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©2017 System Plus Consulting | Integrated Passive Devices Review 1
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Integrated Passive Devices Review
Broadcom, Qorvo, Skyworks, STMicroelectronics, IPDiA
MEMS report by Stéphane ELISABETH
December 2017 – Version 1
©2017 System Plus Consulting | Integrated Passive Devices Review 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Qorvo, Broadcom Limited, Skyworks Solution, STMicroelectronics,
Murata Integrated Passive Solutions (Former IPDiA)
o Smartphones Teardown:
Xiaomi Mi6, Samsung Galaxy S7, Samsung Galaxy S8, Apple iPhone X
o STMicroelectronics technology
o IPDiA Technology
o IPD applications
Market Analysis 45
o RF Substrate
o Substrate by Application
o Glass Substrate Market for RF devices
Physical Comparison 45
o Materials Comparison
o Passives density per applications
o Process Comparison
o Cost Comparison
Physical Analysis 47
o Synthesis of the Physical Analysis
o RF IPD for Wifi/Bluetooth Application 50
o Qorvo’s IPD 51
 Die Views & Dimensions
 Die Top Structure
 Die Electrical Structure
 Die Cross-Section
 Package Opening
 Die Process
o Skyworks’s IPD 74
o STMicroelectronics’ IPD 101
o RF IPD for LTE/HSPA/EDGE/GSM 129
o Broadcom’s IPD 130
o Murata’s IPD 141
o Skyworks’ IPD 160
o RF IPD for ISM/SRD 179
o STMicroelectronics’ IPD 180
o iPDIA’s IPD 206
o Skyworks’ IPD 160
Manufacturing Process Flow 238
o Global Overview
o RF IPD for Wifi/Bluetooth Application 240
o Wafer Fabrication Unit
o Front-End Process Flow
o RF IPD for LTE/HSPA/EDGE/GSM 258
o RF IPD for ISM/SRD 276
Cost Analysis 284
o Yields Explanation & Hypotheses
o RF IPD for Wifi/Bluetooth Application 287
o Qorvo’s IPD Die 288
 Main Steps of Economical Analysis
 Wafer Front-End Cost
 Wafer Front-End Cost per process steps
 Back-End 0 Cost: Bumping & Dicing
 Back-End Final Test
 Component Cost
o Skyworks’s IPD 297
o STMicroelectronics’ IPD 306
o RF IPD for LTE/HSPA/EDGE/GSM 315
o Broadcom’s IPD 316
o Murata’s IPD 325
o Skyworks’ IPD 331
o RF IPD for ISM/SRD 337
o STMicroelectronics’ IPD 338
o iPDIA’s IPD 347
o Skyworks’ IPD 356
Estimated Price Analysis 365
Company services 367
Same structure
for all devices
Same structure for
all Applications
Same structure for
all devices
©2017 System Plus Consulting | Integrated Passive Devices Review 3
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
• This comparative technologies & cost study has been conducted to provide insight on technology & costing data for
RF Integrated Passive Devices (IPD) working on different ranges of communication frequency. The report includes
the study of seven IPDs found in flagships smartphones (Apple iPhone X, Samsung Galaxy S7 & S8, LeTv Le Max 2
Pro) or on the market. This report provides a deep analysis of RF IPD containing inductance, resistor, and
capacitance. Its complete System Plus reports portfolio along with decoupling capacitors IPD.
• This comparative technology study was conducted to provide insight regarding technology and cost estimates for RF
IPDs in various applications. This report studies nine devices in three applications (Wifi/Bluetooth/cellular
communication (LTE/HSPA/GPRS/EDGE), industrial, and scientific/medical short-range devices (ISM/SRD), where five
players (Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics) are active. Besides the ISM/SRD applications,
the other devices are extracted from recent smartphones like the new Apple iPhone X.
• All devices are analyzed in detail, and electrical structures of each component are presented. Sizes and technologies
are extracted to provide a large sampling of various IDMs’ technical and economical choices. We also provide an
overview of passive integration techniques for inductors, resistors, and capacitors.
• This report includes a description of each component, its major characteristics (substrate type (GaAs, silicon, glass),
passivation layers, passive integration, etc.) and a comparison of all devices analyzed. Also included is a
manufacturing cost estimate for the IPDs.
Executive Summary
©2017 System Plus Consulting | Integrated Passive Devices Review 4
Overview / Introduction
Company Profile & Supply
Chain
o Qorvo
o Broadcom
o Skyworks
o STMicroelectronics
o Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Smartphones Teardown – Apple iPhone X
Apple iPhone X – Front & Back View
©2017 by System Plus Consulting
Apple iPhone X – Opened View
©2017 by System Plus Consulting
Apple iPhone X – Board Extracted
©2017 by System Plus Consulting
©2017 System Plus Consulting | Integrated Passive Devices Review 5
Overview / Introduction
Company Profile & Supply
Chain
o Qorvo
o Broadcom
o Skyworks
o STMicroelectronics
o Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Opening
©2017 System Plus Consulting | Integrated Passive Devices Review 6
Overview / Introduction
Company Profile & Supply
Chain
o Qorvo
o Broadcom
o Skyworks
o STMicroelectronics
o Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Integrated Passives Devices Applications
©2017 System Plus Consulting | Integrated Passive Devices Review 7
Overview / Introduction
Company Profile & Supply
Chain
o Qorvo
o Broadcom
o Skyworks
o STMicroelectronics
o Murata Passive Integrated
Solution
o Technologies
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Glass Material Market for RF devices
©2017 System Plus Consulting | Integrated Passive Devices Review 8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Materials Comparison
©2017 System Plus Consulting | Integrated Passive Devices Review 9
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Synthesis of the Physical analysis
©2017 System Plus Consulting | Integrated Passive Devices Review 10
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
STMicroelectronics’ IPD – Package/Die View & Dimensions
©2017 System Plus Consulting | Integrated Passive Devices Review 11
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
STMicroelectronics’ IPD – Die Structure – Top view
©2017 System Plus Consulting | Integrated Passive Devices Review 12
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
STMicroelectronics’ Bluetooth IPD – Die Structure – Electrical Structure
Equivalent Circuit Schematic View
©2017 System Plus Consulting | Integrated Passive Devices Review 13
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
STMicroelectronics’ Bluetooth IPD – Die Structure – Top view
©2017 System Plus Consulting | Integrated Passive Devices Review 14
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
STMicroelectronics’ Bluetooth IPD – Die Structure – Top view
©2017 System Plus Consulting | Integrated Passive Devices Review 15
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
STMicroelectronics’ Bluetooth IPD – Die Cross Section
©2017 System Plus Consulting | Integrated Passive Devices Review 16
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Synthesis
o Qorvo’s WiFi IPD
o Skyworks’s WiFi IPD
o STMicroelectronics’
Bluetooth IPD
o Broadcom’s LTE IPD
o IPDiA’s IMS IPD
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
STMicroelectronics’ Bluetooth IPD – Die Cross Section – Capacitance
©2017 System Plus Consulting | Integrated Passive Devices Review 17
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Global Overview
o MEMS Front-End Process
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2017 System Plus Consulting | Integrated Passive Devices Review 18
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Global Overview
o MEMS Front-End Process
Cost Analysis
Selling Price Analysis
About System Plus
Qorvo’s IPD – MEMS Process Flow
©2017 System Plus Consulting | Integrated Passive Devices Review 19
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Global Overview
o MEMS Front-End Process
Cost Analysis
Selling Price Analysis
About System Plus
Qorvo’s IPD – Die Process Flow 1/4
©2017 System Plus Consulting | Integrated Passive Devices Review 20
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Supply Chain
o Yields
o Front-End Cost.
o Back-End Cost
o Component Cost
Selling Price Analysis
About System Plus
STMicroelectronics’ IPD – Wafer Front-End Cost
©2017 System Plus Consulting | Integrated Passive Devices Review 21
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Supply Chain
o Yields
o Front-End Cost.
o Back-End Cost
o Component Cost
Selling Price Analysis
About System Plus
STMicroelectronics’ IPD – Component Cost
©2017 System Plus Consulting | Integrated Passive Devices Review 22
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
o Financial Ratios
o Manufacturer Price
About System Plus
STMicroelectronics’ IPD – Estimated Manufacturer Price
©2017 System Plus Consulting | Integrated Passive Devices Review 23
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
RF
• Advanced RF SiPs for Cell Phones: Reverse Costing
Overview
• Smartphone RF Front-End Module Review
• Silicon Capacitor Technology and Cost Review
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
RF
• Glass Substrate Manufacturing in the Semiconductor Field
• Advanced RF System-in-Package for Cell Phones 2017
COMPLETE
TEARDOWN WITH:
• Detailed photos
and cross-
sections
• Precise
measurements
• Die structure
• Materials analysis
• Supplier
comparison
• Manufacturing
process flow
• Manufacturing
cost analysis
RF Integrated Passive Devices:
Reverse Costing Overview
Title: RF IPD
Technology & Cost
Review
Pages: 300
Date: December 2017
Format: PDF & Excel
file
Price: Full report:
EUR 3,990
Technology and cost review of nine RF IPD found on the market from different
suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics
With 5G communication technology incoming, this is the perfect time to explore
several IPD technologies and compare the different companies’ integration choices and
cost efficiencies.
This report provides a deep analysis of RF IPD containing inductance, resistor, and
capacitance. It completes System Plus Consulting reports portfolio along with decoupling
capacitors IPD.
This comparative technology study was conducted to provide insight regarding
technology and cost estimates for RF IPDs in various applications. This report studies nine
devices in three applications (Wifi / Bluetooth / cellular communication (LTE / HSPA /
GPRS / EDGE), industrial, and scientific / medical short-range devices (ISM / SRD), where
five players (Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics) are active.
Besides the ISM/SRD applications, the other devices are extracted from recent
smartphones like the new Apple iPhone X.
All devices are analyzed in detail, and electrical structures of each component are
presented. Sizes and technologies are extracted to provide a large sampling of various
IDMs’ technical and economical choices. We also provide an overview of passive
integration techniques for inductors, resistors, and capacitors.
This report includes a description of each component, its major characteristics (substrate
type (GaAs, silicon, glass), passivation layers, passive integration, etc.) and a comparison
of all devices analyzed. Also included is a manufacturing cost estimate for the IPDs.
With integrated passive devices (IPD)
accounting for almost 70 % of the PCB
area in smartphones, integration is a
challenge that several integrated device
manufacturers (IDM) and outsourced
semiconductor assembly & test (OSAT)
companies have accepted in the last few
years. Players active in the RF applications
market include IDM companies like Qorvo,
Skyworks, Murata, Broadcom, and
STMicroelectronics, as well as OSATs such
as STATS ChipPAC, ASE, Amkor, and TSMC.
TABLE OF CONTENTS
Overview / Introduction
Company Profile (Skyworks
Solutions, Murata, iPDIA, Qorvo,
Broadcom, STMicroelectronics)
Smartphone Teardown (Xiaomi Mi6,
Samsung Galaxy S8, Samsung Galaxy
S7, Apple iPhone X)
Market Analysis
Physical Analysis
• RF IPD for Wifi/Bluetooth Applications
 Qorvo, STMicroelectronics, and
Skyworks IPD
• Die view and dimensions
• Die structure: Inductance,
capacitance, resistance, electrical
schematic
• Die cross-section: Metal layers,
capacitance, resistance, passivation
• RF IPD for LTE/HSPA/EDGE/GSM
Applications
 Murata, Broadcom, and Skyworks
IPD
• Die view and dimensions
• Die structure: Inductance,
capacitance, resistance, electrical
schematic
• Die cross-section: Metal layers,
capacitance, resistance, passivation
Author (Lab):
Véronique
Le Troadec
AUTHORS:
cture analysis of semi-
conductors. She has deep
knowledge of chemical and
physical technical analyses.
She previously worked for 20
years at Atmel’s Nantes
Laboratory.
Véronique
Le Troadec (Lab)
Véronique is in
charge of stru-
Stéphane
Elisabeth
Stéphane has a
deep knowledge
of materials characterizations
and electronics systems. He
holds an Engineering Degree in
Electronics and Numerical
Technology, and a PhD in
Materials for Micro-
electronics.
• RF IPD for ISM/SRD
Applications
 iPDIA and
STMicroelectronics’ IPD
• Die view and dimensions
• Die structure:
• Inductance, capacitance,
resistance, electrical
schematic
• Die cross-section: Metal
layers, capacitance,
resistance, passivation
• IPD technologies comparison
Manufacturing Process Flow
• RF IPD die fabrication unit
• RF IPD package process flow
Cost Analysis
• Cost analysis overview
• Supply chain description
• Yield hypotheses
• RF IPD die cost analysis
 RF IPD die front-end cost
 RF IPD die cost by process
step
• Final test cost
• Component cost
Estimated Price Analysis
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price.
MEMS CoSim+
Cost simulation tool to
evaluate the cost of any
MEMS process or device:
From single chip to complex
structures.
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+
MEMS CoSim+
Distributed by
Performed by
Advanced RF SiPs for Cell
Phones: Reverse Costing
Overview
Smartphone RF Front-End
Module Review
Silicon Capacitor Technology
and Cost Review
Physical analyses and cost estimation
of radio-frequency Systems-in-
Packages from Skyworks Solutions,
Murata, TDK-Epcos, Qorvo and
Broadcom / Avago.
Review of RF front-end modules and
components found in five flagship
smartphones: Apple iPhone 7 Plus,
Samsung Galaxy S7, Huawei P9, LG
G5, and Xiaomi Mi5.
Discover the differences between
silicon capacitor technologies from
TSMC, Skyworks, Murata / IPDiA and
Vishay and their related costs.
Pages: 140
Date: November 2017
Full report: EUR 4,990*
Pages: 295
Date: February 2017
Full report: EUR 4,990*
Pages: 140
Date: September 2017
Full report: EUR 3,490*
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Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
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IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be
entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
Distributed by
©2017 System Plus Consulting | Integrated Passive Devices Review 24
COMPANY
SERVICES
©2017 System Plus Consulting | Integrated Passive Devices Review 25
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
Business Model Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings
©2017 System Plus Consulting | Integrated Passive Devices Review 26
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
o Company services
o Feedbacks
o Contact
o Legal
Contact
Headquarters
21 rue La Noue Bras de Fer
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
America Sales Office
Steve LAFERRIERE
Phoenix
USA
(310) 600-8267
laferriere@yole.fr
www.systemplus.fr
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
onozawa@yole.fr
Mavis WANG
GREATER CHINA
wang@yole.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europa Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
PHOENIX
YOLE Inc.
KOREA
YOLE

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RF Integrated Passive Devices: Reverse Costing Overview 2017 report published by System Plus

  • 1. ©2017 System Plus Consulting | Integrated Passive Devices Review 1 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr Integrated Passive Devices Review Broadcom, Qorvo, Skyworks, STMicroelectronics, IPDiA MEMS report by Stéphane ELISABETH December 2017 – Version 1
  • 2. ©2017 System Plus Consulting | Integrated Passive Devices Review 2 Table of Contents Overview / Introduction 3 o Executive Summary o Reverse Costing Methodology Company Profile 6 o Qorvo, Broadcom Limited, Skyworks Solution, STMicroelectronics, Murata Integrated Passive Solutions (Former IPDiA) o Smartphones Teardown: Xiaomi Mi6, Samsung Galaxy S7, Samsung Galaxy S8, Apple iPhone X o STMicroelectronics technology o IPDiA Technology o IPD applications Market Analysis 45 o RF Substrate o Substrate by Application o Glass Substrate Market for RF devices Physical Comparison 45 o Materials Comparison o Passives density per applications o Process Comparison o Cost Comparison Physical Analysis 47 o Synthesis of the Physical Analysis o RF IPD for Wifi/Bluetooth Application 50 o Qorvo’s IPD 51  Die Views & Dimensions  Die Top Structure  Die Electrical Structure  Die Cross-Section  Package Opening  Die Process o Skyworks’s IPD 74 o STMicroelectronics’ IPD 101 o RF IPD for LTE/HSPA/EDGE/GSM 129 o Broadcom’s IPD 130 o Murata’s IPD 141 o Skyworks’ IPD 160 o RF IPD for ISM/SRD 179 o STMicroelectronics’ IPD 180 o iPDIA’s IPD 206 o Skyworks’ IPD 160 Manufacturing Process Flow 238 o Global Overview o RF IPD for Wifi/Bluetooth Application 240 o Wafer Fabrication Unit o Front-End Process Flow o RF IPD for LTE/HSPA/EDGE/GSM 258 o RF IPD for ISM/SRD 276 Cost Analysis 284 o Yields Explanation & Hypotheses o RF IPD for Wifi/Bluetooth Application 287 o Qorvo’s IPD Die 288  Main Steps of Economical Analysis  Wafer Front-End Cost  Wafer Front-End Cost per process steps  Back-End 0 Cost: Bumping & Dicing  Back-End Final Test  Component Cost o Skyworks’s IPD 297 o STMicroelectronics’ IPD 306 o RF IPD for LTE/HSPA/EDGE/GSM 315 o Broadcom’s IPD 316 o Murata’s IPD 325 o Skyworks’ IPD 331 o RF IPD for ISM/SRD 337 o STMicroelectronics’ IPD 338 o iPDIA’s IPD 347 o Skyworks’ IPD 356 Estimated Price Analysis 365 Company services 367 Same structure for all devices Same structure for all Applications Same structure for all devices
  • 3. ©2017 System Plus Consulting | Integrated Passive Devices Review 3 Overview / Introduction o Executive Summary o Reverse Costing Methodology Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus • This comparative technologies & cost study has been conducted to provide insight on technology & costing data for RF Integrated Passive Devices (IPD) working on different ranges of communication frequency. The report includes the study of seven IPDs found in flagships smartphones (Apple iPhone X, Samsung Galaxy S7 & S8, LeTv Le Max 2 Pro) or on the market. This report provides a deep analysis of RF IPD containing inductance, resistor, and capacitance. Its complete System Plus reports portfolio along with decoupling capacitors IPD. • This comparative technology study was conducted to provide insight regarding technology and cost estimates for RF IPDs in various applications. This report studies nine devices in three applications (Wifi/Bluetooth/cellular communication (LTE/HSPA/GPRS/EDGE), industrial, and scientific/medical short-range devices (ISM/SRD), where five players (Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics) are active. Besides the ISM/SRD applications, the other devices are extracted from recent smartphones like the new Apple iPhone X. • All devices are analyzed in detail, and electrical structures of each component are presented. Sizes and technologies are extracted to provide a large sampling of various IDMs’ technical and economical choices. We also provide an overview of passive integration techniques for inductors, resistors, and capacitors. • This report includes a description of each component, its major characteristics (substrate type (GaAs, silicon, glass), passivation layers, passive integration, etc.) and a comparison of all devices analyzed. Also included is a manufacturing cost estimate for the IPDs. Executive Summary
  • 4. ©2017 System Plus Consulting | Integrated Passive Devices Review 4 Overview / Introduction Company Profile & Supply Chain o Qorvo o Broadcom o Skyworks o STMicroelectronics o Murata Passive Integrated Solution o Technologies Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Smartphones Teardown – Apple iPhone X Apple iPhone X – Front & Back View ©2017 by System Plus Consulting Apple iPhone X – Opened View ©2017 by System Plus Consulting Apple iPhone X – Board Extracted ©2017 by System Plus Consulting
  • 5. ©2017 System Plus Consulting | Integrated Passive Devices Review 5 Overview / Introduction Company Profile & Supply Chain o Qorvo o Broadcom o Skyworks o STMicroelectronics o Murata Passive Integrated Solution o Technologies Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Package Opening
  • 6. ©2017 System Plus Consulting | Integrated Passive Devices Review 6 Overview / Introduction Company Profile & Supply Chain o Qorvo o Broadcom o Skyworks o STMicroelectronics o Murata Passive Integrated Solution o Technologies Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Integrated Passives Devices Applications
  • 7. ©2017 System Plus Consulting | Integrated Passive Devices Review 7 Overview / Introduction Company Profile & Supply Chain o Qorvo o Broadcom o Skyworks o STMicroelectronics o Murata Passive Integrated Solution o Technologies Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Glass Material Market for RF devices
  • 8. ©2017 System Plus Consulting | Integrated Passive Devices Review 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Materials Comparison
  • 9. ©2017 System Plus Consulting | Integrated Passive Devices Review 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Synthesis of the Physical analysis
  • 10. ©2017 System Plus Consulting | Integrated Passive Devices Review 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus STMicroelectronics’ IPD – Package/Die View & Dimensions
  • 11. ©2017 System Plus Consulting | Integrated Passive Devices Review 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus STMicroelectronics’ IPD – Die Structure – Top view
  • 12. ©2017 System Plus Consulting | Integrated Passive Devices Review 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus STMicroelectronics’ Bluetooth IPD – Die Structure – Electrical Structure Equivalent Circuit Schematic View
  • 13. ©2017 System Plus Consulting | Integrated Passive Devices Review 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus STMicroelectronics’ Bluetooth IPD – Die Structure – Top view
  • 14. ©2017 System Plus Consulting | Integrated Passive Devices Review 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus STMicroelectronics’ Bluetooth IPD – Die Structure – Top view
  • 15. ©2017 System Plus Consulting | Integrated Passive Devices Review 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus STMicroelectronics’ Bluetooth IPD – Die Cross Section
  • 16. ©2017 System Plus Consulting | Integrated Passive Devices Review 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Synthesis o Qorvo’s WiFi IPD o Skyworks’s WiFi IPD o STMicroelectronics’ Bluetooth IPD o Broadcom’s LTE IPD o IPDiA’s IMS IPD Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus STMicroelectronics’ Bluetooth IPD – Die Cross Section – Capacitance
  • 17. ©2017 System Plus Consulting | Integrated Passive Devices Review 17 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o MEMS Front-End Process Cost Analysis Selling Price Analysis About System Plus Global Overview
  • 18. ©2017 System Plus Consulting | Integrated Passive Devices Review 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o MEMS Front-End Process Cost Analysis Selling Price Analysis About System Plus Qorvo’s IPD – MEMS Process Flow
  • 19. ©2017 System Plus Consulting | Integrated Passive Devices Review 19 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Global Overview o MEMS Front-End Process Cost Analysis Selling Price Analysis About System Plus Qorvo’s IPD – Die Process Flow 1/4
  • 20. ©2017 System Plus Consulting | Integrated Passive Devices Review 20 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Supply Chain o Yields o Front-End Cost. o Back-End Cost o Component Cost Selling Price Analysis About System Plus STMicroelectronics’ IPD – Wafer Front-End Cost
  • 21. ©2017 System Plus Consulting | Integrated Passive Devices Review 21 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Supply Chain o Yields o Front-End Cost. o Back-End Cost o Component Cost Selling Price Analysis About System Plus STMicroelectronics’ IPD – Component Cost
  • 22. ©2017 System Plus Consulting | Integrated Passive Devices Review 22 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis o Financial Ratios o Manufacturer Price About System Plus STMicroelectronics’ IPD – Estimated Manufacturer Price
  • 23. ©2017 System Plus Consulting | Integrated Passive Devices Review 23 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus o Company services o Feedbacks o Contact o Legal Related Reports REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING RF • Advanced RF SiPs for Cell Phones: Reverse Costing Overview • Smartphone RF Front-End Module Review • Silicon Capacitor Technology and Cost Review MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT RF • Glass Substrate Manufacturing in the Semiconductor Field • Advanced RF System-in-Package for Cell Phones 2017
  • 24. COMPLETE TEARDOWN WITH: • Detailed photos and cross- sections • Precise measurements • Die structure • Materials analysis • Supplier comparison • Manufacturing process flow • Manufacturing cost analysis RF Integrated Passive Devices: Reverse Costing Overview Title: RF IPD Technology & Cost Review Pages: 300 Date: December 2017 Format: PDF & Excel file Price: Full report: EUR 3,990 Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics With 5G communication technology incoming, this is the perfect time to explore several IPD technologies and compare the different companies’ integration choices and cost efficiencies. This report provides a deep analysis of RF IPD containing inductance, resistor, and capacitance. It completes System Plus Consulting reports portfolio along with decoupling capacitors IPD. This comparative technology study was conducted to provide insight regarding technology and cost estimates for RF IPDs in various applications. This report studies nine devices in three applications (Wifi / Bluetooth / cellular communication (LTE / HSPA / GPRS / EDGE), industrial, and scientific / medical short-range devices (ISM / SRD), where five players (Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics) are active. Besides the ISM/SRD applications, the other devices are extracted from recent smartphones like the new Apple iPhone X. All devices are analyzed in detail, and electrical structures of each component are presented. Sizes and technologies are extracted to provide a large sampling of various IDMs’ technical and economical choices. We also provide an overview of passive integration techniques for inductors, resistors, and capacitors. This report includes a description of each component, its major characteristics (substrate type (GaAs, silicon, glass), passivation layers, passive integration, etc.) and a comparison of all devices analyzed. Also included is a manufacturing cost estimate for the IPDs. With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
  • 25. TABLE OF CONTENTS Overview / Introduction Company Profile (Skyworks Solutions, Murata, iPDIA, Qorvo, Broadcom, STMicroelectronics) Smartphone Teardown (Xiaomi Mi6, Samsung Galaxy S8, Samsung Galaxy S7, Apple iPhone X) Market Analysis Physical Analysis • RF IPD for Wifi/Bluetooth Applications  Qorvo, STMicroelectronics, and Skyworks IPD • Die view and dimensions • Die structure: Inductance, capacitance, resistance, electrical schematic • Die cross-section: Metal layers, capacitance, resistance, passivation • RF IPD for LTE/HSPA/EDGE/GSM Applications  Murata, Broadcom, and Skyworks IPD • Die view and dimensions • Die structure: Inductance, capacitance, resistance, electrical schematic • Die cross-section: Metal layers, capacitance, resistance, passivation Author (Lab): Véronique Le Troadec AUTHORS: cture analysis of semi- conductors. She has deep knowledge of chemical and physical technical analyses. She previously worked for 20 years at Atmel’s Nantes Laboratory. Véronique Le Troadec (Lab) Véronique is in charge of stru- Stéphane Elisabeth Stéphane has a deep knowledge of materials characterizations and electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Micro- electronics. • RF IPD for ISM/SRD Applications  iPDIA and STMicroelectronics’ IPD • Die view and dimensions • Die structure: • Inductance, capacitance, resistance, electrical schematic • Die cross-section: Metal layers, capacitance, resistance, passivation • IPD technologies comparison Manufacturing Process Flow • RF IPD die fabrication unit • RF IPD package process flow Cost Analysis • Cost analysis overview • Supply chain description • Yield hypotheses • RF IPD die cost analysis  RF IPD die front-end cost  RF IPD die cost by process step • Final test cost • Component cost Estimated Price Analysis System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price. MEMS CoSim+ Cost simulation tool to evaluate the cost of any MEMS process or device: From single chip to complex structures. ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ MEMS CoSim+ Distributed by Performed by
  • 26. Advanced RF SiPs for Cell Phones: Reverse Costing Overview Smartphone RF Front-End Module Review Silicon Capacitor Technology and Cost Review Physical analyses and cost estimation of radio-frequency Systems-in- Packages from Skyworks Solutions, Murata, TDK-Epcos, Qorvo and Broadcom / Avago. Review of RF front-end modules and components found in five flagship smartphones: Apple iPhone 7 Plus, Samsung Galaxy S7, Huawei P9, LG G5, and Xiaomi Mi5. Discover the differences between silicon capacitor technologies from TSMC, Skyworks, Murata / IPDiA and Vishay and their related costs. Pages: 140 Date: November 2017 Full report: EUR 4,990* Pages: 295 Date: February 2017 Full report: EUR 4,990* Pages: 140 Date: September 2017 Full report: EUR 3,490* ANNUAL SUBSCRIPTION OFFER You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! • MEMS & Sensors: Accelerometer - Compass - Display / Optics - Environment - Fingerprint - Gyroscope - IMU/Combo - Light - Microphone - Oscillator - Pressure sensor • Power: GaN - IGBT - MOSFET - Si Diode - SiC • Systems: Automotive - Consumer - Energy - Medical - Telecom Each year System Plus Consulting releases a comprehensive collection of new reverse engineering & costing analyses in various domains. • Imaging: Infrared - Visible • Integrated Circuits & RF: Integrated Circuit (IC) - RF IC • LEDs: LED Lamp - UV LED - White/blue LED • Packaging: 3D Packaging - Embedded - SIP - WLP Performed by More than 60 reports released each year on the following topics (considered for 2017): RELATED REPORTS Distributed by
  • 27. *For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT. Performed by DELIVERY on receipt of payment: By credit card: Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__| Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__| By bank transfer: BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code : 30056, Branch code : 00170 Account No : 0170 200 1565 87, SWIFT or BIC code : CCFRFRPP, IBAN : FR76 3005 6001 7001 7020 0156 587 Return order by: • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DEVELOPPEMENT, 75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne Contact: • Japan: Miho - Ohtake@yole.fr • Greater China: Mavis - Wang@yole.fr • Asia: Takashi - Onozawa@yole.fr • EMEA: Lizzie - Levenez@yole.fr • North America: Steve – laferriere@yole.fr • General: info@yole.fr The present document is valid till November 15, 2017 SHIP TO PAYMENT BILLING CONTACT ABOUT YOLE DEVELOPPEMENT Name (Mr/Ms/Dr/Pr): ...................................................................................... Job Title: ...................................................................................... Company: ...................................................................................... Address: ...................................................................................... City: State: ...................................................................................... Postcode/Zip: ...................................................................................... Country: ...................................................................................... VAT ID Number for EU members: ...................................................................................... Tel: ...................................................................................... Email: ..................................................................................... Date: ....................................................................................... Signature: ...................................................................................... Distributed by First Name: .................................................................. Last Name: ............................................................................ Email:............................................................................ Phone:..................................................................................... Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. CUSTOM STUDIES • Market data & research, marketing analysis • Technology analysis • Reverse engineering & costing services • Strategy consulting • Patent analysis More information on www.yole.fr MEDIA • i-Micronews.com, online disruptive technologies website and its weekly e- newsletter, @Micronews • Communication & webcasts services • Events: Yole Seminars, Market Briefings More information on http://www.i-micronews.com/media-kit.html TECHNOLOGY & MARKET REPORTS • Collection of technology & market reports • Manufacturing cost simulation tools • Component reverse engineering & costing analysis • Patent investigation More information on http://www.i- micronews.com/reports.html ORDER FORM Please process my order for “RF IPD Technology & Cost Review” Reverse Costing Report  Full Reverse Costing report: EUR 3,990* Ref.: SP17328
  • 28. Performed by TERMS AND CONDITIONS OF SALES . Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. “Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests. “Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand. “Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights. “License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license: • One user license: one person at the company can use the report. • Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included. • Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included. “Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. 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Termination 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. Miscellaneous All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. Governing law and jurisdiction 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions. Distributed by
  • 29. ©2017 System Plus Consulting | Integrated Passive Devices Review 24 COMPANY SERVICES
  • 30. ©2017 System Plus Consulting | Integrated Passive Devices Review 25 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus o Company services o Feedbacks o Contact o Legal Business Model Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings
  • 31. ©2017 System Plus Consulting | Integrated Passive Devices Review 26 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus o Company services o Feedbacks o Contact o Legal Contact Headquarters 21 rue La Noue Bras de Fer 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA (310) 600-8267 laferriere@yole.fr www.systemplus.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr NANTES Headquarter FRANKFURT/MAIN Europa Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE PHOENIX YOLE Inc. KOREA YOLE