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Presented By,
Mathew John
College of Applied Sciences, Kanjirappally
C6
Roll No: 14
Contact Email: mathewjohn1414@gmail.com
1
INTRODUCTION
Electronics with out silicon is unbelievable, but it will
come true with evolution of diamond or carbon chip.
 Now a days we are using silicon for manufacturing of
electronic chips.
 It has many disadvantages when it is used in power
electronic applications such as bulk size, slow operating
speed etc.
 By using Carbon as the manufacturing material, we can
achieve smaller, faster and stronger chips.
2
What is an Electronic Chip?
 It’s a piece of semiconducting material on which an
Integrated circuit is embedded.
Chips comes in variety of packages.
3
Different Types of Chips
Three most common are:
• Dual in-line Packages.
• Pin-grid Arrays.
• Single in-line packages.
WHAT IS DIAMOND CHIP..?
Diamond chip is nothing but
carbon chip.
 It is an electronic
chip manufactured on a
Diamond structural Carbon
wafer.
 The major component using
carbon is (cnt) CARBON NANOTUBE.
4
HOW DIAMOND CHIP IS
POSSIBLE?
 Pure Diamond structural carbon is non-conducting in
nature.
 To make it conducting we have to perform doping
process.
 We are using Boron as the p-type doping Agent and the
Nitrogen as the n-type doping agent.
5
CARBON CHIP TECHNOLOGY.
 Carbon will succeed silicon as the predominate
semiconducting material for the integrated circuits of
the future.
 Carbon can surpass silicon’s abilities in,
 Thermal performance
 Frequency range
 Perhaps even superconductivity.
 One-dimensional carbon could solve digital silicon's
speed woes.
Continued.. 6
 Nanotubes will appear first as printable
"inks“.
 That are 10 times faster than
competing organic transistors.
 zero-dimensional carbon could answer
silicon's inability to attain high-
temperature superconductivity.
7
WHAT IS A CARBON
NANOTUBE?
 Carbon nanotubes were discovered in 1991.
 It is a nano - size cylinder of
carbon atoms.
 They are made of one or several
concentric walls.
 Each carbon atoms are arranged in hexagonal pattern.
 They are several tens of microns in length and less than
a few nanometres in diameter.
8
HOW NANOTECHNOLOGY
WORKS?
 Imagine a sheet of carbon atoms, which would look like a
sheet of hexagons.
 If you roll that sheet into a tube,
you'd have a carbon nano tube.
 It’s properties depend on
how you roll the sheet…
9
There are two types of Carbon
Nano Tubes,
According to its properties…
I. Metallic Carbon Nanotube
II. Semiconducting Carbon
Nanotube
10
I. Metallic Carbon
Nanotube
 Exhibit metallic properties.
 The band gap is approximately zero.
 Multi walled nanotube’s are the most common
example.
 Mainly used for interconnection inside the chip.
 It offer small resistance to current.
11
II. Semi-conducting
Nanotube
 Exhibit semiconductor properties.
 Have a narrow energy band gap of 0.3 eV and above.
 Single walled carbon nanotube’s are the most common
example.
 Used for the manufacturing of active electronics
devices.
 Doping is done, in order to increase conductivity.
12
TYPES OF NANO TUBES AND
RELATED STRUCTURES..
1. Single Walled Carbon Nanotubes.
2. Multi Walled Carbon Nanotubes.
3. Torus.
4. Nanobud.
5. Cup Stacked Carbon Nanotubes.
13
1. Single Walled Carbon
Nanotubes
 It’s a Nanotube, which has only
one graphite layer.
 It’s a semiconductor.
 It exhibits band gap energy of
0.3 eV.
 As the diameter increase, It
exhibit metallic properties.
14
2. Multi Walled Carbon
Nanotubes
 It’s a nanotube which has
multiple layer boundary
 They are mostly metallic in
nature.
 The energy band gap is
approximately zero .
 It’s diameter is larger than
single walled carbon
nanotube.
15
3. Torus
 A nanotorus is a carbon nanotube bent into a torus.
 It has largest magnetic moment.
16
Figure Showing a Torus Shape
4. Nanobud
 These are a newly created material.
 It’s a combination of two previously discovered allotropes
of carbon:
carbon nanotubes and fullerenes.
17
A Nanobud.
5. Cup Stacked Carbon
Nanotubes
 Differ from other quasi-1D carbon structures.
 Normally behave as a metallic conductor of electrons.
18
PRODUCTION METHODS OF
CARBON NANOTUBE
There are various production methods. Three main
methods are:
1. Arc discharge method.
2. Pulsed laser evaporation.
3. Silicon carbide vaporisation.
19
1. Arc Discharge Process
 This process made first carbon nanotube.
 It is also called BIG SPARK PROCESS.
 It is done in an enclosed chamber, which contains inert
gas like argon.
 The inert gas is filled in the tube at very low pressure.
 In this process, catalysts are used to trigger the growth
of carbon nanotube.
20
Arc-evaporation apparatus
for producing CNTs.
21
2. Pulsed Laser Evaporation
 Buckyballs are formed.
 Presence of metal catalyst causes the Buckyballs to stay
open and form a single walled nanotube.
 The purest single walled nanotube’s are produced by
pulsed laser vaporization.
 Yield depends on the amount and type of catalyst, laser
power and wavelength, temperature, pressure and type
of buffer gas, and geometry of the fluid flow near the
carbon target.
22
3. Silicon Carbide
Vapourization
 This method includes simple vapourization of sic.
 Sic is vapourized at very high temperature.
 Carbon atoms will bond it self-together to form carbon
nanotube.
 This method is considered as the most pure method of
manufacturing carbon nanotube.
23
Properties of CNT
 CNT has many unique properties.
1) Strength
2) Hardness
3) Kinetic
4) Electrical
24
1. Strength
 Carbon nanotubes are the strongest and stiffest
materials yet discovered in terms of:
tensile strength and elastic modulus.
 This strength results from the covalent sp² bonds
formed between the individual carbon atoms.
25
2. Hardness
 Diamond is considered to be the hardest material.
 It is well known that graphite transforms into diamond
under conditions of high temperature and high pressure.
3. Kinetic
 This property has been utilized to create the world's
smallest rotational motor.
 Future applications such as a gigahertz mechanical
oscillator are also envisaged.
26
4. Electrical
 The structure of a nanotube strongly affects its electrical
properties.
 Multiwalled carbon nanotubes with interconnected inner
shells show superconductivity with a relatively high
transition temperature Tc = 12 K.
ADVANTAGES OF CARBON
NANOTUBE
1) Average diameter Of 1.2 Nm – 1.4 Nm:
 The average diameter of the carbon nanotube is 1.2 nm
to 1.4nm.
 The diameter varies according to the manufacturing
process.
2) Highly stable:
 It can withstand a temperature up to 2800 degree
Celsius in vacuum.
Continued.. 27
3) High current density:
 Maximum current density is one billion ampere per
Centimetre Square.
4) Good thermal conductivity:
 The thermal conductivity of the carbon nanotube is
6000 w/m/k.
 On comparison pure diamond will transmit heat at the
rate of 3320 w/m/k.
5) High tensile strength:
 Carbon nanotube has a tensile strength of 45 billion
Pascal.
 NASA is planning to use carbon nanotube for spacecraft
component manufacturing.
Continued.. 28
6) High density:
 Carbon nanotube has very high density of 1.33 to 1.40
grams per Cm Square.
 NASA is planning to use CNT alloys in the nozzles of
future space shuttles.
7) Twisting Angle Dependence:
 The band gap of the carbon nanotube increases with its
twisting angle.
 So this method can be used to convert metallic carbon
nanotubes in to semi conducting carbon nanotubes.
8) High Mobility:
 Mobility of the electrons inside the doped diamond
structural carbon is higher than that of in the silicon
structure.
Continued.. 29
APPLICATIONS OF CARBON
NANOTUBE.
1) Inter Connection Inside The Chip
2) Carbon Nanotube Transistor Manufacturing
3) Molecular Logic Circuit
30
DIAMONDS ON FILM
 Wafers with polycrystalline films of diamond are being
investigated for use with high-performance materials
like gallium nitride;
 They are also being proposed as higher-performance
replacements for silicon-on-insulator wafers.
31
Advantages Of Diamond
Chip:-
 SMALLER COMPONENTS ARE POSSIBLE:
 It is possible to etch very smaller lines through diamond
structural carbon.
 We can realize a transistor whose size is one in
hundredth of silicon transistor.
 IT WORKS AT HIGHER TEMPERATURE:
 Diamond is very strongly bonded material.
 It can withstand higher temperatures compared with
that of silicon.
 Diamond is very good conductor of heat.
Continued.. 32
 FASTER THAN SILICON CHIP :
 Mobility of electrons inside the doped diamond
structural carbon is higher than that of in he silicon
structure.
 The carbon atom size is small, so the chance of collision
of electrons decreases.
 LARGER POWER HANDLING CAPACITY :
 Diamond has a strongly bonded crystal structure.
 So carbon chip can work under high power environment.
 We can connect high power circuit direct to the
diamond chip.
 At very high voltages silicon structure will collapse.
33
Disadvantages Of Diamond
Chip:-
 EXPENSIVE
 Artificial diamond for chips is expensive than silicon.
 A four-millimetre-square diamond substrate costs
several tens of thousands of yen compared to virtually
nothing for silicon.
 SLOW ELECTRIC FLOW
 Electricity cannot travel smoothly through diamond.
 Researches are seeking impurities that can be added to
aid electricity flow.
 But it’s a negligible fact, when considering its
advantages.
34
CONCLUSION
 Silicon chips have reached the limit of their capacity to
act as a semi-conductor of electricity.
 Diamond has many properties that are superior to
silicon.
 Diamond-based control modules could lead to
considerable energy savings.
 It is the better solution for the problems in power
electronic applications.
 Thus diamond chip replaces the need of silicon in every
aspect in future generations.
35
QUERIES………..
36
37

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Diamond Chip

  • 1. Presented By, Mathew John College of Applied Sciences, Kanjirappally C6 Roll No: 14 Contact Email: mathewjohn1414@gmail.com 1
  • 2. INTRODUCTION Electronics with out silicon is unbelievable, but it will come true with evolution of diamond or carbon chip.  Now a days we are using silicon for manufacturing of electronic chips.  It has many disadvantages when it is used in power electronic applications such as bulk size, slow operating speed etc.  By using Carbon as the manufacturing material, we can achieve smaller, faster and stronger chips. 2
  • 3. What is an Electronic Chip?  It’s a piece of semiconducting material on which an Integrated circuit is embedded. Chips comes in variety of packages. 3 Different Types of Chips Three most common are: • Dual in-line Packages. • Pin-grid Arrays. • Single in-line packages.
  • 4. WHAT IS DIAMOND CHIP..? Diamond chip is nothing but carbon chip.  It is an electronic chip manufactured on a Diamond structural Carbon wafer.  The major component using carbon is (cnt) CARBON NANOTUBE. 4
  • 5. HOW DIAMOND CHIP IS POSSIBLE?  Pure Diamond structural carbon is non-conducting in nature.  To make it conducting we have to perform doping process.  We are using Boron as the p-type doping Agent and the Nitrogen as the n-type doping agent. 5
  • 6. CARBON CHIP TECHNOLOGY.  Carbon will succeed silicon as the predominate semiconducting material for the integrated circuits of the future.  Carbon can surpass silicon’s abilities in,  Thermal performance  Frequency range  Perhaps even superconductivity.  One-dimensional carbon could solve digital silicon's speed woes. Continued.. 6
  • 7.  Nanotubes will appear first as printable "inks“.  That are 10 times faster than competing organic transistors.  zero-dimensional carbon could answer silicon's inability to attain high- temperature superconductivity. 7
  • 8. WHAT IS A CARBON NANOTUBE?  Carbon nanotubes were discovered in 1991.  It is a nano - size cylinder of carbon atoms.  They are made of one or several concentric walls.  Each carbon atoms are arranged in hexagonal pattern.  They are several tens of microns in length and less than a few nanometres in diameter. 8
  • 9. HOW NANOTECHNOLOGY WORKS?  Imagine a sheet of carbon atoms, which would look like a sheet of hexagons.  If you roll that sheet into a tube, you'd have a carbon nano tube.  It’s properties depend on how you roll the sheet… 9
  • 10. There are two types of Carbon Nano Tubes, According to its properties… I. Metallic Carbon Nanotube II. Semiconducting Carbon Nanotube 10
  • 11. I. Metallic Carbon Nanotube  Exhibit metallic properties.  The band gap is approximately zero.  Multi walled nanotube’s are the most common example.  Mainly used for interconnection inside the chip.  It offer small resistance to current. 11
  • 12. II. Semi-conducting Nanotube  Exhibit semiconductor properties.  Have a narrow energy band gap of 0.3 eV and above.  Single walled carbon nanotube’s are the most common example.  Used for the manufacturing of active electronics devices.  Doping is done, in order to increase conductivity. 12
  • 13. TYPES OF NANO TUBES AND RELATED STRUCTURES.. 1. Single Walled Carbon Nanotubes. 2. Multi Walled Carbon Nanotubes. 3. Torus. 4. Nanobud. 5. Cup Stacked Carbon Nanotubes. 13
  • 14. 1. Single Walled Carbon Nanotubes  It’s a Nanotube, which has only one graphite layer.  It’s a semiconductor.  It exhibits band gap energy of 0.3 eV.  As the diameter increase, It exhibit metallic properties. 14
  • 15. 2. Multi Walled Carbon Nanotubes  It’s a nanotube which has multiple layer boundary  They are mostly metallic in nature.  The energy band gap is approximately zero .  It’s diameter is larger than single walled carbon nanotube. 15
  • 16. 3. Torus  A nanotorus is a carbon nanotube bent into a torus.  It has largest magnetic moment. 16 Figure Showing a Torus Shape
  • 17. 4. Nanobud  These are a newly created material.  It’s a combination of two previously discovered allotropes of carbon: carbon nanotubes and fullerenes. 17 A Nanobud.
  • 18. 5. Cup Stacked Carbon Nanotubes  Differ from other quasi-1D carbon structures.  Normally behave as a metallic conductor of electrons. 18
  • 19. PRODUCTION METHODS OF CARBON NANOTUBE There are various production methods. Three main methods are: 1. Arc discharge method. 2. Pulsed laser evaporation. 3. Silicon carbide vaporisation. 19
  • 20. 1. Arc Discharge Process  This process made first carbon nanotube.  It is also called BIG SPARK PROCESS.  It is done in an enclosed chamber, which contains inert gas like argon.  The inert gas is filled in the tube at very low pressure.  In this process, catalysts are used to trigger the growth of carbon nanotube. 20
  • 22. 2. Pulsed Laser Evaporation  Buckyballs are formed.  Presence of metal catalyst causes the Buckyballs to stay open and form a single walled nanotube.  The purest single walled nanotube’s are produced by pulsed laser vaporization.  Yield depends on the amount and type of catalyst, laser power and wavelength, temperature, pressure and type of buffer gas, and geometry of the fluid flow near the carbon target. 22
  • 23. 3. Silicon Carbide Vapourization  This method includes simple vapourization of sic.  Sic is vapourized at very high temperature.  Carbon atoms will bond it self-together to form carbon nanotube.  This method is considered as the most pure method of manufacturing carbon nanotube. 23
  • 24. Properties of CNT  CNT has many unique properties. 1) Strength 2) Hardness 3) Kinetic 4) Electrical 24
  • 25. 1. Strength  Carbon nanotubes are the strongest and stiffest materials yet discovered in terms of: tensile strength and elastic modulus.  This strength results from the covalent sp² bonds formed between the individual carbon atoms. 25 2. Hardness  Diamond is considered to be the hardest material.  It is well known that graphite transforms into diamond under conditions of high temperature and high pressure.
  • 26. 3. Kinetic  This property has been utilized to create the world's smallest rotational motor.  Future applications such as a gigahertz mechanical oscillator are also envisaged. 26 4. Electrical  The structure of a nanotube strongly affects its electrical properties.  Multiwalled carbon nanotubes with interconnected inner shells show superconductivity with a relatively high transition temperature Tc = 12 K.
  • 27. ADVANTAGES OF CARBON NANOTUBE 1) Average diameter Of 1.2 Nm – 1.4 Nm:  The average diameter of the carbon nanotube is 1.2 nm to 1.4nm.  The diameter varies according to the manufacturing process. 2) Highly stable:  It can withstand a temperature up to 2800 degree Celsius in vacuum. Continued.. 27
  • 28. 3) High current density:  Maximum current density is one billion ampere per Centimetre Square. 4) Good thermal conductivity:  The thermal conductivity of the carbon nanotube is 6000 w/m/k.  On comparison pure diamond will transmit heat at the rate of 3320 w/m/k. 5) High tensile strength:  Carbon nanotube has a tensile strength of 45 billion Pascal.  NASA is planning to use carbon nanotube for spacecraft component manufacturing. Continued.. 28
  • 29. 6) High density:  Carbon nanotube has very high density of 1.33 to 1.40 grams per Cm Square.  NASA is planning to use CNT alloys in the nozzles of future space shuttles. 7) Twisting Angle Dependence:  The band gap of the carbon nanotube increases with its twisting angle.  So this method can be used to convert metallic carbon nanotubes in to semi conducting carbon nanotubes. 8) High Mobility:  Mobility of the electrons inside the doped diamond structural carbon is higher than that of in the silicon structure. Continued.. 29
  • 30. APPLICATIONS OF CARBON NANOTUBE. 1) Inter Connection Inside The Chip 2) Carbon Nanotube Transistor Manufacturing 3) Molecular Logic Circuit 30
  • 31. DIAMONDS ON FILM  Wafers with polycrystalline films of diamond are being investigated for use with high-performance materials like gallium nitride;  They are also being proposed as higher-performance replacements for silicon-on-insulator wafers. 31
  • 32. Advantages Of Diamond Chip:-  SMALLER COMPONENTS ARE POSSIBLE:  It is possible to etch very smaller lines through diamond structural carbon.  We can realize a transistor whose size is one in hundredth of silicon transistor.  IT WORKS AT HIGHER TEMPERATURE:  Diamond is very strongly bonded material.  It can withstand higher temperatures compared with that of silicon.  Diamond is very good conductor of heat. Continued.. 32
  • 33.  FASTER THAN SILICON CHIP :  Mobility of electrons inside the doped diamond structural carbon is higher than that of in he silicon structure.  The carbon atom size is small, so the chance of collision of electrons decreases.  LARGER POWER HANDLING CAPACITY :  Diamond has a strongly bonded crystal structure.  So carbon chip can work under high power environment.  We can connect high power circuit direct to the diamond chip.  At very high voltages silicon structure will collapse. 33
  • 34. Disadvantages Of Diamond Chip:-  EXPENSIVE  Artificial diamond for chips is expensive than silicon.  A four-millimetre-square diamond substrate costs several tens of thousands of yen compared to virtually nothing for silicon.  SLOW ELECTRIC FLOW  Electricity cannot travel smoothly through diamond.  Researches are seeking impurities that can be added to aid electricity flow.  But it’s a negligible fact, when considering its advantages. 34
  • 35. CONCLUSION  Silicon chips have reached the limit of their capacity to act as a semi-conductor of electricity.  Diamond has many properties that are superior to silicon.  Diamond-based control modules could lead to considerable energy savings.  It is the better solution for the problems in power electronic applications.  Thus diamond chip replaces the need of silicon in every aspect in future generations. 35
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