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Lead Free Cost Reduction



               Available with Audio at:
    www.SaturnElectronics.com/webinar_leadfree.htm
   ...
Lead Free
 L dF
Cost Reduction
Direct Cost Drivers
 Hi h T      L i t
–High Temp Laminates
 Final Finishes
–Final Finishes



                       3
Indirect Cost Drivers
 Increased Scrap Rate
–Increased Scrap Rate
 • De-lamination
 • Solderability

 Pre Baking
–Pre‐Baki...
Section 1
     S ti  
    Pb‐free 
      bf
   Assembly
     sse b y
Capable Laminate 5
IPC 4101/99 /124 
           from
  Isola Group/ Insulectro


                            6
Current State
                            Audience Poll……

 C      C ll
–Common Callouts
 •   IS410 / 370HR
 •   FR4
 •   ...
Current State ( )
                      (cont.)
                                           Audience Poll……
• Effect of Com...
•   Have you experienced delamination during Lead Free
    Assembly?

•   Yes
•   No




                                 ...
Poll Results




               10
Current State ( )
                    (cont.)

3. Non Pb Free capable material
3. Non‐Pb Free capable material
  • FR4 is ...
Proposed Solution
• Mid‐Grade Pb‐free capable 
  laminates
  – IPC 4101 / 99 (filled) or /124 (unfilled)
     • 150 Tg min...
Benefits
– 15‐20% Cost Savings on Raw Materials
– Lower Moisture Absorption (0 10%‐
  Lower Moisture Absorption (0.10%
  0...
Results
(using Isola IS400 as example)




                                 14
Results
Test Group                      Results
Decomposition Temperature
Test 1 of 2 
Method of Determination:        TGA...
TGA




      16
Results
Test Group
Test Group                    Results
Delta TG
Test 1 of 1
Method of Determination:      DSC
TG Scan 1:...
DSC 
DSC – (A)




            18
DSC – (B)




            19
Results
Test Group                             Results
Time to Decomposition at Temperature
Test 1 of 2
Method of Determin...
T-260
T 260




        21
T‐288
T 288




        22
Results
Test G
T Group                   Results
                          R l
Weight Loss % by TGA
Test 1 of 1
Percent We...
Moisture Absorption (A)




                          24
Results
Test Group                 Results
Peel Strength


Condition:                 Condition A
Peel Strength Side 1:   ...
6‐X Reflow
             6 X Reflow
Pb‐free Assembly Temperature
Pb f         bl
  – One board, 3 array
  – One 4.25 x 9.5L...
27
Results
Conditioning                         As Received
Board # 14753-1
Material                             IS400
Thickn...
Coming Soon – FR406HR



                    29
Section 2
 Pb‐Free
 Pb Free
  HASL
       Audience Poll
                       30
•   Have you ever tried and subsequently abandoned SN100CL?

•   Yes
•   No
•   Never even tried it.




                 ...
Poll Results




               32
Definition
SN100CL
‐this is a SnCu alloy stabilized with Ni, 
 composed of:
  •   99.3% Tin
  •   <0.7% Copper
      <0 7%...
Industry 
               y
     Misconceptions
• Predictions of HASL’s Demise
• S ld bili  I
  Solderability Issues
• Shor...
Benefits
1.     Lower Copper Erosion on PCB surface and vias
2.     Quick Process
       Q i k P
3.     Long Shelf Life
4....
Results
( using Florida CirTech HALT example )
            Highly Accelerated Life Test




                              ...
Benefits – Solder Joint Strength
                  J          g
       HALT Test Results




                             ...
Benefits –HALT Test Results




                          38
Benefits




           39
Benefits 




            40
HALT Test Results
Lead-Free HASL, with all different solderpastes pooled together, required the most energy
(G-force + the...
Drawbacks
• Not Planar
    • Not Ideal for extremely fine pitch applications

• Past Solderability Issues
    • HASL and F...
Drawbacks, cont.
      Drawbacks  cont
• Thermal Cycle
 – SN100CL requires a Thermal Cycle in addition to 
   Thermal Cycl...
Polling Question
P lli  Q ti




                   44
•   What is your primary Lead Free finish?

•   ENIG
•   Lead Free HASL
•   Immersion Silver
•   Immersion Tin
•   RoHS Co...
Poll Results




               46
No Standard 
No Standard ‐ Solutions
Trigger Event 
 Solderability Issue at Customer
             y




                  ...
No Standard ‐
No Standard  Solutions
• Goal
 – Establish a Set Criteria




                              48
Thickness Criteria
• Generic Thickness Requirement
                      q
     • Not proper to have only one
        – Sm...
Pad Size ( s) Min. Thickness
 ad S e (mils)        c ess
126 x 131        50 uin


29 x 83          80 uin


17 x 36      ...
Implementation
• Alloy Control
   • Lower copper content of alloy increases solderability
             pp                 ...
Implementation
• Specific Design Set‐Up
  Specific Design Set Up
 – Each Design may require its own specific set‐up
 – Adj...
Implementation
• In effect, since the operating window is 
  smaller than with SnPB,…….


  CONTROL The PROCESS!!!


     ...
SN100CL 
         Study Conclusion
• No Solderability Issues at any customer
  – Fab Notes
    • Fab notes can specify the...
Conclusion
• By implementing one or both of these 
  proposed solutions, you can:
  proposed solutions  you can:
  – Save ...
• To view the archived version of this presentation, 
  please email jim@saturnelectronics.com




• To sign up for our up...
Thank You!
Saturn Electronics Corporation 
 would like to thank our presenters:

      Dave Coppens / Isola
      Terry ...
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Wird geladen in …5
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Lead Free Pcb RoHs Compliant Design, Fabrication, and Assembly Cost Reduction

Lead Free Cost Reduction webinar dealing with RoHS compliant laminates and final finishes pertaining to PCB manufacturing to included design, fabrication, and assembly.

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Lead Free Pcb RoHs Compliant Design, Fabrication, and Assembly Cost Reduction

  1. 1. Lead Free Cost Reduction Available with Audio at: www.SaturnElectronics.com/webinar_leadfree.htm Email Jim@saturnelectronics.com for the password Thank you for your inquiry into the Lead Free Cost Reduction PowerPoint Presentation. 1
  2. 2. Lead Free L dF Cost Reduction
  3. 3. Direct Cost Drivers Hi h T  L i t –High Temp Laminates Final Finishes –Final Finishes 3
  4. 4. Indirect Cost Drivers Increased Scrap Rate –Increased Scrap Rate • De-lamination • Solderability Pre Baking –Pre‐Baking g g –Storage / Handling 4
  5. 5. Section 1 S ti   Pb‐free  bf Assembly sse b y Capable Laminate 5
  6. 6. IPC 4101/99 /124  from Isola Group/ Insulectro 6
  7. 7. Current State Audience Poll…… C  C ll –Common Callouts • IS410 / 370HR • FR4 • RoHS Compliant • 180ºC Tg • 340ºC Td • IPC 4101/126 or /129 7
  8. 8. Current State ( ) (cont.) Audience Poll…… • Effect of Common Callouts 1. Locked in to laminate by brand name 2. Typically Phenolic 2  Typically Phenolic materials • Moisture absorption up to .45% on 0.028” core • Less mechanical strength (interlaminate adhesion) • More prone to de‐lamination during assembly • Prone to pad cratering on BGA applications 8
  9. 9. • Have you experienced delamination during Lead Free Assembly? • Yes • No 9
  10. 10. Poll Results 10
  11. 11. Current State ( ) (cont.) 3. Non Pb Free capable material 3. Non‐Pb Free capable material • FR4 is not capable • RoHS Compliant can include standard FR4 • 180Tg does not guarantee adequate Td 11
  12. 12. Proposed Solution • Mid‐Grade Pb‐free capable  laminates – IPC 4101 / 99 (filled) or /124 (unfilled) • 150 Tg min.  T   i • 325 Td min. 12
  13. 13. Benefits – 15‐20% Cost Savings on Raw Materials – Lower Moisture Absorption (0 10%‐ Lower Moisture Absorption (0.10% 0.25%) – Higher interlaminate adhesion • Peel strength • T‐288 >10 minutes – Higher Copper to Laminate peel strength 13
  14. 14. Results (using Isola IS400 as example) 14
  15. 15. Results Test Group Results Decomposition Temperature Test 1 of 2  Method of Determination: TGA Decomposition Temperature: 331 C Ramp Rate: 10 C/ min Test 2 of 2 est o Method of Determination: TGA Decomposition Temperature: 334 C Ramp Rate: Ramp Rate: 10 C/ min 10 C/ min 15
  16. 16. TGA 16
  17. 17. Results Test Group Test Group Results Delta TG Test 1 of 1 Method of Determination: DSC TG Scan 1:  150 C TG Scan 2: 154 C Delta Tg: 4 C Ramp Rate:      20 C/min Analysis Method: Half Height 17
  18. 18. DSC  DSC – (A) 18
  19. 19. DSC – (B) 19
  20. 20. Results Test Group Results Time to Decomposition at Temperature Test 1 of 2 Method of Determination: TMA Time to Decomposition: 35.9 minutes Isothermal Temperature: 260 C Test 2 of 2 Method of Determination: TMA Time to Decomposition: 10.4 minutes Isothermal Temperature: Isothermal Temperature: 288 C 288 C 20
  21. 21. T-260 T 260 21
  22. 22. T‐288 T 288 22
  23. 23. Results Test G T Group Results R l Weight Loss % by TGA Test 1 of 1 Percent Weight Loss: 0.2% Start Temperature: 0º C Stop Temperature: Stop Temperature: 0º C 0º C Comments: Moisture Method % Weight Loss = 0.1717% 23
  24. 24. Moisture Absorption (A) 24
  25. 25. Results Test Group Results Peel Strength Condition: Condition A Peel Strength Side 1: 11.73 lbs/in Peel Strength Side 2: Peel Strength Side 2: 10.95 lbs/in 10.95 lbs/in 25
  26. 26. 6‐X Reflow 6 X Reflow Pb‐free Assembly Temperature Pb f bl – One board, 3 array – One 4.25 x 9.5L”, Two 4.75 x 9.5L” – Thickness + 0.063 3 – TGA moisture = 0.2534% – 260° Peak Temperature p 26
  27. 27. 27
  28. 28. Results Conditioning As Received Board # 14753-1 Material IS400 Thickness (mil) ( ) 0.063 Conveyor Speed (cm/min) 48 Peak Mean Temp (°C) 259.8 TC Temp Range TC Temp Range 3.4 Rising time between 150C ‐ 200C 66.67 (sec) Time above 217 101 Time above Time above 255 19.69 19 69 Passes to Fail 6x‐Pass 28
  29. 29. Coming Soon – FR406HR 29
  30. 30. Section 2 Pb‐Free Pb Free HASL Audience Poll 30
  31. 31. • Have you ever tried and subsequently abandoned SN100CL? • Yes • No • Never even tried it. 31
  32. 32. Poll Results 32
  33. 33. Definition SN100CL ‐this is a SnCu alloy stabilized with Ni,  composed of: • 99.3% Tin • <0.7% Copper <0 7% Copper • 0.05% Nickel • 60 ppm Germanium pp 33
  34. 34. Industry  y Misconceptions • Predictions of HASL’s Demise • S ld bili  I Solderability Issues • Short Duration of Usage 34
  35. 35. Benefits 1. Lower Copper Erosion on PCB surface and vias 2. Quick Process Q i k P 3. Long Shelf Life 4.   Cost (< 1/14 ENIG) 5. Forgiving a.) Humidity y b.) Handling c.) Temperature 6. Solder Joint Strength 35
  36. 36. Results ( using Florida CirTech HALT example ) Highly Accelerated Life Test 36
  37. 37. Benefits – Solder Joint Strength J g HALT Test Results 37
  38. 38. Benefits –HALT Test Results 38
  39. 39. Benefits 39
  40. 40. Benefits  40
  41. 41. HALT Test Results Lead-Free HASL, with all different solderpastes pooled together, required the most energy (G-force + thermo-cycling) to break the solder joints. Since this test takes out the failure effect of the components, we can conclude that lead-free HASL solderjoints outperform all other surface finishes, including SnPb HASL. Our thanks go to Tim Murphy of Thomson Lab Services and Florida CirTech for the report abstract. For a full report, please contact James Kelch @ jim@saturnelectronics.com 41
  42. 42. Drawbacks • Not Planar • Not Ideal for extremely fine pitch applications • Past Solderability Issues • HASL and Flow: A Lead-Free Alternative addresses this in the February ’08 issue of Request a copy from James Kelch or visit the Lead Free Resource Center on our website. 42
  43. 43. Drawbacks, cont. Drawbacks  cont • Thermal Cycle – SN100CL requires a Thermal Cycle in addition to  Thermal Cycles in Assembly • No Set Industry Standards – Neither the IPC nor Nihon Superior had developed a  Thickness Acceptability Criteria when SN100CL was  introduced Audience Poll 43
  44. 44. Polling Question P lli  Q ti 44
  45. 45. • What is your primary Lead Free finish? • ENIG • Lead Free HASL • Immersion Silver • Immersion Tin • RoHS Compliant 45
  46. 46. Poll Results 46
  47. 47. No Standard  No Standard ‐ Solutions Trigger Event  Solderability Issue at Customer y 47
  48. 48. No Standard ‐ No Standard  Solutions • Goal – Establish a Set Criteria 48
  49. 49. Thickness Criteria • Generic Thickness Requirement q • Not proper to have only one – Smaller Pads receive thicker solder deposition • Solution • Minimum Alloy Thickness should be         segregated by Ranges of Pad Size 49
  50. 50. Pad Size ( s) Min. Thickness ad S e (mils) c ess 126 x 131 50 uin 29 x 83 80 uin 17 x 36 100 uin 50
  51. 51. Implementation • Alloy Control • Lower copper content of alloy increases solderability pp y y • Standard Drossing of solder pot is not enough to  keep copper content below 0.90% • Recommend a  1/4 ‐ 1/3 solder pot dump once weekly  1/4 ‐ measurement reaches 0.90% 51
  52. 52. Implementation • Specific Design Set‐Up Specific Design Set Up – Each Design may require its own specific set‐up – Adj t Adjustments t • Air Knife Pressure • Retract Speed • Dwell Time 52
  53. 53. Implementation • In effect, since the operating window is  smaller than with SnPB,……. CONTROL The PROCESS!!! 53
  54. 54. SN100CL  Study Conclusion • No Solderability Issues at any customer – Fab Notes • Fab notes can specify the use of these coupons or range of solder thickness standards – Forcing your supplier to meet these specs will give you: C l    h  P »Control over the Process 54
  55. 55. Conclusion • By implementing one or both of these  proposed solutions, you can: proposed solutions  you can: – Save up to 30% of your bare board cost –IIncrease performance of your products   f   f    d – Standardize your fab notes to remove risk of  non‐performing products f i   d t – Improve your supply base 55
  56. 56. • To view the archived version of this presentation,  please email jim@saturnelectronics.com • To sign up for our upcoming Lead Free Newsletter,  please email jay@saturnelectronics.com 56
  57. 57. Thank You! Saturn Electronics Corporation  would like to thank our presenters:  Dave Coppens / Isola  Terry Staskowicz / Insulectro  Glenn Sikorcin / Florida CirTech *Don’t forget to visit the Lead Free Resource Center 57

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