2013 12-05-sirris-materials-workshop-printed-electronics-cosemans-seronveaux

Inks and their application in Printed Electronics
Results of a European Research project for SME Associations
(CLIP)

Printed Electronics

A wide range of (possible) applications

Solar Cells

Automotive sensors

Food Sensors
EL Packaging

RFID tags
© sirris | www.sirris.be | info@sirris.be |

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2

Printed Electronics

A wide range of (possible) applications

Lightning (OLED)

Batteries
Displays

Medical Sensors


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Printed Electronics Manufacturing
Requirements










Materials &
Technology

Conversion of printed ink to a conductive track
High Performance
Cost efficient
Flexible
Large area / thin tracks / large area + thin tracks
Various substrate (glass, paper, ceramic, plastics)
Thermal compatibility with substrate and materials
Defined interface formation between stacked materials
Compatible with industry standard practices

Ink
formulation

Printing

Drying

Sintering


Device

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Technology for Printed Electronics
Conventional printing

Digital Printing

Offset
Gravure

Aerosol Jet

Screen

Thermal transfer

Flexo
Materials &
Technology

Inkjet

magnetography

Ink
formulation

Printing

Drying

Sintering


Device

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Technology for Printed Electronics
Conventional printing

Digital Printing

Offset
Gravure

Aerosol Jet

Screen

Thermal transfer

Flexo
Materials &
Technology

Inkjet

magnetography

Ink
formulation

Printing

Drying

Sintering


Device

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Which technology will dominate?
Inkjet (piëzo)

Flexo

Screen

~30 µm

Resolution

Aerosol Jet
~10 µm

~80µm

40 - 100 µm

10 m2/s

2-3 m2/s

Throughput

0,01-0,5 m2/s

Single pass layer
thickness
Particle size



< 500 nm

25 nm -10 µm

3 - 10 µm

50 - 100 µm

Nano

Nano (micro)

Nano & micro

Nano & Micro

Depends on market and applications

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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Conductive ink materials
Conductive
Material

Ink Type / Printing
process

Advantage

Disadvantage

Silver Flake

Predominantly
Screen printing

Cost effective for
many applications

thick films, surface
roughness, difficult
to photocure

Silver
Nanoparticles

Predominantly
Inkjet, Aerosol jet
printing

Thin films,
flexibility, high
conductivity, low T
sintering

High cost

Copper
Nanoparticles

Predominantly
Inkjet, Aerosol jet
printing

Same as Ag NP, but
slightly lower cost

Can oxidise and lose
conductivity

All

Transparent,
flexible, water
resistant

Lower conductivity
then metal based
inks

Polymers
(PEDOT, PANI)

Research focus on graphene based inks
Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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Market

2012 market size*: $2.86 billion, dominated by silver flake inks
2018 forecast*: $3.36 billion, of which $735 million is based on nano Ag and Cu

Drivers




Silver flake inks for screen printing will
continue to dominate with largest market
share (low cost)

 Cost



Increasing share for inkjet, AJP and
nanoparticle inks.





Barriers

Delicate or irregular shaped objects
Low temperature sintering required to
print onto cheap flexible substrates
(polymer film, paper)



 Technical




Alternative needed for sputtered
transparent ITO due to cost, supply and
performance issues

Materials &
Technology

Ink
formulation

Printing

Nanoparticles significantly more
expensive
Ink development is time consuming and
expensive
Total in-use cost needs to be considered
rather than a price comparison of inks

Drying

* Adapted from IDTECHEX report: Conductive Ink Markets, 2012

Long term stability
High resolution printing
Curing
Sintering


Device

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CLIP:Conductive Low Cost Ink Project
Objectives


Development, formulation, and feasibility of low cost inks



Development of optimized inks for screen, flexo, inkjet and aerosol jet printing



Optimization of inks for large area printing with high resolution, <50 microns



Prepare demonstrators


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Ink formulation
Specific guidelines for the inks

Viscosity

Complex composition of
nanoparticles and chemicals

Nanoparticles
Solvents

Surface Tension

Binders

Particle size

Materials &
Technology

Ink
formulation

Additives

Printing

Drying

Sintering


Device

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Multimodal Ag inks



40 nm/6 nm/ <1nm



Improve particle packing  improved sintering and conductivity



Less material  Lower cost

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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Filtering
 Filtering of the inks

 necessary if small nozzle cartridges are
used

 Nano-particles tend to agglomerate

 Wide variety of filters available

 Materials: PP,PES,PTFE,Nylon6,…

 Different µ-structures
 Ink dependent

Cellulose
Materials &
Technology

PVDF
Ink
formulation

Printing

PC
Drying

PES
Sintering


Device

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Printing

Digital printing - print at wish
High quality
Low cost
Small waste
Non contact/sensitive substrates
No masking

Inkjet

AJP

Flexible & Scalable


High resolution



Different printheads




Fujifilm, Xaar, Konica, Ricoh,...





1 pL to 80 pL



Planar substrates



Wide ink viscosity range




Very high resolution
Local laser sintering

Non-planar substrates possible

Line and area printing
Materials &
Technology

Ink
formulation



Printing

Drying

Sintering


Line printing

Device

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Inkjet technology
Drop on
Demand

Continuous
High speed
No clogging
Low resolution

Piezoelectric

Limited fluids

Materials &
Technology

Thermal

All fluids

Ink
formulation

Printing

Acoustic

Drying

Electrostatic

Sintering


Device

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Non contact AJP technology
AJP Technology description

1

3
2
1 – Nitrogen input
2 – Mist created (1-5µm droplet)

4

3 – Sheath gas input
4 - Printing and Deposition

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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Substrates


Type of substrate depends on application
 Papers: good printability, good adhesion, solvents are absorbed quickly
by the paper, fast drying but porosity of paper can have a negative
effect on conductivity.
 Plastics: good printability, longer drying and curing time, adhesion can
be a problem. No interference from substrate (no porosity). If curing
and sintering are good optimal conductivity



Pretreatment can enhance adhesion

Untreated substrate
Materials &
Technology

Ink
formulation

Printing

Treated substrate
Drying

Sintering


Device

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Curing: Drying and Sintering
Depending on substrates and used materials


Thermal heating









Standard practice / conventional approach - Silver
Uniformity
Wide area of practice
Substrate limiting the maximum temperature
Long residence time -> inert atmosphere
Not usable for Cu (oxidation)

UV Curing

 Wide area of processing
 Standard practice
 Lower intensity, continuous output

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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Drying and Sintering

Depending on substrates and used materials


Broadband flash







High power densities / wide area of processing
Less substrate limited and curing times short
Adjustable spectrum / tunable pulse lengths
High capital cost for some systems

Laser
 High Power densities
 Exposure area smaller /
 Fixed wavelength but targeted wavelength to match ink requirements / uniform across the beam
/ Spatial selectivity - targeted
 Cost / rastering

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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Printing results

Trimodal CLIP-ink

Commercial Reference

Reference

Sheet Resistance
Multimodal  better conductivity

Sheet Resistance after sintering 150°C
Low temperature  better conductivity


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Inkjet demonstrator
Chipless RFID tag


4-bit chipless RFID tags successfully demonstrated using the final trimodal ink on PEL paper
and Kapton polyimide respectively.



Higher performance than reference ink thanks to its higher conductivity at lower sintering
temperature

Sintering
Temperature

CLIP trimodal ink

Reference

200 °C

7.85E+6 S/m

5.66E+6 S/m

39% higher

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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AJP and inkjet demonstrator
Humidity sensor

Hybrid Integration of printed electronics and silicon electronics by AJP-printed interconnections.
Printing of
primary circuitry
MCU Gluing by
KTH
Overprinting
Rest of component programming
and placing

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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AJP printed demonstrator

LED application

3D printing by AJP of conductive tracks for LED application.

Materials &
Technology

Ink
formulation

Printing

Drying

Sintering


Device

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Conclusions
 Inkjet technology is mature and available for conductive
printing
 Upscaling is possible to R2R with increasing printing speed
 Bottleneck is the ink-development to fit the requirements
 Cost reduction related to Cu-inks was limited because nanoparticle
production was driving factor but improving
 Sintering of Cu-based inks needs alternative for thermal sintering
 At low sintering temperatures
 Multimodal Ag-based inks show lower resistance
 Less ink necessary for comparable conductivity as monomodal inks


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Conclusions
 Aerosol technology is dedicated for the future.
 Direct printing on 3D substrate is easily done with AJP
 Due the “Aerosol” dynamic deposition, inks are easily printable
 AJP is very suitable for ink development.
 Large range of viscosity
 Size particle from nano to micro

 AJP is equipped with Laser sintering. Curing by laser allow us to print and
cure the deposition on low melting temperature substrates.
 The printing is dedicated for line printing (10µm to 100µm) not for large area
printing (even in case of scaling up according to industrial requirement).


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5.12.13

Patrick Cosemans – Senior Project Engineer Smart Coating Application Lab
Patrick.cosemans@sirris.be
+32 498 91 94 63


5.12.13

http://www.sirris.be
http://techniline.sirris.be
#sirris
http://www.linkedin.com/company/sirris

5.12.13

2013 12-05-sirris-materials-workshop-printed-electronics-cosemans-seronveaux

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2013 12-05-sirris-materials-workshop-printed-electronics-cosemans-seronveaux