The first-ever smartphone technology monitor covering the latest components, packaging, and silicon chip choices of smartphone makers. More: https://www.systemplus.fr/monitors/smartphone-design-win-quaterly-monitor/

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22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
QUATERLY TECHNOLOGY MONITOR
SPM21001 – Monitor by Romain FRAUX and Audrey LAHRACH
Q1 2021 – Sample
Q1 2021 Quaterly Technology Monitor
SMARTPHONE DESIGN WIN MONITOR
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr

2. ©2021 by System Plus Consulting | SPM21001 Smartphone Design Win Quarterly Monitor Sample – Q1 2021 2
Table of Contents
Overview / Introduction 4
Executive Summary 12
Design Wins 32
o Design Wins per Vendors
o Design Wins per Vendors: Smartphones Details
o Design Wins per Vendors: OEM Evolution (Apple, Samsung, Huawei)
o Design Wins per Nationality
o Design Wins per Nationality: Smartphones Details
o Design Wins per Nationality: OEM Evolution (Apple, Samsung, Huawei)
Packaging 54
o Package Footprint per Vendors
o Package Footprint per Vendors: Smartphones Details
o Package Footprint per Vendors: OEM Evolution (Apple, Samsung, Huawei)
o Package Footprint per Category
o Package Footprint per Family
o Package Footprint: OEM Evolution (Apple, Samsung, Huawei)
eBoM Cost 69
o eBoM Cost per Category
o eBoM Cost per Category: Smartphones Details
o eBoM Cost per Category: OEM Evolution (Apple, Samsung, Huawei)
Die, Wafer & Technology 81
o Die Area per Vendors
o Die Area per Vendors: Smartphones Details
o Die Area per Vendors: OEM Evolution (Apple, Samsung, Huawei)
o Die Area per Nationality
o Die Area per Nationality: Smartphones Details
o Die Area per Nationality: OEM Evolution (Apple, Samsung, Huawei)
o Die Area per Category
o Die Area per Category: Smartphones Details
o Die Area per Category: OEM Evolution (Apple, Samsung, Huawei)
o Wafer Size Repartition
o Wafer Material Repartition
o Technology Node Repartition
Focus on Application Processors 113
o Focus on Application Processors
Focus on Memories 118
o Focus on NAND
o Focus on DRAM
Focus on Sensors 124
o Focus on Sensors: CMOS Image Sensors
o Focus on Sensors: Others
Focus on RF 133
o Focus on RF
Focus on Passives 138
o Focus on Capacitors
o Focus on Capacitors
o Focus on Capacitors
Feedbacks 143
Related Products 145
SystemPlus Consulting services 147

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Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
The Smartphone Design Win Monitor allows to stay updated on the latest components, packaging and silicon chip choices of
the smartphone makers.
This monitor offers a clear view of the semiconductor compagnies leading the market and a direct comparison between OEM.
It provides :
✓ Design wins for the top smartphones OEM (per vendors., nationality…)
✓ Packaging evolution in term of type, footprint, pitch…
✓ Die area evolution per function, technology node, wafer size…
✓ Focus per category (Processor, Camera, Memory, Sensor…)
The following deliverables is included in the monitor:
▪ An online dynamic dashboard with historical data from past years and last quarter including at least 8 new smartphones
analyzed during this quarter.
▪ A PDF slide deck with graphs and comments to explain the main technology evolutions on the smartphone market.
▪ Direct access to the analyst for more details and analysis of the data.
INTRODUCTION
©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1

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Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
MONITOR METHODOLOGY
❑ Methodology:
▪ We construct the smartphone monitor with data coming from representative phones:
➢ 8 per quarter, 32 per year
▪ It follows the shipment market share, which means that selected phones are a good representation
of the market (i.e. if a vendor has 20% market share, we will take around 20% of phones from that
vendor).
❑ One-year smartphones shipment market share (from Yole Développement):
Mfr.
Q1 2020 Units
(Million)
Q1 2020
%
Q2 2020 Units
(Million)
Q2 2020
%
Q3 2020 Units
(Million)
Q3 2020
%
Q4 2020 Units
(Million)
Q4 2020
%
Nb Phones to analyse
per year
Samsung 61 21% 68 21% 70 21% 74 21% 6.7
Apple 41 14% 46 14% 47 14% 50 14% 4.5
Xiaomi 35 12% 39 12% 40 12% 42 12% 3.8
Huawei 32 11% 36 11% 37 11% 39 11% 3.5
Others 29 10% 32 10% 33 10% 35 10% 3.1
Vivo 25 9% 28 9% 29 9% 30 9% 2.7
OPPO 25 8% 27 8% 28 8% 30 8% 2.7
Honor 13 4% 13 4% 13 4% 14 4% 1.3
Realme 8 3% 9 3% 9 3% 10 3% 0.9
LG 5 2% 6 2% 6 2% 6 2% 0.6
ZTE 5 2% 6 2% 6 2% 6 2% 0.6
Lenovo 5 2% 5 2% 6 2% 6 2% 0.5
Google 2 1% 3 1% 3 1% 3 1% 0.3
OnePlus 2 1% 3 1% 3 1% 3 1% 0.3
TCL 2 1% 2 1% 2 1% 3 1% 0.2
Sony 1 0% 1 0% 1 0% 1 0% 0.1
Meizu 1 0% 1 0% 1 0% 1 0% 0.1
ASUS 0 0% 0 0% 0 0% 0 0% 0.0
HTC 0 0% 0 0% 0 0% 0 0% 0.0
Coolpad 0 0% 0 0% 0 0% 0 0% 0.0
Total 294 325 332 353 32.0
©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1

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Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
MONITOR METHODOLOGY
Phone-Level Filters IC-Level Filters Package-Level Filters Die-Level Filters
Teardown Date IC Manufacturer Package Length Die Manufacturer
Phone Manufacturer IC Manufacturer Nationality Package Width Die Manufacturer Nationality
Phone Manufacturer Nationality IC Reference Package Height Die Category
Phone Model IC Category Package Area Die SubCategory
IC SubCategory Package Ball/Pin number Die Quantity
IC Quantity Package Pitch Die Length
IC ASP Package Type/Family Die Width
Die Area
Die Process Node
Die Wafer Size
Die Wafer Material
❑ Database Filters:
▪ The Excel database provided with the slides deck allows to realize filters and to create pivot
tables using at least 29 levels of filters:
©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1

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Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
MONITOR METHODOLOGY
❑ IC/Die Categories:
▪ Seven categories and several subcategories are used to differentiate the functional areas of
the phones:
Application
Processor
Audio & Power
Management
Baseband Connectivity Memory RF Sensor
APU/APE ADC/DAC Modem
(2G/3G/4G/5G)
Bluetooth DRAM RF Transceiver Fingerprint Sensor
ASIC Audio Amp GPS FLASH NAND RF Front-End Environmental
Sensor
FPGA Audio Codec NFC/MST Serial
FLASH/EEPROM
Image Sensor
ISP Audio Processor WiFi Inertial Sensor
MCU Charger/Interface/P
rotection IC
FM/TV Light/Proximity
Sensor
Controller/Driver
(Display, LED,
Touch…)
Magnetic Sensor
Power
Management Unit
(PMU)
Microphone
Switch/SMPS/Envel
ope Tracking IC
Radar
©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1

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Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
Q1 2021 SMARTPHONES REFERENCES SELECTED
❑ Smartphones references selected for Q1 2021 monitor:
▪ Q1 2021 (8 smartphones):
➢ Apple iPhone 12 US
➢Apple iPhone 12 Pro Max US
➢Google Pixel 4a
➢Huawei nova 7 SE 5G Youth
➢Microsoft Surface Duo
➢Samsung Galaxy Note 20
➢Samsung Galaxy Z Fold 2
➢Vivo X50 Pro
©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1

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Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
Overview / Introduction
o Introduction
o Monitor Methodology
o Smartphones References
o Glossary
Executive Summary
Monitor
Feedbacks
Related Analyses
About System Plus Consulting
ONE-YEAR SMARTPHONES REFERENCES SELECTED
Mfr.
Nb Phones
Selected
over a year
Samsung 6
Huawei 4
Apple 3
Xiaomi 2
Oppo 2
Vivo 3
Other 12
Total 32
❑ Smartphones references selected for the monitor:
Year Quarter Mfr. Ref. Chipset Display RAM NAND Network
2021 Q1 APPLE iPhone 12 Pro Max US Apple A14 6.7" 6GB 128GB 5G
2021 Q1 APPLE iPhone 12 5G US Apple A14 6.1" 4GB 64GB 5G
2021 Q1 GOOGLE Pixel 4a Qualcomm Snapdragon 730G 5.8" 6GB 128GB 4G
2021 Q1 Huawei nova 7 SE 5G Youth HiSilicon Kirin 820 6.5" 8GB 128GB 5G
2021 Q1 MICROSOFT Surface Duo Qualcomm Snapdragon 855 8.1" 6GB 128GB 4G
2021 Q1 SAMSUNG Galaxy Z Fold2 5G Qualcomm Snapdragon 865+ 7.6" 12GB 256GB 5G
2021 Q1 Samsung Galaxy Note 20 5G Qualcomm Snapdragon 865+ 6.7" 8GB 128GB 5G
2021 Q1 Vivo X50 Pro Qualcomm Snapdragon 765G 6.5" 8GB 128GB 5G
2020 Q4 Apple iPhone SE (2020) Apple A13 4.7" 3GB 128GB 4G
2020 Q4 Huawei P40 Pro 5G HiSilicon Kirin 990 6.6" 8GB 256GB 5G
2020 Q4 Motorola Edge+ Qualcomm Snapdragon 865 6.7" 12GB 256GB 5G
2020 Q4 OnePlus 8 5G Qualcomm Snapdragon 865 6.5" 8GB 128GB 5G
2020 Q4 Realme X50 5G Qualcomm Snapdragon 765 6.6" 8GB 128GB 5G
2020 Q4 Samsung Galaxy M31 Samsung Exynos 9611 6.4" 6GB 64GB 4G
2020 Q4 Sharp AQUOS R5G Qualcomm Snapdragon 865 6.5" 12GB 256GB 5G
2020 Q4 ZTE Nubia Red Magic 5G Qualcomm Snapdragon 865 6.6" 12GB 256GB 5G
2020 Q3 Huawei Mate Xs HiSilicon Kirin 990 8.0"" 8GB 512GB 5G
2020 Q3 LG Electronics V60 ThinQ 5G Qualcomm Snapdragon 865 6.8" 8GB 128GB 5G
2020 Q3 Motorola Razr 2019 Qualcomm Snapdragon 710 6.2" 6GB 128GB 4G
2020 Q3 OPPO Find X2 5G Qualcomm Snapdragon 865 6.7" 12GB 256GB 5G
2020 Q3 Samsung Galaxy S20 Ultra 5G USA Qualcomm Snapdragon 865 6.9" 12GB 128GB 5G
2020 Q3 Samsung Galaxy Z Flip Qualcomm Snapdragon 855+ 6.7" 8GB 256GB 4G
2020 Q3 Vivo Nex 3s 5G Qualcomm Snapdragon 865 6.9" 12GB 256GB 5G
2020 Q3 Xiaomi Mi 10 Pro 5G Qualcomm Snapdragon 865 6.7" 8GB 256GB 5G
2020 Q2 HTC Desire 19s Mediatek Helio P22 6.2" 3GB 32GB 4G
2020 Q2 Huawei Mate 30 Pro 5G HiSilicon Kirin 990 6.5" 8GB 256GB 5G
2020 Q2 Motorola One Hyper Qualcomm Snapdragon 675 6.5" 4GB 64GB 4G
2020 Q2 OPPO Reno3 Pro 5G Qualcomm Snapdragon 765 6.5" 8GB 128GB 5G
2020 Q2 Samsung Galaxy A51 Samsung Exynos 9611 6.5" 4GB 128GB 4G
2020 Q2 Vivo X30 Pro 5G Samsung Exynos 980 6.4" 8GB 128GB 5G
2020 Q2 Xiaomi Mi Note 10 Global Qualcomm Snapdragon 730G 6.5" 6GB 128GB 4G
2020 Q2 ZTE Blade 10 Prime Mediatek Helio P60 6.3" 3GB 64GB 4G
©2021 by System Plus Consulting | SPM21001 - Smartphone Design Win Monitor Sample 2021 Q1

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Overview / Introduction
Executive Summary
Monitor
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About System Plus Consulting
Overview / Introduction
Executive Summary
Monitor
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About System Plus Consulting
Q1 2021 DESIGN WINS PER VENDORS
©2021 by System Plus Consulting
❑ Q1 2021 shows Qualcomm leading with xxx design wins (xx%).
▪ Most of them are processors (Snapdragon), RF components (Transceivers, RFFEM) and PMIC
Q1 2021 Design Wins: xxx units
Q4 2020 Design Wins: xxx units
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Overview / Introduction
Executive Summary
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About System Plus Consulting
Overview / Introduction
Executive Summary
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Q1 2021 DESIGN WINS PER NATIONALTY
©2021 by System Plus Consulting
Q1 2021 Design Wins: xxx units
Q4 2020 Design Wins: xxx units
❑ Nationality represents the country of the headquarter of the component provider.
❑ USA represents xx% of the design wins in Q1 2021
▪ Qualcomm, Qorvo, Skyworks, Broadcom Texas Instruments and Cirrus Logic account for the majority of these design wins.
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Overview / Introduction
Executive Summary
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About System Plus Consulting
Overview / Introduction
Executive Summary
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About System Plus Consulting
Q1 2021 PACKAGE FOOTPRINT PER VENDORS
©2021 by System Plus Consulting
Q1 2021 Total Footprint: xxx mm²
Q4 2020 Total Footprint: xxx mm²
❑ Q1 2021 shows Qualcomm leading with xxx (xx%) of packages among the 8 selected smartphones.
▪ Most of this area is for snapdragon processors and modems, followed by RF components (Transceivers, RFFEM).
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Overview / Introduction
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Q1 2021 PACKAGE FOOTPRINT DISTRIBUTION PER FAMILY
Q1 2021 Package Footprint Distribution
©2021 by System Plus Consulting
❑ BGA/LGA is the main packaging platform (xx% in Q1
2021) for smartphones.
▪ BGA/LGA packages are used in all categories of components, with
around xx% of the footprint being used for memories.
Total Footprint
xxx mm²
Total Footprint
xxx mm²
Total Footprint
xxx mm²
Total Footprint
xxx mm²
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Overview / Introduction
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Q1 2021 eBOM COST PER CATEGORY
©2021 by System Plus Consulting
Q1 2021 Total eBOM Cost: $xxx
Q4 2020 Total eBOM Cost: $xxx
❑ Memory represents xx% of BoM cost for the electronic components in Q1 2021 (Display, battery, PCB and mechanical components
excluded).
▪ NAND & DRAM drive this cost, with only 4 players involved: Samsung, Kioxia, SK Hynix and Micron.
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Overview / Introduction
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Q1 2021 DIE AREA PER VENDORS
©2021 by System Plus Consulting
Q1 2021 Total Die Area: xxx mm²
Q4 2020 Total Die Area: xxx mm²
❑ Samsung is leading the die area utilization in Q1 2021, with xxx (xx%).
▪ xxxx is the main driver.
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Overview / Introduction
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Overview / Introduction
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Q1 2021 DIE AREA PER NATIONALTY
©2021 by System Plus Consulting
Q1 2021 Total Die Area: xxx mm²
Q4 2020 Total Die Area: xxx mm²
❑ USA accounts for xxx mm² of dies area in Q1 2021 (xx%)
▪ This dies area is most only realized by xx players: xx and xx.
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Overview / Introduction
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Overview / Introduction
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Q1 2021 DIE AREA PER CATEGORY
©2021 by System Plus Consulting
Q1 2021 Total Die Area: xxx mm²
Q4 2020 Total Die Area: xxx mm²
❑ Memory accounts for xxx mm² (xx%) of dies area in Q1 2021.
▪ xxxx.
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Overview / Introduction
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Overview / Introduction
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Q1 2021 WAFER SIZE REPATITION
©2021 by System Plus Consulting
xxx mm²
❑ 300mm (12-inch) wafers represents xx% of dies area used in
Q1 2021.
❑ By using this calculated area, and to ensure xxM
smartphones units shipment in Q1 2021 as estimated by Yole
Développement, it would require:
✓ xxK units of 150mm wafers
✓ xxM units of 200mm wafers
✓ xxM units of 300mm wafers
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Q1 2021 WAFER MATERIAL REPARTITION
©2021 by System Plus Consulting
❑ Silicon represents xx% of the material
used in Q1 2021.
❑ By using this calculated area, and to
ensure xxM smartphones units
shipment in Q1 2021 as estimated by
Yole Développement, it would require:
✓ xxM units of silicon wafers (200mm
equivalent)
✓ xxK units of SOI wafers (200mm
equivalent)
✓ xxK units of LT/LN wafers (200mm
equivalent)
✓ xxK units of III/V wafers (200mm
equivalent)
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Q1 2021 TECHNOLOGY NODES BREAKDOWN
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Total dies Area
xxx mm²
❑ Leading edge technologies (14nm down to 5nm) represents xx% of
the dies area in Q1 2021.
❑ DRAM and application processors are driving this consumption.
❑ By using this calculated area, and to ensure xxM smartphones
units shipment in Q1 2021 as estimated by Yole Développement, it
would require:
✓ xxM units of wafers using 14-5nm technology nodes
✓ xxM units of wafers using 28-16nm technology nodes
✓ xxM units of wafers using 90-32nm technology nodes
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Overview / Introduction
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Q1 2021 PACKAGE FOOTPRINT PER CATEGORY: SMARPHONES DETAILS
©2021 by System Plus Consulting
❑Apple iPhone 12 Pro Max and Samsung Galaxy Z Fold 2 are the phones holding the most ICs area.
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Q1 2021 DIE AREA PER CATEGORY: SMARTPHONES DETAILS
©2021 by System Plus Consulting
❑ The Samsung Galaxy Z Fold 2 and Samsung Galaxy Note 20 are the smartphones having the most dies area.
▪ xxxx.
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Q1 2021 FOCUS ON APPLICATION PROCESSORS
©2021 by System Plus Consulting
Snapdragon
865+
Apple A14 Apple A14 Kirin 820
Snapdragon
730G
Snapdragon
855
❑ Among the 8 smartphones used for Q1 2021, only three vendors are integrated: Qualcomm, Apple and HiSilicon.
▪ xxx.
Snapdragon
865+
Snapdragon
765G
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Q1 2021 FOCUS ON MEMORY: NAND
Q1 2021 NAND Die Area
©2021 by System Plus Consulting
❑ xxxx.
▪ xxxx.
128GB
64GB
128GB
128GB
256GB
128GB 128GB 128GB
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Q1 2021 FOCUS ON MEMORY: DRAM
©2021 by System Plus Consulting
❑ xxxx.
▪ xxxx.
8GB
LPDDR5
6GB
LPDDR4X
12GB
LPDDR5
4GB
LPDDR4X
6GB
LPDDR4X
8GB
LPDDR4X 6GB
LPDDR4X
8GB
LPDDR4X
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Q1 2021 FOCUS ON SENSORS – CMOS IMAGE SENSORS
©2021 by System Plus Consulting
❑ xxxx.
▪ xxxx.
Rear Main:
12Mp
Rear telephoto:
64Mp
Rear Wide:
12Mp
Front:
10Mp
Front depth:
8Mp
Rear Main:
12Mp
Rear telephoto:
12Mp
Rear Wide:
12Mp
Front:
12Mp
Front 3D: 1.5Mp
Rear Main:
12Mp
Front:
10Mp
Inside:
10Mp
Rear Wide:
12Mp
Rear telephoto:
12Mp
Rear Main:
12Mp
Rear Wide:
12Mp
Front:
12Mp
Front 3D: 1.5Mp
Rear 3D:
12Mp
Rear Main:
64Mp
Front:
16Mp
Rear Macro: 2Mp
Rear Bokeh: 2Mp
Rear Wide:
8Mp
Rear Main:
12.2Mp
Front: 8Mp
Front: 11Mp Rear telephoto: 8Mp
Front:
32Mp
Rear Portrait:
13Mp
Rear Main:
48Mp
Rear Wide:
8Mp
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Q1 2021 FOCUS ON SENSORS – OTHERS
©2021 by System Plus Consulting
❑ xxxx.
▪xxxx.
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Q1 2021 FOCUS ON RF
©2021 by System Plus Consulting
❑ xxxx.
▪xxxx.
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R E L AT E D
ANALYSES
R E L AT E D
ANALYSES

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RELATED PRODUCTS
REVERSE COSTING REPORTS
MONITORS
TEARDOWN TRACKS
o CMOS Image Sensor Quarterly Market Monitor
o Advanced Packaging Quarterly Market Monitor
o Processor Quarterly Market Monitor
o NAND Quarterly Market Monitor
o DRAM Quarterly Market Monitor
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30. ©2021 by System Plus Consulting | SPM21001 Smartphone Design Win Quarterly Monitor Sample – Q1 2021 30
COMPANY
S E R V I C E S

31. ©2021 by System Plus Consulting | SPM21001 Smartphone Design Win Quarterly Monitor Sample – Q1 2021 31
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o Company services
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FIELDS OF EXPERTISE

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BUSINESS MODEL

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Overview / Introduction
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34. ©2021 by System Plus Consulting | SPM21001 Smartphone Design Win Quarterly Monitor Sample – Q1 2021 34
Overview / Introduction
Executive Summary
Monitor
Feedbacks
Related Products
About System Plus
o Company services
o Contact
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