12. Greater choice with a robust blade ecosystem A Full Range of 2P and 4P Blades Interconnect choices for LAN, SAN, and Scale-Out Clusters Unified Management Choice of Power Complete Services Assessment Implementation Support Server Blades Workstation Blades Storage Blades Virtual Connect LAN Ethernet NICs SAN Fibre Channel InfiniBand 4X DDR New
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16. BL860c – BL870c Comparison BL870c BL860c Up to 3 mezzanine cards Choices: 4Gb FC, IB, 4-port NIC expansion 4 Server Blades in 10U enclosure 2 Server Blades in 6U enclosure 4 SFF Hot-Plug SAS HDDs HW RAID 1 support PC2-4200 DDR-SDRAM (533 MHz) 24 Sockets 96GB max (using 4GB DIMMs) hp zx2 Up to four Intel® Itanium® 9100 Processors (Dual-Core) BL870c Up to 3 mezzanine cards Choices: 4Gb FC, IB, 4-port NIC expansion, PCIe pass thru 8 Server Blades in 10U enclosure 4 Server blades in 6U enclosure HP-UX 11i v2 and v3; OpenVMS; Linux (Red Hat and SUSE); and Microsoft Windows Integrity iLO2 Advanced Pack 4 Integrated Gigabit NICs 2 SFF Hot-Plug SAS HDDs HW RAID 1 support PC2-4200 DDR-SDRAM (533 MHz) 12 Sockets 48GB max (using 4GB DIMMs) hp zx2 Up to two Intel® Itanium® 9000 and 9100 Processors (Single- and Dual-Core) BL860c OS Support Enclosure Chipset Management Mezzanine Support Memory HDD and Controller Networking Processor
18. HP BladeSystem c-Class Unique HP innovations to meet core infrastructure challenges Energy Time Cost Change HP Thermal Logic Dynamic power and cooling provisioning to lower energy costs HP Insight Control Unified management delivers 10-fold improvements in productivity HP Virtual Connect and HP-VM Virtualization of I/O to wire-once and change datacenter connections on the fly
22. 2 ways to manage your server connections Server Server Server Server LAN SAN Server Server Server Server LAN SAN Virtual Connect
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26. Thermal Logic management Monitor actual power and cooling in the datacenter Multiple Enclosures Rack-level BTU/hr. Enclosure Inlet Air Temperature Thermal and Power Status Power Redundancy Mode Actual Power Utilization Max Available Power