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COMPANY PROFILE
WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS.
您的成功就是胜科的成功。
WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our
professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis. WinTech
Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF-SIMS, D-SIMS,
XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production customers.
胜科纳米是世界顶尖的独立第三方实验室,其材料分析和失效分析实验室配备了全套的高端分析仪器,并搭建起了
开放式的专业分析平台,拥有世界一流的实验室设备,如:高分辨透射电镜(HR-TEM),双束聚焦离子束(Dual Beam
FIB),场发射扫描电镜(FE-SEM),飞行时间二次离子质谱仪(TOF-SIMS),动态二次离子质谱仪(D-SIMS),X射
线光电子能谱仪(XPS/ESCA)等。胜科纳米拥有众多的专家级分析人员,均拥有十多年海外从业经历。他们非常熟悉
相关工艺流程,且具有超强的设计、试验及分析能力。我们提供7天24小时不间断的一站式服务,随时为贵公司项目及
产品的研发、生产、客服提供最专业最快捷的分析服务。
“Our mission is to be the preferred analytical solution provider
for R&D and manufacturing company through our stringent
quality control and excellent customer service.”
“我们的服务宗旨是通过对服务质量的严格把关和提供卓越
的客户服务,成为研发及制造业的首选分析服务商。”
Li Xiaomin
Managing Director
COMPANY PROFILE
WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS.
	
  
“
missio
to be
prefe
analy
solu
provider for R&D and manufacturing company through our string
quality control and excellent customer service.”
	
  
“
”
vement
3D	
  	
  	
  	
  
X-­‐Ray	
  
EMMI	
  
OBIRCH	
   Project	
  
TEM	
  
SEM	
  
ESD	
   Thermal	
  
FIB	
  
Auger	
  
SIMS	
  
XPS	
  
WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our
professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis.
WinTech Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF-
SIMS, D-SIMS, XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production
customers.
	
  
HR- TEM ,
Dual Beam FI B FE- SEM TOF- SI MS
D- SI MS X XPS/ ESCA
7 24
	
   	
  
	
  
Quality Assured
TOP15	
  SME	
  2011	
  
1
SINGAPORE:
WinTech Nano-Technology Services Pte. Ltd.
The Alpha, 10 Science Park Road, Science Park II
Tel: +65-67777354
SUZHOU (CHINA):
99 NW-09-507
+86-512-62800006
COMPANY PROFILE
MODULE TEAM 分析能力
Structure Analysis 结构分析
SEM, FIB, TEM, Ion Milling, EBSD…
Material Analysis材料分析
TOF-SIMS, D-SIMS, XPS, Auger, AFM, FTIR, CT…
Electrical Testing电性分析
OBIRCH, EMMI, CAFM, AFP, Thermal, TDR, ESD..
PROJECT TEAM项目团队能力
Project team provides customized mid-term and
long-term technology assessment. Members over
10 years expertise in advanced analytical lab.
Our international expert advisory board provides
technical support.
项目团队通过目标管理,结合行业专家,长期提供
系统集成化的专业技术分析服务。
TURNAROUND TIME交货时间
WinTech is your 24-hour service lab. Our
standard turnaround time is 3 days (including
weekends and holidays). For urgent requests,
the delivery time is 24 hours.
实验室7天24小时运作,服务交付时间 为3天(含
周末及节假日),加急服务交付时间为24小时。
INFORMATION SECURITY 保密信息
WinTech provides 3 level of information security to
ensure the highest standard for our customer.
-	 NDA coverage for legal perspective
-	 Physical sample storage and information firewall
-	 VPN secured line login for data transmission
实验室提供最高3层保密层级:保密协议,物理信
息隔离,VPN专用数据网。
Our Network 我们的网络
Website: www.wintech-nano.com
Email: sales@wintech-nano.com
2
PRODUCT ANALYSIS
SYSTEM/PACKAGE LEVEL ANALYSIS
WinTech Nano provide full range of package related analysis.
For Product Engineering: 2.5D/3D, BGA, QFN, Flip Chip, SOP, CSP, WLP, SOC,
SiP, PCB, Lead Frame, Wire, EMC, Chemical
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PRODUCT ANALYSIS
系统及封装分析
For Process Engineering: TSV, Sawing, DA, WB, Bumping, Plating, Molding, SMT
Testing, Failure Analysis, Reliability
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!   Package metal fuse or bridging
!   Wire Bond failure
!   Solder bump void/crack
!   PCB via open/short
!   Surface contamination
!   Metal surface oxidation
!   Trace element analysis
!   Thermal heat distribution
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PRODUCT ANALYSIS
IC DIE LEVEL ANALYSIS
Our wafer fabrication knowledge extending into latest technology node.
For Product Engineering: SOI, Bulk Si, CPU, Memory, Analog, Digital, RF, MEMS,
Si Interposer
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PRODUCT ANALYSIS
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For Process Engineering: Epitaxial, Litho, Implant, Diffusion, CVD PVD, ALD, Etch
CMP, CleanTech, Plating, TSV, Wafer Bonding, Metrology
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!   PCB via open/short
!   Surface contamination
!   Metal surface oxidation
!   Trace element analysis
!   Thermal heat distribution
!   Package reflow warpage
!   CMOS defect in metal trace, via
!   ESD and EOS damage isolation
!   Junction damage,
!   gate oxide breakdown
!   Memory single bit failure
!   Implantation/Diffusion defect
!   Substrate dislocation
!   LED and Solar damage
!   Soft defect identification
!   EBAC/EBIC analysis
!   nA leakage localization
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PRODUCT ANALYSIS
III-V and II-VI 光电元器件
WinTech is serving world top 5 LED and RF manufacturer.
For Product Engineering:	LED in GaN, GaAs, GaP, InP, Sapphire, HEMT,
	 VCSEL, DFB, PIN, Optoelectronics, Fiber Optics,
For Process Engineering:	MOCVD, MBE, Litho, Etch, Saw, DA, WB, Bump,
	 Bond, Mold, Plating

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Wintech-Nano Corp Broch-new version

  • 1.
  • 2. COMPANY PROFILE WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS. 您的成功就是胜科的成功。 WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis. WinTech Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF-SIMS, D-SIMS, XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production customers. 胜科纳米是世界顶尖的独立第三方实验室,其材料分析和失效分析实验室配备了全套的高端分析仪器,并搭建起了 开放式的专业分析平台,拥有世界一流的实验室设备,如:高分辨透射电镜(HR-TEM),双束聚焦离子束(Dual Beam FIB),场发射扫描电镜(FE-SEM),飞行时间二次离子质谱仪(TOF-SIMS),动态二次离子质谱仪(D-SIMS),X射 线光电子能谱仪(XPS/ESCA)等。胜科纳米拥有众多的专家级分析人员,均拥有十多年海外从业经历。他们非常熟悉 相关工艺流程,且具有超强的设计、试验及分析能力。我们提供7天24小时不间断的一站式服务,随时为贵公司项目及 产品的研发、生产、客服提供最专业最快捷的分析服务。 “Our mission is to be the preferred analytical solution provider for R&D and manufacturing company through our stringent quality control and excellent customer service.” “我们的服务宗旨是通过对服务质量的严格把关和提供卓越 的客户服务,成为研发及制造业的首选分析服务商。” Li Xiaomin Managing Director COMPANY PROFILE WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS.   “ missio to be prefe analy solu provider for R&D and manufacturing company through our string quality control and excellent customer service.”   “ ” vement 3D         X-­‐Ray   EMMI   OBIRCH   Project   TEM   SEM   ESD   Thermal   FIB   Auger   SIMS   XPS   WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis. WinTech Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF- SIMS, D-SIMS, XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production customers.   HR- TEM , Dual Beam FI B FE- SEM TOF- SI MS D- SI MS X XPS/ ESCA 7 24       Quality Assured TOP15  SME  2011  
  • 3. 1 SINGAPORE: WinTech Nano-Technology Services Pte. Ltd. The Alpha, 10 Science Park Road, Science Park II Tel: +65-67777354 SUZHOU (CHINA): 99 NW-09-507 +86-512-62800006 COMPANY PROFILE MODULE TEAM 分析能力 Structure Analysis 结构分析 SEM, FIB, TEM, Ion Milling, EBSD… Material Analysis材料分析 TOF-SIMS, D-SIMS, XPS, Auger, AFM, FTIR, CT… Electrical Testing电性分析 OBIRCH, EMMI, CAFM, AFP, Thermal, TDR, ESD.. PROJECT TEAM项目团队能力 Project team provides customized mid-term and long-term technology assessment. Members over 10 years expertise in advanced analytical lab. Our international expert advisory board provides technical support. 项目团队通过目标管理,结合行业专家,长期提供 系统集成化的专业技术分析服务。 TURNAROUND TIME交货时间 WinTech is your 24-hour service lab. Our standard turnaround time is 3 days (including weekends and holidays). For urgent requests, the delivery time is 24 hours. 实验室7天24小时运作,服务交付时间 为3天(含 周末及节假日),加急服务交付时间为24小时。 INFORMATION SECURITY 保密信息 WinTech provides 3 level of information security to ensure the highest standard for our customer. - NDA coverage for legal perspective - Physical sample storage and information firewall - VPN secured line login for data transmission 实验室提供最高3层保密层级:保密协议,物理信 息隔离,VPN专用数据网。 Our Network 我们的网络 Website: www.wintech-nano.com Email: sales@wintech-nano.com
  • 4. 2 PRODUCT ANALYSIS SYSTEM/PACKAGE LEVEL ANALYSIS WinTech Nano provide full range of package related analysis. For Product Engineering: 2.5D/3D, BGA, QFN, Flip Chip, SOP, CSP, WLP, SOC, SiP, PCB, Lead Frame, Wire, EMC, Chemical Au PdNi Ni =50 µm; IPF_X0; Step=1 µm; Grid199x175 ##9 1$' ;!##!%7 ; 7 )%! ;** ' ! ; #,% ; ; )!% ;
  • 5. 3 PRODUCT ANALYSIS 系统及封装分析 For Process Engineering: TSV, Sawing, DA, WB, Bumping, Plating, Molding, SMT Testing, Failure Analysis, Reliability K)%*$!.% 68707274767880828486 0 10 20 30 40 0 2000 4000 6000 8000 10000 12000 14000 16000 Binding Energy (eV) c/s ! # Cu9Al4 CuAl2 Al Pad Cu Wire )%! ;** ' ## ! '%9 )+ ; 2 ;9 1) 2 ; : !) ; )%! ; !   Non Destructive X-Ray CT scan !   Package metal fuse or bridging !   Wire Bond failure !   Solder bump void/crack !   PCB via open/short !   Surface contamination !   Metal surface oxidation !   Trace element analysis !   Thermal heat distribution !   Package reflow warpage !   C !   E !   Ju !   ga !   M !   Im !   S !   LE !   S !   E !   nA
  • 6. 4 ) * , - /. # ! # )* # ) * ## ) * # # PRODUCT ANALYSIS IC DIE LEVEL ANALYSIS Our wafer fabrication knowledge extending into latest technology node. For Product Engineering: SOI, Bulk Si, CPU, Memory, Analog, Digital, RF, MEMS, Si Interposer
  • 7. 5 . # ) ( * # !! ) * $ ) ( * -1
  • 8. ) * ## )( * /0 ) * PRODUCT ANALYSIS 芯片分析 For Process Engineering: Epitaxial, Litho, Implant, Diffusion, CVD PVD, ALD, Etch CMP, CleanTech, Plating, TSV, Wafer Bonding, Metrology . # ) ( * # !! ) * $ ) ( * -1
  • 9. ) * ## )( * /0 ) * !   Non Destructive X-Ray CT scan !   Package metal fuse or bridging !   Wire Bond failure !   Solder bump void/crack !   PCB via open/short !   Surface contamination !   Metal surface oxidation !   Trace element analysis !   Thermal heat distribution !   Package reflow warpage !   CMOS defect in metal trace, via !   ESD and EOS damage isolation !   Junction damage, !   gate oxide breakdown !   Memory single bit failure !   Implantation/Diffusion defect !   Substrate dislocation !   LED and Solar damage !   Soft defect identification !   EBAC/EBIC analysis !   nA leakage localization
  • 10. 6 @8 L?? @8 L?@ @8 L?A @8 L?B @8 L?C @8 L?D @8 L?E @8 L@E @8 L@F @8 L@G @8 L@H @8 LA? @8 LA@ @8 LAA ? @?? A?? B?? C?? D?? E??
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  • 12. #! ! $')+1) ; )$# +)1+1) ;',# B ; ; 1')#/ ; '!+2!# ; !*#,% ; ; PRODUCT ANALYSIS III-V and II-VI 光电元器件 WinTech is serving world top 5 LED and RF manufacturer. For Product Engineering: LED in GaN, GaAs, GaP, InP, Sapphire, HEMT, VCSEL, DFB, PIN, Optoelectronics, Fiber Optics, For Process Engineering: MOCVD, MBE, Litho, Etch, Saw, DA, WB, Bump, Bond, Mold, Plating
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  • 22. 240 200 160 120 80 40 0 2001000μm Na+ MC:102;TC:2.577e+006 100 80 60 40 20 0 240 200 160 120 80 40 0 2001000μm K+ MC:44;TC:2.950e+005 40 30 20 10 0 #** % 2 % ; : !(1! )3*+# ; )' ;+3#1* )#) ; 0 50 100 150 200 250 0 10 20 30 40 50 60 70 80 90 100 Depth (nm) AtomicConcentration(%) O1s Ga2p3 In3d5 Zn2p3 %7 % 480482484486488 SnO2 SnO Sn !% !#$ ; 9 ;9 ; 9 ; #) !#+) ; PRODUCT ANALYSIS DISPLAY PANEL 触摸显示屏 Display panel is the key industry in future product. For Product Engineering: LCD, OLED, Array, Cell, Module, In-Cell, On-Cell, OGS, Metal Mesh, Glass, ACF, COG, Flex, OCA, PET For Process Engineering: CVD/PVD, Litho, Implant, Sputter, Etch, Grind, Bond, a-Si, IGZO, LTPS
  • 23. 8 CUSTOMIZED ANALYSIS Leader in Lab Services 世界一流实验室 Our leading analytical services are serving not only electronic and semiconductor but also chemical, consumer, biotech, aerospace industries and many other research organizations. 1*+$!4 %#3*!* Finger Print (TOF-SIMS) World Leading Analysis Surface Element Quantification Top Surface Interface Material Structure 3D Imaging X-ray / Element / Organic Nano Beam Electron Diffraction (NBED) 2.5D/3D IC Electrical Physical FA Nano Particle (TEM) Human Hair (SEM)WinTech Logo (FIB)a-Si Pyramid (TEM) AR Coating (TEM, SIMS) Nano Pattern (FIB) Paper (SEM) !
  • 24. %!# $!/ 81%! ) %$#)9 1%! '$! %) = # = # = # = # = K J= K 1#
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  • 28. Analytical Techniques Spot Size Vs Signal Depth
  • 29. CAPABILITIES One Stop Solution Lab 一站式分析服务 Today, a cutting-edge integrated circuit (IC) easily consists of over 100 million transistors with a critical dimension below 14 nanometers. In order to analyze the interiorofburiedstructureofthemicro/nano-scaleregion,groupofadvancetechnique are irreplaceable solution for root cause analysis and customer satisfaction. NDT: 3D X-Ray, CSAM, Thermal, TDR Electrical Analysis Fault Isolation: EMMI, OBIRCH, EBAC Circuit Edit Probing Fault Localization: CAFM, Nano-probing, AFP Structure Analysis RIE, Stain SEM, EBSD Ion Milling Reliability Test: ESD, HTSL, PCT, HAST, TC Consultation Service Hardness, Shadow Moire, Solderability Material Characterization Top surface: TOF-SIMS, XPS, Auger, TXRF Thin film: D-SIMS, EDX, FTIR, Ellipsometry, XRF, XRD Chemical: ICP-MS, IC, GC-MS, LC-MS Thermal: TGA, DSC, DMA, TMA Wafer Storage Life Qualification Bond Pad Qualification DB-FIB, HR-TEM Counterfeit Verification Construction Analysis Modelling, Simulation Dual Beam FIB XPS TEMD-SIMSOBIRCH
  • 30. 胜科纳米(苏州)有限公司Suzhou (China) 电话:+86-512-62800006 传真:+86-512-62800007 地址:苏州工业园区金鸡湖大道99号苏州纳米城NW-09-507 邮编:215123 网站: www.wintech-nano.com 电邮: sales@wintech-nano.com Copyright ©2014 WinTech Nano-Technology Services Pte. Ltd. WinTech Nano-Technology Services Pte. Ltd. 10 Science Park Road #03-26, The Alpha Singapore Science Park II Singapore 117684 tel: +65 67777354 fax: +65 67772462 Website: www.wintech-nano.com Email: sales@wintech-nano.com