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NASA LOW
OUTGASSING
APPROVED
ADHESIVS
SYSTEMS
NASA LOW
OUTGASSING
APPROVED
ADHESIVE
SYSTEMS
ONE PART EPOXY with
Ultra High Heat Transfer
SILVER FILLED
EP3HTSDA-2
Thermal conductivity
6.5-7.0 W/(m•K)
Tg
154 Hobart Street, Hackensack, NJ 07601 USA
+1.201.343.8983 • main@masterbond.com
www.masterbond.com
FOR DIE ATTACH APPLICATIONS
OPTICALLY CLEAR
Room Temperature
Curing Adhesive
TWO PART EPOXY
EP30-2
Refractive index
1.55
FOR CRYOGENIC APPLICATIONS
HIGH TEMPERATURE
RESISTANT
UV Curable System
ONE PART UV26
Glass transition
temperature
160-170°C
FOR BONDING OPTICAL COMPONENTS
HEAT & UV CURING
Nanosilica Filled
Epoxy Compound
ONE PART
UV22DC80-1
Cures under UV light
or at 80°C in
shadowed out areas
FOR ABRASION RESISTANT COATINGS
LOW VISCOSITY
Optically Clear
Silicone System
FOR CONFORMAL COATINGS
ONE PART
MasterSil 920-LO
Service temperature
range
-115°C to 260°C
THERMALLY
CONDUCTIVE
Electrically
Insulative Silicone
FOR POTTING & ENCAPSULATION
TWO PART
MasterSil 151TC
Volume resistivity
>1014
ohm-cm

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