X Ray inspection of Plated Throughhole Devices Using X-Ray
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X-ray inspection can be used to determine and confirm hole fill which is a non-inspectable criteria for PTH devices. Industry standards are reviewed as well as sample x-ray images are provided. Call solder.net for more assistance.
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X Ray inspection of Plated Throughhole Devices Using X-Ray
- 1. X-Ray Inspection of Plated Throughhole Using X-ray Bob Wettermann, MIT November 2017
- 2. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net X-Ray Inspection Plated Throughholes IPC-A-610 G Criteria You DO NOT HAVE to x-ray inspect BTCs according to the IPC-A-610 G
- 3. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net Plated Throughhole Table 7-4 Plated-Through Holes with Component Leads - Minimum Acceptable Solder Conditions1 Criteria Class 1 Class 2 Class 3 A. Vertical fill of solder for component with less than 14 leads2,3 (see 7.3.5.1) Not Specified 75% 75% Vertical fill of solder for component with 14 leads or more2,3 (see 7.3.5.1) 50% or 1.2 mm [0.05 in], whichever is less Note 2. The 25% unfilled height includes both source and destination side depressions. Note 3: Less than 100% solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance. The user is responsible for identifying these situations to the manufacturer. IPC–A-610 Rev G
- 4. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net Plated Throughhole 50% Hole Fill
- 5. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net Plated Throughhole >75% Hole Fill
- 6. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net Plated Throughhole Non-inspectable visually
- 7. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net Plated Throughhole X-Ray
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- 9. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net Improper Fill
- 10. Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net QC and Measurement Screening Criteria Using x-ray
- 11. Voids in Throughhole Courtesy of NPL
- 12. X-Ray Inspection of Plated Throughhole Using X-ray Solder.net info@solder.net
Editor's Notes
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- Target - Class 1,2,3 There is 100% fill. Acceptable - Class 2 Minimum vertical fill of 50% or 1.2mm for components with 14 or more leads. Component lead is discernible in the solder source side of the solder connection. Acceptable - Class 1,2,3 Minimum 75% fill. A maximum of 25% total depression, including both secondary and primary sides is permitted. Defect - Class 2 Vertical fill of hole is less than 75% for component with less than 14 leads. Vertical fill of hole is less than 50% or 1.2 mm [0.047 in], whichever is less, for component with 14 leads or more.
- 7.3.5.1 Supported Holes – Solder - Vertical fill (A) Target - Class 1,2,3 There is 100% fill. Acceptable - Class 2 Minimum vertical fill of 50% or 1.2mm for components with 14 or more leads. Component lead is discernible in the solder source side of the solder connection. Acceptable - Class 1,2,3 Minimum 75% fill. A maximum of 25% total depression, including both secondary and primary sides is permitted. Defect - Class 2 Vertical fill of hole is less than 75% for component with less than 14 leads. Vertical fill of hole is less than 50% or 1.2 mm [0.047 in], whichever is less, for component with 14 leads or more. Defect - Class 3 Vertical fill of hole is less than 75%. Note: Less than 100% solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance. The user is responsible for identifying these situations to the manufacturer.
- 7.3.5.1 Supported Holes – Solder - Vertical fill (A) Target - Class 1,2,3 There is 100% fill. Acceptable - Class 2 Minimum vertical fill of 50% or 1.2mm for components with 14 or more leads. Component lead is discernible in the solder source side of the solder connection. Acceptable - Class 1,2,3 Minimum 75% fill. A maximum of 25% total depression, including both secondary and primary sides is permitted. Defect - Class 2 Vertical fill of hole is less than 75% for component with less than 14 leads. Vertical fill of hole is less than 50% or 1.2 mm [0.047 in], whichever is less, for component with 14 leads or more. Defect - Class 3 Vertical fill of hole is less than 75%. Note: Less than 100% solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance. The user is responsible for identifying these situations to the manufacturer.
- 7.3.5.1 Supported Holes – Solder - Vertical fill (A) Target - Class 1,2,3 There is 100% fill. Acceptable - Class 2 Minimum vertical fill of 50% or 1.2mm for components with 14 or more leads. Component lead is discernible in the solder source side of the solder connection. Acceptable - Class 1,2,3 Minimum 75% fill. A maximum of 25% total depression, including both secondary and primary sides is permitted. Defect - Class 2 Vertical fill of hole is less than 75% for component with less than 14 leads. Vertical fill of hole is less than 50% or 1.2 mm [0.047 in], whichever is less, for component with 14 leads or more. Defect - Class 3 Vertical fill of hole is less than 75%. Note: Less than 100% solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance. The user is responsible for identifying these situations to the manufacturer.