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Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
APM4015PU
Pin Description
Ordering and Marking Information
Features
Applications
• -40V/-45A,
RDS(ON)
= 13mΩ (typ.) @ VGS
=-10V
RDS(ON)
= 19mΩ (typ.) @ VGS
=-4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• Lead Free and Green Devices Available (RoHS
Compliant)
• Power Management in LCD TV Inverter
Top View of TO-252
P-Channel MOSFET
G D
S
G
S
D
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termina-
tion finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements
of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to
mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous
material and total of Br and Cl does not exceed 1500ppm by weight).
APM4015P
Handling Code
Temp. Range
Package Code
Package Code
U : TO-252
Operating Junction Temp. Range
C : -55 to 150 C
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APM4015P U : APM4015P
XXXXX
XXXXX - Date Code
Assembly Material
o
Free Datasheet http://www.datasheet4u.net/
2. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw2
APM4015PU
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage -40
VGSS Gate-Source Voltage ±20
V
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C
IS
*
Diode Continuous Forward Current TC=25°C -20 A
TC=25°C -90
IDP
*
300µs Pulse Drain Current Tested
TC=100°C -60
A
TC=25°C -45
ID
*
Continuous Drain Current
TC=100°C -30
A
TC=25°C 50
PD
*
Maximum Power Dissipation
TC=100°C 20
W
RθJC
*
Thermal Resistance-Junction to Case 2.5 °C/W
RθJA
*
Thermal Resistance-Junction to Ambient 50 °C/W
Notes:
* Surface Mounted on 1in
2
pad area, t ≤ 10 sec.
Electrical Characteristics (TA
= 25°C unless otherwise noted)
APM4015PU
Symbol Parameter Test Condition
Min. Typ. Max.
Unit
Static Characteristics
BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=-250µA -40 V
VDS=-32V, VGS=0V -1
IDSS Zero Gate Voltage Drain Current
TJ=85°C -30
µA
VGS(th) Gate Threshold Voltage VDS=VGS, IDS=-250µA -1.3 -2 -2.5 V
IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA
VGS=-10V, IDS=-20A 13 16
RDS(ON)
a
Drain-Source On-state Resistance
VGS=-4.5V, IDS=-10A 19 25
mΩ
Diode Characteristics
VSD
a
Diode Forward Voltage ISD=-20A, VGS=0V -0.75 -1.1 V
trr Reverse Recovery Time 28 ns
Qrr Reverse Recovery Charge
ISD=-20A, dlSD/dt=100A/µs
26 nC
Free Datasheet http://www.datasheet4u.net/
3. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw3
APM4015PU
Electrical Characteristics (Cont.) (TA
= 25°C unless otherwise noted)
APM4015PU
Symbol Parameter Test Condition
Min. Typ. Max.
Unit
Dynamic Characteristics b
RG Gate Resistance VGS=0V,VDS=0V,F=1MHz 4 Ω
Ciss Input Capacitance 2800
Coss Output Capacitance 320
Crss Reverse Transfer Capacitance
VGS=0V,
VDS=-20V,
Frequency=1.0MHz
220
pF
td(ON) Turn-on Delay Time 11 21
tr Turn-on Rise Time 75 135
td(OFF) Turn-off Delay Time 89 161
tf Turn-off Fall Time
VDD=-20V, RL=20Ω,
IDS=-1A, VGEN=-10V,
RG=6Ω
35 64
ns
Gate Charge Characteristics b
Qg Total Gate Charge 40 56
Qgs Gate-Source Charge 6
Qgd Gate-Drain Charge
VDS=-20V, VGS=-10V,
IDS=-20A
12
nC
Notes:
a : Pulse test ; pulse width≤300µs, duty cycle≤2%.
b : Guaranteed by design, not subject to production testing.
Free Datasheet http://www.datasheet4u.net/
4. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw4
APM4015PU
Typical Characteristics
Power Dissipation
Ptot-Power(W)
Tj - Junction Temperature (°C)
-ID-DrainCurrent(A)
Drain Current
Tj - Junction Temperature (°C)
Safe Operation Area
-VDS - Drain - Source Voltage (V)
-ID-DrainCurrent(A)
NormalizedTransientThermalResistance
Thermal Transient Impedance
Square Wave Pulse Duration (sec)
0 20 40 60 80 100 120 140 160 180
0
10
20
30
40
50
60
TC
=25
o
C
0 20 40 60 80 100 120 140 160
0
10
20
30
40
50
TC
=25
o
C,VG
=-10V
0.01 0.1 1 10 100
0.1
1
10
100
200
Rds(on)Limit
1s
TC
=25
O
C
10ms
1ms
100ms
DC
1E-4 1E-3 0.01 0.1 1 10 100
1E-3
0.01
0.1
1
2
Mounted on 1in
2
pad
RθJA
:50
o
C/W
0.01
0.02
0.05
0.1
0.2
Single Pulse
Duty = 0.5
Free Datasheet http://www.datasheet4u.net/
5. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw5
APM4015PU
-VDS - Drain - Source Voltage (V)
-ID-DrainCurrent(A)
Output Characteristics
RDS(ON)-On-Resistance(mΩ)
Drain-Source On Resistance
-ID - Drain Current (A)
-VGS - Gate - Source Voltage (V) Tj - Junction Temperature (°C)
Gate Threshold Voltage
NormalizedThresholdVlotage
Typical Characteristics (Cont.)
RDS(ON)-On-Resistance(mΩ)
Drain-Source On Resistance
0.0 0.5 1.0 1.5 2.0 2.5 3.0
0
10
20
30
40
50
60
70
80
90
100
-3.5V
-5V
-4.5V
-3V
-4V
VGS
=-6,-7,-8,-9,-10V
2 3 4 5 6 7 8 9 10
5
10
15
20
25
30
35
40
ID
= -20A
-50 -25 0 25 50 75 100 125 150
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IDS
=-250µA
0 20 40 60 80 100
0
5
10
15
20
25
30
35
VGS
=-10V
VGS
=-4.5V
Free Datasheet http://www.datasheet4u.net/
6. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw6
APM4015PU
Drain-Source On Resistance
NormalizedOnResistance
Tj - Junction Temperature (°C) -VSD - Source - Drain Voltage (V)
Source-Drain Diode Forward
-IS-SourceCurrent(A)
-VDS - Drain - Source Voltage (V)
C-Capacitance(pF)
Capacitance Gate Charge
QG - Gate Charge (nC)
-VGS-Gate-sourceVoltage(V)
Typical Characteristics (Cont.)
0.0 0.3 0.6 0.9 1.2 1.5 1.8
0.5
1
10
100
Tj
=150
o
C
Tj
=25
o
C
-50 -25 0 25 50 75 100 125 150
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
RON
@Tj
=25
o
C: 13mΩ
VGS
= -10V
IDS
= -20A
0 5 10 15 20 25 30 35 40
0
500
1000
1500
2000
2500
3000
3500
4000
Frequency=1MHz
Crss
Coss
Ciss
0 10 20 30 40 50
0
1
2
3
4
5
6
7
8
9
10
VDS
= -20V
ID
= -20A
FreeDatasheethttp://www.datasheet4u.net/
7. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw7
APM4015PU
Package Information
TO-252
S
Y
M
B
O
L MIN. MAX.
2.39
4.95 5.46
0.46 0.61
0.13
5.33
A
A1
b3
c
c2
D
D1
E
MILLIMETERS
b 0.50 0.89
2.29 BSC
TO-252
4.57
6.35 6.73
6.22
0.090 BSC
MIN. MAX.
INCHES
0.094
0.020 0.035
0.195 0.215
0.018 0.024
0.210
0.180
0.250 0.265
2.18
0.245
0.086
0.005
E1
0.035
0.070
0.410
L3
H
L
e
9.40
0.90
0.46 0.89
1.78
10.41 0.370
0.035
0.018
0.040L4 1.02
0.1503.81
0.89 2.03 0.035 0.080
0 8°0° 8°0°
0
0.25
GAUGE PLANE
L A1
VIEW A
SEATING PLANE
L4L3D
E
e
b3
H
A
SEE VIEW A
c2
b
c
E1
D1
6.00
Note : Follow JEDEC TO-252 .
6.00
0.235
0.235
Free Datasheet http://www.datasheet4u.net/
8. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw8
APM4015PU
Application A H T1 C d D W E1 F
16.4+2.00 13.0+0.50
330.0±2.00 50 MIN.
0 -0.2
1.5 MIN. 20.2 MIN. 16.0±0.30 1.75±0.10 7.5±0.10
P0 P1 P2 D0 D1 T A0 B0 K0
TO-252
4.0±0.10 8.0±0.10 2.0±0.10 1.5 +0.10 1.5 MIN. 0.6 +0.00 6.8±0.20 10.4±0.20 2.5±0.20
Package Type Unit Quantity
TO- 252 Tape & Reel 2500
Devices Per Unit
(mm)
Carrier Tape & Reel Dimensions
H
T1
A
d
A
E1
A
B
W
F
T
P0OD0
B
A0
P2
K0
B0
SECTION B-B
SECTION A-A
OD1
P1
Free Datasheet http://www.datasheet4u.net/
9. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw9
APM4015PU
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B, A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
Reflow Condition (IR/Convection or VPR Reflow)
Classification Reflow Profiles
Reliability Test Program
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Zone
TL
to TP
°
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate
(TL to TP)
3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183°C
60-150 seconds
217°C
60-150 seconds
Peak/Classification Temperature (Tp) See table 1 See table 2
Time within 5°C of actual
Peak Temperature (tp)
10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Free Datasheet http://www.datasheet4u.net/
10. Copyright © ANPEC Electronics Corp.
Rev. A. 3 - Feb., 2008
www.anpec.com.tw10
APM4015PU
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm
3
<350
Volume mm
3
350-2000
Volume mm
3
>2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C)
at the rated MSL level.
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm
3
<350
Volume mm
3
≥350
<2.5 mm 240 +0/-5°C 225 +0/-5°C
≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Classification Reflow Profiles (Cont.)
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindain City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
FreeDatasheethttp://www.datasheet4u.net/