1. Merix Corporation Capabilities Cross Compare
San Jose Oregon Huiyang Huizhou
Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production
Class A Class B Class A Class B Class A Class B Class A Class B
1.0 Material
1.1 Global Material Offerings All Sites Number of Conductive layers Number of Conductive layers Number of Conductive layer Number of Conductive layer Number of Conductive layers Number of Conductive layers Number of Conductive layers Number of Conductive layers
Isola FR406: 2 - 30 32 - 40 2 - 30 32 - 40 2 – 14 10 - 24 2–8 10-14
Isola 370HR: 2 - 30 32 – 40 2 - 30 32 – 40 2 – 14 10 - 24 2-8 NO
ITEQ 180: NO 2 – 40 NO 2 – 40 2 – 14 10 -24 NO NO
FR408: 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 NO NO
N4000-13 & 13SI: 2 - 30 32 - 40 2 - 30 32 - 40 NO 2 -24 NO NO
Rogers 4350/4450: M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric M/L & MIXED Dielectric 2-SIDED ONLY M/L & MIXED Dielectric 2-6 M/L & MIXED Dielectric
1.2 Additional Standard Based Material
Standard FR4: 2 - 30 32 – 40 2 - 30 32 – 40 2 – 14 10 - 24 2–8 10-14
NO NO NO NO
High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40
High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40 NO 2-24 NO NO
1.3 Low Loss E-Glass Materials
High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 - 24 NO NO
High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40 NO NO NO NO
Polyclad GETEK & MEM Megtron: NO NO NO NO NO NO NO NO
Nelco 4000-13& 13SI: 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 NO NO
1.4 Lead-Free Qualified Materials
ITEQ 180: NO 2 – 40 NO 2 – 40 2 – 14 10 - 24 NO NO
High Tg CAF Resistant (370HR): 2 - 30 32 – 40 2 - 30 32 – 40 2 – 14 10 - 24 NO 2-8
NO NO NO NO
High Tg FR4 (Nelco-29): 2 - 30 32 – 40 2 - 30 32 – 40
High Tg Modified FR-4 (IS415) 2 - 30 32 – 40 2 - 30 32 – 40 NO 2-24 NO NO
Polyimide: 2 - 30 32 – 40 2 - 30 32 – 40 NO NO NO NO
1.5 Lead-Free Low Loss Materials
High Freq. FR4 (FR408): 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 NO NO
High Freq. Modified FR4 (IS620): 2 - 30 32 – 40 2 - 30 32 – 40 NO NO NO NO
Nelco 4000-13EP and EPSI: 2 - 30 32 – 40 2 - 30 32 – 40 NO 2 -24 for -13EP Only NO NO
1.6 High Temperature Materials
Polyimide: 1 – 16 18 – 28 2 - 30 32 – 40 NO NO NO NO
1.7 Commercial RF Materials
Roger 3000 Series: YES YES YES YES NO NO NO NO
Mixed Dielectric – Rogers Mixed Dielectric & Mulitlayer -
Roger 4000 Series: YES YES YES YES 2-SIDED Rogers 4350 ONLY 4350 2-sided Rogers 4350 Only 4350
Taconic RF Materials: YES YES NO YES NO NO NO NO
1.8 Advanced RF Materials
Nelco 9000 Series (PTFE): 1-2 NO NO NO NO NO NO NO
Roger 6000 Series: 1–2 NO NO NO NO NO NO NO
Roger 5000 Series: 1–2 NO NO NO NO NO NO NO
1.9 Asia Material Offering
Isola 400,402, and ED130UV (Tg=125-145C): NO NO NO NO NO 2 – 14 2–8 10-14
Polyclad 370/ Turbo (Tg=175C): NO NO NO NO 2 - 18 10 – 24 2–8 10-14
ITEQ IT140(Tg=140C) NO NO NO NO 2 – 14 2 – 14 2–8 10-14
Nanya NP-140 (Tg=140C) NO NO NO NO 2 – 14 2 – 14 2–8 10-14
SHENGYI S1141 (Tg=135C): NO NO NO NO 2 – 14 2 – 14 NO YES
SHENGYI S1441 (Tg=140C): NO NO NO NO 2 – 14 2 – 14 NO NO
ITEQ IT158 (Tg=150C): NO NO NO NO 2 - 18 10 – 24 2–8 10-14
SHENGYI S1170 (Tg=170C): NO NO NO NO 2 - 18 10 – 24 NO Yes
ITEQ IT170 (Tg=170C) NO NO NO NO 2 - 18 10 – 24 NO NO
1.10 Buried Capacitance
Isola FR406– 2mil YES YES YES YES NO YES NO NO
Isola FR408- 2mil YES YES YES YES NO YES NO NO
Isola 370HR-2 mil YES YES YES YES NO YES NO NO
Nelco-13 and -13Si – 2mil YES YES YES YES NO YES NO NO
Isola IS620 – 2mil YES YES YES YES NO NO NO NO
Polyimide P96 – 2mil YES YES YES YES NO NO NO NO
Oak-Mitsui Faradflex – BC 24 ( 1 mil) NO NO YES YES NO NO NO NO
Oak-Mitsui Faradflex – BC12TM (.5 mil) NO NO NO YES NO NO NO NO
Merix Corporation Page 1 of 5 Rev:090128

2. San Jose Oregon Huiyang Huizhou
Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production
Class A Class B Class A Class B Class A Class B Class A Class B
1.11 Panel Sizes and Useable Area
18 X 24 18 X 24 18 X 24, 18 X 24, 20 X 24, 16 X 21
Multilayer Panel Sizes: 12 X 18 16 X 18 21 X 24 16 x 18 21 X 24, 14 x 24 16 x 20, 14 x 20, 14 x 24
Non Usable Border on Panel:
Double Sided Boards: .65 .65 .65 .55 .7 .65 .5 .5
Multilayer Boards: .75 .75 .65 .55 .7 .65 .7 .7
Spacing Between Boards: (Routing Process)
Double Sided and Multilayer Boards: .150 .100 .150 .100 .150 .1 .150 .1
2.0 Stack-ups
2.1 Overall Thickness Range and Tolerances
Overall Board Thickness: ≤ ≤ ≤ ≤ ≤ ≤ ≤
.126 - .240 .240 .126 - .240 .275 .125 .220 .118 .118
Overall Board Thickness Tolerance:
< .020”: +/- 15% +/- 15% +/- 15% +/- 15% +/-15% +/-15% NO +/-15%
.031”: +/- 15% +/- 10% +/- 15% +/- 10% +/-10% +/-10% +/-10% +/-10%
.062”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% +/-10% +/-10%
.093”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% +/-10% +/-10%
.125”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% NO NO
.187”: +/- 10% +/- 8% +/- 10% +/- 8% +/-10% +/-10% NO NO
2.2 Flatness Spec
Flatness: (Warp per Inch) .010 .007 .010 .0075 .010 .0075 .010 .0075
2.3 Thinnest Dielectric Finished
Thin Board Overall Thickness: .017 .013 .017 .015 .031 .020 (No HASL) 0.028 .020
Thinnest Plated Core: .012 .008 .012 .008 NO .016 NO 0.016
3.0 Mechanical Capabilities
3.1 Machining Drill Capabilities
Primary Drilled Hole Location Tolerance to Datum
(Hole) Zero (DTP): 0.007 0.006 0.007 0.006 0.010 0.008 0.011 0.0085
2nd Drill Hole Location Tolerance to Datum Zero
(DTP): 0.014 0.011 0.014 0.011 0.014 0.011 0.014 0.011
Minimum Clearance from Copper Conductor to Mechanical
Drilled Hole: .0085 .008 .0085 .008 .010 .0085 .0085 .008
Minimum Clearance from Copper Conductor to a Laser
Drilled Hole: .008 .006 .0085 .008 NO NO NO NO
3.2 Plated Through Hole Capabilities
Smallest Plated Thru Hole Size: (Finished Via Size
with Finished Hole Size - 1 mil Min Ave Copper
Requirement)
Finished Panel Thickness < .020”: .004 .003 .006 .006 .010 .008 .010 .010
Finished Panel Thickness .031”: .004 .004 .006 .006 .010 .008 .010 .010
Finished Panel Thickness.062”: .006 .006 .006 .006 .010 .008 .010 .010
Finished Panel Thickness.093”: .010 .008 .008 .008 .012 .008 .014 .014
Finished Panel Thickness.125”: .012 .008 .008 .008 .012 .008 NO NO
Finished Panel Thickness.187”: .015 .012 .014 .012 NO .014 NO NO
Plated Hole Tolerance: +/-.003 +/-.002 +/- .003 +/- .002 +/-.003 +/- .002 +/-.003 +/-.002
5:1 ( 12 mil drill)
Aspect Ratio (with 10 mil drill): 10:1 12:1 12.5:1 14:1 8:1 12:1 6:1 non- auto 8:1
Plated Hole Spacing Minimum (Drilled hole to hole): .022 .015 .022 .015 .022 .015 .022 .020
3.3 Non Plated Through Holes
Smallest Non Plated Hole Size: (Finished) .010 .008 .010 .008 .012 .010 .012 (non-HASL) .012 (non HASL)
Largest Non-Plated Hole Size Routed: .200 NO LIMIT .200 NO LIMIT .200 NO LIMIT .250 NO LIMIT
Largest Primary Drilled and Tented Non-Plated Hole: .200 .250 .200 .250 .200 .250 .236 .250
Non-plated Routed Hole Tolerance: +/- .005 +/- .003 +/- .005 +/- .003 +/- .005 +/- .003 +/- .005 +/- .003
Minimum NPTH to Edge of Board Spacing: .020 .010 .020 .010 .030 .020 .030 .025
3.4 Micro Via (μVia) Capabilities
Smallest Laser μVia Hole Size: ( Via Size with 0.4 mil
Copper Requirement) .004 .004 .004 .004 NO NO NO NO
Largest Drilled Laser Via: .010 .010 .006 > .009 NO NO NO NO
Via Aspect Ratio 0.8:1 .9:1 .75:1 .85:1 NO NO NO NO
Capture Pad Size: μvia + .010 μvia + .006 μvia + .010 μvia + .007 NO NO NO NO
Landing Pad Size: μvia + .010 μvia + .006 μvia + .010 μvia + .007 NO NO NO NO
Stacked Via NO 2 NO 3 NO NO NO NO
Type I Capabilities YES YES YES YES NO NO NO NO
Type II Capabilities YES YES YES YES NO NO NO NO
Type III Capabilities NO NO NO YES NO NO NO NO
Merix Corporation Page 2 of 5 Rev:090128

3. San Jose Oregon Huiyang Huizhou
Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production
Class A Class B Class A Class B Class A Class B Class A Class B
3.5 Control Depth Drill Capabilities
Smallest Control Depth Drill .008 .006 .010 .010 NO NO NO NO
Largest Control Depth Drill .125 .257 .125 .125 NO NO NO NO
Minimum Backside Dielectric Separation .008 .005 .007 .007 NO NO NO NO
Control Depth Drill Depth Tolerance .005 .002 .005 .002 NO NO NO NO
Control Depth Drill Aspect Ratio (with tolerance) .75:1 .85:1 .75:1 .85:1 NO NO NO NO
3.6 Back Drilling Capabilities
Minimum Back Drill Drilled Diameter .022 .020 .022 .020 .022 .020 NO NO
Drilled Hole Over Finished Hole Size .012 .010 .012 .010 .012 .010 NO NO
Drill Depth Tolerance +/- .008 +/- .005 +/-.008 +/-.005 +/-.008 +/-.007 NO NO
Number of Drilled Depths per Side MULTIPLE MULTIPLE MULTIPLE MULTIPLE 1 MULTIPLE NO NO
3.7 Scoring Capabilities
Angles: 60° 30° / 45° 30° 30° 30, 45, 60 30, 45, 60 30, 45, 60 30, 45, 60
Offset Tolerance: +/- .010 +/- .005 +/- .003 +/- .002 +/- .003 +/- .002 +/- .003 +/- .002
Optimum Remaining Web Thickness: .018 .012 .015 .012 .015 .012 .015 .012
Remaining Web Tolerance +/- .005 +/- .003 +/- .005 +/-.002 +/- .005 +/- .003 +/- .005 +/- .003
True Position Tolerance: .010 .005 .008 .005 .008 .005 .008 .005
3.8 Edge Connector Bevel Capabilities
Finger Tip Angle: 45° 30° / 20° 49°, 45°, 40° 30°, 20° 20°, 30°, 45°, 60° 20°, 30°, 45°, 60° 20°, 30°, 45°, 60° 20°, 30°, 45°, 60°
Bevel Depth Tolerance: +/- .010 +/- .005 +/- .008 +/- .005 +/-.010 +/- .008 +/-.010 +/- .008
3.9 Profile Capabilities
Standard Router Bit Diameter: .093 & .125 .062,.039,.031 1.6 mm, 2.4mm, .125 .031, 1mm .062, .093, .031, .039, .125 1.6mm, 2.4mm 2.0mm
Routed Profile Tolerance: (18”X 24” Panel): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004
Routed Cutout Tolerance: (0.50” x 0.50”): +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004 +/- 0.005 +/- 0.004
Minimum Internal Rout Radius: > .031 0.016 > .031 0.016 0.031 0.024 >.031 .031
Minimum Routed Slot Width: > .062 .062 - .031 > .062 .062 - .031 .062 .062 - .031 .062 .062
4.0 Feature Size Capabilities
4.1 Innerlayer Capabilities
Minimum Conductor Width
Internal Starting Copper Weight ½ oz.: .00325 .003 .00325 .003 .0035 .00325 .005 .004
Internal Starting Copper Weight 1 oz.: .004 .0035 .004 .0035 .00425 .004 .006 .005
Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 .006 .0055 .008 .007
Internal Starting Copper Weight 3 oz: NO YES NO YES NO NO .011 .010
Minimum Conductor Spacing: (Airgap)
Internal Starting Copper Weight ½ oz.: .0035 .00325 .0035 .00325 .00375 .0035 .005 .004
Internal Starting Copper Weight 1 oz.: .004 .004 .004 .004 .00425 .004 .006 .005
Internal Starting Copper Weight 2 oz.: .006 .0055 .006 .0055 .006 .0055 .008 .007
Internal Starting Copper Weight 3 oz.: NO YES NO YES NO NO .011 .010
4.2 Outerlayer Capabilities (Finished Cu Thick)
(Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating)
Minimum Conductor Width (Finished Copper Thickness with Base Foil and Plating)
External Copper Thickness 1.5 mil: .004 .003 .0035 .003 .0045 .004 .005 .0045
External Copper Thickness 2.0 mil: .0045 .0035 .004 .0035 .005 .0045 .006 .005
External Copper Thickness 2.5 mil: .0055 .005 .0055 .005 .0055 .005 .007 .006
External Copper Thickness 3.0 mil: .007 .006 .007 .006 .007 .006 .008 .0065
Minimum Conductor Spacing: (Airgap (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating) (Finished Copper Thickness with Base Foil and Plating)
External Copper Thickness 1.5 mil: .004 .003 .004 .0035 .0045 .0045 .005 .005
External Copper Thickness 2.0 mil: .0045 .0035 .0045 .004 .005 .005 .006 .0055
External Copper Thickness 2.5 mil: .005 .004 .006 .0055 .0055 .0055 .007 .0065
External Copper Thickness 3.0 mil: .007 .006 .007 .006 .007 .006 .008 .007
4.3 Pad Diameter to Finished Hole Size
Conventional Drilling:
Minimum Pad / Drill / Plated Hole:
(Pad Size for Tangency. Add 2X minimum annular ring as
needed.) PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE PAD / DRILL / HOLE
.062 Thick Board: .020/.010/.006 .018/.008/.004 .020 / .010 / .006 .018 / .008 / .004 .020 / .010 / .006 .019 / .010 / .006 .024 / .014 / .010 .022 / .012 / .008
.093 Thick Board: .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .026 / .016 / .010 .024 / .014 / .010
.125 Thick Board ( .120 for HY only): .020 / .010 / .006 .019 / .010 / .006 .020 / .010 / .006 .019 / .010 / .006 .020 / .012 / .006 .019 / .010 / .006 N/A N/A
.150 Thick Board: .022 / .012 / .008 .020 / .010 / .005 .022 / .012 / .008 .020 / .010 / .005 .024 / .013 / .009 .022 / .012 / .008 N/A N/A
.187 Thick Board: .024 / .014 / .010 .022 / .012 / .008 .024 / .014 / .010 .022 / .012 / .008 .026 / .016 / .012 .024 / .014 / .010 N/A N/A
Micro Drilling: Laser Via
Blind Via: .012/.006/.003 .010/.005/.003 .012/.004/.004 .011/.004/.004 NO NO N/A N/A
Micro Drilling: Mechanical Via
Blind Via: .012/.006/.003 .010/.005/.003 .020 / .010 / .006 .019 / .008/ .004 NO NO .024 / .014 / .010 .022 / .012 / .008
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4. San Jose Oregon Huiyang Huizhou
Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production
Class A Class B Class A Class B Class A Class B Class A Class B
5.0 Solder Mask and Silkscreen
5.1 Solder Mask
Minimum Solder Mask Clearance: (LPI)
Pad size larger than NPTH: .010 .006 .010 .006 .010 .006 .010 .006
Over Surface Image (pad relief): .006 .003 .005 .004 .006 .005 .006 .005
Web Between Surface Mount Pads: .004 .003 .003 .002 .004 .003 .004 .003
IPC SPEC COVERAGE IPC SPEC COVERAGE IPC SPEC COVERAGE IPC SPEC COVERAGE
Solder Mask Thickness Over Metal: (SPC RANGES .0002 - .003 TYPICAL = .0007 over (SPC RANGES .0002 - .003 TYPICAL = .0007 over (SPC RANGES .0002 - .003 TYPICAL = .0007 over (SPC RANGES .0002 - .003 TYPICAL = .0007 over
conductor) conductor) conductor) conductor)
BLUE, RED, BLACK,
Solder Mask Colors:
GREEN GREEN RED, BLUE, BLACK GREEN BLUE, RED,BLACK GREEN, BLUE RED, BLACK
YELLOW, WHITE
TAIYO PSR4000-G23K semi-gloss, Huntsman
Solder Mask Type:
TAIYO-PSR4000 - HFX TAIYO-PSR4000 - HFX (Probimer77) TAIYO, Huntsman
Minimum Mask Defined Pad Diameter: .012 .010 .012 .010 .012 .010 .012 .010
Mask Defined Pad Minimum Overlap of Copper: .005 .0025 .005 .0025 .005 .0025 .005 .0025
5.2 Silkscreen
Minimum Width Silk Screen Image: .007 .005 .006 .005 .006 .005 .007 .006
Nomenclature Colors WHITE BLACK, YELLOW WHITE BLACK, YELLOW WHITE BLACK, YELLOW WHITE BLACK, YELLOW
6.0 Via-in-Pad - HDI
6.1 Epoxy Filled – Non Conductive
Epoxy Filled Thru Hole Capability: YES YES YES YES NO Yes NO NO
Epoxy Filled Thru Hole Minimum: .010 .0072 .010 .008 NO .010 NO NO
Epoxy Filled Thru Hole Maximum: .018 .020 .020 .035 NO .020 NO NO
Epoxy Filled μVia Process: YES YES YES YES NO NO NO NO
Epoxy Filled μVia Hole Minimum: .0055 .004 .0055 .004 NO NO NO NO
Minimum Board Thickness: .025 .020 .020 .020 NO .020 NO NO
Maximum Board Thickness: .125 .180 .120 .180 NO .120 NO NO
Via Fill Aspect Ratio: 8:1 12:1 10:1 12:1 NO 12:1 NO NO
Maximum Panel Size for μVia: 12 X 18 18 X 24 18 X 24 21 X 24 NO 18 X 24 NO NO
.004 / .0045 with Wrap Spec
Outerlayer Trace Widths/Spacing
.004 / .005 .0035 / .0045 .004 / .005 Class II NO .0045 / .005 NO NO
6.2 Copper Plated/ Filled
Copper Filled μVia Process: NO NO NO YES NO NO NO NO
Copper Filled μVia Hole Minimum: NO NO NO .004” NO NO NO NO
Copper Filled μVia Hole Maximum: NO NO NO .005” NO NO NO NO
Via Fill Aspect Ratio: NO NO NO .85:1 NO NO NO NO
Maximum Board Thickness: NO NO NO <.150” NO NO NO NO
.004”/.004” with LB to
Outerlayer Trace Widths/Spacing:
NO NO NO Pattern NO NO NO NO
Combined with other fill technologies NO NO NO Must be reviewed NO NO NO NO
7.0 Military
7.1 Etch Back
2 Pt. Connection YES YES FR406, 370HR, FR408, Nelco-13, IS415, and Polyimide NO NO NO NO
3 Pt. Connection ( glass etch) YES YES FR406, 370HR and Polyimide NO NO NO NO
8.0 Cavity Boards - TMS
Through Rout Technology: NO YES YES YES NO NO NO YES
Step Rout Technology: NO YES YES YES NO NO NO YES
9.0 Thermal Management
Technology
9.1 Coin Attached
Conductive Adhesive: NO NO YES YES NO NO NO YES
Solder Adhesive: NO NO NO YES NO NO NO NO
9.2 Pallet Attached
Conductive Adhesive: NO NO YES YES NO NO NO YES
Embedded Copper Technology(Merix Patent Pending): NO NO YES YES NO NO NO NO
10.0Surface Finishes Options
10.1 Surface Finishes Selection
Hot Air Solder Level: YES YES YES YES YES YES YES YES
Immersion Silver: Enthone Alpha Star MacDermid Sterling MacDermid Sterling MacDermid Sterling
Lead Free OSP : Shikoku F2(LX) Shikoku F2(LX) Enthone 106AX-HT Shikoku F2(LX)
Electroless Nickel Immersion Gold: YES YES YES YES YES YES YES YES
Immersion Tin: YES YES NO Yes – thru SJ YES YES NO Processed in Huiyang
Full Body Gold: YES YES – 4 mil spacing on .5 oz YES YES NO NO YES – 5:1 YES
Bondable Gold: YES YES – 4 mil spacing on .5 oz NO NO NO NO NO NO
Merix Corporation Page 4 of 5 Rev:090128

5. San Jose Oregon Huiyang Huizhou
Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production Volume Production Controlled Volume Production
Class A Class B Class A Class B Class A Class B Class A Class B
10.2 Mixed Finishes
Immersion Silver with Selective Hard Gold: YES YES YES YES NO YES – tie bar NO YES – tie bar
HASL with Selective Gold: YES YES YES YES NO YES NO YES
Dual Gold Plating: YES YES YES YES NO NO YES YES
Immersion Gold with OSP: YES YES NO NO NO NO NO NO
Immersion Gold with Selective Hard Gold: NO YES NO YES NO YES – tie bar NO Yes
Selective Hard Gold with OSP: YES YES YES YES YES YES – tie bar YES YES
Recessed Fingers: YES YES NO NO NO NO YES YES
10.3 Lead-Free Surface Finishes
Immersion Silver: YES YES YES YES YES YES YES YES
Lead Free OSP : Shikoku F2(LX) Shikoku F2(LX) Shikoku F2(LX)
Enthone 106AX-HT
Electroless Nickel Immersion Gold: YES YES YES YES YES YES YES YES
Immersion Tin: YES YES NO YES YES YES NO NO
Full Body Gold: Processed in Huizhou
YES YES YES YES NO NO YES
Lead-Free HASL: NO YES – Outside Service NO YES – Outside Service NO NO NO NO
11.0 Testing Capabilities
Minimum Test Continuity Resistance: 20 OHMS 10 OHMS 20 OHMS < 20 OHMS 50 OHMS 20 OHMS 50 OHMS 20 OHMS
Maximum Test Voltage: 100V 200V 100V 250V 250V 250V 250V 250V
Maximum Test Isolated Resistance: 10M OHMS 50M OHMS 10M OHMS 100M OHMS 10M OHMS 20M OHMS 20M OHMS 30M OHMS
Largest Test Bed Fixtured: 12 X 19.3 16.5 X 22.5 29.6 x 19.2 DD 29.6 x 19.2 DD DOUBLE SIDED DOUBLE SIDED
Largest Test Bed Flying Probe: 20 X 24 20 X 24 24X27 24X27 24 X 26 24 X 36 15.6x21.6 15.6x21.6
Electrical Test Pitch (Fixture Test): 0.019 0.016 .020 .016 .025 .020 .025 .020
Electrical Test Pitch (Flying Probe Test): 0.008 0.004 .010 .005 .010 .005 .010 .008
DC Line Resistance Testing: NO YES NO YES NO NO NO YES
Prop Delay: NO NO YES YES NO NO NO NO
12.0 Electrical Performance
TDR Test Tolerance (Print and Etch): +/- 10% +/- 7.5% +/- 10% +/- 7.5% +/- 15% +/- 10% +/- 10% +/- 10%
TDR Test Tolerance (Plated Copper): +/- 15% +/- 10% +/- 10% +/- 10% +/- 15% +/- 10% +/- 15% +/- 10%
TDR Test Tolerance Differential Measurements: +/- 15% +/- 10% +/- 10% +/- 10% +/- 15% +/- 10% +/- 15% +/- 10%
TDR Tolerance Single Ended Tolerance: +/- 10% +/- 7.5% +/- 10% +/- 10% +/- 15% +/- 10% +/- 15% +/- 10%
HiPot Testing (AC & DC): NO YES YES YES NO YES YES (DC) YES (DC)
13.0 Data & Documentation
13.1 Tooling Formats
Film Data Formats: ODB++ RS-274X ODB++ RS-274X ODB++ RS-274X ODB++ RS-274X
Drill Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER
Route Data Formats: ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER ODB++ NC DATA & GERBER
Electrical Test Formats: ODB++ IPC-D-356A ODB++ IPC-D-356A ODB++ IPC-D-356A ODB++ IPC-D-356A
IPC-D-356A OR MENTOR IPC-D-356A OR MENTOR IPC-D-356A OR MENTOR
Netlist Compare Formats: ODB++ ODB++ ODB++ ODB++ IPC-D-356A OR MENTOR
NEUTRAL FILE NEUTRAL FILE NEUTRAL FILE
13.2 Tooling Communication
FTP FTP FTP FTP
Media Types & Data Transfer: ftp.sj.merix.com ftp.merix.com ftp.asia.merix.com ftp.asia.merix.com
E-mail E-mail E-mail E-mail
cam@sj.merix.com cam@fg.merix.com cam@hy.merix.com hzphoto@asia.merix.com
Compression Formats: ZIP, TAR, TGZ RAR, ARC ZIP, TAR, TGZ RAR, ARC ZIP, TAR, TGZ RAR, ARC ZIP, TGZ RAR
Secured Transfer: FTP PGP ENCRYPTION FTP PGP ENCRYPTION FTP PGP ENCRYPTION FTP PGP ENCRYPTION
Merix – San Jose Merix – Oregon Merix - Huiyang, China Merix – Huizhou, China
355 Turtle Creek Court 1521 Poplar Avenue 23 Yin Ling Lu, Chen Jiang Town, Hui Yang City 16 Gu Tang Au, Industrial District, Huizhou City
San Jose, California 95125 Forest Grove, Oregon 97116 Guang Dong Province, 516229 China Guang Dong Province, China
Phone: (800) 800-3278 Phone: (888) 256-3749 Phone: 86 752 2617 111 Phone: 86 752 2266 111
Direct: (408) 280-0422 Direct: (503) 359-9300 FTP: ftp.asia.merix.com FTP: ftp.asia.merix.com
FTP: ftp.sj.merix.com FTP: ftp.merix.com
Merix Corporation Page 5 of 5 Rev:090128