example investor presentation / Ornek yatirimci sunumu

1. An Example Investor Presentation
from Ziya’s Students
Ziya G. Boyacigiller
This presentation was created and given by Ziya
Boyacigiller who was leading Angel Investor and a loved
mentor to many young entrepreneurs in Turkey. We have
shared it on the web for everyone’s benefit. It is free to
use but please cite Ziya Boyacigiller as the source when
you use any part of this presentation. For more about
Ziya Boyacigiller’s contributions to the start-up Ecosystem
of Turkey, please go to www.ziyaboyacigiller.com

2. Example Presentation to
Investors
Ziya G. Boyacigiller
Sabanci University
BA, MBA and EXEC MBA
2004 through 2013

3. THE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS
Mustafa Birinci
mustafa@sigyros.com
Mahmut Ikinci
mahmut@sigyros.com
Mehmet Ucuncu
mehmet@sigyros.com
+90 216 555 0000
SILICON GYROS
MEMS+
GYROSCOPES
+ MEMS = Micro-Electro-Mechnanical-System

4. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 4
Overview
• All positioning electronics rely on gyroscopes, creating a $10B
market in 2010
• Fabless semiconductor company designing and marketing
integrated MEMS+CMOS silicon components for
communication, navigation, storage, and consumer markets
• Silicon Gyros (SG) integrated positioning solutions solve
critical power, cost, space, performance & reliability constraints

5. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 5
$10B Market Opportunity
$0.3
$1.6
$0.9
$0.3
$1.7
$1.1
$0.3
$1.9
$1.3
$0.3
$2.1
$1.5
$0.3
$2.3
$1.7
$0.0
$0.5
$1.0
$1.5
$2.0
$2.5
$3.0
$3.5
$4.0
$4.5
2004 2005 2006 2007 2008
Worldwide Gyro Market ($B)
$2.8
$3.1
$3.5
$3.9
$4.3 10% AGR
ource: WTC Consulting, JPMorgan, IDC, iSupply, Reed Electronics, World Information Technologies, Gartner, In-Stat, ARC
•Mechanical
•NO GROWTH
•2 chip
•9% AGR
Single chip / IPS
13% AGR

6. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 6
Separate Component
─Requires board space (>10mm2
)
─Major source of board field failures
Complex System Design
─One gyro per axis
─Multiple components required
Limited Performance
─Inefficient, wastes power
─Limited range of sensitivity
High System Costs
─Direct: component and assembly
─Indirect: long design cycles, procurement
Pain:
Off-chip Gyro Limits Integration

7. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 7
Solution:
Integrated Positioning Solutions (IPS)
MEMS Gyroscope
 back-end CMOS compatible
 wafer level encapsulation
 bare-die or plastic packaging
System Integration
 IPS = CMOS circuitry+MEMS
gyro
•
SiGe MEMS
Gyro
Advanced CMOS
Circuitry
Integrated
Electronics
(Gyro + Circuitry) ••
•••••••
Si

8. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 8
Value-Add Capabilities
Size
Resonant Frequency
Temperature Range
Accuracy/Stability
Sensitivity
Packaging
Reference Frequencies
On-Chip Integration
Synchronization
0.8 x 0.7 mm
32 kHz – 2 GHz
-40°C to 120°C
+/- 1ppm
+/- 1ppm
Plastic (or bare-die)
Multiple
Yes
Yes
2.0 x 3.0 mm
32 kHz – 160 MHz
-30°C to 80°C
+/- 1ppm
+/- 10ppm
Ceramic
1
No
No
IPSQuartz

9. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 9
Benefits to End Customer
Performance
Consolidation
Reliability
 Single-chip design
 Ultra-Low noise
 Lower power
 Less board space
• Smaller plastic packages
• Bare-die for MCM
 High stability (1ppm)
 Single-chip design
• Lower mfg cost
 Consolidate components
• Reduce assembly cost
• Reduce supplier costs
 Consolidate SKUs
• Increase design flexibility
• Shorten design cycles
 Integration minimizes number of components
 Simplified system design
 Standard semiconductor packaging and assembly

10. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 10
Silicon Gyros
CMOS + MEMS
Competition
Standard CMOS Integration
Stability
QUARTZ-based
• NDK, Epson, Vectron, Saronix
• IDT/ICS, Cypress, Silego
• Multiple ‘leaders’ each with
fortes in certain niches
GyroX
• Polysilicon MEMS
• Targeting low-end applications
• $12M VC in April 2004
PolySi
• Polysilicon MEMS + CMOS
• $12M VC in December
2004

11. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 11
Product / Go-to-Market Strategy
2006 2007 2008
2-Chip
(CMOS & MEMS)
MEMS Gyro
Low Noise (*)
Integrated
Lower-Performance
(Consumer Quality)
(CMOS + MEMS)
Integrated
High-Performance
(Navigation Quality)
(CMOS + MEMS)
• Market MEMS Gyros during MEMS
technology transfer/development
• Establish 1st
customer relationships (storage)
• Vehicle for fully integrated MEMS/Gyro
• Early revenue generation
% of TAM
• Exploit advantages of MEMS and CMOS
• Pursue multiple range opportunities
• Expand market to consumer, storage and
communication
MEMS Technology As Key Value Differentiator
This product is already developed

12. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 12
Sustainable Advantage
(Intellectual Property / IP)
• World’s First fully integrated gyro+electronics using standard CMOS
foundry processing ( low cost & high volume)
• MEMS Process
— Enables integration of MEMS and CMOS
• Temperature Compensation (array of gyros)
— Low-power and low-cost design enables high stability
• Temperature Sensor
— Low-cost, on-chip, temperature sensor enables high stability
• Standard Manufacturing
— Low-cost, robust manufacturing-proprietary layout of gyro design
• Low-Noise Gyro
— Gyros optimized for high volume applications
• License from UC Berkeley for MEMS IP
— Exclusive, world-wide rights
— All inventors are members of Silicon Gyros
— Fully characterized gyro cores (for commercial applications)

13. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 13
Customer Engagements
Inertial Systems
Hitachi / Maxtor
Infineon
CommentsCompany
• Evaluating MEMS core Gyro for their next system
• Evaluating MEMS core Gyro for H-M 55 tape drive
• Interest in MEMS core Gyro for enterprise HDD
• List of 500 target customers identified

14. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 14
• Silicon Circuitry
— Mature standard wafer fabrication processes : 0.18u – 0.35u
— World class foundries: UMC & TSMC
— Mature small pin count semiconductor packaging and test
• MEMS
— Enable LPCVD furnace for standard post-process deposition
— NNTC
• turn-key foundry partner (CMOS + MEMS)
• MOU and NRE agreements for product and process/mfg collaboration
— Analog Devices
• pure MEMS foundry partner already validated process compatibility
• discussing price, volumes, and IP
— Hitachi
• turn-key foundry partner with strategic initiative evaluating MEMS
Manufacturing

15. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 15
ilestones
equirements
MEMS Gyro Development Schedule
Headcount
abor Cost
R&D
SG&A
otal
Cumulative
6-12
$ 780k
$ 640k
$ 320k
$1,740k
$1,740k
12-24
$ 1,100
$ 300
$ 250
$ 1,650
$ 3,390
24-34
$ 1,910
$ 790
$ 550
$ 3,250
$ 6,640
34-45
$ 2,830
$ 720
$ 750
$ 4,300
$10,940
45-70
$ 4,000
$ 1,800
$ 1,150
$ 6,950
$17,890
0 months 6 12 18 24 30
MEMS
Core CMOS
XGyro Con
XGyro Nav
Qualify
Prototype
Prototype
Finish Prototype Ship
Qualify Ship
Design Win Qualify Ship
Yield ProcessTransfer Process
Initial MEMS product samples

16. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 16
Financial Summary ($M)
$0
$2
$4
$6
$8
$10
$12
$14
$16
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
2005 2006 2007 2008
Revenue
Gross Profit
Cash
Revenue by Product Family ($M)
$0
$2
$4
$6
$8
$10
$12
$14
$16
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
2005 2006 2007 2008
eadcount
venue
OGS
oss Inc.
G&A
&D
BIT
d Cash
10
$ 0
$ 0
$ 0
$ 370
$ 510
($ 880)
$ 9,120
93
$ 36,020
$ 9,450
$ 26,570
$ 9,280
$ 5,500
$ 11,790
$ 6,440
24
$ 2,170
$ 650
$ 1,520
$ 1,770
$ 2,390
($ 2,640)
$ 4,400
49
$ 10,100
$ 3,370
$ 6,730
$ 4,620
$ 3,930
($ 1,820)
$ 13,320
Units (000s)
Gyro MEMs
XGyro (Nav)
XGyro (Con)
Revenues (000s)
Gyro MEMs
XGyro (Nav)
XGyro (Con)
15,100
3,750
38,700
$ 12,500
$ 4,900
$ 18,500
10,100
230
480
$ 8,500
$ 300
$ 290
Financials
2,000
0
0
$ 2,150
$ 0
$ 0

17. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 17
Team• FOUNDERS:
—Mustafa Birinci, CEO and Founder
• Veteran gyro market entrepreneur: NovaSensor, VP Marketing at IC Works, CEO at GyroTech
—Mahmut Ikinci, CTO and Founder
• System design and SiGe MEMS: UC Berkeley PhD, Xenos, NovaSensor, GyroTech
—Mehmet Ucuncu, VP Marketing and Founder
• Early-stage start-up planning: NetX, GyroNet, UC Berkeley MBA, MIT MS
• ADVISORY BOARD
—Prof. Roger Howdy, Chief Scientist and Founder
• MEMS gyro pioneer: Stanford, EECS UC Berkeley, BSAC Director, ADI Technical Advisor
—Shusaku Sudaka, Sr. Advisor to CEO (Marketing, Ops, Biz Dev)
• Japan semiconductor marketing: President and COO: Technology and Marketing at Oki America
• MANAGEMENT
—Leyla Basaran, Dir. Applications and Founder
• Gyro marketing and application support: Stanford Telecom, ICWorks, Exar, UC Berkeley
—Nilufer Calisan, Manufacturing
• MEMS process transfer: VP Eng. Lilliputian, Dir. Eng. Candescent, Stanford Professor
—Yasemin Kazanan, Design Engineer
• Mixed Signal IC Designer: Exar, Cypress, Project leader for OC-98 transceiver
—Lang-Lang Dang, Dir. Strategic Accounts - China
• Chinese handset vendor relationships: Dir. Handset Engineering Enuvis (SiRF), Haier, Casio
—Rafet Sevilen, Dir. Sales
• Semiconductor sales: 20 years experience from Conx, SigmaGyros, AMD

18. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 18
The Deal
• Financing Objectives
— Seeking $10Mn investment for 40% of Shares
• Signed term-sheet for $5Mn
— Seeking two additional investors with (i) strong aerospace industry
contacts and (ii) MEMS industry experience
• Use of Funds
— Transfer technology to commercial foundry
— Develop integrated MEMS/Gyro products
• for storage, consumer, and communications
• for navigation
— Recruit additional engineering and management expertise
• Exit Strategy
— Build full-support component manufacturing company
— Profitable in 26 months, 15% earnings growth
— IPO in year 4 ($100Mn estimated valuation)