Accelerating Innovation from Edge to Cloud

Supermicro’s Edge-to-Cloud
AI/ML/DL Overview
David Nielsen
Sr. IoT/Embedded System Product Manager
davidn@supermicro.com
March 15, 2022

Agenda
• Supermicro at the Edge
• Edge-to-Cloud Digital Transformation
• AI/ML/DL & Benchmarking
• Management Tools
• New Products to Meet the Challenge
Better Faster Greener™ © 2022 Supermicro
2
2/1/2022

Old “Embedded” world IT World
Intelligent Edge
Standalone servers
Bare metal operating
systems
Lots of COTS product choices
Lightweight
DevOps
Low-cost architecture
and components are
supported
Evolved from IT world
Evolved from OT world
Cloud native
Hyperscale
Virtual Machines
Containers
No scale-out
Limited application
choices - niche products
Support for Realtime
workloads
Enterprise-grade hardware
expected
Autonomic management
Redundant distributed storage
Automatic failover
Scale-out architecture
Zero touch deployment
Programmatic management (APIs)
IT meets OT at the Intelligent Edge
Adapting the best technologies from datacenter and the cloud to the OT environment

Market Vertical Focused Solutions
3/15/2022 4
Retail/Restaurants
Transportation & Smart City
Energy & Power
HealthCare & Telemedicine
Oil & Gas Production
vNetwork Functions
Private 5G/LTE
Industry 4.0

2/1/2022 Better Faster Greener™ © 2022 Supermicro
5
Remote DC
Regional DC
Central Office /
Edge Cloud
Network Edge
Network-
Optimized
2-5ms
<1ms/Realtime <10ms <20ms >50ms
Customer
Premises
Edge-Optimized ML/Analytics/Archive
Resource Management
Edge DC
CPE
Edge
Platforms
Enabling Edge to Cloud

Edge Appliance Prerequisites
Self Healing and Resiliency at the Edge
Edge Systems are remotely managed and unmanned.
Provides low latency and high throughput delivery for
VM’s & Containers – some of which are expected to be
up 99.9999% of the time
Automation / AI / ML
The use of GPU technology to enhance the
responsiveness of issues, policy and real-time analytics.
Built in AI for container and vNF management is
becoming a critical requirement
Cloud native approach and DevOps enablement
Service Providers & NFV vendors are driving a cloud
native approach. Service providers acknowledge the
evolvement of software in every part of the network
allowing cloud-based automation for infrastructure
deployment, operations and VM/Container
management.
Role of Open Software and Hardware Architectures
Open Architectures for software and hardware
infrastructure to develop, deploy and manage vNFs,
containers and APIs for services – enablement of
multiple, integrated partners
providing guidance and standards for delivery.
6

SCMI Edge Portfolio
Small
(Atom/Core)
Large
(Single Socket Core / Xeon-SP
1 - 3 GPU/VPU & I/O options)
X-Large
(Dual Socket Xeon-SP
3 or more GPU/VPU)
vNF
Workloads
Throughput
SYS-220HE
SYS-E403P
SYS-110P
SYS-5019A
✔ Built for Net/Comms
✔ 2x workloads
✔ Power Needs
✔ Increased internal
connections
✔ Redundancy/HA
✔ Expandability
✔ Flexible
✔ Rackmount or
standalone
✔ NEBS and harsher
certifications
✔ Cost Effective
✔ Enterprise driven
✔ Normalized
Workloads
✔ uCPE & Intel Select
solutions
✔ SMB capable
✔ Lower power
consumption Minimal Port / Throughput Maximum Port / Throughput
SYS-E50/100/302
Medium
(Single Socket Core / Xeon-D
1 GPU/VPU & I/O options)
SYS-510D
SYS-210SE
7

Micro-Datacenters w/ Liquid Immersive cooling
3/15/2022 8
Low Latency
AI Driven
Micro-Datacenter

• Momentum into Wireless & High Throughput
• Merging of common elements for heavy workloads
• Whitebox H/W & Open SW Architectures
• Increased use of AI
• Network Architecture for Edge-to-Cloud platforms
• Distributed Automated, Self Healing/Managing Intelligent platforms
• “Killer-Apps” driving the need for increased AI/ML/DL based systems
Market Evolution Snapshot
Key Market Opportunities
System integration, consolidation of hardware, exponential application
deployment, higher-need agile partners
9

Edge Service Delivery (GPU/CPU/FPGA)
HCI
Edge
Compute
Resolution
Media
Transformation
Private
Networking
Edge
Broadcasting
Compute
Transcoding
User
Requests
Content
Proactive
Caching
Transparent
Caching
Big Data
Sensor
Data
WebTv/Video
Video Communication
Flickr
Text2Speech
Speech2Text
Video2Text
Translation
SASE
Dedicated Routing
Enterprise Networks
Social Events
Local Aides
Alerts
GPS
Cryptography
Cloudlets
VoIP
Video
Audio
Proximity Proof
Geolocation
Bandwidth Indication
Augmented Reality
Face Recognition
Site Recognition
Edge Based CDN
Geo Information
Preloading
Distributed Database
Proximity Caching
Car2Car
RAN Data
Monitoring
IoT
Local Connectivity
Edge Content
Delivery
10
Offloading Aggregation
Content Scaling Augmentation

High Level View of AI / ML / DL
11

Edge Inferencing – What is it?
• Enabling the edge data gathering device to provide
actionable intelligence using Artificial Intelligence
(AI) techniques.
• Using multiple combined sensor input of large
volumes of data is extracted and analyzed using AI
with a trained neural network.
• Platform requires sufficient computing capacity to
run an optimized AI model at the point of data
capture and this is referred to as ‘Inference at the
Edge’.
• Accelerates the OODA loop so that actions can be
taken much more quickly.
• How it is Achieved: Inference requires a pre-trained
deep neural network model which is trained by
feeding as many data points as possible into a
framework to provide the best possible accuracy.
• Typical frameworks that are used as the basis of
these deep neural network models include:
Tensorflow, MxNet and Caffe.
12

Seven Patterns of AI
13
Goal driven output & analytics

https://devcloud.intel.com/edge/
• Prototype on the latest hardware and
software to future proof your solution
• Benchmark your customized AI
application
• Run AI applications from anywhere in the
world
• Reduce development time and cost
Using X86 based AI OpenVINO SDK
14
• OpenVINO - SDK From Intel
• Runs on key X86 CPUs
• HW Acceleration from Movidius
• Continued enhancements of AI on each release of CPU
Intel® DevCloud for the Edge
A development sandbox to try AI and vision
workloads remotely before purchasing Intel®
platforms

SMCI AI Ready Solutions
15
HPC/AI/Edge Testing, Certification & Benchmarking

ML Perf Benchmarking
16
GPU certified systems URLs on NVIDIA website
https://docs.nvidia.com/ngc/ngc-ready-systems/index.html
https://www.nvidia.com/en-us/data-center/resources/vgpu-certified-
servers/
https://www.nvidia.com/en-us/data-center/data-center-gpus/qualified-
system-catalog/
https://docs.nvidia.com/ngc/ngc-deploy-on-premises/nvidia-certified-
systems/index.html

AI in Action – Partner Solutions
17
Personalization
Vision AI
AI Voice Interaction
Lidar
Smart Transportation
Lidar Traffic
Analysis
SmartEdge MEC
Augmented
Reality
Multi-Purpose
CDN

SuperCloud Composer
• SW Defined Data Center Redfish API & Web Mngt
Interface
• Intelligent Data Center Management for day-to-day
operations
• Composable Disaggregated infrastructure
• Multi-Rack Architecture and Orchestration of dynamic
resources
• Brick and mortar Server Health, Monitoring and Alerting
Mngt
• Pooled PCI-E NVMe (GPU/FPGA)
• Pooled NVMe (GPU/FPGA) over Fabric
• OS Provisioning / Fast Deploy
• Advanced Out of Band Telemetry and Analytics
• Application & Service-Level High Availability
3/15/2022 18
www.supermicro.com/en/solutions

New Supermicro Edge Products
19

3/15/2022 20
20
SYS-210SE-31D/SYS-210SE-31A
SuperEdge Series, 2U 3-Node, Intel® Ice Lake-SP Front Access Short Depth Server
Processor
Intel® Xeon® Ice Lake Scalable Processors up to 205W TDP, single
socket
Memory Capacity
8x DIMM slot, DDR4 3200MHz 3DS ECC RDIMM or LRDIMM
Support Intel® Optane™ Persistent Memory 200 Series
Expansion Slots
2x PCIe 4.0 x16 FHHL
1x PCIe 4.0 x16 HHHL
I/O Ports
1x GbE Mgmt RJ45, NCSI support (share NIC)
1x KVM dongle (output 1x VGA, 1x COM, 2x USB 2.0 through KVM
cable)
Storage
2x PCIe 4.0 x4 M.2 M-key 2280/22110, with RAID (by Intel® VROC)
Security
1x on board TPM and 1x TPM header, HW Root of Trust
1
2
C
D
4
5
Motherboard: X12SPED-F
Chassis: CSE-SE201
Dimension: W17.7” x D16.9” x H3.5” (449mm x 430mm x 88mm)
6
16.9” (430mm) chassis depth, fits in 600mm deep cabinet
Front hot-swappable Nodes with single CPU socket and 8 DIMM design
Front access IO design, and tool-less serviceability
Redundant power supply units with DC and AC options
Carrier Grade (NEBS Level 3) compliance
3rd Gen Intel® Xeon® Ice Lake Scalable Processors, up to 205W, single socket
2x PCIe 4.0 x16 FHHL slots and 1x PCIe 4.0 x16 HHHL slot per Node
2x M.2 M-Key 2280/22110 per node
Key features
Applications
Telecom, C-RAN(vRAN), 5G Open-RAN, 4G vBBU, Edge Datacenter,
Enterprise Edge Computing, Flex-RAN, Multi-Access Edge Computing (MEC)
System Form Factor 2RU Rackmount, 3 hot-swappable CPU
Nodes
System Cooling 4x 4056mm Counter Rotation Fans per Node
Power Supply 2000W DC or 2000W AC Redundant PSU
System Operating Environment
General application: 0°C to 40°C (up to 205W TDP)
NEBS criteria: -5°C to 55°C (up to 185W TDP)
CPU Node Specification
3
B
A

Product Specifications
Form Factor 2U Rackmount
Chassis: CSE-217HQ+-000NBP4
Dimension
(Wx H x D)
438 x 88 x 730mm (W x H x D)
Node/Sled 4 x Hot-swappable 1U CPU Node
Storage 24x 2.5” Hot-swap SATA Drive Bays (6 bays per Node)
System Cooling 4 Heavy duty 8cm PWM fans with optimal fan speed
control
Power Supply 2000W 1+1 Redundant Power Supplies
DC PSU: PWS-2K03D-1R
AC PSU: PWS-2K04A-1R
Operating & Non-
operating
Temperature
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Certification EMC: CE/FCC/VCCI/RCM/NEBS
Safety: CB/UL/CUL
3/15/2022 21
Design features
• 2U4N server DC 2000W redundant and rear access PSU
• Single Intel ICX socket P support up to 270W
• Front hot-swappable 2.5” HDD tray, rear hot-swappable nodes
• Rear access l/O design, and tool less serviceability
• AC/DC Redundant power supply units
SYS-210TP-HPTR / SYS-210TP-HPTRD
2U 4-Node, Intel® Ice Lake-SP Rear Access DU Server

22
Processor
Intel Ice Lake Xeon D-1718IT, 2.6GHz, 46W, 2933MHz/D-1736NT,
2.7GHz, 67W, 2667MHz, QAT 20G
Memory Capacity
DDR4 2933Mhz 2 channels, 4 slots RDIMM/UDIMM (ECC&non ECC) up to 256GB
Expansion Slots
1 x M.2 B-Key (3042/3052/2280) & Nano SIM Slot
1 x M.2 M-Key (2280)
1x M.2 E-Key (2230)
I/O ports
1x VGA
2x USB 3.0 Slots
4x 1GbE LAN Ports
2x 25G SFP28
1x Dedicated IPMI Port
Storage
2.5“ SSD/HDD
M.2 M-Key (2280)
Mounting Options
Wall Mount
Power Supply
Lockable 150W DC Power Adapter
Operating Temperature
0°C - 40°C
1
2
3
4
5
6
7
• Intel Ice Lake Xeon D-1718T 10MB 4c 46W 2.6GHz/ D-1736NT 15MB 8c 67W
2.7GHz QAT 20G
• Up to DDR4 2933MHz 256GB RDIMM or 128GB UDIMM
• 2x25G SFP28, 4x 1GBase-T LAN, 1x IPMI LAN, 1x VGA, 2x USB3.0
• 2x SATA 2.5” Storage, 1x M.2 B-Key (3042/3052/2280), 1x M.2 M-Key (2280)
• 0°C-40°C Operating Temperature
Key features
Applications
1x VGA
2x USB 3.0
1x M.2 B-Key &
Nano SIM Slot
1x M.2 M-Key
1xM.2 E-Key
Network Appliance, Retail, Industrial Automation,
Artificial Intelligence, Machine Learning
Intel Xeon D-
1718T 4C 46W/ D-
1736NT 8C 67W
4x 1GbE
2x 10GBase-T
1x IPMI
2x SFP+
2x 2.5” Storage
8
Motherboard: X12SDV-4C/8C-SP6F
Fanless Chassis: CSE-E302iL
Dimensions: W:10.5” x D:7.5” x H:3.5”
FRONT
VIEW
REAR
VIEW
SYS-E302-12D
Intel® Xeon D Fanless Embedded System

23
SYS-E300-12D-4C/8C/10CN6P
Intel® Ice Lake-D Mini-1U Super Server
Processor
Intel® Xeon D Ice Lake LCC SoC Processor,4/8/10 Cores, 25W/50W/88W
Memory Capacity
4 DIMM slot,
DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC
Expansion Slots
1 x PCIe 4.0 x 16
1 M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280
1 M.2 E-Key PCI-E 3.0 x1, 2230
1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042
I/O ports
1 x IPMI dedicated LAN
4 x GbE ; 2 x 25G SFP28
2 x USB 3.0 type A
1 x VGA
Drive Bays
1 Internal 2.5" drive bays
Power Supply
150W AC Power Adapter
System Cooling
3x 40x28mm 4pin FAN
1
2
3
4
5
6
Motherboard: X12SDV-4C/8C/10C-SP6F (Flex-ATX 9” x 7.25”)
Embedded Server Box Chassis: CSE-E300
System WxDxH : 10”x8.9”x1.7” or 254x226x43 mm.
7
Key features
Applications
Retail Application, Firewall, Gateway, uCPE
1 VGA
PCIe 4.0 x16
M, B, E-Key
M.2
Xeon-D SoC
4/8/10C
4x GbE LAN,
2x 25G SFP28
1 x IPMI
Dedicated LAN
1 x 2.5”
SATA SSD
Intel® Xeon D Ice Lake 4/8/10 Cores Processor
Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots
1 x IPMI dedicated LAN ;4 x GbE ; 2 x 25G SFP28; 2x USB 3.0 type A;
1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280
1 M.2 E-Key PCI-E 3.0 x1, 2230
1 M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042
1 SATA SSD drives

24
SYS-110D-4C/8C/16C/20C-FR(A/D)N8TP
Intel® Ice Lake D Compact 1U Embedded System
Processor
Intel® Xeon D Ice Lake 4/8/xx/xx Cores Processor, 65W~125W
Memory Capacity
DDR4 3200MHz 1DPC, 4 slots RDIMM/LRDIMM, up to 256GB/512GB
Expansion Slots
1 x PCIe 4.0 x 16
1 M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2242/2280
I/O ports
4 x GbE ; 2 x 10GbE ; 2 x 25G SFP28
2 x USB 3.0 type A
1 x VGA
Drive Bays
2 Internal 2.5" drive bays
Power Supply
Redundant 800 W, 100-240 Vac
Redundant 600 W, -48 Vdc
System Cooling
5x 40x56mm Hot-swap Counter-rotation PWM Fans (one is optional)
1
2
3
4
5
6
Motherboard: X12SDV-4C/8C/16C/20C-SPT8F(7.5”x 8.5”)
1U Chassis: 515M-R804/515M-R601
W17.2” x D15.7” x H1.7” (437x399x43mm)
7
Intel® Xeon D Ice Lake 4/8/16/20 Cores Processor
Up to DDR4 3200Mhz 4 channels, 4 slots RDIMM/LRDIMM up to 512GB
1 x IPMI dedicated LAN ;4 x GbE ; 2x 10GbE; 2 x 25G SFP28
2x USB 3.0 type A;
2 SATA/U.2 2.5” drives
Key features
Applications
1 VGA
PCIe 4.0 x16
M-Key M.2
Networking Application, Firewall, uCPE, Telecom Application
Xeon Ice
Lake D SoC
4/8/16/20C
4x GbE LAN,
2x 10GbE LAN
2x 25G SFP28
1 x IPMI
dedicated LAN
2x 2.5” drive
bays

25
SYS-510D-4C/8C/10C-FN6P
Intel® Xeon D Compact 1U Embedded System
Processor
Intel® Xeon D Ice Lake LCC SoC Processor,4/8/10 Cores,
25W/50W/88W
Memory Capacity
4 DIMM slot,
DDR4 2933MHz up to 256GB RDIMM/UDIMM ECC/Non-ECC
Expansion Slots
1 x PCIe 4.0 x 16
1 M.2 M-Key SATA3.0/PCI-E 3.0 x4, 2280
1 M.2 E-Key PCI-E 3.0 x1, 2230
1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 2280/3042
I/O ports
4 x GbE ; 2 x 25G SFP28
2 x USB 3.0 type A
1 x VGA
Drive Bays
1 Internal 3.5" or 4 Internal 2.5" drive bays
Power Supply
200W AC-DC power supply
System Cooling
3x 40x28mm 4-PIN PWM fans
1
2
3
4
5
6
Motherboard: X12SDV-4C/8C/10C-SP6F (9.0” x 7.25” Flex ATX)
1U Chassis: CSE-505-203B
W17.2” x D9.8” x H1.7” (437x249x43mm)
7
Intel® Xeon D Ice Lake 4/8/10 Cores Processor
Up to 256GB RDIMM or 128GB UDIMM, DDR4 2933MHz in 4 Slots
1 x IPMI dedicated LAN ;4 x GbE ; 2 x 25G SFP28; 2x USB 3.0 type A;
1 M.2 E-Key PCI-E 3.0 x1, 2230
1 M.2 B-Key SATA3.0/PCI-E 3.0 x2/USB 3.0, 2280/3042
4 SATA drives
Key features
Applications
1 VGA
PCIe 4.0 x16
M, B, E-Key
M.2
Retail Application, Firewall, Gateway, uCPE
Xeon Ice
Lake D SoC
4/8/10C
4x GbE LAN,
2x 25G SFP28
1 x IPMI
dedicated LAN
1x 3.5” or
4 x 2.5”
drive bays

26
SYS-E403-9D-14CN/16C-IPD2
Pole-Mounted IP65 Server Platform for 5G and the Intelligent Edge
Processor
Intel® Xeon® Skylake D-2183IT Processor, 16C/32T, 2.2GHz,
100W
Intel® Xeon® Skylake D-2177NT Processor, 14C/28T, 1.9 GHz,
105W
Memory Capacity
4x DIMM slots, (2400 MHz: D-2183IT, 2667 MHz: D-2177NT)
DDR4, up to 512GB ECC LRDIMM, or 256GB ECC RDIMM
Expansion Slots
2x PCIe 3.0 x16 (FHFL) or 2x PCIe 3.0 x8 & 1x PCIe 3.0 x16
(FHFL)
1x M.2 M-Key 2280/22110 (PCIe 3.0 x4/SATA3)
1x M.2 B-Key 3042 (PCIe 3.0 x2/SATA3/USB3.0)
1x M.2 E-Key 2230 (PCIe 3.0 x1/USB2.0)
I/O Ports
4x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
4x 10GbE SFP+ ports, 9x GbE ports, 1x Dedicated IPMI port
1x VGA, 1x COM via RJ45
Drive Bays
4x Internal 2.5" drive bays
Main Power
900W –44 Vdc to -59 Vdc, support dual power input, redundant
power
System Cooling
3 x 8080mm PWM redundant fans, 6x 8038mm waterproof fans
Compact server in IP65 enclosure for extreme
environments
Intel® Skylake D-2177NT(14C/28T) / D-
2183IT(16C/32T)
3x PCIe slots (FHFL, 300mm) for GPU/FPGA
4x 10GbE SFP+, 9x GbE (1 for MGMT), 1x dedicated
IPMI port
Redundant power supply, fans and sensors
-40℃ to 46℃ ambient (14CN), -40℃ to 50℃ ambient
(16C)
Weight: 101.5lbs (46.04kg)
Key features
Applications
5G Radio Access Network (RAN)
Multi-Access Edge Computing (MEC)
Vehicle to Everything (C-V2X/V2X), Smart City
Motherboard: MBD-X11SDW-14CN/16C-TP13F+ (8” x 10”)
Chassis: CSE-E403iF-000NDBP2
3x PCIe slot
B-Key M.2
M-Key M.2
E-Key M.2
Extreme
Outdoor
Environment
D-2183IT/
D-2177NT
IPMI LAN
9x GbE
4x 10GbE
SFP+
4x SATA3
2x USB 3.0
2x USB 2.0
-48 VDC
1
2
3
4
5
6
7

27
SYS-E403-9D-16C-IP
Pole-Mounted IP65 Server Platform for 5G and the Intelligent Edge
Processor
Intel® Xeon® Skylake D-2183IT Processor, CPU TDP support
100W
Memory Capacity
4x DIMM slots, DDR4 2400 MHz, up to 512GB ECC LRDIMM,
or 256GB ECC RDIMM
Expansion Slots
2x PCIe 3.0 x16 (FHFL) or 2x PCIe 3.0 x8 & 1x PCIe 3.0 x16
(FHFL)
1x M.2 M-Key 2280/22110, 1x M.2 B-Key 3042, 1x M.2 E-Key
2230
I/O Ports
4x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10
2x 10GbE SFP+ ports, 2x 10GbE Base-T ports
9x GbE ports, 1x Dedicated IPMI port, 1x COM via RJ45, 1x
VGA
Drive Bays
4x Internal 2.5" drive bays
Main Power
100-240 VAC, Est. Max Power consumption: 1200W
(instantaneous) / 900W (stable)
Server Power
600W 100-240 VAC, Multi-output power supply, 80Plus Gold
System Cooling
3x 8080mm PWM redundant fans, 4x 172x25.4mm enclosure
fans
Compact server in IP65 enclosure for extreme
environments
Intel® Skylake D-2183IT(16C/32T)
DDR4 2400MHz up to 512GB, 256GB non ECC
3x PCIe slots (FHFL, 300mm) for GPU/FPGA
2x 10GbE SFP+, 2x 10GbE Base-T, 9x GbE
2x USB 3.0, 2x USB 2.0, 4x 2.5” SATA3 drive bays
3x M.2 M-Key, B-Key, E-Key
2x PCIe 3.0 x16 or 2x PCIe 3.0 x8 & 1x PCIe 3.0 x16
-40℃ to 46℃ ambient
Key features
Applications
5G Radio Access Network (RAN)
Vehicle to Everything (C-V2X/V2X), Smart City
3x PCIe slot
B-Key M.2
M-Key M.2
E-Key M.2
Extreme
Outdoor
Environment
D-2183IT
IPMI LAN
9x GbE
2x 10GbE
2x 10GbE SFP+
4x SATA3
2x USB 3.0
2x USB 2.0
Motherboard: MBD-X11SDW-16C-TP13F (8” x 10”)
Chassis: CSE-E403iF-000NBP
100-240 VAC
1
2
3
4
5
6
7

28
SYS-E403-12P-IPA2-C
Pole-Mounted IP65 Server Platform for Smart City and the Intelligent Edge
Processor
Intel® Xeon® Ice Lake Scalable Processor up to 165W
Memory Capacity
8x DIMM slots, (up to 2TGB, 3DS ECC DDR4-3200MHz
RDIMM/LRDIMM)
Expansion Slots
3x PCIe 4.0 x16 (FHFL)
1x M.2 M-Key 2280/22110 (PCIe 3.0 x4/SATA3)
I/O Ports
2x 10GbE LANs, 1x Dedicated IPMI port
1x VGA, 1x COM
Drive Bays
4x SATA 2.5 SSD
Main Power
900W 110V – 240 Vac
System Cooling Modular
3 x 8038mm PWM System fans, 6x 8038mm HEX Fans
Compact server in IP65 enclosure for extreme environments
Intel® Xeon® Ice Lake Scalable Processor, Up to 165W
8x DIMM slots, (up to 2TB, 3DS ECC DDR4-3200MHz
RDIMM/LRDIMM)
2x 10GbE, 1x dedicated IPMI port
2x USB 3.0, 2x USB 2.0
1x M.2 M-Key 2280/110
3x PCIe 4.0 x16 (FHFL, 300mm)
4x SATA 2.5 SSD
-40℃ to 46℃ ambient plus solar load
Weight: 97lb (44kg)
Key features
Applications
Smart City
Intelligent Edge
Motherboard: X12SPW-TF (8” x 13”)
Chassis: CSE-B403L1-A600DIP65
3x PCIe Slots
M-Key M.2
Extreme
Outdoor
Environment
Intel® Ice Lake
Processor
IPMI LAN
2x 10GbE
4x SATA 2.5
SSD/U.2
2x USB 3.0
2x USB 2.0
1
2
3
4
5
6
7
3/15/2022

29
3rd Gen Intel® Xeon® Ice Lake Scalable Processors, up to 250W
DDR4 3200MHz up to 2TB Total Memory
2x PCIe 4.0 x16 FHHL,
1x PCIe 4.0 x16 low profile slot (or 2 x8)
1x PCIe 4.0 x8 FHHL *(if CPU <= 165W, 1U heatsink)
2x 10G BASE-T & 4x GbE
Processor
Intel® Xeon® Ice Lake Scalable Processors up to 250W TDP
Memory Capacity
8x DIMM slot, DDR4 3200MHz, up to 2TB total memory
Expansion Slots
2x PCIe 4.0 x16 FHHL
1x PCIe 4.0 x16 low profile slot (or 2 x8)
1x PCIe 4.0 x8 FHHL *(if CPU <= 165W, 1U heatsink)
I/O Ports
2x 10G BASE-T, 4x GbE, 2x USB 3.0, 2x USB 2.0, 1x VGA, 1x dedicated IPMI,
1x COM port
Drive Bays
2x SATA3 (2x internal), 1x M.2 M Key 2280/22110
2 x NVMe with Optional NVMe Backplane – I/O Slot 2 is lost
Power Supply
600W DC redundant power supply
System Cooling
4x 8038 chassis fan 4-PIN PWM FAN
1
2
3
4
6
Motherboard: X12SPM-LN6TF
Chassis: CSE-211M
7
Key features
Applications
GPU/FPGA
Supported
2x PCIe 4.0 x16
1x PCIe 4.0 x16 LP
1x PCIe 4.0 x8*
M.2 – M Key
Multi-Access Edge Computing(MEC), C-RAN(vRAN), uCPE,
AI on Edge, Deep Learning, Advance Network Security
3rd Gen. Xeon
Scalable
Processors up
to 225W TDP
IPMI LAN
4x GbE
2x 10GbE
2x SATA3
2x USB 2.0
1x COM via RJ45
1x IPMI
5
SYS-210P-FRDN6T
Intel® Ice Lake-SP 300mm Short Depth 2U UP Edge System

DISCLAIMER
Super Micro Computer, Inc. may make changes to specifications and product descriptions at any time, without notice. The
information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions
and typographical errors. Any performance tests and ratings are measured using systems that reflect the approximate
performance of Super Micro Computer, Inc. products as measured by those tests. Any differences in software or hardware
configuration may affect actual performance, and Super Micro Computer, Inc. does not control the design or implementation of
third party benchmarks or websites referenced in this document. The information contained herein is subject to change and may
be rendered inaccurate for many reasons, including but not limited to any changes in product and/or roadmap, component and
hardware revision changes, new model and/or product releases, software changes, firmware changes, or the like. Super Micro
Computer, Inc. assumes no obligation to update or otherwise correct or revise this information.
SUPER MICRO COMPUTER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE
CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT
MAY APPEAR IN THIS INFORMATION.
SUPER MICRO COMPUTER, INC. SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR
FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE TO ANY
PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE
OF ANY INFORMATION CONTAINED HEREIN, EVEN IF SUPER MICRO COMPUTER, Inc. IS EXPRESSLY ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES.
ATTRIBUTION
© 2022 Super Micro Computer, Inc. All rights reserved.
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