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Profile / PortfolioProfile / Portfolio
Tomasz Janicki
Krakow April 2014, made for Camlin / Kalvatek, Poland
Agenda
● Profile
● Projects for Today:
 FMC ADC 130M
 AMC FMC Carrier (AFC)
 AMC CPU COM6 (ACC)
 MTCA uBackplane (uBP)
● Summary – general know-how
● Other projects not in this presentation:
 Astronomical CCD camera
 FPGA Back-End for GEM detector
 & others... Interested ???& others... Interested ???
Profile
CharacteristicsCharacteristics
● meticulousness
● reliability
● persistent
● Consultations:
- Technical specifications
- Electrical schematics,
- PCB (SI, PI, EMC - ERC/DRC)
● Designing:
- concept / spec,
- schematics,
- PCB,
- VHDL, ASM,C/C++
● Satisfaction is a must
● determined
● I still want to evolve
● Team-player, or solo
ExperienceExperience
● Technical:
- soldering,
- prototype rework,
- running prototypes
● Placing orders, cost
optimization
● Applications for funding
(Scientific circles, Creotech)
Tenzin Gyatso, Dalai Lama 14
“If a problem can be solved it will
be. If it can not be solved there
is no use worrying about it.”
http://www.dalailamaquotes.org
FMC ADC 130M
Keywords PCB, Signal Integrity,
Analog-to-digital conversion, EMC,
Microwave Office, LNLS, BPM,
Analog-Front-End, MAST
Date November 12, 2012
Co-author Tomasz Janicki - Consultant
Schematic correction,
PCB correction,
MWO SI, EM and SPICE transient
simulation/modelling
Other
authors
Grzegorz Kasprowicz,
Fernando Henrique Cardoso,
Daniel de Oliveira Tavares
Project overview Main characteristics
Four conversion channels based on differential input
LTC2208 ADC with LVCMOS digital interface
Low jitter clocking design, based on AD9510 PLL and
Si570 / Si571 oscillator
ADC's input symmetrization by Anaren's Balun or by
transformer (optional)
Power distribution network design based on uModule
LTM8021 and LDO regulators for further
analog/conversion power supply isolation
ADCs digital isolation by additional LVCMOS buffers
Sampling rate with effective 12-bit @ 130Msps with
input bandwidth of 700MHz
FMC ADC 130M
FMC ADC 130M
FMC ADC 130M
FMC ADC 130M
ADC (conversion channel) analog input matching circuit.
Default RC values and placement set according to Microwave SI, EM simulation
ADC's clock input matching circuit.
Default RC values and placement set according to Microwave SI, EM simulation
FMC ADC 130M
TOP 3D view and PCB of input matching circuit with etched ground beneath (selected white region) in order to minimize parasitic
capacitance influence. Each analog channel is isolated with grounding guards to minimize inter-channel coupling influence
FMC ADC 130M
Analog-digital power domain separation (BOT 3D view and power plane PCB desing).
Split power plane is created immediately under ADC for shortest possible current drain/return path.
Power plane is further closely sandwiched with solid (not-split) ground plane.
This creates buried capacitance with great frequency response qualities for fast current transient filtering.
AMC FMC Carrier
Keywords PCB, AMC, MTCA, uTCA, FMC,
PCIe, FPGA (Xilinx Artix), DDR3,
ADC, IPMI (NXP LPC)
Date April 05, 2013
Co-Author Tomasz Janicki
uTCA 4.0 consultant:
schematic and mechanical
PCB design author
Other
authors
Andrzej Wojeński,
Daniel de Oliveira Tavares,
Fernando Henrique Cardoso,
Grzegorz Kasprowicz
Xilinx Artix-7 200T FFG1156 FPGA
2 GB DDR3 SDRAM (32-bit interface)
2 high pin count (HPC) slots for 2 single FMC or 1
double width FMC
SPI Flash for FPGA configuration and user data
JTAG multiplexer (SCANSTA) for FMC access
Power supply for FPGA, memory, FMCs
- programmable VADJ 1.8-3.3V
White Rabbit compatible Clock distribution
Temperature, voltage and current monitoring
Mini-USB connected to the IPMI processor
SATA connector for Port2, Port3
MGT connected to FMC1, FMC2, Fat Pipe 1, Fat Pipe
2 (optional), Port0, Port1, Port2 (optional), Port3
(optional), RTM (optional)
uTCA 4.0 compatible IPMI
Short descriptionShort description
● AFC is an FMC motherboard
● Main unit is an FPGA (Artix) connected
to DDR3 bank
● FPGA purpose is data-mining, storing &
pattern recognition for off-line data
processing, and also event triggering for
on-line processing
Project overview Main characteristics
AMC FMC Carrier
Artix
FMC (HPC)
SLOT 1
FMC (HPC)
SLOT 2
DDR3
32-bit
SGMII 2
FAT PIPE 1
SGMII 1
FAT PIPE 2
SATA 2
SATA 1
CLOCKS
IPMI
JTAG
MLVDS
buffers
uC
SATA 2
SATA 1
MLVDS
AMC
Connector
CLOCK
SWITCH
Simplified connections diagram
AMC FMC Carrier
Board was designed with 12-layer stack-up. Traces width and gaps have been chosen,
with Saturn PCB tool, to obtain 55 Ohm Single-Ended impedance and 95
Ohm Differential impedance (for differential signals).
AMC FMC Carrier
AMC FMC Carrier
AMC FMC Carrier
AMC FMC Carrier
AMC FMC Carrier
DDR3 routing and length matching
AMC FMC Carrier
FMC slots routing
AMC FMC Carrier
DC/DC GND (yellow) polygon narrow connection, thus creating an
isolation for high current return paths on TOP layer, where some strategic and
more sensitive components reside.Wider GND connection is created through
vias into dedicated, not split layer beneath, This is a trade-off between controlling
current return path and solid (less ground-bouncing) GND on TOP layer.
AMC CPU COM6 (ACC)
Keywords PCB, AMC, MTCA, uTCA, PCIe,
COM EXPRESS, RTM, INTEL
Ethernet Controller
(GbE-PCIe Bridge), IPMI (LPC)
Date August 2, 2013
Co-Author Tomasz Janicki
Schematic and PCB
consultant
PCB design
Other
authors
Marcin Krzewski, Grzegorz
Kasprowicz, Adrian Byszuk,
4 USB 2.0 ports and 4 USB 3.0 porst
Type 6 COM Express module
2 eSATA ports
custom RTM / MCH connector
2 Gigabit Ethernet ports
2 Gigabit Ethernet routed to uTCA Port 0
and Port1
Mini Display / HDMI Port
mPCIe socket
IPMI compatible
Short descriptionShort description
● ACC is COM6 motherboard
● Thanks to dedicated RTM/MCH link ACC can be an AMC or RTM board
● ACC equipped with COM6 module becomes a PC data server (storing & off-line processing)
and/or uTCA crate controller.
Project overview Main characteristics
AMC CPU COM6
AMC Connector
AMC Connector
COMe
Module
Dual
USB 2.0
Dual
USB 2.0
Dual
USB 3.0
Dual
USB 3.0
SATA 1 SATA 2 HDMI 1
mPCIe
Slot
HDMI 2 VGA
GbE
1000T
RS232
PCie
USB
Clock
Buffer
CLK 0 REF 0 REF 1
CLK 1
CLK 2
CLK 4
CLK 5
CLK 6
CLK 7
REF
CLK
RTM / MCH custom connector
RTM / MCH custom connector
uC
PCIe
x4
IPMI
PCIe
x4
SGMII SGMII
i350
GbE
1000T
LPC
PCIe
x1
HDASPI
RS232
PCIe
x1
PCIe
x16
SATA
PCIe
x1
PCIe
x1
CLK PCIe
x1
JTAG CLKsP2PMLVDSSATA SATA
Simplified connections diagram
AMC CPU COM6
AMC CPU COM6
AMC CPU COM6
AMC CPU COM6
AMC CPU COM6
Board was designed with 6-layer stack-up shown in Fig 8 - traces width and gaps have
been chosen (with Saturn PCB tool) to obtain 50-55 Ohm Single-Ended impedance
and 95-105 Ohm Differential impedance for differential signals, and closely 50 Ohm
for single-ended signals.
AMC CPU COM6
AMC CPU COM6
One-layer power distribution plane. Selected white-green is digital 3.3V, rest are analog
(filtered, local) power islands. Power distribution plane has been designed to minimize the
required layers and with only couple of differential signals cross-over splits. In all-digital
design it is a typical trade-of between a number of layers and a solid reference for
impedance controlled routing.
AMC CPU COM6
Small footprint DC/DC SMPS placement - PCB space vs EMC tradeoff
uBackplane
Keywords PCB, AMC, RTM, SFP, QSFP
Date Still under development,
Schematics done April 4
Author Tomasz Janicki
Schematic and PCB
Co-
Authors
Grzegorz Kasprowicz
4 SFP+
2 QSFP+ (QSFP10)
8 SMA / LEMO MLVDS Bus
2 AMC slots
Rigid-Flex-Rigid PCB
10Mb Ethernet for management
Small form factor case, 19 inch rack
3-4U (mechanical case still under)
development
Short descriptionShort description
● uBP is a laboratory backplane for two AMC modules – used for testing 1xAFC, 1xACC setup
● uBP is possible the cheapest and fully functional (yet smallest) uTCA backplane that one can
have on the desk – made for uTCA / AMC related development
● QSFPs and/or SFPs (fiber connectivity) make uBP an interesting choice for "noisy" & space-
limited environments
Project overview Main characteristics
uBackplane
SFP1
SFP2
SFP1
SFP2
SATA
QSFP
SFP1
SFP2
SFP1
SFP2
SATA
QSFP
MLVDS
8x SMA
8x LEMO
LPC
MGT
AFC
ACC
CLK
ETH
uBackplane
AMC side
uBackplane
RTM side
uBackplane
Rigid-Flex-Rigid Stack'up
uBackplane
Clock distribution
uBackplane
Power distribution
uBackplane
uBackplane
Summary
Know-how / ExperienceKnow-how / Experience
● Converters (mostly buck)
● Fast interfaces
● Signal & Power Integrity
● EMI/EMC constrained designing
● FPGA projects
● High/Medium Density designs
● Multi-layer designs
● Analog Front-End designs
● ADC conversion techniques & parameters
● Tools:
Altium, KiCad, MWO, AXIEM, HyperLynx,
SPCIE, PADS, OrCad
● Knowledge & selection of:
 technological processes
 material parameters
 components to spec
 electronic standards:
PCIe, PCI, MTCA,
ATCA, cRIO, PXI...
● Signal processing in:
 DSP,
 FPGA
Done

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Prezentacja_Profil_Portfolio - EN

  • 1. Profile / PortfolioProfile / Portfolio Tomasz Janicki Krakow April 2014, made for Camlin / Kalvatek, Poland
  • 2. Agenda ● Profile ● Projects for Today:  FMC ADC 130M  AMC FMC Carrier (AFC)  AMC CPU COM6 (ACC)  MTCA uBackplane (uBP) ● Summary – general know-how ● Other projects not in this presentation:  Astronomical CCD camera  FPGA Back-End for GEM detector  & others... Interested ???& others... Interested ???
  • 3. Profile CharacteristicsCharacteristics ● meticulousness ● reliability ● persistent ● Consultations: - Technical specifications - Electrical schematics, - PCB (SI, PI, EMC - ERC/DRC) ● Designing: - concept / spec, - schematics, - PCB, - VHDL, ASM,C/C++ ● Satisfaction is a must ● determined ● I still want to evolve ● Team-player, or solo ExperienceExperience ● Technical: - soldering, - prototype rework, - running prototypes ● Placing orders, cost optimization ● Applications for funding (Scientific circles, Creotech)
  • 4. Tenzin Gyatso, Dalai Lama 14 “If a problem can be solved it will be. If it can not be solved there is no use worrying about it.” http://www.dalailamaquotes.org
  • 5. FMC ADC 130M Keywords PCB, Signal Integrity, Analog-to-digital conversion, EMC, Microwave Office, LNLS, BPM, Analog-Front-End, MAST Date November 12, 2012 Co-author Tomasz Janicki - Consultant Schematic correction, PCB correction, MWO SI, EM and SPICE transient simulation/modelling Other authors Grzegorz Kasprowicz, Fernando Henrique Cardoso, Daniel de Oliveira Tavares Project overview Main characteristics Four conversion channels based on differential input LTC2208 ADC with LVCMOS digital interface Low jitter clocking design, based on AD9510 PLL and Si570 / Si571 oscillator ADC's input symmetrization by Anaren's Balun or by transformer (optional) Power distribution network design based on uModule LTM8021 and LDO regulators for further analog/conversion power supply isolation ADCs digital isolation by additional LVCMOS buffers Sampling rate with effective 12-bit @ 130Msps with input bandwidth of 700MHz
  • 9. FMC ADC 130M ADC (conversion channel) analog input matching circuit. Default RC values and placement set according to Microwave SI, EM simulation ADC's clock input matching circuit. Default RC values and placement set according to Microwave SI, EM simulation
  • 10. FMC ADC 130M TOP 3D view and PCB of input matching circuit with etched ground beneath (selected white region) in order to minimize parasitic capacitance influence. Each analog channel is isolated with grounding guards to minimize inter-channel coupling influence
  • 11. FMC ADC 130M Analog-digital power domain separation (BOT 3D view and power plane PCB desing). Split power plane is created immediately under ADC for shortest possible current drain/return path. Power plane is further closely sandwiched with solid (not-split) ground plane. This creates buried capacitance with great frequency response qualities for fast current transient filtering.
  • 12. AMC FMC Carrier Keywords PCB, AMC, MTCA, uTCA, FMC, PCIe, FPGA (Xilinx Artix), DDR3, ADC, IPMI (NXP LPC) Date April 05, 2013 Co-Author Tomasz Janicki uTCA 4.0 consultant: schematic and mechanical PCB design author Other authors Andrzej Wojeński, Daniel de Oliveira Tavares, Fernando Henrique Cardoso, Grzegorz Kasprowicz Xilinx Artix-7 200T FFG1156 FPGA 2 GB DDR3 SDRAM (32-bit interface) 2 high pin count (HPC) slots for 2 single FMC or 1 double width FMC SPI Flash for FPGA configuration and user data JTAG multiplexer (SCANSTA) for FMC access Power supply for FPGA, memory, FMCs - programmable VADJ 1.8-3.3V White Rabbit compatible Clock distribution Temperature, voltage and current monitoring Mini-USB connected to the IPMI processor SATA connector for Port2, Port3 MGT connected to FMC1, FMC2, Fat Pipe 1, Fat Pipe 2 (optional), Port0, Port1, Port2 (optional), Port3 (optional), RTM (optional) uTCA 4.0 compatible IPMI Short descriptionShort description ● AFC is an FMC motherboard ● Main unit is an FPGA (Artix) connected to DDR3 bank ● FPGA purpose is data-mining, storing & pattern recognition for off-line data processing, and also event triggering for on-line processing Project overview Main characteristics
  • 13. AMC FMC Carrier Artix FMC (HPC) SLOT 1 FMC (HPC) SLOT 2 DDR3 32-bit SGMII 2 FAT PIPE 1 SGMII 1 FAT PIPE 2 SATA 2 SATA 1 CLOCKS IPMI JTAG MLVDS buffers uC SATA 2 SATA 1 MLVDS AMC Connector CLOCK SWITCH Simplified connections diagram
  • 14. AMC FMC Carrier Board was designed with 12-layer stack-up. Traces width and gaps have been chosen, with Saturn PCB tool, to obtain 55 Ohm Single-Ended impedance and 95 Ohm Differential impedance (for differential signals).
  • 19. AMC FMC Carrier DDR3 routing and length matching
  • 20. AMC FMC Carrier FMC slots routing
  • 21. AMC FMC Carrier DC/DC GND (yellow) polygon narrow connection, thus creating an isolation for high current return paths on TOP layer, where some strategic and more sensitive components reside.Wider GND connection is created through vias into dedicated, not split layer beneath, This is a trade-off between controlling current return path and solid (less ground-bouncing) GND on TOP layer.
  • 22. AMC CPU COM6 (ACC) Keywords PCB, AMC, MTCA, uTCA, PCIe, COM EXPRESS, RTM, INTEL Ethernet Controller (GbE-PCIe Bridge), IPMI (LPC) Date August 2, 2013 Co-Author Tomasz Janicki Schematic and PCB consultant PCB design Other authors Marcin Krzewski, Grzegorz Kasprowicz, Adrian Byszuk, 4 USB 2.0 ports and 4 USB 3.0 porst Type 6 COM Express module 2 eSATA ports custom RTM / MCH connector 2 Gigabit Ethernet ports 2 Gigabit Ethernet routed to uTCA Port 0 and Port1 Mini Display / HDMI Port mPCIe socket IPMI compatible Short descriptionShort description ● ACC is COM6 motherboard ● Thanks to dedicated RTM/MCH link ACC can be an AMC or RTM board ● ACC equipped with COM6 module becomes a PC data server (storing & off-line processing) and/or uTCA crate controller. Project overview Main characteristics
  • 23. AMC CPU COM6 AMC Connector AMC Connector COMe Module Dual USB 2.0 Dual USB 2.0 Dual USB 3.0 Dual USB 3.0 SATA 1 SATA 2 HDMI 1 mPCIe Slot HDMI 2 VGA GbE 1000T RS232 PCie USB Clock Buffer CLK 0 REF 0 REF 1 CLK 1 CLK 2 CLK 4 CLK 5 CLK 6 CLK 7 REF CLK RTM / MCH custom connector RTM / MCH custom connector uC PCIe x4 IPMI PCIe x4 SGMII SGMII i350 GbE 1000T LPC PCIe x1 HDASPI RS232 PCIe x1 PCIe x16 SATA PCIe x1 PCIe x1 CLK PCIe x1 JTAG CLKsP2PMLVDSSATA SATA Simplified connections diagram
  • 28. AMC CPU COM6 Board was designed with 6-layer stack-up shown in Fig 8 - traces width and gaps have been chosen (with Saturn PCB tool) to obtain 50-55 Ohm Single-Ended impedance and 95-105 Ohm Differential impedance for differential signals, and closely 50 Ohm for single-ended signals.
  • 30. AMC CPU COM6 One-layer power distribution plane. Selected white-green is digital 3.3V, rest are analog (filtered, local) power islands. Power distribution plane has been designed to minimize the required layers and with only couple of differential signals cross-over splits. In all-digital design it is a typical trade-of between a number of layers and a solid reference for impedance controlled routing.
  • 31. AMC CPU COM6 Small footprint DC/DC SMPS placement - PCB space vs EMC tradeoff
  • 32. uBackplane Keywords PCB, AMC, RTM, SFP, QSFP Date Still under development, Schematics done April 4 Author Tomasz Janicki Schematic and PCB Co- Authors Grzegorz Kasprowicz 4 SFP+ 2 QSFP+ (QSFP10) 8 SMA / LEMO MLVDS Bus 2 AMC slots Rigid-Flex-Rigid PCB 10Mb Ethernet for management Small form factor case, 19 inch rack 3-4U (mechanical case still under) development Short descriptionShort description ● uBP is a laboratory backplane for two AMC modules – used for testing 1xAFC, 1xACC setup ● uBP is possible the cheapest and fully functional (yet smallest) uTCA backplane that one can have on the desk – made for uTCA / AMC related development ● QSFPs and/or SFPs (fiber connectivity) make uBP an interesting choice for "noisy" & space- limited environments Project overview Main characteristics
  • 41. Summary Know-how / ExperienceKnow-how / Experience ● Converters (mostly buck) ● Fast interfaces ● Signal & Power Integrity ● EMI/EMC constrained designing ● FPGA projects ● High/Medium Density designs ● Multi-layer designs ● Analog Front-End designs ● ADC conversion techniques & parameters ● Tools: Altium, KiCad, MWO, AXIEM, HyperLynx, SPCIE, PADS, OrCad ● Knowledge & selection of:  technological processes  material parameters  components to spec  electronic standards: PCIe, PCI, MTCA, ATCA, cRIO, PXI... ● Signal processing in:  DSP,  FPGA
  • 42. Done