2. COMPANY PROFILE
WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS.
您的成功就是胜科的成功。
WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our
professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis. WinTech
Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF-SIMS, D-SIMS,
XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production customers.
胜科纳米是世界顶尖的独立第三方实验室,其材料分析和失效分析实验室配备了全套的高端分析仪器,并搭建起了
开放式的专业分析平台,拥有世界一流的实验室设备,如:高分辨透射电镜(HR-TEM),双束聚焦离子束(Dual Beam
FIB),场发射扫描电镜(FE-SEM),飞行时间二次离子质谱仪(TOF-SIMS),动态二次离子质谱仪(D-SIMS),X射
线光电子能谱仪(XPS/ESCA)等。胜科纳米拥有众多的专家级分析人员,均拥有十多年海外从业经历。他们非常熟悉
相关工艺流程,且具有超强的设计、试验及分析能力。我们提供7天24小时不间断的一站式服务,随时为贵公司项目及
产品的研发、生产、客服提供最专业最快捷的分析服务。
“Our mission is to be the preferred analytical solution provider
for R&D and manufacturing company through our stringent
quality control and excellent customer service.”
“我们的服务宗旨是通过对服务质量的严格把关和提供卓越
的客户服务,成为研发及制造业的首选分析服务商。”
Li Xiaomin
Managing Director
COMPANY PROFILE
WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS.
“
missio
to be
prefe
analy
solu
provider for R&D and manufacturing company through our string
quality control and excellent customer service.”
“
”
vement
3D
X-‐Ray
EMMI
OBIRCH
Project
TEM
SEM
ESD
Thermal
FIB
Auger
SIMS
XPS
WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our
professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis.
WinTech Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF-
SIMS, D-SIMS, XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production
customers.
HR- TEM ,
Dual Beam FI B FE- SEM TOF- SI MS
D- SI MS X XPS/ ESCA
7 24
Quality Assured
TOP15
SME
2011
3. 1
SINGAPORE:
WinTech Nano-Technology Services Pte. Ltd.
The Alpha, 10 Science Park Road, Science Park II
Tel: +65-67777354
SUZHOU (CHINA):
99 NW-09-507
+86-512-62800006
COMPANY PROFILE
MODULE TEAM 分析能力
Structure Analysis 结构分析
SEM, FIB, TEM, Ion Milling, EBSD…
Material Analysis材料分析
TOF-SIMS, D-SIMS, XPS, Auger, AFM, FTIR, CT…
Electrical Testing电性分析
OBIRCH, EMMI, CAFM, AFP, Thermal, TDR, ESD..
PROJECT TEAM项目团队能力
Project team provides customized mid-term and
long-term technology assessment. Members over
10 years expertise in advanced analytical lab.
Our international expert advisory board provides
technical support.
项目团队通过目标管理,结合行业专家,长期提供
系统集成化的专业技术分析服务。
TURNAROUND TIME交货时间
WinTech is your 24-hour service lab. Our
standard turnaround time is 3 days (including
weekends and holidays). For urgent requests,
the delivery time is 24 hours.
实验室7天24小时运作,服务交付时间 为3天(含
周末及节假日),加急服务交付时间为24小时。
INFORMATION SECURITY 保密信息
WinTech provides 3 level of information security to
ensure the highest standard for our customer.
- NDA coverage for legal perspective
- Physical sample storage and information firewall
- VPN secured line login for data transmission
实验室提供最高3层保密层级:保密协议,物理信
息隔离,VPN专用数据网。
Our Network 我们的网络
Website: www.wintech-nano.com
Email: sales@wintech-nano.com
4. 2
PRODUCT ANALYSIS
SYSTEM/PACKAGE LEVEL ANALYSIS
WinTech Nano provide full range of package related analysis.
For Product Engineering: 2.5D/3D, BGA, QFN, Flip Chip, SOP, CSP, WLP, SOC,
SiP, PCB, Lead Frame, Wire, EMC, Chemical
Au
PdNi
Ni
=50 µm; IPF_X0; Step=1 µm; Grid199x175
##9 1$' ;!##!%7
; 7
)%! ;** '
! ;
#,% ;
;
)!% ;
5. 3
PRODUCT ANALYSIS
系统及封装分析
For Process Engineering: TSV, Sawing, DA, WB, Bumping, Plating, Molding, SMT
Testing, Failure Analysis, Reliability
K)%*$!.%
68707274767880828486
0
10
20
30
40
0
2000
4000
6000
8000
10000
12000
14000
16000
Binding Energy (eV)
c/s
!
#
Cu9Al4
CuAl2
Al Pad
Cu Wire
)%! ;** '
## !
'%9 )+ ;
2 ;9 1)
2 ; :
!) ;
)%! ;
! Non Destructive X-Ray CT scan
! Package metal fuse or bridging
! Wire Bond failure
! Solder bump void/crack
! PCB via open/short
! Surface contamination
! Metal surface oxidation
! Trace element analysis
! Thermal heat distribution
! Package reflow warpage
! C
! E
! Ju
! ga
! M
! Im
! S
! LE
! S
! E
! nA
6. 4
)
*
, -
/.
# ! # )*
# )
*
## ) *
# #
PRODUCT ANALYSIS
IC DIE LEVEL ANALYSIS
Our wafer fabrication knowledge extending into latest technology node.
For Product Engineering: SOI, Bulk Si, CPU, Memory, Analog, Digital, RF, MEMS,
Si Interposer
12. #!
!
$')+1) ; )$#
+)1+1) ;',#
B ;
;
1')#/ ; '!+2!# ;
!*#,% ;
;
PRODUCT ANALYSIS
III-V and II-VI 光电元器件
WinTech is serving world top 5 LED and RF manufacturer.
For Product Engineering: LED in GaN, GaAs, GaP, InP, Sapphire, HEMT,
VCSEL, DFB, PIN, Optoelectronics, Fiber Optics,
For Process Engineering: MOCVD, MBE, Litho, Etch, Saw, DA, WB, Bump,
Bond, Mold, Plating
23. 8
CUSTOMIZED ANALYSIS
Leader in Lab Services 世界一流实验室
Our leading analytical services are serving not only electronic and semiconductor but
also chemical, consumer, biotech, aerospace industries and many other research
organizations.
1*+$!4
%#3*!*
Finger Print (TOF-SIMS)
World Leading Analysis
Surface Element
Quantification
Top Surface
Interface
Material
Structure
3D Imaging
X-ray /
Element /
Organic
Nano Beam
Electron
Diffraction
(NBED)
2.5D/3D IC
Electrical
Physical FA
Nano Particle (TEM)
Human Hair (SEM)WinTech Logo (FIB)a-Si Pyramid (TEM)
AR Coating (TEM, SIMS)
Nano Pattern (FIB)
Paper (SEM)
!