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RoHS PCB Finishes - Lead Free Pros Cons

Pb-free PCB final finishes are listed alongside their various pros and cons for RoHS / Lead Free PCB design, fabrication and assembly.

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RoHS PCB Finishes - Lead Free Pros Cons

  1. 1. Immersion Silver Pros Cons Good Wettability Poor Shelf-Life: Good Coplanarity *Must be vacuumed packed for shipping Good Reflow Cycles *Must be vacuumed packed for storage Good Process times *Must not handle Surface Areas Low Cost Fair Process Window Good Process Control Poor Adhesion Good Electrical Testability Difficult to Re-Work Organic Solderability Preservative - OSP Pros Cons Good Coplanarity Poor Shelf-Life: Good Surface Oxidation *Degrades with High Temperature Re-Workable *Must not handle Surface Areas Very Low Cost Reflow Cycles Good Process Window Flux Sensitivity Good Process Control Poor Wettability Very Poor Electrical Testability Poor Adhesion Electroless Nickel Immersion Gold - ENIG Pros Cons Good Wettability High Cost Good Coplanarity Complex Process Good Reflow Cycles Not Re-Workable Good Surface Oxidation Ni/Sn brittle Solder Joints Good Shelf-Life Field Failure
  2. 2. Good Adhesion Fair Process Window Wire Bonding Fair Process Control Keypads Good Electrical Testability Hard Gold Pros Cons Good Wettability High Cost Good Coplanarity Not Re-Workable Good Reflow Cycles Good Surface Oxidation Good Shelf-Life Good Process Window Good Process Control Good Adhesion Good Electrical Testability White Tin Pros Cons Good Wettability Long Process Time Good Coplanarity Fair Process Window Good Reflow Cycles Possible Tin Whiskers Good Surface Oxidation Problems if Tin Thickness is Low Low Cost Good Process Control Good Adhesion Good Electrical Testability Lead-Free Hot Air Solder Leveling Pros Cons Excellent Wettability Process Control Much Improved Coplanarity over Sn/Pb Heat Cycle Excellent Reflow Cycles Excellent Surface Oxidation Very Low Cost Re-Workable Good Process Window Good Adhesion Excellent Solder Joints Excellent Shelf-Life Good Electrical Testability

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