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Welcome
Specificaitons, Design & Development of smart
             silicon sensor systems
                Mayur Sarode

               Engineer at INCAS3
              Assen, The Netherlands
About the workshop
 Smart Sensor Systems 2012 by Delft Institute of Microelectronics (DIMES)




 Lectures , demonstrations, visit to clean room at TU/Delft.
Lectures
1.   Silicon sensors: Applications and Future Perspectives by Paddy French, TU/Delft.
2.   Designing Smart Sensors and Smart Sensor Systems by Kofi Makinwa, TU/Delft.
3.   Measurement techniques for smart sensor systems by Gerard Meijer, TU/Delft.
4.   Calibration and Self-Calibration of Smart Sensors by Michiel A.P Pertijs, TU/Delft.
5.   Integrated Hall Magnetic sensors by Pavel Keijk EPFL Lausanne, Switzerland.
6.   Capacitive Sensors by Xiujin Li, TU/Delft.
7.   Smart temperature sensors by Gerard Meijer, TU/Delft.
8.   Optical Sensors Based on Photon Detection by Reinoud Wolffenbuttel , TU/Delft.
9.   Physical chemosensors by Michel Velekoop, TU/Vienna.
10. Dynamic offset-cancellation techniques by Kofi Makinwa, TU/Delft.
11. Precision Instrumentation Amplifiers by Johan Huijsing , TU/Delft.
12. Universal asynchronous sensor interfaces by Gerard Meijer, TU/Delft.
13. Implantable Smart Sensors for Advanced Medical Devices by Tim Dension, Medtronics
14. Interface electronics and A/D converters by Frank Reidijk, Xensor Integrartion
15. Introduction to CMOS-based DNA Microarrays by Jan Bosiersm Dalasa
16. Energy harvesting Sensor Systems by Ruud Vullers
What are Smart sensors?
Sensors ~“Smart sensor”
        o Low cost, Small size, Multi-sensing
        o Self-test, digital output, bus interface, RF, energy scavening
Transducers ~ self generating, modulating
MEMS + CMOS design ~ a smart sensor
Silicon Sensors
MEMS sensors~good planar processing technology
Silicon not the best in class!
Package design & analog design
Signal processing to compensate for silicon defects

                                              Radiant
                                           Photo diodes
                                 (CMOS image sensors, optical sensors)
           Chemical                                                                 Thermal
                                                                             Resistors, transistors,
             ISFETS
                                                                                  thermopiles
   DNA detector, chemeosensors
                                                                          (temperature, wind sensor)




                                            Electrical
                                         Resistors,capaci
    Mechanical                           tors, inductors,                         Magnetic
       Diaphram,                           (Capacitive                   Hall-plates, magFET’s, coil
(micromachiened devices)                                                       (Hall sensors)
                                             sensors)
Silicon Sensors
Radition Domain
        • P-N junction depletion layer
        • Shorter wavelentgth is absorbed by silicon
        • CCD’s, position sensors

 Mechanical Domain
      • can introduce self test
      • Pressure and accelerartion sensors

   Thermal domain
        • Silicon sensitive to temperature
        • Temperature and flow measurement

  Magnetic Domain
• Based on Hall effect
• Magnetic field measurement, current, rotation and position

 Chemical Domain
       • Physical chemeosensors
Smart Sensor Systems: System specs.
 On Silicon
 Output format




 Sensor bandwidth ~ 10 KHz
 Errors: offset, drift, noise, cross sensitivity, linearity, impedance, multipath
 Measurement techniques to solve these problems
       • nested chopping
       •Dynamic element matching
       •Auto calibration
Smart Sensor Systems: functionality
 Hardware

                               General hybrid solution


     Sensing       Signal               A/D                        Bus          Processor
     element    Conditioning          converter                 Intefacing


                               Universal transducer interface



                                     One chip solution


 Software
                                                                                         Data
      oSelf test in accelerometer              Self testing
                                                                                       evaluation
      Auto-Calibration
      oTransducer electronic data sheet (TEDS)
      oThree signal measurement                   Auto-
                                                                                       identificaiton
                                                                       calibration
Reducing errors
• Random, Systematic, multi-path error
• Auto zeroing vs Chopping




• Reduces 1/f noise , offset,
Autocalibration
 What is Mx ??
                           100 Kg               Mx Kg




        5 Kg                55 Kg               25 Kg




 High accuracy ~high dynamic range



                                       Sense1


                    Rotating
                    Resistors

                                      Sense2
Compensating for parasitic effects

           Cable and wire impedance
               Zs1                                  Zs3                                                                   YX


                                                                                  Vforce                                                         Isense




                                                                                                        Yp1
Iforce                                                          Vsense




                                                                                                                                           Yp2
                               ZX




               Zs2                                     Zs4




         Low ohmic impedance ( current)                                             High ohmic impedance ( voltage)

Cross and parasitic effects

                                                                                            Zp

                     Cx                  Rp
                                                  Rx                     Cp                                                    Yp
                                                                                                                     Ix
                                                                                            Vx


                     Capacitve sensors              resistive sensors
                                                                           Votlage generating sensors         Current generating sensors
                     (humdity sensors)        (thermistors/photoresistors)
                                                                                (thermopiles/PH)                  (photo detectors)



                 Use of additonal sensors
                 Excitation signal, DC vs square vs sinusoidal vs pulsed, frequency
Smart sensor Systems: A/D converters
       Conventional system


                          Analog               Off the shelf
                           Front                                         processor
                                                    A/D
                            end                 converter



       Smart A/D conversion


                                    Period
                                   converter       Tsense           Treference       Toffset

 Sensing element                                                processor
reference element   MUX
  Offset element
                                     MUX                       S/H circuit
  capacitve                         control                    Quantization
                                                               Digital filtering
                                                               ΣΔ converter



     •Also used with resistive sensors
Universal Sensor Interface

System Setup




Sensing, signal conditioning , A/D conversion
Universal interface for interfacing sensor element to the processor
Smart sensor systems design

Wind sensor design at TU/Delft

System design~ sensor biasing
Digitize early, modulation techniques for silicon
limitations
Characteristics

oSlow, use dynamic techniques
oSmall output voltage, spreads, thermal balancing
oThermal offset due to placement

Auto-zeroing of comparator~ low thermopile output
1.6 μm technology
10 bit ΣΔ ADC .
Smart temperature Sensors
 Absolute temp sensors
          Thermistors( cheap, non linear, sensitive,
-80 to 200 ºC
          Platinum resistors (expensive, stable, -260 to 1000 ºC)
          Thermocouple (reference junction and measurement
Junctions
                                                            Microcontroller
          Silicon Vbe ~ temperature

 On silicon chips
          Integrated thermistors
1.Comparable to Pt resistors                                             Sensor
                                                                        Interface
2.Stress dependent
3.Voltage dependent non linear behaviour
          Thermocouples
1.No offset, no calibration
          Measuring absolute temperature.            Smart           Temperature
                                                    Temperature         Sensing
                                                      Sensor            elements
Smart tempearature Sensors
Design considerations

   Accuracy

    Triple point of water ~ defined fixed point
    Absolute accuracy vs drift

 Drift (1 mK ~ 10 mK)

  Cross sensitivity to mechanical stress accuracy noise and
resolution
  Reduced to 100 mK with packaging

 Self heating

     Dynamic behaviour
     Thermal design considerations
     Long term stability
So how to design it?
 Problem statement

Microrganism detection in milk products.

System level design




Circuit level design



         DC                                                      DC
               Im                    Is

                     Milk carton                   Milk carton
                                          Sensor
Conclusions
Thank you

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Silicon sensors final_prsentation

  • 1. Welcome Specificaitons, Design & Development of smart silicon sensor systems Mayur Sarode Engineer at INCAS3 Assen, The Netherlands
  • 2. About the workshop  Smart Sensor Systems 2012 by Delft Institute of Microelectronics (DIMES)  Lectures , demonstrations, visit to clean room at TU/Delft.
  • 3. Lectures 1. Silicon sensors: Applications and Future Perspectives by Paddy French, TU/Delft. 2. Designing Smart Sensors and Smart Sensor Systems by Kofi Makinwa, TU/Delft. 3. Measurement techniques for smart sensor systems by Gerard Meijer, TU/Delft. 4. Calibration and Self-Calibration of Smart Sensors by Michiel A.P Pertijs, TU/Delft. 5. Integrated Hall Magnetic sensors by Pavel Keijk EPFL Lausanne, Switzerland. 6. Capacitive Sensors by Xiujin Li, TU/Delft. 7. Smart temperature sensors by Gerard Meijer, TU/Delft. 8. Optical Sensors Based on Photon Detection by Reinoud Wolffenbuttel , TU/Delft. 9. Physical chemosensors by Michel Velekoop, TU/Vienna. 10. Dynamic offset-cancellation techniques by Kofi Makinwa, TU/Delft. 11. Precision Instrumentation Amplifiers by Johan Huijsing , TU/Delft. 12. Universal asynchronous sensor interfaces by Gerard Meijer, TU/Delft. 13. Implantable Smart Sensors for Advanced Medical Devices by Tim Dension, Medtronics 14. Interface electronics and A/D converters by Frank Reidijk, Xensor Integrartion 15. Introduction to CMOS-based DNA Microarrays by Jan Bosiersm Dalasa 16. Energy harvesting Sensor Systems by Ruud Vullers
  • 4. What are Smart sensors? Sensors ~“Smart sensor” o Low cost, Small size, Multi-sensing o Self-test, digital output, bus interface, RF, energy scavening Transducers ~ self generating, modulating MEMS + CMOS design ~ a smart sensor
  • 5. Silicon Sensors MEMS sensors~good planar processing technology Silicon not the best in class! Package design & analog design Signal processing to compensate for silicon defects Radiant Photo diodes (CMOS image sensors, optical sensors) Chemical Thermal Resistors, transistors, ISFETS thermopiles DNA detector, chemeosensors (temperature, wind sensor) Electrical Resistors,capaci Mechanical tors, inductors, Magnetic Diaphram, (Capacitive Hall-plates, magFET’s, coil (micromachiened devices) (Hall sensors) sensors)
  • 6. Silicon Sensors Radition Domain • P-N junction depletion layer • Shorter wavelentgth is absorbed by silicon • CCD’s, position sensors  Mechanical Domain • can introduce self test • Pressure and accelerartion sensors Thermal domain • Silicon sensitive to temperature • Temperature and flow measurement Magnetic Domain • Based on Hall effect • Magnetic field measurement, current, rotation and position  Chemical Domain • Physical chemeosensors
  • 7. Smart Sensor Systems: System specs.  On Silicon  Output format  Sensor bandwidth ~ 10 KHz  Errors: offset, drift, noise, cross sensitivity, linearity, impedance, multipath  Measurement techniques to solve these problems • nested chopping •Dynamic element matching •Auto calibration
  • 8. Smart Sensor Systems: functionality  Hardware General hybrid solution Sensing Signal A/D Bus Processor element Conditioning converter Intefacing Universal transducer interface One chip solution  Software Data oSelf test in accelerometer Self testing evaluation Auto-Calibration oTransducer electronic data sheet (TEDS) oThree signal measurement Auto- identificaiton calibration
  • 9. Reducing errors • Random, Systematic, multi-path error • Auto zeroing vs Chopping • Reduces 1/f noise , offset,
  • 10. Autocalibration  What is Mx ?? 100 Kg Mx Kg 5 Kg 55 Kg 25 Kg  High accuracy ~high dynamic range Sense1 Rotating Resistors Sense2
  • 11. Compensating for parasitic effects  Cable and wire impedance Zs1 Zs3 YX Vforce Isense Yp1 Iforce Vsense Yp2 ZX Zs2 Zs4 Low ohmic impedance ( current) High ohmic impedance ( voltage) Cross and parasitic effects Zp Cx Rp Rx Cp Yp Ix Vx Capacitve sensors resistive sensors Votlage generating sensors Current generating sensors (humdity sensors) (thermistors/photoresistors) (thermopiles/PH) (photo detectors) Use of additonal sensors Excitation signal, DC vs square vs sinusoidal vs pulsed, frequency
  • 12. Smart sensor Systems: A/D converters Conventional system Analog Off the shelf Front processor A/D end converter Smart A/D conversion Period converter Tsense Treference Toffset Sensing element processor reference element MUX Offset element MUX S/H circuit capacitve control Quantization Digital filtering ΣΔ converter •Also used with resistive sensors
  • 13. Universal Sensor Interface System Setup Sensing, signal conditioning , A/D conversion Universal interface for interfacing sensor element to the processor
  • 14. Smart sensor systems design Wind sensor design at TU/Delft System design~ sensor biasing Digitize early, modulation techniques for silicon limitations Characteristics oSlow, use dynamic techniques oSmall output voltage, spreads, thermal balancing oThermal offset due to placement Auto-zeroing of comparator~ low thermopile output 1.6 μm technology 10 bit ΣΔ ADC .
  • 15. Smart temperature Sensors  Absolute temp sensors Thermistors( cheap, non linear, sensitive, -80 to 200 ºC Platinum resistors (expensive, stable, -260 to 1000 ºC) Thermocouple (reference junction and measurement Junctions Microcontroller Silicon Vbe ~ temperature  On silicon chips Integrated thermistors 1.Comparable to Pt resistors Sensor Interface 2.Stress dependent 3.Voltage dependent non linear behaviour Thermocouples 1.No offset, no calibration Measuring absolute temperature. Smart Temperature Temperature Sensing Sensor elements
  • 16. Smart tempearature Sensors Design considerations  Accuracy Triple point of water ~ defined fixed point Absolute accuracy vs drift  Drift (1 mK ~ 10 mK) Cross sensitivity to mechanical stress accuracy noise and resolution Reduced to 100 mK with packaging  Self heating Dynamic behaviour Thermal design considerations Long term stability
  • 17. So how to design it?  Problem statement Microrganism detection in milk products. System level design Circuit level design DC DC Im Is Milk carton Milk carton Sensor