2. CONTENTS
ABOUT THE COMPANY
METHODOLOGY
PRODUCTION DEPARTMENT
WAREHOUSE AND LOGISTICS
RESEARCH AND DEVELOPMENT CENTER
3. ABOUT THE COMPANY
Siemens Energy and Automation Verna, Goa is a
Greenfield factory with an investment of around Rs. 200
crores.
This factory produces a range of products for power
distribution of industries, power plants, infrastructure and
cities.
The products include medium voltage gas-insulated
switchgears of up to 36k, numerical protection relays, tele-
control devices for smart grids.
The factory has its own in-house Research and
Development unit.
4. ABOUT THE COMPANY(CONT.)
This factory is built as green factories with features such
as ground water recharging, rain water harvesting, water
conservation through low flow fixtures, energy conservation
through energy efficient lighting & HVAC, use of solar
technology for street lighting and water efficient landscaping.
The Energy Automation factory is the first such factory
outside Europe and third in the Siemens World, after Germany
and United Kingdom.
5. METHODOLOGY
R & D
DEPARTMENT
MANAGEMENT
PRODUCTION DEPARTMENT
SMT LINE
AOI & MANUAL
INSPECTION
THT MOUNTING &
WAVE SOLDERING
INSPECTION &
TESTING
DEBUG &
REWORK
Packing & Labelling
DEVICE
ASSEMBLY
ELECTROMECHANICAL
ASSEMBLY 1
ELECTROMECHANICAL
ASSEMBLY 2
6. PRODUCTION DEPARTMENT
• SMT PRODUCTION LINE
• AOI (AUTOMATIC OPTICAL INSPECTION)
• THT PRODUCTION LINE
• FINAL MOUNTING and Testing
• STENCIL CLEANING
• DEVICE ASSEMBLY
• Packing - Packing Material
8. SMT PLACEMENT EQUIPMENT
SMT component
placement systems, commonly
called pick-and-place machines
or P&Ps, are robotic machines
which are used to place surface-
mount devices (SMDs) onto a
printed circuit board.
They are used for high speed, high precision placing of
broad range of electronic components, like capacitors , resistors ,
integrated circuits onto the PCBs which are in turn used in
computers.
9. COMPONENT FEEDERS
• Surface mount components are placed along the front and
back faces of the machine.
• Most components are supplied on paper or plastic tape,
in tape reels that are loaded onto feeders mounted to the
machine.
• Larger integrated circuits are sometimes supplied
arranged in trays which are stacked in a compartment.
10. REFLOW SOLDERING
There are usually four stages, called "zones", each having a
distinct thermal profile:
• PREHEAT
• THERMAL SOAK
• REFLOW
• COOLING
11. REFLOW SOLDERING
• Preheat: The preheat zone is often the lengthiest of the
zones. Here the solvent in the paste begins to evaporate.
• Thermal soak: thermal soak, is typically a 60 to 120
second exposure for removal of solder paste volatiles and
activation of the fluxes, where the flux components begin oxide
reduction on component leads and pads.
12. REFLOW SOLDERING(CONT.)
• Reflow: It is the part of the process where the maximum
temperature is reached. Temperature limit is determined by the
component on the assembly with the lowest tolerance for high
temperatures.
• Cooling: The last zone is a cooling zone to gradually cool
the processed board and solidify the solder joints. Proper
cooling inhibits excess inter-metallic formation or thermal shock
to the components.
13. AOI (AUTOMATIC OPTICAL INSPECTION)
A Small Scale AOI Machine
Types: Stand-alone and inline AOI systems, Closed- and open-top AOI systems, AOI
and combined AOI/AXI systems.
LOADER AOI MACHINE UNLOADER
14. AOI (AUTOMATIC OPTICAL INSPECTION)
A machine vision or an AOI system can acquire millions
of data points (pixels) in a fraction of a second.
These data points are used for visual inspection and
precision measurement. AOI visually scans the surface of the
PCB.
The board is lit by several light sources and observed by a
scanner or by a number of high definition cameras.
This enables the monitoring of all areas of the board, even
those hidden in one direction by other components.
15. THT PRODUCTION LINE
PCBS
PCBs for Testing
MOUNTING
CELL
MANUAL
INSPECTION
WAVE
SOLDERING
MANUAL
INSPECTION
FINAL
MOUNTING
16. THT PRODUCTION LINE
HOLE
The mounting scheme used for electronic components that
involves the use of leads on the components that are inserted
into holes drilled in printed circuit boards and soldered to pads
on the opposite side either by manual assembly (hand
placement) or by the use of automated insertion mount machines
17. WAVE SOLDERING
Wave soldering is used for both through-hole printed circuit
assemblies, and surface mount.
Different Zones:
Fluxing
Preheating
Soldering
Cooling
18. WAVE SOLDERING(CONT.)
PROCESS:
The basic equipment used during the process is a conveyor
that moves the PCB through the different zones, a pan of solder
used in the soldering process.
A pump that produces the actual wave, the sprayer for the
flux and the preheating pad.
19. WAVE SOLDERING(CONT.)
FLUXING:
The primary objective is to clean the components that are to
be soldered, principally any oxide layers that may have formed.
There are two types of flux, corrosive and noncorrosive.
Noncorrosive flux requires pre-cleaning and is used when low
acidity is required. Corrosive flux is quick and requires little pre-
cleaning, but has a higher acidity.
20. WAVE SOLDERING(CONT.)
PREHEATING:
The preheating zone consists of convection heaters which
blow hot air onto the PCB to increase its temperature. For thicker
or densely populated PCBs, an upper pre-heater might be used.
Preheating is necessary to activate the flux, and to remove
any flux carrier solvents. Preheating is also necessary to prevent
thermal shock.
21. WAVE SOLDERING(CONT.)
SOLDERING:
The tank of molten solder has a pattern of standing waves on
its surface.
When the PCB is moved over this tank, the solder waves
contact the bottom of the board, and stick to the solder pads and
component leads via surface tension.
22. WAVE SOLDERING(CONT.)
SOLDERING (CONT.):
This process is sometimes performed in an inert nitrogen
(N2) atmosphere to increase the quality of the joints. The
presence of N 2 also reduces oxidization known as solder dross.
Solder dross, its reduction and elimination, is a growing
industry concern as lead soldering is being replaced by lead-free
alternatives at significantly higher cost.
23. WAVE SOLDERING(CONT.)
CLEANING:
Some types of flux, called "no- clean" fluxes, do not
require cleaning; their residues are benign after the soldering
process.
Others, however, require a cleaning stage, in which the
PCB is washed with solvents and/or de-ionized water to
remove flux residue.
FINISH AND QUALITY:
Quality depends on proper temperatures when heating
and on properly treated surfaces.
24. FINAL MOUNTING
This includes various processes depending on different
PCB models. This include
Hot melt adhesive
Soldering
Display mounting
25. FINAL MOUNTING(CONT.)
HOT MELT ADHESIVE (HMA):
Also known as hot glue, is a form of thermoplastic
adhesive that is commonly supplied in solid cylindrical sticks
of various diameters, designed to be melted in an electric hot
glue gun.
The gun uses a heating element to melt the plastic glue,
which may be pushed through the gun by a mechanical trigger
mechanism, or directly by the user.
The glue is tacky when hot, and solidifies in a few
seconds to one minute.
27. FINAL MOUNTING(CONT.)
SOLDERING:
Filler materials are available in many different alloys for
differing applications.
In electronics assembly, the eutectic alloy of 63% tin and
37% lead (or 60/40, which is almost identical in melting point)
has been the alloy of choice.
There are three forms of soldering soft soldering, which
originally used a tin-lead alloy as the filler metal, silver
soldering, which uses an alloy containing silver, brazing which
uses a brass alloy for the filler.
28. TESTING
Additional hardware includes:
Cameras to test for presence and correct orientation of
components Photo detectors to test for LED color and intensity
External timer counter
BED OF NAILS TESTER
A bed of nails tester is a
traditional electronic test fixture
which has numerous pins inserted
into holes which are aligned using
tooling pins to make contact with
test points.
29. TESTING(CONT.)
Flying probe testing uses electro-mechanically controlled
probes to access components on printed circuit assemblies
(PCAs). Commonly used for test of analog components, analog
signature analysis and short/open circuits.
They provide an alternative to the bed-of-nails technique
for contacting the components on printed circuit boards.
FLYING PROBE TESTER
Flying probe test systems are
often used for only testing basic
production, prototypes, and boards
that present accessibility problems.
30. STENCIL CLEANING
PROCESSES
Ultrasonic Stencil Cleaning is one of the preferred
methods for removing trace levels of solder paste from stencil
openings.
Spray-In-Air C8882 WASH / C8882 RINSE
Cybersolv® C8882 is a solvent-based stencil cleaning fluid
specifically designed to clean wet solder paste, SMT adhesive
and flux residue from stencils (conventional and plastic pump),
mis-printed PCBs, wave soldering pallets and tools, fixtures and
squeegees.
31. DEVICE ASSEMBLY
Outer Assembly
Contact leads are placed and connected to the former with
the help of screws.
Housing Box Assembly
It is associated with the mounting of whole structure in a
metallic box.
Riveting
A rivet is a permanent mechanical fastener. Before being
installed, a rivet consists of a smooth cylindrical shaft with a head
on one end. The end opposite the head is called the buck-tail. On
installation the rivet is placed in a punched or drilled hole.
32. DEVICE ASSEMBLY(CONT.)
Front Panel Assembly
Here, the front panel assembly for the various devices is
done. These include PCBs with control buttons, LCD screens and
status LEDs, etc.
PCBA(PCB Assembly):
After the printed circuit board is completed, electronic
components must be attached to form a functional printed circuit
assembly or PCA.
Wiring
Wires are attached from PCB components to input and
output ports and power supply points.
33. DEVICE ASSEMBLY(CONT.)
Inner Block Assembly
Final and one of the last inner blocks are assembled and a
manual inspection is made.
Testing
Testing is commonly done to maintain quality control in
this stage of PCB manufacturing.
While the power is off, analog signature analysis, power-off
testing is done.
While the power is on, in-circuit tests, where physical
measurements (for example, voltage) can be done.
While the power is on, functional test, just checking if the
PCB does what it had been designed to do.
