1. Zain Isma Bin Mohamed Lazim
Address: A-4-07, Green Villa Apartment, Taman Universiti, Sungai Tangkas,
Kajang, 43000, Selangor, Malaysia
E-mail: zainimlazim@yahoo.com or zain.mlazim@gmail.com
Phone: +6017-286-1970
Summary
Results oriented, highly driven, self-directed, and competent technical professional with multiple
accomplishments.
Recently completed “Javascript Fundamentals” online course available at Microsoft Virtual
Academy. Currently, completing “The Complete Android Developer” online course, at Udemy.com.
March 2013, completed Master’s degree, majored in information and communications technology
(ICT), focusing on telecommunications technology. Completed final paper titled, “Green Cellular
Network: Improving the Energy Efficiency of LTE-Advanced Mobile Networks”.
Completed 2-year contract as Senior Engineer at MIMOS Berhad in the product design and
development of a Wireless Precision Agriculture/Aquaculture System. Analyzed, tested, and resolved
electronic circuitry issues. Developed and improved electrochemical sensor characterization for
measuring the electrical conductivity of water, and humidity. Developed and implemented
automated calibration process. Provided technical support for wireless sensor deployment and
testing (ZigBee, Wi-Fi, HSPA, and GPRS). Also, involved in project development (technical support
and testing) of IOT Gateway utilizing ZigBee, HSPA & GPRS wireless communication.
Over 10 years of extensive hands-on experience in product design engineering and development, at
SONY EMCS (Malaysia) Sdn. Bhd. Highly experienced in applying, Design for Manufacturing and
Assembly (DFMA), Failure Mode and Effect Analysis (FMEA), Design Review, and Sony 6-Sigma.
Involved in multiple home video consumer electronics projects that are very critical of product
design quality, manufacturing yield, as well as, market defect ratio.
Achievements
• Improved water electrical conductivity sensor detection range to cover 0.2mS/cm – 60mS/cm,
instead of developing three separate water electrical conductivity sensors that measure 0.2 – 1
mS/cm, 1 – 10 mS/cm, and 10 – 60mS/cm.
• Improved in-house water salinity sensor stability by identifying root cause of instability, and
introducing method of removing manufacturing chemical residue on the Platinum electrodes
• Implemented suitable calibration and temperature compensation method for water electrical
conductivity sensor, and humidity sensor, by improving embedded firmware, circuit modification,
and continuous data analysis.
• Successfully designed a 920MHz local oscillator circuit and produced a complete mounted
printed circuit board for an RF Transceiver.
• Developed and programmed a frequency synthesizer IC using C++ Language
• Established Mount Engineering Group for managing all aspects of PCB Design to manufacturing.
This includes manpower, CAD/CAM data, prototype schedule, material selection, material cost,
development fees, design reviews, new supplier introduction, and new component registration
• Effectively lead and managed over 100 PCB design and development projects (Single layer, 2/4

2. layer CuTH, and 2 layer AgTH) from prototype to mass production, within budget and schedule
constraints.
• Consistently achieved material cost savings of approx. USD1million annually from 2005 – 2008,
through successful single layer to 4 layer CuTH PCB area reduction activities
• Implemented, PVC Free wire-harness, Halogen Free FFC, and Lead-free (Pb-free) solder to all
DVD player/recorder, two years ahead of the SONY Corporation directive
Education
Masters of Applied Science (ICT: Telecommunications Technology)
University College at the University of Denver, Colorado, USA. 2013
CGPA: 3.23/4.00
Capstone/ Final Paper: Green Cellular Network: Improving the Energy Efficiency of LTE-
Advanced Mobile Networks
Bachelor of Engineering (Electronics) with Honors (Major: Communication Engineering)
La Trobe University, Melbourne, Australia. 22 May 1998
GRADE: H2B
Final Project: Low Power Radio Frequency Network for Environmental Monitoring
Employment History
MIMOS Bhd (September 2013 – November 2015)
Senior Engineer (IET Division, Product Development department)
 Mi-Sensor TEC (water electrical conductivity sensor) & Mi-Sensor TH (Humidity sensor)
development project
• Integration of MIMOS Unified Readout module (Analogue and Digital circuit), with
MIMOS Electrical Conductivity and Humidity sensor elements, using existing
mechanical housing and existing MIMOS wireless ZigBee MOTE
• Improvement of Mi-Sensor TEC electrical conductivity detection range
• Testing, verifying, and troubleshooting, MIMOS Unified readout module (Analogue
and Digital circuit) and embedded firmware integration with Electrical
Conductivity and Humidity sensor elements
• Data collection, analysis, and reporting (Microsoft Excel and VBA)
• Identifying, testing, and verifying suitable calibration, and temperature
compensation method/process for Mi-Sensor TEC and Mi-Sensor TH
• MIMOS Unified factory (C#) software testing and verification. (This software is for
calibration, temperature compensation, and verification of Mi-Sensor TEC and Mi-
Sensor TH, during engineering testing, and manufacturing process)
• Develop, test, and implement Mi-Sensor TH calibration process automation using
UnifiedAutomata software (C#, SQLite, Web GUI)
• Testing wireless connectivity during product development testing of Mi-Sensor TEC
and Mi-sensor TH (ZigBee and Wi-Fi)
• Prepare manufacturing process documentation.
• Prepare Technical Architecture, and Technical Requirement document.
 IOT Gateway development project
• Prepare hardware test procedure document

3. • Testing IOT Gateway functionality (Test setup connection, Subnet setup, Web GUI,
Current consumption measurement)
• Testing sensor wireless connectivity to IOT Gateway units via ZigBee Mote and
Router (Range test)
• Testing IOT Gateway backhaul connectivity via GPRS and HSPA+ network, for
confirmation that the collected sensor data can be successfully sent to Mi-
Manage database server (Web GUI, MySQL)
• Setting up a public access Ubuntu VM web server via MIMOS Mi-Cloud as an
alternative database server for MIMOS sensor that uses the Unified Readout
board
• Basic VM web server maintenance via SSH client software (PuTTY)
• Trouble shoot and resolve IOT Gateway wireless connectivity problems
• Sensor serial data packet monitoring using proprietary program via SSH client
(PuTTY)
Sony EMCS Malaysia Sdn. Bhd., R&D Center (June 2013 – August 2013)
Assistant Manager (Product Design 1, TVEG)
 Model Leader for FY2014 TV model
• Assist the Project Leader and Project Manager for worldwide FY2014 Sony TV
models in managing all design activities among various groups, departments, and
divisions, that ensures a successful model production and introduction for/into
worldwide market
• Manage all sales sample set requests from SONY TV Marketing (Tokyo) through
collaboration with Sony Supply Chain Solution (Japan)
DirecTV Customer Service Inc. Colorado, USA (January 2009 – January 2010)
Customer Support Representative – DirecTV Call Centre Technical Support
• Provide over the phone technical support for DirecTV satellite TV equipment and
programming, as well as, customer assistance with billing inquiries, payments, and
disputes
Sony EMCS Malaysia Sdn. Bhd. (Dec 1997 – August 2008)
Latest title: Sr. Design Engineer (Mount Engineering Group)
 Manage mount engineering group
• Established mount engineering group (budgeting, manpower, job
responsibilities/scope, workflow/process, procedures, schedule, forms, and
documentation)
• Lead, trained and managed up to three group members (task assignments, job
allocation, training, appraisal, etc.)
• Prepare and apply annual budget for PCB CNC samples and die-tooling cost
• Prepare and apply annual budget for FFC, wire-harness, and connector sample
cost
• PCB, FFC, wire-harness, and connectors vendor introduction, negotiation, and
audit
• Issue payment instructions to vendors for samples and other fees
 Manage Printed Circuit Board (PCB) or Printed Wiring Board (PWB) design
• Design PCB for analogue, low and high-speed digital circuits, PCB arrangements

4. & PCB interconnectivity solutions (wire harness designs and Flat Flexible Cable
designs)
• Develop and optimize PCB design for manufacturing. This includes, Auto-insert
machines (chip, IC, Radial and Axial), Manual hand-insert process, DIP-bath
soldering process, Re-Flow soldering process, Point-DIP/ Spot-DIP soldering process
and set assembly process
• Design PCB shape and layout, and select appropriate material as well as,
mount/solder process
• Ensure PCB compliance towards Sony and other related International safety
standards/regulations, as well as any EMC compliance requirements
• Plan, change, and manage PWB schedule
• Organize PCB data tape-out judgment meeting with division management,
circuit block designers, and PCB CAD engineers
• Arrange and manage PWB trial runs (production and circuit confirmation)
• Deal with PWB vendors (meetings, specs, data transfer, sample quantity/delivery,
resolve problems, factory audit)
• Die-tool PCB sample approval
 Design and manage Flat Flexible Cable (FFC), Wire-harness and connector
• Collect and compile circuit design, internal device structure, and production
requirements for FFC, wire-harness and connector design
• Manage FFC, wire-harness and connector design (Designing, modifying,
determine spec and material)
• Ensure FFC, wire-harness and connector compliance towards Sony and other
related International safety standards/regulations, as well as any EMC
compliance requirements
• Plan, change, and manage FFC, wire-harness and connector schedule
• Arrange and manage FFC trial runs (production and circuit confirmation)
• Deal with FFC, wire-harness and connector vendors (meetings, specs, quotation,
sample quantity/delivery, resolve problems, factory audit)
• FFC, wire-harness and connector sample approval
 Manage design review for PCB, FFC, Wire-Harness, and connector
before/after Prototype, Trial Mass Production-1 (TMP-1), and TMP-2 events.
• Organize and schedule design review meeting with circuit designers, production
division, and quality division
• Arrange sample sets for the design review meeting
• Chair design review meeting to collect and compile design review request from
circuit designers, production division, and quality
• Review all design review requests with circuit designers, related
department/divisions, and implement design review items/requests into PCB, FFC,
wire-harness, and connectors using CAD applications.
• Feedback and verify all design review changes with requestors and related
division
• Reconfirm design reviews with trials/test runs and get more feedback
 Material Cost calculation
• Keep track of total mounted components quantity, mount process, and part kind

5. • Liaison and follow-up with respective block circuit designer engineers to complete
prototype circuit
• Collect and compile component prices from procurement database, and vendor
quotations
• Prepare report on estimated electronic components total cost of new device
minus mechanical components
• Present report findings during Mount-Concept and Design-Concept meeting
 Mount Concept meeting (Planning for Prototype stage)
• Collect and compile information regarding new device, new features, and
complete model line-up
• Identify device variations and model groups to determine the number of PCBs
required to complete new device models and their variations
• Determine PCB type, shape, size and material, according to design and
production requirements
• Calculate optimum material cost of PCBs to complete each device model
variation
• Calculate manufacturing time to complete each device model variation
• Present and report BOM (build of material/components list) tally of mounted
electronic quantity and mounted component types (Ex. Radial, axial, jumper-wire,
chip, IC, hand-mount, etc.) used for each device model
• Present and report PCB production process requirements for new device (Ex.
Reflow soldering, Dip/flow soldering, spot dip soldering, manual soldering, and
general set assembly)
Certifications & courses completed
• Sony Six Sigma green belt training program (2008)
• The 7 Habits of Highly Effective People Training Program, Franklin Covey (2003)
• Problem Solving & Decision Making Workshop, QUEST Consulting (1999)
• Failure Mode & Effects Analysis, SPC Consultants (1999)
• AEDC, 4500 EFD Design to Mass Production, Melbourne, Australia (1997)
• Auto-CAD, Bench fitting works, Lathe & Milling machine works, Malaysia (1994)
Computer skills
• Basic (<1 year): Android App development using Android Studio.
• Basic (<1 year): Java, JavaScript, jQuery, XML, HTML, CSS Programming
• Advance (>5 years): ZUKEN CR5000 (Circuit Diagram Application)
• Intermediate (> 5 years): ZUKEN Board Designer (Multilayer PCB Design Application)
• Intermediate (> 5 years): ZUKEN PWS CR3000 (Single layer PCB Design Application)
• Advance (> 5 years): Microsoft Office Applications (Excel, PowerPoint, Words & Project)
• Basic (< 1 years): C++ Programming
• Intermediate (> 5 years) knowledge in Mac OS, UNIX OS, Linux OS, and Microsoft Windows OS
• Intermediate (2 years): Wireless router management
• Basic (<1 year): Visual Basic for Applications (Microsoft Excel)
• Basic (<1 year): MySQL, SQLite
Courses completed during graduate studies (master’s degree)

6. • ICT Fundamentals
• ICT Industry Overview
• Telecom Networks
• Network Security with Lab
• TCP/IP Networks
• Broadband Wireless Networks
• Principles of Project Management
• Managing Technology for Strategic Value
• Business Forecasting & Planning
• Enterprise Architecture
Some areas covered during undergraduate studies
• RF, Microwave and Optical Transmission
• Antennas and Propagation
• Electronic Circuit Design and Development
• RF Simulation and Optimization
• C++ Programming
• SPICE

7. • ICT Fundamentals
• ICT Industry Overview
• Telecom Networks
• Network Security with Lab
• TCP/IP Networks
• Broadband Wireless Networks
• Principles of Project Management
• Managing Technology for Strategic Value
• Business Forecasting & Planning
• Enterprise Architecture
Some areas covered during undergraduate studies
• RF, Microwave and Optical Transmission
• Antennas and Propagation
• Electronic Circuit Design and Development
• RF Simulation and Optimization
• C++ Programming
• SPICE