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Design for Reliability - Quality Reliabilty Conference 2013
1. Design for Reliability :
A guide for Civilian Companies
(Something you can take home with you at the end of the day)
Joel Mandel
Oct,2013
2. Definitions
Reliability
The ability of a system or component to perform its required functions
under stated conditions for a specified period of time(IEEE)
Quality
A degree of grade or excellence or worth
3. Key to Success
The Objective of
every company
is to make
money
The objective of
every reliability
engineer is to
produce a
reliable project
plan
$
Reliability
The objective of every Reliability Manger is to
produce a reliability plan that gives maximum
reliability at minimal cost
4. Reliability Engineering
Project Life Cycle
Dolly Family
Dolly 2
Dolly 1A
Prototype
R&D
Final
Product
IDEA
MTBF
MTTR
Component analysis
Temperature analysis
Location analysis
HALT
Thermal
Mapping
Qual testing
TAAF/RG
Availability
System Reliability
FMECA
TAAF/RGT
FTA
Thermal Analysis/Demo
Reliability Engineering
Production
Operation /Useful
ESS-Vibration
ESS- Temperature
High Accelerated Stress testing
FRACAS
5. Design or Predict
Design for Reliability
Which way to go?
Reliability Prediction
MIL STD 217
British Telecom HRD4/5
Telecordia/Belcore
Siemens
Cnert
6. Problems with Reliability Prediction
The assumptions/models are sometimes wrong.
The design can be less than perfect,
Production is not flawless
Not every failure of every part will cause the equipment to fail,
The database is likely to be at least 15 years out-of-date.
None of this matters much, if the predictions are used to
compare
different topologies or approaches rather than to establish an absolute
figure for reliability.
This is what predictions were originally designed for.
In otherwords reliability prediction is useless by itself especially for
new companies and new concepts .
EUROPEAN POWER SUPPLY MANUFACTURERS ASSOCIATION 2005 ( at www.epsma.org )
8. Design & Prototype Stage
Component Specification ( BOM) / Reliability- Temperature Pareto
The most dominant parameter for component reliability is temperature. Rank components according to
failure rate try to improve failure rate by improving specification ,analyze cost versus benefit.
Component Placement analysis
The component placement should take into account
Power dissipating components should be in a good location for
cooling. Surrounding these high dissipating components should be components
which can with stand the increase temperature surrounding the high dissipating
component
Thermal Mapping
Thorough thermal mapping of all components as per prior paragraphs at worst case
maximum and safety conditions . This process optimizes cost/temperature through
testing many scenarios (for example for fan cooling number of fans location temperature
, noise)
.