The most significant cost driver for multi-chip printed circuit boards (MCPCBs) is the dielectric substrate located between the copper traces and metal heatsink. The dielectric substrate is the insulating medium between the two conducting elements. Introducing competition between suppliers of the dielectric substrate, such as between Laird, Bergquist, Dupont, Uniplus, Iteq, and Insulectro, is the most effective way to reduce costs for this important component of MCPCBs.