铜 PTH
钻孔Drilling 全自动电镀Auto Panel Plating

18. Equipments 2
干膜 Dry film 蚀刻 Acid etching 水平线 Horizontal treatment lines
阻焊 Solder mask 丝印 Silkscreen Printing 沉金 ENIG

19. Equipments 3
喷锡线 HASL Line 锣边 Routing E-T测试 E-Testing
飞针测试 Flying probe testing 真空包装 Vacuum packing 废水处理系统 Waste water treament system

20. Equipments 4
抗剥离强度测试仪
Anti-peeling tester
金相切片仪
Metalloscope
镀层测厚仪
Plating thickness tester
二次元
Quadratic element
MIT弯折测试仪
MIT Bending tester
阻抗测试仪
Impedance tester

21. Fabrication flow chart 1

22. Fabrication flow chart 2

23. Enterprise spirit
质量控制
QC
产品目标
Product Aim
环境方针
Environment Policy
优质高效
科学管理
持续改进
客户满意
准时交货率:99%
一次合格率:98%
客户投诉率:1%
客户满意度:98%
恪守法规
善用资源
节能降耗
保护环境
High quality and efficiency
Scientific management
Continuous improvement
Customer Satifaction
On time delivery Rate:99%
E-Testing passed Rate:98%
Complaints Rate:1%
Customer Satisfaction:98%
Abide by the regulations
Good-use of resources
Energy saving
Protect the environment

24. THANKS FOR YOUR ATTENTION!
To be the most reliable supplier of electronic circuit
http://www.andwinpcb.com