Embedded Die Packaging: Technology and Market Trends 2017 - Report by Yole Developpement

© 2016
Embedded Die
Packaging:
Technology and Market
Trends 2016
November 2016
From Technologies to Market
Report Sample

2©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
REPORT OBJECTIVES
To provide a market overview of the Embedded Die landscape
o Emerging and declining applications
o Forecasts until 2021: Revenue, unit count
o Identify main players and provide supply chain analysis
To provide analysis of technology trends
o Technology roadmap
o Latest technical innovations
To assess the future development of the Embedded Die market
o Outlook on volume growing disruptions: new market drivers, infrastructure,
expanding business models, new entries, competing packaging solutions
o Impact on supply chain and technology roadmap

3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample

4
REPORT METHODOLOGY
Technology analysis methodology Information collection

5
REPORT OUTLINES
Part I/II
Report scope & objectives 6
• Scope of the report
• What’s new since last report ?
• Companies cited in this report
• Glossary
Executive summary 16
• Key points and take-aways
Market Drivers 31
• Advanced Packaging drivers
• Advanced packaging market status
• Advanced packaging platforms
• Technical gaps & positioning of embedded die packaging vs other
packaging platforms
• Embedded Die drivers
• Definition of embedded die
• EDTechnology segmentation
• Embedded die in substrate
• Embedded die in PCB
• Embedded die in flexible board
• Embedded interconnections in substrate
• Technology trends
Market forecasts for embedded die 63
• Market forecasts
• Market forecasts by units breakdown by markets
• Market forecasts by revenues by markets
• Market dynamics
Embedded Die Markets & Applications 74
• Market and applications matrix
• Detailed review of applications by market
• Motivations and drivers
• Rationales for adopting embedded die technology
• Cost considerations
Roadmaps 98
• Volume production technical roadmap for
• Embedded die in substrate
• Embedded die in PCB
• Embedded die in flexible board
• Challenges in embedding die for volume production
• Overview of R&D programs around Embedded Die packaging

6
REPORT OUTLINES
Part II/II
Supply chain & Commercialization 116
• Examples of commercialization of embedded die packaging
• Embedded die packaging main players mapping
• Supply chain 2016
• Key partnerships in 2016
• Challenges related to supply chain
• Embedded die ecosystems
• PCB and substrate makers new position
• Potential new entrants in the ED packaging business
Main technology review by player 133
• Key players process flows
• Focus on embedded interconnects in substrate
Conclusions 150
• SWOT analysis for embedded die packaging stakeholders
• Conclusions
• Highlight of what is coming next

7
Biography & contact
ABOUT THE AUTHORS
Emilie Jolivet
Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement
the "More than Moore" market research and strategy consulting company. She holds a master’s degree Applied Physics specialized in
Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 years
in photovoltaic business and co-authored several scientific articles. Strong for this experience, she graduated from a master in Business
Administration at IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining Yole
Développement in 2016.

8
SYNERGIESTOTHIS REPORT
Status of the Advanced
Packaging Industry 2017
January 2017
Fan-In Packaging:
Business Update 2016
November 2016
Status and Prospects for
the Advanced Packaging
Industry in China
July 2016
3D TSV & 2.5D Interconnect
for Advanced Packaging:
Technologies and Market
Trends
October 2016
Thin Wafer Processing
and Dicing Equipment
Market
August 2016
Fan-Out Packaging:
Technologies and Market
Trends
September 2016
Status of the CMOS
Image Sensor Industry
2016
June 2016
Embedded Die Packaging:
Technology and Market
Trends
November 2016
Readiness for Panel
Manufacturing
November 2015

THE 2016 EMBEDDED DIE REPORT
New content with respect to previous edition
The 1st standalone edition of Embedded Die Packaging report fromYole Développement brings:
• Focus exclusively on the Embedded Die packaging platform
• Analysis of Embedded Die technology on IC package substrate and board level
• Updated market forecasts, from 2015 to 2021
• Revised technology roadmaps, from 2015 to 2021
• Updated supply chain
• Embedded Die market dynamics and future disruptions
What’s
New?

10
SCOPE OF THE REPORT
• The industry is using the term embedded die packaging for a broad range of packaging architectures and technologies
• This report covers die embedding in laminate layers, namely IC package substrates and boards
• This report will cover all types of active die embedded in layers of laminate, focusing on products with embedded active dies
only or active dies and passives
• Within the scope of embedding in laminate, this report also covers the emerging technologies involving the embedding of
passive interconnects
• On the other hand, die embedding in mold compound is termed Fan-Out and is covered in the report « Fan-Out Packaging
2016 »
• Yole has reviewed:
 Market and applications using embedded die technology today and in the future
 Industrial and R&D players and supply chains
 Business models and its challenges
 Market forecasts
• Market forecasts will take into account embedding active dies in laminate IC package substrates, in printed circuit boards and in
flexible printed circuit boards

11
EMBEDDED PACKAGING TECHNOLOGIES
Embedded packaging technologies with connections
fanned out of the IC surface
Embedding in organic laminate
Embedding in epoxy mold compound
(Fan-OutWLP/PLP)
CHIP FIRST: CF
CHIP LAST: CL
FACE UP: FU
FACE DOWN: FD
Process type
Lamination around
the chip
Cavity dig in
substrate
Interconnections type RDL
Foundry
BEOL
Coreless
Substrate
Chip orientation
Encapsulator type
CF / CLCF / CL CL
FU / FD FU / FD
Chip placing
Scope of the Embedded die report

Leadframes
QFN,QFP
w/o IC substrates
Fan-in Fan-out
IC substrates-based
Package Substrate
(organic)
W/B BGA
Flip Chip
BGA
3DIC
Interposer
based
(Si, Glass, Org)
SiP
Embedded
die
(in substrate)
ADVANCED PACKAGING PLATFORMS
Overview of
advanced
packaging
platforms
PCB
(organic board)
Increased functionality,performance…
Interconnect:
Single die
Multiple Dies
Integration:2D 3D
Embedded die
(in substrate or
PCB)
Bumping,Pillars,Studs,Through-silicon-via,Bump-less,EmbeddedTechnologies...

13
What’s new since our last
report

WHAT’S NEW ONTHE MARKET SINCE OUR EMBEDDED DIE 2015 REPORT?
• Mobile segment is slowing down causing a ripple effect of consolidation
(M&A) throughout the semiconductor industry
• Attention turns to advanced packaging in attempt to continue the cost
reduction curve and increase functionality of devices
• Embedded Die packaging is in the initial stage of market development, in
favorable position to catch a part of the new wave
Market dynamics – WW semiconductor industry
• New semiconductor drivers are sought with R&D efforts transitioning to IoT and
automotive segments
• Higher emphasis on countries in transition in pursuit of new business opportunities,
primarily China

o Although unit growth has continued, the Embedded Die revenue has decreased from 2015 to 2016
mainly due to decline of higher value camera modules in Embedded Die packaging
o A complete recovery and upward slope is expected from 2018
o The mobile segment might still bring highest volumes and revenues, but also highest uncertainty and
competition
o Automotive and Medical segment emerge as significant opportunities for the Embedded Die platform
with highest projected growth
o The supply chain continues to mature with more participating players in preparation for new products
o New opportunities arise both for Embedding in board and IC package substrate
WHAT’S NEW ONTHE MARKET SINCE OUR EMBEDDED DIE 2015 REPORT?
Mobile
=> Mobile segment is still driving Embedded Die production, however, high uncertainty and competition leads to
Automotive and Medical segments as more stable opportunities with highest projected market growth

16
GAP IN INTEGRATED PACKAGING FOR MIDDLE AND HIGH POWER APPLICATIONS
Filled in by embedding the die in the PCB
Embedded die
packaging
already offers
solution both
for ultra-low
and middle
power
applications
POWER
(Watt)
PACKAGING
INTEGRATION
Ultra-low Low Middle High
Laminate - Embedded die package - PCB
Flip-Chip BGA
panel
wafer
WL-CSP
SMD
QFN & Leadframe (advanced, ceramic, …)
WLP (Fan-out)
3D-IC
A gap to fill in
0,01 1 1 000 100 000
Discrete/ Module
10 00010 100
TO package
Power module
Need more integration

17
Embedding
die packaging
platforms
Embedded die in
laminate (substrate)
A die packaged between
layers of laminate which is
attached to a final PCB
Embedded die in
PCB
layers of laminate forming
the final PCB
Embedded die in
flexible substrate
layers of FLEXIBLE laminate
forming the final PCB
Embedded
interconnections in
substrate
A silicon bridge is embedded
acting as die-to-die
interconnect
EMBEDDED DIE TECHNOLOGIES SEGMENTATION
Definitions
EMIB technology from INTEL
WABE technology from Fujikura
Courtesy of AT&S
ACTIVE &
PASSIVE DICE
PASSIVE
INTERCONNECT

18
KEY PLAYER’S ACTIVITY SUMMARY
Pioneers have paved the way from incubation to volume
PLAYER PRODUCTION STATUS HISTORY PCB
ASSEMBLY &
TEST
TECHNOLOGY MARKET POSITIONING
ASE (TW) middle volume
own technology but also produced for external
companies (Infineon)
internal internal aEASI Mobile, Consumers
AT&S (AT) middle volume own technology and partnered with UTAC internal UTAC ECP
Mobile, Automotive, Medical, AD and
Industry
Fujikura (JP) low volume own technology internal NA WABE Medical
General Electric (US) currently licensing
own technology and acquired Imbera and
licensed to Taiyo Yuden and Shinko
Shinko and TY Shinko and TY POL Automotive, Mobile, Consumers
Infineon (GE) middle volume outsourced to ASE own technology and partnered with ASE ASE ASE Dr Blade ICT, Automotive, Mobile, Consumers
Microsemi (US) low volume acquired Zarlink internal internal NA Medical and power electronic
Schweizer (GE) not started yet own technology internal to be determined P² Pack Automotive
Shinko (JP) high volume own technology internal internal MCeP Mobile
Taiyo Yuden (JP) high volume already proven
technology EOMIN and licensing from GE
ventures
internal internal EOMIN Mobile, Consumers
TDK-EPCOS (JP) middle volume own technology and partnered with ASE internal ASE SESUB Mobile, Consumers

19
MOTIVATIONS AND DRIVERS FOR EMBEDDING COMPONENTS
By applications
Form factor
Shorter
interconnections
Higher
components
integration
Protection
against harsh
environment
Thermal
management
Design flexibility
Wireless module
Digital and processor module
Wireless module
Lighting module
Power management module
Power management unit
Power management unit
Wireless module
Sensor module
Wireless module
Lighting module
Sensor module

20
EMBEDDED DIE MARKET
Mobile
Consumers
Information
Communication &
Technology
Automotive
Medical
A&D
and
Industry
Thanks to its diversity,
embedded die packaging
serves different markets,
which are not submitted
to the same business
cycles. Initially present in
mobile market, ED
packaging have
penetrated ICT and
medical market
demanding on customed
solutions

21
EMBEDDED DIE ACTIVITY MARKET FORECAST
Breakdown by market: revenues analysis (1/2)
• In 2021,
ED
packaging
revenues
will reach
50 million
dollars
* These revenues do not include revenues from MCeP packaging from Shinko
0
10 000 000
20 000 000
30 000 000
40 000 000
50 000 000
60 000 000
2015 2016 2017 2018 2019 2020 2021 CAGR
EmbeddedDiePackagingRevenue($)
Embedded Die Packaging REVENUE FORECAST
2015 - 2021
MOBILE CONSUMERS MEDICAL AUTOMOTIVE ICT A&D and INDUSTRY TOTAL

22
Breakdown by market: units analysis (1/2)

23
Forecasts including MCeP

24
EMBEDDED DIE MARKET AND APPLICATIONS MATRIX
MODULES
MARKETS APPLICATIONS Wireless module Power Management Sensor module
Digital & Processor
module
Lighting module
MOBILE Smartphone & Tablet x x x x
MEDICAL
Medical implants x
x
Medical wearables x
AEROSPACE AND DEFENSE
Commercial aircraft x
Military communication x
Security x x
AUTOMOTIVE Vehicles x x
CONSUMERS Wearables x x
INFORMATION AND
COMMUNICATION TECHNOLOGY
Telecommunication x
High-end computing x

25
Middle performance
component for mobile
and power electronics
for automotive
Low-end
component for
mobile market
High-end
component
available in
premium mobile
market
EMBEDDED DIE PACKAGING COST CONSIDERATIONS
Year
Packaging cost
(Assembly, Test & Yield loss)
Cooled power switch
transistor
DC-DC converter
Power
Management
2011 2016
Microprocessor
for smartphone
Cost
available
in report
$$$$$
$$$$
$

26
VOLUME PRODUCTION TECHNICAL ROADMAP FOR EMBEDDED DIE IN LAMINATE
Key parameters
2020

27
IN BOARD 2013 2014 2015 2016 2017 2018 2019 2020
Pad pitch on die 250 µm 200 µm 150 µm 120 µm 80 µm 50 µm
Nb of chips embedded 1 2*
Line/space 25/25 µm 15/15 µm
Min package thickness 800 µm 650 µm 400 µm
Copper layer thickness
(Min-Max)
Build-up layers 4 (standard app)
Max I/O numbers 40 100
VOLUME PRODUCTIONTECHNICAL ROADMAP FOR EMBEDDED DIE IN RIGID PCB
Key parameters

28
IN FLEXIBLE 2013 2014 2015 2016 2017 2018 2019 2020
Pad pitch on die 150 µm 125 µm
Number of chips stacked Stacked by folding
Line/space 50/50 µm 25/25 µm 20/20 µm
Min package thickness 800 µm 650 µm 400 µm 320 µm
Chip thickness (Min-Max) 150 – 350 µm 80 – 100 µm 30 – 80 µm
Build-up layers 4 (standard) 6 (available)
Max I/O (die) numbers 80 120
VOLUME PRODUCTION TECHNICAL ROADMAP FOR EMBEDDED DIE IN FLEXIBLE SUBSTRATE
Key parameters

29
EMBEDDED DIE PACKAGING MAIN PLAYERS MAPPING
Passives manufacturers
Substrate & PCB mnf
OSAT companies
Fabless companies
Component & IDM
Research institutes &
Governmental agencies

30
EXAMPLES OF BUSINESS ECOSYSTEM
CASE 1: OSAT as prime contractor
OSAT
Responsible for yield
& delivering final
component
Customer
(final product maker/
end-user)
Laminate &
PCB supplier
In charge of :
- SMT assembly
- product level assembly
- Singulation and final
testing
Subcontractor
In charge of :
- Final finish of wafers
(copper pads)
In charge of :
- PCB manufacturing
- Die placement
- Build-up
- Circuitization
- PCB design (optional)
In charge of :
- Die specifications
- PCB design (optional)
Wafer foundry
In charge of :
- Die design
- Wafer production
- KGD testing
- Final finish of wafers
(copper pads)

31
Chip Passives
Laminate &
board maker
OSAT
Components
& IDM
Fabless Final products End-users
EMBEDDED DIE PACKAGING SUPPLY CHAIN
Examples of commercial and development partnerships

32
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©2016 | www.yole.fr | About Yole Développement

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37
OUR 2016 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS
byYole Développement
o MEMS SENSORS
− Gas Sensor Technology and Market 2016
− Status of the MEMS Industry 2016
− Sensors for Cellphones andTablets 2016
− Inkjet Printhead Market Technology Trends 2016
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market andTechnologies 2016
− Silicon Photonics 2016
− Emerging NonVolatile Memories 2016
o IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology MarketTrends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones Robots: Market Opportunities and Technology
Evolution 2016
− Silicon Photonics 2016
o MEDTECH
− BioMEMS: Microsystems for Healthcare Applications 2016
− Point of Need Testing 2016:Application of MicrofluidicTechnologies
o ADVANCED PACKAGING
− Fan-Out WLP:Technology Trends and Business Update 2016
− Embedded Die Packaging:Technologies and Markets Trends 2016
− 2.5D 3D IC Business Update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
− Fan-in Wafer Level Packaging: Market and Technology Trends 2016
o MANUFACTURING
− Thinning Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics,
LED, CMOS 2016

38
OUR 2016 REPORTS PLANNING (2/2)
o COMPOUND SEMICONDUCTORS
− Power SiC 2016: Materials, Devices, Modules, and Applications
− GaN Modules, Devices and Substrates for Power Electronics 2016
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− GaN RF Devices Market:Applications, Players,Technology, and Substrates
2016 – 2022
− RF components and modules for cellphones 2016**
o LED
− Sapphire Applications and Market 2016: From LED to Consumer Electronics
− Thermal Management for LED and Power 2016
− LED Packaging 2016
− Microdisplays and MicroLEDs 2016**
− UV LEDs - Technology, Manufacturing and Application Trends
− OLED for Lighting - Technology, Industry and Market Trends 2016
− Automotive Lighting:Technologies, Industry and MarketTrends 2016
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and MarketTrends for Power Electronics
2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− GaN Modules, Devices and Substrates for Power Electronics 2016
− InverterTechnologies Trends Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation
2016
− Thermal Management for LED and Power 2016
− GaN RF Devices Market:Applications, Players,Technology, and Substrates
2016 - 2022
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− Stationary Storage and Automotive Li-ion Battery Packs
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers
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published in 2016.

39
OUR 2015 PUBLISHED REPORTS LIST
o MEMS SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology Market Trends
− Infrared Detector Technology Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace
Industrial
− Emerging Non Volatile Memory (NVM) Technology Market Trends
o IMAGING OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro
Diagnostic, and Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics
applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors Quantum Dots 2015: LED Downconverters for Lighting Displays
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics
applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and
LED Applications
− Emerging Non Volatile Memory (NVM) Technology Market Trends

40
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Email: laferriere@yole.fr
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Email eloy@yole.fr
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Email: onozawa@yole.fr
• Greater China: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr
• General
• Email: info@yole.fr

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Embedded Die Packaging: Technology and Market Trends 2017 - Report by Yole Developpement