Hugo Pristauz

Austria area Austria

VP Advanced Technology Development @ Besi Austria, Technology Angel & Catalyst for Innovation

Manufacturing

Passionate about cutting edge technology and making the impossible possible! Since begin of the millennium working in equipment business for emerging semiconductor packaging technologies, responsible for R&D and product management while carrying business ownership for flip-chip bonders, RFID assembly lines, thermo compression bonders, and wafer level fan-out bonders. The world's biggest install base of flip chip bonders - the famous Datacon 8800 flip chip platform (ba-ba-lin-lin), soon reaching a number of 1000 installations, has been grown in a marvelous team work of great colleagues and employees under my leadership. Now focusing on technology scouting and networking in order to suppo...