This candidate has over 20 years of experience in quality engineering and manufacturing roles within the semiconductor industry. Most recently, they managed customer expectations for machined metal components and ensured quality processes were followed. They have experience supervising engineers, auditing operational procedures, and increasing productivity. Previously, they conducted investigations and root cause analysis after catastrophic losses. The candidate also has experience in logistics, supplier communications, and process engineering with global travel to customer sites.

1. Summary
Most recently, as Senior Quality Eng. managed customer expectations for machined metal
components & subassemblies used in the semiconductor wafer Mfg. industry. Including
metrology, processing & testing of Anodize, Alodine & Plasma coated processed 6061 T6
Aluminum (including aluminum alloy variants – sheet, plate, cast, forged). Other metals - SST,
Titanium, Bronze. Plastics - Delrin, Vespel & semiconductor films. Offering solid experience in
Global Quality Manufacturing (domestic & off shore) and Test Engineering (1st
& sub-tier).
Competently assigning and auditing operational procedures for improvement as well as providing
solutions successfully increasing daily productivity and efficiency.
Previously, logistics specialist for investigations & root cause analysis due to catastrophic
loss. Additionally, supplier communications data base administrator for capitol equipment Eng.
and Mfg. I am a results driven professional, offering excellent experience supervising engineers
and engineering processes. With extensive background at global locations including training and
applications in the technical fields of electronic design, test engineering and quality process
control. Global travel to customer locations to oversee the receipt, installation and start-up of
multimillion dollar production systems (capital equipment) ensuring both equipment and process
meet the customer needs and expectations, through Process Engineering. Successfully worked in
more than a dozen different semiconductor fabrication facilities around the world, verifying proper
delivery and assembly of highly-expensive equipment, through field management.
Summary 16B (21 September 2016)