How to Troubleshoot Apps for the Modern Connected Worker
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Audio Low Power and Closed Lid Enhancements for Intel Platforms
1. Audio Low Power and Closed Lid
Enhancements for IntelÂŽ Platforms
ICPS008
Devon Worrell
Intel Corporation
Audio Architect
Henry Wong
DTS, Inc
Sr. Product Manager
Ming-Jane Hsieh
Realtek Semiconductor Corp.
Project Manager
2. 2
Agenda
⢠Importance and Value of Good Audio
⢠The Next Generation
⢠Next Generation of audio processing technologies
⢠DTS* Premium Suite* Logo and Certification
⢠Notebook PC Not a Brick When the Lid
is Closed
⢠Ultra Low Power Microphones
⢠Demo of Speech Recognition
⢠Closed Lid usages and Design Recommendations
⢠Designing Low Power Audio Hardware
⢠Realtek* Vienna
⢠Display Audio improvements
⢠Demos
⢠Voice Wake Capability
⢠Long Music Playback
⢠Speech Recognition
⢠Next Steps
⢠Q&A
3. 3
Introduction and Overview
⢠Importance of Audio
⢠Notebook Audio Consumption
⢠OEM Value-Add Opportunity for
DTS Premium SuiteTM
⢠Logo Program
⢠DTS Premium Suite IITM Features
⢠Tuning & Certification
Henry Wong
Sr. Product Manager
4. Importance of Audio
4
0% 25% 50% 75% 100%
Watch DVD/Blu-ray movies
Watch movies on internet
Watch TV on internet
Watch other video on internet
Play games
Listen to music
Use the internet
US
Germany
Japan
⢠Up to 79% of notebook users consume
audio
⢠6 out of top 7 usages show that audio is
an essential part of consumer PC
experience
79%
Independent market survey by third party marketing research firm
Base: All laptop respondents (US, n=897; Germany, n=906, Japan, n=898)
5. Notebook Audio Consumption
0 20 40 60 80 100
Japan
Germany
US
Built-in speakers
Headphones
External speakers
5
92%
⢠Up to 92% of audio experience from users are via built-in
speakers
⢠More than 55% via headphones
Independent market survey by third party marketing research firm
Base: All laptop respondents (US, n=897; Germany, n=906, Japan, n=898)
6. $217
Value-Add
⢠Consumers are willing to pay up to an additional $217 for better
audio experience and solution for PC with DTS Premium SuiteTM
6
Laptop US Germany Japan
Acceptable Incremental Price $150-200 âŹ99-129 ÂĽ10320-15800
Converted to USD $141-184 $110-168
Desktop US Germany Japan
Acceptable Incremental Price $107-163 âŹ99-152 ÂĽ10000-18330
Converted to USD $141-217 $106-195
Note: In order to better understand the price consumers are willing to pay for a particular product or service, Dutch
economist Peter van Westendorp developed the Price Sensitivity Meter. The van Westendorp PSM gauges thresholds and
provides a range of acceptable prices. The underlying premise of this model is that there is a relationship between price and
quality and that consumers are willing to pay more for a higher quality product.
Base: US laptop respondents (N=638), Germany laptop respondents (N=563), Japan laptop respondents (N=539)
US desktop respondents (N=66), Germany desktop respondents (N=70), Japan desktop respondents (N=70)
7. 7
Designing for the Next Generation
⢠Logo Program
⢠Next Generation of audio
technologies
⢠DTS Premium SuiteTM Service
8. Logo Program
DTS Premium SuiteTM DTS Premium Suite IITM
8
Product in
market today
SDK targeted
for Q4 2010
9. DTS Premium Suite IITM
⢠Complete PC audio technology chain â from input to output
⢠Enabling exciting new usages by combining capture and
render technologies
⢠Significant opportunities for OEMs to improve audio
entertainment
9
10. DTS Clear VoiceTM
⢠Microphone array processing
⢠Improve speech perception in noisy environment with following
technologies:
â Noise Suppression | Acoustic Echo Cancellation | Beam Forming
⢠Focus reception on desired user; suppress feedback from local
loudspeakers; and reject contribution from undesired external
sound sources
⢠High-performance, low latency, efficient microphone array
processing solution to enrich speech recognition, text-to-speech,
voice info-snacking, voice based activation, etc.
10
11. DTS Clear AudioTM
11
⢠Environment Noise Compensation
⢠Intelligently increase the gain at specific frequencies to
counterbalance the undesired signal when noise is detected
⢠Automatically adjust over when and where is needed (time &
frequency domain)
12. DTS Audio RestorationTM
⢠Adaptive Dynamic Enhancement
⢠Intelligently analyze the audio signal for restoration of
compressed or âre-masteredâ percussion and transient
sounds
⢠Brings back the âpunchâ and âclarityâ from dynamic range
compression
12
Peaks of original mix are
squashed after re-mastered
Enhances the dynamic range
and brings back the original
life into the music
13. DTS EnhanceTM
⢠Low and high frequency enhancement
⢠Improve natural timbre balance
⢠Brighten the quality of voice and musical tone
⢠Bandwidth extension for low-bit rate encoded audio
â MP3, streaming audio, internet TV, etc.
13
Original audio
Enhances the low &
high frequencies
14. Tuning & Certification
DSP Vendors OEM / ODM
DTSPSReady
DTS IC
Certification
DTS User
experience
testing vectors
DTS PS User
Experience
Certification
Certified DSP
with Drivers
Final Product
Certification by
Commonality on
additional
products
DTS Source code
and Certification
reference data
14
Assures Ultimate Sound in PC
16. 16
Not a Brick When Lid Closed
⢠Existing Power Challenge
⢠Ultra Low Power Microphones
⢠Voice Based Activation
⢠Closed Lid usages and Design
Recommendations
⢠Demo
Devon Worrell
Audio Architect
17. It does not have toâŚ
HowâŚ
When you close the lid,
your PC turns into a
âBRICKâ
18. 18
Closed Lid, Not a BrickâŚ
â Speakers and Microphones are in 100% of Notebooks
â But you canât use them, even open lid, for many uses
because⌠Placement, Power, Ease of Use and Fidelity
⢠These are actually easy to fix⌠we are already
working to enable several âwowâ usages
â Commanding your PC using speaker-independent
Speech Recognition with small vocabulary grammars
â Responding to commands with Text to Speech,
entertainment such as Music Playback and
Communications⌠all with only the Speakers and
Microphones already there
⢠Notebooks already have the fundamentals
for usages that work âClosed Lidâ
20. 20
Acceleration
Sub
Native
speakers
Amp
MEMS Array
Mixed
Signal
Codec
Audio
DSP
1 MB
Integrated RAM
Voice Enabled
Applications
Noise Reduction
Processing and
Echo Cancelation
Recognition
engines
Microphone Power
High Power Challenging
⢠Intel working with 3rd parties to
provide dramatic power savings and
new usages for Microphones
⢠DSP Microphone noise reduction
processing for low power & better AEC
⢠Voice-activation provided enabling
recognition that always works
⢠No need for DMA always running
Calpella with ARD C2/IBX B3 Uncore & core only
Package
C0 (%)
Power
(Watts)
Idle Reference (Win-7) 0.7 0.391
Speech
recognition
noise cancellation Off 14.5 2.069
noise cancellation On
38.8 3.611
Skype
conference call
noise cancellation Off 24.5 1.977
noise cancellation On 38.8 2.719
Active â 300-400mW
Sx â 10mW Drops to
Host Based
Sub
Native
speakers
Amp
MEMS Array
Mixed
Signal
Codec
Voice Enabled
Applications
Noise Reduction
Processing
Recognition
engines
Echo
Cancelation
20
21. 21
Processor & PCH
hardware
Ultra Low Power Microphones
Enable New Usages
Ÿ Voice Based Activation
§ Bursts voice only when
detected lowering power and
increasing recognition accuracy
Acceleration
Processor
Fan and
voltage
Controls
Environment
acoustic state
monitoring
Microphone
noise
reduction
Controls
Voice
stream
Ÿ Room Acoustics
§ Lowers platform power by allowing fans
to cool system when in noisy
environment
§ Smart volume, controls level of render
to same level above room sound level
§ Improved speaker Fidelity using
microphone feedback
§ Enables OS to behave as a âpersonâ
would, such as stopping background
tasks in a quiet environment
§ Slow fans while recognizing speech
Audio Hardware vendor
IP / Firmware vendor
ISVs
Intelâs Technology
Existing Software
Voice enabled
Applications such
as VoIP and Media
playback
Voice Recognition,
UI and Grammar
Engine
OS
processing
behavior
changes
based on
room sound
Room sound level
Activation
(wake)
Burst Buffer
Voice
Detection
22. Voice Based Activation
Enabling Speech Recognition with Low Power
⢠Hierarchical Audio Processing Reduces power and enhances
speech recognition
⢠Ultra Low Power Microphone interface in Hardware
⢠Thresholding hardware
â âActivatesâ system or DSP if present
⢠Buffering allows listen back in time after activation
2+ second
buffer
Activation of DSP or
system if no DSP
Hardware Acceleration
Hardware
threshold
Detection
Audio Hardware vendor
IP / Firmware vendor
ISV e.g. media player or VoIP application like Skype*
Low
Power
clock & I/F
Voice enabled
Apps e.g. Media
(iTunes*) and
Telephony (Skype*)
New API for
easy voice
enabling in
applications
Grammar
Processing
New Codec Hardware
Processed Audio
samples
Speaker Identification &
keyword recognition
Firmware
⢠Speaker identification used for
Better Privacy and Security
22
23. 23
Closed Lid Audio
Could be as simple as a Notch
§ Microphones on lid exposed through notch when closed
microphones
Speakers
notch
23
24. 24
Low Power Audio Hardware
⢠Realtek* Vienna
⢠Display Audio Improvements
⢠Demo - Voice Wake
⢠Demo - Long Music Playback
Ming-Jane Hsieh
Product Manager
25. 25
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33343536373839404142434445464748
49
50
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59
60
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64
PVDD1
SPDIF-OUT
PVSS2
AVDD2
SPK-OUT-L+
AVSS2
SPK-OUT-L-
EAPD
SPK-OUT-R-
SPK-OUT-R+
PVDD2
PVSS1
CBP
MIC1-VREFO-L
VREFforDie1
AVSS1
AVDD1
CBN
CPVEE
MIC1-VREFO-R
MIC2-VREFO
CPVREF
HPOUT1-R
HPOUT1-L
LINE1-L
LINE1-R
Sense A
MIC1-R
MIC1-L
Sense B
MONO/LFE-OUT
JDREF
MIC2-L
MIC2-R
LINE2-L/SURR-OUT-L
LINE2-R/SURR-OUT-R
SDATA-OUT
BCLK
SDATA-IN
SYNC
RESET#
GPIO0/DMIC-DATA
PD#
DVDD-CORE
DVDD-IO
PCBEEP/TRST#
DVSS
GPIO1/DMIC-CLK
SPDIF-IN
DMIC-DATA2
DMIC-CLK2
DVSS
FRONT/SIDE-OUT-R
FRONT/SIDE-OUT-L
CENTER-OUT
GPIO2/I2SLRCK/TMS
GPIO3/I2SCLK/TCLK
GPIO4/I2SSDI/TDI
GPIO5/TDO
HPOUT2-L
HPOUT2-R
VREFforDie2
DACREForAVDD3
NC
QFN48 Exposed Pad (5x5mm)
QFN64 Exposed Pad (6x6mm)
ALC5503
Vienna
Audio DSP
Realtek Vienna
⢠Provides Blu-ray* audio
decoding
⢠Post Processing for
premium quality sound
⢠Enables DTS* logo
program
⢠Premium audio for
IntelÂŽ Display Audio
⢠Extended Playback
⢠Voice Wake
⢠More than 2 watts of
power savings for
playback and
microphones usages
25
26. 26
DTS* Premium Suite*
For Display Audio
â˘One Driver âpackageâ being
developed for both external
and display audio
â˘Improves Usability by allowing
audio to be dynamically moved
â˘Enabled DTS* Premium Suite*
for devices attached to Intelâs
display interfaces such as
HDMI* & Display Port
Private communication
between drivers to
coordinate the audio
devices exposed
Chipset
Integrated
Display
Audio
DSP Codec
Player
applications
Audio is sent from back
from Vienna to HDMI or
Display Port devices
through system memory
âHDMIâ
function
emulation
for the DSP
HP
Spkrs
Mic
Intel High
Definition
Audio
Existing
outputs and
input
converters
Mixer
Display Audio driver
from Realtek*,
replaces the Intel
driver and does not
expose devices
Physical Codec
down driver which
contains a Logical
HDMI functionality
for the Vienna
acceleration
Other or Real-
time
application
Unified Primary & Display
based Audio Available Soon
26
27. Demo
Extended Music Playback
27
0
10
20
30
PowerinWatts
Time (about one minute)
Traditional music playback ULMP playback
12.67
4.65
0
5
10
15
Traditional Playback ULMP playback
Average Platform Power (W)
⢠Utilizing an audio DSP, music plays
while system stays in S3
⢠Short duration âpop-upsâ used to
quickly load more content into DSP
As much as 20 hours of Music
Playback achievable
Measurements taken using Calpella
reference board with Intel Core i7 @
2.67GHz, Arrandale C2/Ibex Peak B3. SSD
80GB (Postville 34nm) with IMSM
7.0.0.1013. Microsoft Windows 7 32-bit
Ultimate with DDR3 2x1GB 1067. Sony
Optiarc BD 5500S optical drive connected.
VGA display set to 12x10 mode with
integrated graphics driver 8.15.10.2119
28. Demo Voice Wake Hardware
Dedicated Hardware Listens for Voice
28
DCU
Host
HD Audio
I/F
HD
Audio
BCLK
RST
SYNC
SDO
SDI
Bank0~2
SRAM
(768KB)
CPU
End address
Trigger
Pointer
Stop
Pointer
Start address
DMIC
Decimation
Filter
AI
Bank3
SRAM
(256KB)
Trigger
System
Wake
N samples
Interrupt
VAD
DMA
RingBuffer
⢠Dedicated Hardware continuously listens and stores audio
for later retrieval after system wakes
⢠Using HD Audio Wake, hardware initiates resume from S3
when audio exceeds a preset threshold
( )CountSample
LevelEnergy
dBPE _
_
log20)( ´=>
30. 30
Demo
Closed-Lid Voice Info-Snacking
â˘Use voice to retrieve and listen to
information while walking or driving
â âWhere is my next meeting?â
â âGet new emailâ
â âPlay musicâ and âStop Musicâ
â âCall Devon Worrellâ
The Convenience of Closed Lid
Usages will Wow End Users
32. Summary
⢠Consumers value Audio in key usages and are willing to
pay over $200 for better PC audio experience
⢠Realtek* Vienna and DTS* Premium Suite* Products &
technology are ready for adoption now
⢠As much as 20 hours of music playback on battery
possible using Audio DSP
⢠Convenience of Closed Lid Usages will Wow End Users
⢠Adoption of simple Co-layout board design allows for
audio with or without Vienna DSP Codec
⢠Unified Primary & Display based Audio available soon
⢠Next Generation DTS* Premium Suite II* targeted to
be Available Q4 2010
32
33. Next Steps
⢠Design your systems with both Realtek* Vienna
and DTS* Premium Suite*
⢠Chassis supporting Speakers & Mics closed lid
⢠Adopt a single unifying software and driver
package for âDownâ and âDisplayâ audio
⢠Reduce your systemâs Audio Power
Consumption for key usages
⢠Provide Closed Lid audio, enabling new Voice &
Speech features that will wow your end users
⢠Improve the usability of your Systemâs audio
for displays
33
Which WillâŚ
35. Legal Disclaimer
⢠INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTELŽ PRODUCTS.
NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPETY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELâS TERMS
AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTELÂŽ PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO
FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
⢠Intel may make changes to specifications and product descriptions at any time, without notice.
⢠All products, dates, and figures specified are preliminary based on current expectations, and are
subject to change without notice.
⢠Intel, processors, chipsets, and desktop boards may contain design defects or errors known as
errata, which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
⢠Performance tests and ratings are measured using specific computer systems and/or
components and reflect the approximate performance of Intel products as measured by those
tests. Any difference in system hardware or software design or configuration may affect actual
performance.
⢠Intel, Intel Sponsors of Tomorrow. and Intel Sponsors of Tomorrow. Logo and the Intel logo are
trademarks of Intel Corporation in the United States and other countries.
⢠*Other names and brands may be claimed as the property of others.
⢠Copyright Š2010 Intel Corporation.
35
36. Risk Factors
36
The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the
future are forward-looking statements that involve a number of risks and uncertainties. Many factors could affect Intelâs actual
results, and variances from Intelâs current expectations regarding such factors could cause actual results to differ materially from
those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could
cause actual results to differ materially from the corporationâs expectations. Demand could be different from Intel's expectations due
to factors including changes in business and economic conditions; customer acceptance of Intelâs and competitorsâ products; changes
in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel operates in
intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short
term and product demand that is highly variable and difficult to forecast. Additionally, Intel is in the process of transitioning to its
next generation of products on 32nm process technology, and there could be execution issues associated with these changes,
including product defects and errata along with lower than anticipated manufacturing yields. Revenue and the gross margin
percentage are affected by the timing of new Intel product introductions and the demand for and market acceptance of Intel's
products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing
pressures and Intelâs response to such actions; defects or disruptions in the supply of materials or resources; and Intelâs ability to
respond quickly to technological developments and to incorporate new features into its products. The gross margin percentage could
vary significantly from expectations based on changes in revenue levels; product mix and pricing; start-up costs, including costs
associated with the new 32nm process technology; variations in inventory valuation, including variations related to the timing of
qualifying products for sale; excess or obsolete inventory; manufacturing yields; changes in unit costs; impairments of long-lived
assets, including manufacturing, assembly/test and intangible assets; the timing and execution of the manufacturing ramp and
associated costs; and capacity utilization. Expenses, particularly certain marketing and compensation expenses, as well as
restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and
profits. The majority of our non-marketable equity investment portfolio balance is concentrated in the flash memory market segment,
and declines in this market segment or changes in managementâs plans with respect to our investment in this market segment could
result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest
and other. Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in countries
where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure
disruptions, health concerns and fluctuations in currency exchange rates. Intelâs results could be affected by the timing of closing of
acquisitions and divestitures. Intel's results could be affected by adverse effects associated with product defects and errata
(deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder,
consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable
ruling could include monetary damages or an injunction prohibiting us from manufacturing or selling one or more products,
precluding particular business practices, impacting our ability to design our products, or requiring other remedies such as compulsory
licensing of intellectual property. A detailed discussion of these and other factors that could affect Intelâs results is included in Intelâs
SEC filings, including the report on Form 10-Q for the quarter ended March 27, 2010.
Rev. 5/7/10