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pcb line machine.pdf

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pcb line machine.pdf

  1. 1. PCB prototyping
  2. 2. • The PCB stands for printed circuit board, PCB is a thin chip created by compound epoxy, glass-fiber, or laminated different substances. There are many current-carrying ways are designed on the chip, which is used different components like resistor, capacitors, a transistor with each other and current flows to these components through printed ways paths
  3. 3. Types of PCB
  4. 4. • The company Bungard Elektronik was founded on January 11, 1961 by Heinz Bungard in Leverkusen. Heinz Bungard's business idea of ​​photo-coated boards soon became known worldwide. In the meantime, Bungard Elektronik has become a full-fledged manufacturer of industrial grade prototype circuit boards and small batches, including all machinery, raw materials and consumables. From the rivet to the turnkey laboratory for small series, you will find all products around the printed circuit board. 58 Years of experience 65 Countries 23000 End customers
  5. 5. General specs PCB fabrication line • Min track width ≥ 150µm • Min track- track clearance ≥ 150µm • Min via diameter :300µm • Max effective Pcb dimension :30*40 cm • Max number pf layer 6 up to 12 • Finishing : green mask and legand
  6. 6. Etched circuit boards process • Step 1: Data preparation • Step 2: artwork production • Step 3: CNC drilling • Step 4: Brush cleaning • Step 5: Galvanic plating through hole • Step 6: brush cleaning • Step 7: Laminating of tenting resist • Step 8: Vacuum exposure • Step 9: wet process • Step 10: Surface Finishing
  7. 7. Step 1 ;Data preparation: IsoCam PRO 5.0, CAM software for mechanical etching and prototyping • Check data(With IsoCAM you can import Gerber, HP/GL and drilling data and move, mirror, rotate and edit individual elements or entire layers). • Covert(The Aperture List and the Tool Rack can be edited, saved and logged. An integrated converter allows these tables to be read in automatically ) • Isolation milling (A full isolation milling program is integrated in IsoCAM. It takes into account the width of two different gravers and can also create copper-free areas).
  8. 8. Step 2: artwork production Photo plotter Film star • construction: film is fixed on a rotating drum, highly focused red light laser diode, stepper motor with worm and gear drive • Data :are either transferred via USB cable from computer to the plotter oru directly bye USB stick • Data formats: Gerber, Extended Gerber, Hi-Res BMP Extent of delivery: Photoplotter and Software on CD System requirements: Windows XP / Windows 7 / Windows 8 • Size: - small: Max. film size: 250 x 380 mm - default : Max. film size: 390 x 380 mm - XL: Max. film size: 380 x 460 mm
  9. 9. CCD/2-Eco Working area: 270 x 325 x 38 mm CCD/MTC Work area: 270 x 325 x 38 mm ATC=automatic tool change Work area: 325 x 495 x 38 mm CCD/2/ATC Precision Working area: 270 x 325 x 38 mm CNC premium Working area 400x500mm (Z-max: 64mm) Tool change: semi- automatic 99 tools RPM range: 5,000 - 35,000 Range of RPM: 5.000 - 63.000 Tool diameter: 0.1 mm – 3,175 mm Range of RPM: 5.000 - 63.000 Tool change: 16 RPM range: 5,000 - 63,000 Travel speed: 1 – 7000 mm/min Tool diameter: 0.1 mm – 3.175 mm RPM range100,000 rpm 300 watt spindle Tool diameter: 0.1 mm – 3.175 mm Resolution: 0.01 µm Resolution: 0,01 µm Resolution: 0,01 µm Resolution: 0.01 µm resolution: 0.01 µm
  10. 10. CNC Accessories for CNC Premium
  11. 11. Brush cleaning RBM 300 RBM 402 Dimensions (LxWxH): 760 x 590 x 415 mm Board thickness (rigid boards only): 0,3 - 3 mm Brushing speed: 1360 RPM Board thickness (rigid boards only): 0.3 - 5mm Board sizes max.: 400 mm x endless Brushing speed: 1360 rpm
  12. 12. Through hole plating Mechanical through-plating • favourite chemical-galvanic through-plating • HitecPlate 2030 + 3040
  13. 13. Hitec plating optional process • tinning (subtractive technique) • Desmear, Blackening • chemical tin • Organic protective layer (OSP) • Electroless nickel/gold or • Stripper negative resist Hitec Adv. • safety tub • exhaust hood • vibration device • anode kit • chemicals • board holder • Filters for galvanic baths • Ion exchange systems for sinks • Foot switch for spray sink • Changing the pool size according to the required work surfac
  14. 14. Laminating of tenting resist RLM is a dry film laminator • Board thickness: 0.3 – 5 mm • Board size: min 50 x 50mm; max. 450mm x endless • Resist tension: adjustable • Lamination pressure: adjustable
  15. 15. Vacuum exposure The Eurolux LED Precision The EXP 3040 LED vacuum exposure unit for single-sided contact exposure of photo-coated base material LED grid exposure Exposure area approx. 250x380 mm High speed double sided exposure machine mainly designed for high resolution production of printed circuit boards, stencils and clichés in small and medium quantities ! Two special 50 W LED bulbs ensure almost parallel light. Max. Working area 300 mm x 400 mm)
  16. 16. Hellas EXP 8000/EXP 1200 high speed double sided exposure machine mainly designed for industrial production and equipped with two 4000 W mercury halide lamps Max. Working area 600 mm x 600 mm (recommended: 400 mm x 500 mm) Hellas 1S Hellas 2S Hellas 1S XL Hellas 2S XL •Maintenance free vacuum (>60%) with gauge display, 1380 l/hour continuous rating Vacuum exposure
  17. 17. wet process Horizontal technology • DL 500 • Sprint (3000/4500/6000) series Vertical technology • Splash/Splash XL • Splash Center/Splash Center XL • Jet 34 d • Titan 3500 • twin jet
  18. 18. Horizontal technology DL 500 is a double sided conveyorised spray etching machine with integrated rinsing zone. Etching format: 510 mm x endless Double sided etching with 4 x 14 flat jet nozzles Line definition down to 35 µm lines and spaces on 18 µm copper The Sprint (3000/4500/6000) series is made for double sided PCBs conveyorized spray etching. Suitable for all acid and alcaline etchants. with line resolution down to better than 0,1 mm. Additional rinsing sections possible
  19. 19. Vertical technology Titan 3500 • The inside of the special nozzles is designed in such a way that the full spray cone hits the rotating substrate with a twist. During the etching process, • Max. plate size: 350 mm x 350 mm Dimensions Jet 34d • Maintenance-free spray-etching system with self-cleaning nozzle openings • Line resolution better than 0.1 mm • Loading via large, front opening flap with safety switch • Maximum board format = 300 x 400 mmEtching time pre-selection to the second via digital timer (0- 99 minutes) with countdown, auto-reset and end signal function
  20. 20. Vertical technology Splash/Splash XL • maintenance-free spray etching system with special full jet nozzles • Resolution 0.1 mm • maximum etching format 210 x 300 mm (Splash XL 300 x 400 mm) Splash Center/Splash Center XL • Laboratory spray etching device with standing sink + spray sink, integrated developer bath, a reserve tank (e.g. for immersion tin) and squeeze drying. • For example, a typical workflow is to etch in tank 1 (spray chamber), rinse in tanks 2 and 3, develop in tank 4 (with circulating pump) and tin in tank 5. • Resolution 0.1 mm • Etched format: 210 x 300 mm Capacity : 1 x 23 L + 1 x 12 L + 3 x 8 L • Etched format for XL: 300 x 400 mm Capacity : 1 x 35 L + 1 x 22 L + 3 x 15 L
  21. 21. The RMP 210 and RMP 3545 multilayer presses RMP 210 • Plate size: gross: 250 x 350 mm, net: 210 x 300 mm Pressure: > 12 t RMP 3545 • Plate size: gross: 350 x 450 mm, net: 300 x 400 mm Pressure: > 24 t The production of multilayers in this plant takes place in the following steps: •Pinning and inserting the prepreg stack •pressure generation •Switching on the heating •heating cycle •Press cycle at target temperature •cooling cycle •Removing the multilayer
  22. 22. Hitec success stories
  23. 23. ‫االلكترونيات‬ ‫بحوث‬ ‫معهد‬ ‫معمل‬
  24. 24. ‫للمعمل‬ ‫الديب‬ ‫هشام‬ ‫والدكتور‬ ‫الوزير‬ ‫سيادة‬ ‫افتتاح‬ ‫من‬ ‫صور‬
  25. 25. Scan Cad inspection system in ERI
  26. 26. Thank You

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