These slides use concepts (e.g., scaling) from my (Jeff Funk) course entitled analyzing hi-tech opportunities to look at how reductions in the feature sizes for integrated circuits (ICs) are enabling increases in the functionality of IC chips and thus the placements of larger systems on them. In turn, these increases in functionality of ICs are enabling increases in the functionality of mobile phones while at the same time creating new challenges for IC and mobile phone suppliers.
Uneak White's Personal Brand Exploration Presentation
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System on Chip (SoC) for mobile phones
1. System On Chip
(for mobile devices)
Heng Sin Wei Adrian
(A0082006U) Kong Yeng Hong
(A0082260N)
Chris Goh Chee Peng Jason
Liu Chaofeng (A0077117E) Koh Sheng Fa
(A0082015U) (A0082016R)
5. Requirements of a Smart phone and
Tablet for the savvy user
Games, music, video
⢠intense graphics and sound
⢠Powerful processing
Internet surfing/email
⢠Good aspect ratio for a mobile device.
⢠(gyro, capacitive touch for zooming)
⢠Wifi, 3g, 4g capability.
GPS
⢠Requires GPS chip and Compass.
Cameras and Video cam
⢠Good image processing module
Mobile health monitoring
⢠Requires bio electronics IC
General
⢠Antenna
⢠Power control
6. But how do we integrate all requirements?
Smartphone - Galaxy
S2
Future!!
!
Early mobile phones - Ericsson
SoC
DSP, Microprocessor and Memory
are all integrated into a single SoC!
9. What is System on Chip (SoC)?
⢠A complex IC that integrates
the major functional
elements into a single chip
or chipset.
⢠programmable processor
⢠on-chip memory
⢠accelerating function
hardware
⢠both hardware and
software
⢠analog components
⢠opto/microelectronic
mechanical system
⢠Benefits of SoC
⢠Reduce overall system cost
⢠Increase performance
⢠Lower power consumption
⢠Reduce size
10. Technology Paradigm
Basic Method of
Technology Basic Paradigm Improvements within
Technology Paradigm
Chips on Board Mounting of IC chips Substituting different
(COB) directly on PCBs materials to reducing
interconnect delays
System in Package Stacked chips or Improving performance
(SIP) packages for and power efficiency by
reduced form factor short direct connection
channels
System on Chip Complete system on Reducing form factor,
(SOC) a chip power consumption, heat
dissipation, analog mixed
signal integration
11. Comparison of COB, SIP & SOC
COB SIP SOC
Performance
(Speed, Power, W M B
Frequency)
Form Factor W M B
Signal process
packing density
W M B
Cost in volume W M B
Thermal
dissipation
B W M
Functionality W M B
12. Why SoC?
⢠Basedon the comparison above, SOC
poses more potential
⢠Howeverin certain cases, the IC industry
may leverage on both technology to
advance.
⢠Ourteam felt that although currently both
tech are complementing each other but
SOC will be the ultimate goal!
15. SoC Challenges
Transistor
Size
Transistor
Density
Process
Size
Mixed
Performance Power
Cost Signal
requirement issue
Complexity
16. Current Limits of SoC
-Performance
⢠Endless Performance Required Current
Requirement Processing Processing
Multimedia: Many codecs for
â˘
image/audio/video
Performance Performance
⢠Networking: Diverse and
complicated standards
⢠Wireless: Many new and
existing wireless standard
⢠Current processing
performance is not able to
meet current needs.
17. Current Limits of SoC
-Power
⢠With the processor speed
remaining constant
⢠Smaller chip = Poorer power
eff.
⢠As the processor speed
increases, power consumption
increases at a higher rate
18. Limited Battery Improvement
⢠Power Increase vs. Battery Improvement
Year 2001 2004 2007 2010 2013 2016
Feature Size(nm) 130 90 65 45 32 22
Dynamic Power Reduction(X) 0 1.5 2.5 4.0 7.0 20
Stand-by Power Reduction(X) 2 6 15 30 150 800
[ITRS 2001] ⢠Cellular Phone
Talk Time : about 12Hrs
Standby : about 1 month
Smaller
Volumetric Energy
Fuel Cell Lighter
800
Density(Whr/L)
⢠Cellular Phone
Talk Time : 2Hrs ~ 4Hrs
600 Standby : about 1 week
Only 4~5 X improvement
400
Li-Ion / Polymer
In Battery lifetime!
NI-MH
200
100 200 300 400 500 600 700 800 900
Gravimetric Energy Density(Whr/Kg)
20. Current Limits of SoC
- Cost
ď§ Software cost exceeds Hardware cost when
size decreases
21. Current Limits of SoC
⢠Some Mixed Signals Challenges
⢠Design considerations of analog devices differs from
digital devices
⢠Process geometry size shrinks, analog gets bigger
⢠Need to be compensated for by increasing sizes of transistors,
capacitors and resistors used.
⢠Lower levels of predictability
⢠Parasitics capacitance and resistance less predictable
⢠Parasitics
⢠Noise issue
22. Current Limits of SoC
⢠Mixed Signals
⢠Integrating audio codecs in SoC for smartphones and tablets
At 28nm process technology, wafer costs are significantly
higher than 65 nm. (~40% higher) 40%
Unlike digital circuits, analog circuits do not scale in
accordance to Mooreâs law.
Eg: Scaling limitations of analog audio codec
1) Active amplifiers and resistive ladders
1) Reducing area of device negatively impacts the device
matching characteristics
2) Data converters
1) Noise level in switched capacitor circuits is inversely
proportional to the capacitance.
2) Supply voltage drop as process becomes smaller.
⢠In order to maintain dynamic range, area and
capacitance need to increase
3) Output drivers
1) Size of output devices will not scale with process
technology 20%
⢠Large output current must be delivered with low distortion.
24. â˘Multi-Cores for improvements to
CPU performance
Multi-Core
Lesser Leakage current
Less Power Consumption â˘Hyper threading to process tasks in parallel
Lesser Heat Loss
â˘Easier to turn off entire CPU for power-savings
Performance
Hyper-Threading
â˘Switch between CPU for temperature
Single management
Core
High Power Consumption
Heat Loss
High Leakage Current
Frequency
26. Difference between CPU/GPU
CPU GPU
General processing Iterative processing of
huge data
Few cores Hundreds of cores
Process a few threads Thousands of threads
simultaneouly
Less Power efficient More power efficient
Lesser floating point cores More floating point cores
Lesser FLOPS MoreFLOPs
27. Graphics Processing Unit (GPU)
TI Omap Power VR GPU
Improvements
12
10
Performance(X)
8
6
4
2
0
Omap 3 Omap 4 Omap 5
TI Omap PowerVR GPU
Nvidia UL Geforce GPU â˘Brand masters
Improvements Improving GPU to
3.5
achieve Graphic
performance that
3
Performance(X)
2.5
2
1.5
might rival that of
1 console games or
0.5
0 PC
Tegra 2 Tegra 3
28. The size advantage
Cheaper
More yield
Smaller size Production
per wafer
Costs
Flexibility of
form factor
29. Power
Most dominant Processor in Smartphone SoC (over 95% market share)
â ARM
A need for efficient Power
Management in SoC!!!
30. Power Saving vs Abstraction Layers
Design Time
SoC need faster Time to
Market
System/Algorithm/Architecture
have a large potential!
31. Power Saving via Architecture Design
Using Secondary CPU
SoC
Main Secondary
CPU CPU
(CPU A) (CPU B)
Secondary CPU to handle all the âlow-powerâ tasks like running the operating system in sleep mode,
checking emails and notification, and keeping the system alive when you are reading a book, playing media
files.
Asynchronous Symmetrical Multi-Processor system
(aSMP)
Independent clock and voltage:
aSMP allows each CPU to run at the
appropriate frequency & voltage
depending on the workload executed
33. Economies of Scale
Mobile SoC Brand Utilizing Smartphone Utilizing Tablets
HTC Vivid
HTC Amaze 4G
Qualcomm HTC Sensation HTC Jetstream
HTC
Snapdragon S3 HTC EVO 3D
HTC Rezound
HTC Rhyme
LG Nitro HD
LG LG Optimus LTE LU6200
LG Spectrum
Samsung Galaxy S II
Samsung Galaxy S II LTE
Samsung Samsung Galaxy S II Skyrocket Samsung Galaxy Tab 8.9
Samsung Galaxy Note
Samsung Galaxy S Blaze 4G
Asus Asus Eee Pad Memo
Sony Xperia Ion
Sony
Sony Xperia S
Huawei Mediapad
T-Mobile myTouch 4G Slide
Le Pan II
Others Xiaomi MI-One
Pantech Element
ZTE Optik
T-mobile Springboard Tablet
Toshiba Toshiba AT270
34. Potential in Mixed Signals
⢠Supply voltage restrictions on output driver performance
⢠At 28 nm process technology, most SoC will migrate to 1.8 V
I/O transistors.
⢠Will cause output voltage swing to drop to 0.54 Vrms which will limit
the performance of the headphone. (From 40mW to 12mW)
⢠Solution:
⢠Tap into 3.3V supply used for the USB interface.
⢠Generate 3.3V supply with a charge pump that takes the existing
1.8V supply and creates a negative 1.8V supply
35. Potential in Mixed Signals
⢠Moving analog functionality into digital domain
⢠To increase the percentage of circuitry that follows
Mooreâs law and reduce the percentage of
circuitry that has limited scaling.
⢠Moving signal controls like volume, mixing and switching to
the digital domain.
⢠Digital-centric architectures where signal processing
is executed in digital blocks.