1. Micro Nano Technology
Center
Virtual Tour

2. MNTC Cleanroom Floor Layout
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3. What is the Gowning Room?
In order to protect the lab from impurities, a gowning
protocol must be followed prior to entering the lab.
Cleanroom gowning is specific to the cleanliness level of
the cleanroom environment you are preparing to enter.
The MNTC Cleanroom is rated cleanliness level class
100 in all bays and class 10 in the lithography room.
MNTC Things you will find in the gowning room:
Gowning Room
Latex Gloves
Safety glasses Hair Net –
– Protection
- Protection Protection
against
for your eyes against hair
fingerprint
contamination
contamination
Beard cover – Shoe Covers – Cleanroom
Protection To maintain a Garments –
against facial clean Designed to cover
hair decontaminated your clothing and
contamination floor inside the remaining
lab exposed skin
Sticky Mats – Telephone – Lab Sink - For
Removes dirt For decontaminatio
from shoe soles emergency n and safety
calls procedures
Fact : The maximum allowable contaminant particle volume for a
Class 1 Cleanroom is 0.5 µm per cubic foot

4. What is the Thermal Bay?
The thermal bay is the area inside the lab where thermal
microfabrication processing occurs. Thermal oxidations
and annealing for film growth are amongst the most
common processes performed.
MNTC Equipment you will find in the thermal bay:
Thermal Bay
The Bio MEMS Room The Lindberg The LPCVD are
is a room used for furnaces are used for furnaces that are
creating custom very high temperature capable of Low
PDMS molds laboratory processes Pressure Chemical
such as oxidation and Vapor Deposition.
doping
Safety Showers are The RTP uses high- The Thermal spinner
located in every bay intensity visible bench is used
for safety purposes. radiation to heat a primarily for
single wafer for a application of spin-on
short time at dopants and spin-on
precisely controlled glass compound.
temperatures and
allows us to quickly
grow oxides on
wafers
Fact : The RTP can heat up a wafer to 1000 C in 1 min

5. What is the Deposition Bay?
The deposition bay is where we place down layers of
metallic materials on a wafer of silicon or silicon
oxide. The two basic methods for this is to evaporate the
desired metal onto it or shooting plasma ions into the
metal causing pieces of the metal to shoot out and land
on the wafer. This is essential for the lift off process. The
photoresist is then stripped off leaving behind the
patterned area of metal.
MNTC Equipment you will find in the Deposition bay:
Deposition Bay
The sputtering
The thin film
The Molecular Vapor system series is a
deposition tool
Deposition is set up thin film deposition
featuring 3 sputter
with chemical tool that uses a
guns for the
precursors leading sputter gun for the
deposition of both
either a hydrophobic deposition of both
metals and
or hydrophilic coating metals and
dielectrics
dielectrics
The Plasma The TF-200 puts The E-beam
Enhanced Chemical down layers of Evaporator is a
Vapor Deposition material in multiple versatile thin film
(PECVD) is a layers, each layer is deposition tool that
process used to an atom thick. The fires super heated
deposit thin films materials commonly metal onto a wafer
from a gas state to a used are aluminum which forms a thin
solid state on one oxide and silicon and near flat film on
side of a substrate oxide the wafer.
Fact : Why is technology expensive. Can you guess?

6. What is the Wet Etch Bay?
The wet etch bay is the area where most chemistry
work occurs, wet processes that are used in film
manufacturing, chemical etching and general cleaning
processes. Toxic fumes are eliminated via exhaust
hoods on the wet benches.
MNTC Things you will find in the Wet Etch Bay:
Wet Etch Bay
The Solvent s
The Acid Hood is The Base Hood is
hood is used
used exclusively a hood used
exclusively for
for Acid exclusively for
solvent
processing Base Processing
processing
The Spin Rinse Dryer The Etch Hood is The Coway Megasonic
(SRD) is used to clean used exclusively Cleaner is a megasonic
off wafers by rotating for processing based wafer cleaning
them at high rpms with certain tool that makes tiny
which locks them in etchants bubbles with a 1.6Mhz
place with centrifugal megasonic wave that
force removes impurities
Fact : The maximum allowable contaminant particle volume for a
Class 1 Cleanroom is 0.5 µm per cubic foot

7. What is the Dry Etch Bay?
The dry etch bay is the area where we use plasma to
etch away materials on a wafer. The main method we
use in this bay for etching through materials is to use
reactive ions in a plasma to cause the material on wafers
to vaporize and collect elsewhere.
MNTC Things you will find in the Dry Etch Bay:
Dry Etch Bay
The Flip Chip
Bonder is the
direct electrical
The KJL Ion Milling connection of The DRIE (Deep
System is a two source face-down Reactive Ion Etcher)
Ion beam based etching electronic copies a specific pattern
system capable of components onto silicon wafers
nanometer scale onto which is achieved
etching of numerous substrates, circui through etching using
materials t boards, or specific gases.
carriers.
The RIE is a Reactive The Zeiss The XeF2
Ion Etching device Zxiolmageer M2m System is a
used to strip resist or microscope is a table top etcher
etch patterns in high-end light that uses Xenon
wafers after the microscope Di-fluoride
photolithography featuring (XeF2) as the
process reflectance and etching gas
transmittance
mode
Fact : The maximum allowable contaminant particle volume for a
Class 1 Cleanroom is 0.5 µm per cubic foot

8. What is the Photolithography
Bay 2?
Photolithography is the process of making photomasks to
easily produce multiple wafer samples with the same
structures on them. This is done by using photoresists
that react to UV exposure by ether strengthening or
weakening it's molecular structure. To weaken the
photomask, photoresist is knocked off the wafer
exposing what ever materials underneath. This material
will either be etched in wet etch bay or have additional
layers be placed on top of it in deposition bay. Things you will find in the Photolithography
MNTC Bay 2:
Photolithography Bay 2
The SF-100 is an
The Raith 150 e-beam
easy to use micro
lithography system is an
patterning
e-beam based
system, which
lithography tool capable
allows users to
of minimum feature
fabricate micro
sizes in the 10’s of
devices quickly and
nanometer range.
easily
The YES Polyimide The Heidelberg
Curing Oven is a high DWL66FS performs
temperature vacuum lithography by weakening
oven capable of positive photoresist or
operating at up to strengthening negative
550C with controllable photoresist on a wafer by
atmosphere and exposing photoresist with
pressure. high power UV laser
Fact : The maximum allowable contaminant particle volume for a
Class 1 Cleanroom is 0.5 µm per cubic foot

9. What is the Photolithography
Bay 1?
Photolithography is the process of making photomasks
to easily produce multiple wafer samples with the same
structures on them. This is done by using photoresists
that react to UV exposure by ether strengthening or
weakening it's molecular structure. To weaken the
photomask, photoresist is knocked off the wafer
exposing what ever materials underneath. This material
will either be etched in wet etch bay or have additional
layers be placed on top of it in deposition bay. Things you will find in the Photolithography
MNTC Bay 1:
Photolithography Bay 1
The CPK Spin Dev/Etch
The ABM Aligner
Bench is a spinner
is used with
based system for MF-
photomasks to
319 based
copy designs to a
photolithographic
substrate
development and
chromium etching
The SUSS Mask Aligner The SUSS Wafer
is used to align and/or Bonder is a
exposure device for machine used to
substrates used in bond multiple
semiconductor and substrates together
microsystem technology
Fact : The maximum allowable contaminant particle volume for a
Class 1 Cleanroom is 0.5 µm per cubic foot