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Semi Conductors in Normandy

Semi-conductors Players in Normandy

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Semi Conductors in Normandy

  1. 1. Invest in Normandy www.normandydev.com Semiconductors: R&D, Industry leaders
  2. 2. CONTENTS 1 Major players in Microelectronics 2 NXP Semiconductors 4 IDPiA 5 PRESTO Engineering 6 public research Laboratories 6 LaMIPS: Semiconductor Physics and Micro-Electronics Laboratory 7 CRISMAT: Laboratory of Cristallography and Materials Science 8 IRSEEM: Research Institute for Embedded Electronic Systems 9 Existing test Equipment facilities for the semiconductor industry in Caen 10 Some of the Semiconductor projects developed within the e-secure Transactions Cluster 11 academic support 11 ENSICAEN Engineering School 12 ESIGELEC Engineering School
  3. 3. 1 August 2010 Major players in Microelectronics ALTIS/Corbeil Philips-Freescale ST/Crolles Freescale Toulouse ST Tours Automotive electronics Power electronics Magnetic technologies CMOS technologies 300 200 150 125 Communicating devices Regional programs for microelectronics and major wafer labs in France Philips Caen ATMEL ST/Rousset NXP IDPiA PRESTO Engineering NXP In NormandyIn France
  4. 4. 2 August 2010 NXP’ teams at the Caen-based R&D center, comprising 900 engi- neers and researchers, are developing ground-breaking technologies in four of NXP’s key fields of activity: • Mobile & Personal (nomad devices) • Home (household electronics) • ID (identification) • MMS (multimarket semiconductors) R&D teams work in a number of fields including: RF technologies, si- licon tuners, System-in-Package, together with other innovative solu- tions such as Near Field Communication (NFC) technology. Two joint R&D intitutes: LaMIPS & ISyTest NXP R&D Center also hosts common research institutes: • ISyTest (Institute for System Testing) in partnership with the CNRS (National Centre for Scientific Research). Specialized in advanced semiconduc- tors test strategies and tools, it is developing innovative test methods and techniques allowing NXP to improve the quality of its increasingly com- plex system solutions. • LaMIPS, a joint institute with CRISMAT lab in Caen, is specialized in failure analysis, reliability and characterization of semiconductors (SiP & SoC) and Materials. During the company’s 50 year presence in the town of Caen, NXP has continued its committed involvement in the local ecosystem. Now located within the new Effiscience Science Park, the company’s R&D Center federates the key ingredients capable of attracting high-tech partners and activities to the science park. NXP Semiconductors, French R&D Headquarters - Caen • 1,150 Employees • Home, Mobile & Personal, Identification, Multimarket Semiconductors (MMS) • Innovation & Technology • IC Manufacturing Operations • Support Functions Caen has always been the ideal location for our R&D activities: it boasts a strong entrepre- neurial culture and commitment from public authorities, as well as a solid ecosystem formed by research laboratories, regional competitiveness clus- ters, engineering schools and technical expertise. Henri-Alain Rault, former President of NXP France ” “
  5. 5. 3 August 2010 R&D products • Integrated circuit design in the fields of cellular and cordlessw telephony, secure electronic transactions and consumer electronics • Image and video processing for mobile & personal solutions • International Innovation Centers in RF technologies and video compression techniques R&D processes and pilot lines • International Competence Center for Advanced Technologies in heterogeneous integration (System-in-Package) • Test, assembly and packaging technologies Caen Campus • Inauguration Q3 2007 • 800 engineers and support functions (Headquarters) • Showroom with NXP Caen applications and technologies: TV-on-PC, TV-on-Mobile, Set-Top-Box, NFC, RF Cellular, SiP/PICS technologies, Solid-State Lighting NXP’s competencies SECTORS CRAFTS Production (Operations) Production, Maintenance Test Test Development / Support, Test Manufacturing Hardware Development Analog Designer, Mixed Designer Digital back-end, Digital front-end Software Software Designer Architecture HW Architect, SW Architect System Architect, IC Architect Innovation Proc., Innovation Dev. TPE Test Engineer, Product Engineer Support BL Quality / Logistic, Industrialization/ SCM Assistant Project Management Project management Marketing & Sales IPM/Tactical, Business Development Account Manager Support Site HR, Communication F&A, Legal & Fiscal Purchasing, IT, Logistic
  6. 6. 4 August 2010 IDPiA - Caen IPDIA was founded in 2009 as a spin-out from NXP. New manufacturing plant on PICS technologies and 3D Silicon Production IPDIA is a preferred supplier of high-performance, high-stability and high- reliability silicon passive components. IPDiA’s primary objective is to focus on two main axes : Integrated Devices for high brightness LEDs and Integra- ted Passive Devices for new markets such as medical, industrial, aerospace and defense. IPDiA’s technological lead in components for lighting, LEDs and integrated pas- sive devices will enable companies to capitalize on this know-how acquired over the last few years and which earned IPDiA its position as a major player on the world market. IPDiA produces both stand-alone IPDs as well as Systems-In-Package (SiP). The stand-alone IPDs are used in LEDs and modem cards. In SiPs the IPD and the chip are integrated leading to better performance, a smaller footprint (10 x smal- ler), and a lower cost price. The SiP technology opens up numerous commercial applications and meets the ongoing requirements of many OEMs to keep on reducing the size of electronic devices while improving their performance and reliability. R&D Projects PRIIM IPDiAhas announced the launch of the R&D consortium PRIIM (Platform for the Realization of Shared Industrial Innovation) which will address application requirements for markets such as: implantable medical devices (stimulators, defibrillators, motion detectors), multimedia chips and embedded systems. IPDIA Multi Wafer Interposer & IPD Program The consortium goal is to develop high-performance silicon passive components capable of “withstanding severe environ- ments and assembly technologies that allow the ultraminiatu- rization of future products”. This 53 million euro - four year project will include the following partners: Oseo, CEA Leti, CNRS/LAAS, CNRS /CRISMAT, 3D PLUS, ELA Medical, Gemalto, Kalray and Movea. IPDiA dedicated campus covers 7 ha, including: . The IPDiA company Headquarters . The Sales and Marketing organization . Pilot line for SiP product development and rapid prototyping . 6" wafer fab with integrated passives, capacity 150k wafers per year. • Customized Products • 3D Silicon Capacitors • RF Integrated Passive Devices • Integrated Protection Devices IPDiA Products
  7. 7. 5 August 2010 PRESTO Engineering - Caen Presto Engineering Offering Semiconductor Test and Analysis Services in new European Hub • Test • Reliability • Electrical Failure Analysis • Physical Failure Analysis • Program Management About Presto Engineering Presto Engineering, an ISO 9001 company headquartered in San Jose, California, pro- vides comprehensive semiconductor test and analysis solutions to IDM and Fabless companies, helping to improve the speed and predictability of new product releases. Presto combines unique technical expertise, extensive industry experience and state-of- the-art ATE, reliability, failure analysis and fault isolation capabilities to offer a com- plete product engineering solution designed to complement the internal resources of its customers. Presto Engineering, a pioneer of the labless business model for bringing semiconductor pro- ducts into volume production, announced in February 2010 the opening of its new services hub in Caen. For the first time, European chip companies have access to a state-of-the-art lab with a staff of highly skilled engineers and technology specialists offering advanced outsourced test and analysis capabilities. “ Patrick Poirier - Director of Operations ” The new hub, which includes equipment and infrastructure acquired from NXP Semiconductors’ facility in Caen, offers comprehensive failure analysis and reliability testing for semiconductor compa- nies. The hub will be operated by Presto Engineering Europe. Presto’s state-of-the-art capabilities include enhanced RF and 3D-integration expertise and ad- vanced test, reliability, fault-isolation and failure-analysis services. By outsourcing these steps, chip companies are able to cut costs and free resources for their core business. Bringing an advanced chip design into silicon requires a variety of advanced test and analytical tech- niques. Presto’s Design Success Analysis™ offering eases this process by providing first-silicon vali- dation, as well as characterization of new processes, new designs, and process transfers. Capabilities include comprehensive custom ATE hardware interfaces (such as load modules, probe cards, DUT cards and thermal interfaces) and product-engineering services. More broadly, Presto can proactively and reactively address a variety of design-to-manufacturing chal- lenges. Presto’s product debug services include ATE-coupled in-silicon analytical capabilities, with ex- tensive backside silicon analysis; additional release-acceleration offerings include reliability services. The company’s hubs can also maximize the utility of expensive test chips and engineering, validating simulation results and characterizing timing, power, leakage, and other parameters. «This new facility is the springboard for Presto’s expansion into Europe and our introduction of the labless model to that key market, which includes some of the world’s top fabless design houses, fab lines, and other members of the semiconductor community,» said Michel Villemain, CEO of Presto Engineering. (source: Press Release - February 16, 2010)
  8. 8. 6 August 2010 public research Laboratories LaMIPS’ strengths • A huge amount of equipment at the cutting-edge of today’s tech- nologies (AFM, TEM, SEM, FIB...) • A workforce of 60 people including doctors, engineers and tech- nicians, who manage twenty or so PhD students and trainees • Strong skills in all kind of technical analysis combined with advanced skills in the fields of electrical stresses and reliability tests • A rich, outward-looking network with other companies (Valeo, Magneti Marelli, ArvinMeritor, Fime, Expert’eyes...) • Partnership with competitive clusters: MOV’EO (automotive & transport) and TES (e-secure transactions) ; membership in Caen “CNRT” Materials LaMIPS is a shared facility between the CRISMAT (Laboratory of Christallo- graphy and Materials Science) renowned worldwide in the fields of material synthesis and characterization and NXP Semiconductors, which has de- veloped expertise in the characterization, failure analysis and qualification of products and processes on the Caen site. LaMIPS is a vital partner for the development of new technologies, its mission is to develop research activities focusing on physical and elec- trical characterization, modelling and the reliability of complex systems. The laboratory is also open to businesses with needs in the field of micro-electronic system analysis and characterization. By reuniting the expertise of all of its partner organizations, LaMIPS is emerging as a major player for understanding the difficulties generated by new and increasingly complex micro-electronic systems. Partnership with NXP NXP uses the laboratory for its specific needs. Furthermore, the company ensures its maintenance and its ope- rating costs. As for its research activities, NXP’s engineers and technicians take part in research and conduct measurements along with researchers. “Thus, we can improve our efficiency and genuinely focus on identifying defects” explains LaMIPS’ Director, Philippe Des- camps. The research topics developed within the laboratory are generally put forward by NXP. Nevertheless, the lab can also work on its own themes according to publication opportunities and to the specific skills of available researchers. Research thematics To develop innovative methods for characte- rizing and analysing micro- electronic systems • Failure Analysis • Material Characterization • Reliability • Hyperfrequency & Radio Frequency, Electric Charac- terization and modelling • Supporting Process Development Main fields LaMIPS: Semiconductor Physics and Micro-Electronics Laboratory Failure Analysis, Reliability and Characterization of Semiconductors and Materials
  9. 9. 7 August 2010 CRISMAT: Laboratory of Cristallography and Materials Science Publication pending: Mas Subramanian was welcomed to Caen last July. His time is shared between his American lab and CRISMAT, where he has started research work with a team comprising a professor, a CNRS researcher and two PhD students. ‘We are looking to develop new oxide nanomaterials, drawing on our knowledge in the field of solid-state chemistry.’ Subramanian coordinates his work between the United States and France. First impressions? «From a scientific point of view, we are already preparing and submitting articles for publication. This exchange has given us a new lease of life. Our students plan to travel to the United States this summer, and, likewise, we also plan to welcome American students to Caen. Without forgetting scientific dissemination, since local researchers can take full advantage of the Caen-based conferences and seminars at which Subramanian has agreed to speak». (1) This one-year, full-time partnership stretches in fact, on a part-time basis, over a period of two years and will consequently end in July 2009. (2) The regional scheme in support of chairs of excellence aims at encouraging the hosting of top-level foreign researchers within regional laboratories, by providing attractive resources for them to rapidly conclude their research project A regional scheme aimed at supporting chairs of excellence has allowed the CRISMAT to welcome one of the world’s leading names in research into nanomaterials for a 12-month, full-time secondment. And al- though CRISMAT is a renowned laboratory for its research on materials, a valuable outside view is sure to accelerate its exploratory work. Since the summer of 2007, the CRISMAT has been proud to welcome a high-flying American researcher for a one-year (1) secondment. ‘We were looking to initiate new work on nanomaterials with support from an established outside source. The regional scheme(2) in support of hosting renowned exterior researchers offered the ideal opportunity.’ CRISMAT’s Director Antoine Maignon and his research team had already set their sights on Mas Subrama- nian, a professor from Oregon State University. ‘A big name in nanomaterials, thermoelectricity in particular, for which he is among the world’s top 5 for patent applications.’ Working with him could but enhance the CRISMAT’s international influence in its particular field of research. Functional & Structural Materials. Ceramics, Alloys, Composites and Microelectronics The CRISMAT, affiliated to CNRS and ENSICAEN, is a large research laboratory with more than 100 people. The main scope of activities is the design of new oxides to create new properties for applications
  10. 10. 8 August 2010 IRSEEM: Research Institute for Embedded Electronic Systems Research fields: • Electromagnetic compatibility • Components EMC • Systems EMC • Measurement and investigation platforms (Near field test bench, Load Pull test bench, TEM 3D Cell, mode- stirred reverberating chamber) Equipment: • Semi-anechoic chamber with rolls bench until 18 GHz for automobile and bulky embedded systems • Semi-anechoic chamber until 40 GHz • Mode-stirred reverberating chamber • Measurement bench for EMC immunity (200V/m) and emission (CISPR 22) • BCI tests bench • Vectorial analysis bench until 40 GHz • CAD • Electric simulations • 2D-3D electromagnetic modelling • DPI test bench • Near field test benches (systems and components) IRSEEM Research Ins- titute and technology transfer center has de- veloped a strong ex- pertise in embedded electronic systems with a special emphasis on the Automotive and Aeronautics sectors Partners: • Academic partners: GREAH (Le Havre University), GPM (Rouen University), LGEP (SUPELEC) and L2S (SUPELEC and Paris-Sud 11 University), TELICE-IEMN (Lille University), XLIM (Limoges University), Groupe Antennes et Micro-ondes (Kent University) • Industrial partners: Airbus, EADS, Faurecia, FCI, INRETS, PSA, Renault, Thales Air Defence, Valeo, Synchronic, Pragmatech, etc. IRSEEM was created in 2001 with the support of the ESIGELEC, the Rouen Chamber of Commerce and Industry and several industrials and public bodies; it houses industrial research laboratories and has positioned itself on embedded electronics. The industrial research it has enabled to develop since then has been dedicated to regional automotive, aerospace and electronics networks. IRSEEM teams have carried out major research works while supporting various technology transfer and economic development activities. • Innovative Solutions • Measurements & Tests • Technical Support • Technology Transfer • Technological & Normative Watch • Professional Training Measurement, Simulation, Design assistance
  11. 11. 9 August 2010 Failure Analysis: Lab tools Initial Inspection: Non Destructive Analysis • X-rays: Pheonix Nanomex 160 : 2D & 3D • SAM: HITACHI FS300 • TDR: Agilent 86100 + TDR + Tektronix probe • Magnetic Current Imaging (2008) Sample Preparation and Observation • Observation: . Optical Observation: Leica, Olympus . Confocal microscope (2008) • De-capsulation: . Chemical de-capsulation: BGDCAP . Milling system: Hamamatsu IC Back Side Polishing - ASAP-1 . Laser ablation • Repackaging: . Wire bonding: K&S4526 • Preparation: . Grinding and polishing system: Multiprep . Plasma etcher (Nextral860 & 110) . Laser cutter (Ezlase 3 wave lengths) . FIB (FEI200) Existing test Equipment facilities for the semi- conductor industry in Caen Within the Normandy region, numerous quality & analytical equipements for the semiconductor & micro-electronic industry are available for external compa- nies. Below, some examples of the failure analysis lab tools that can be found in the different Norman facilities. Electrical Verification • Manual probe station PM8 + DC and RF probe PHEMOS1000 • Photon Emission • Thermal Laser Stimulation (IR Laser 1300nm) (OBIRCh/TIVA), SDL • Magnetic Current Imaging (not available project 2008) • Measurement instruments : Scope WavePro 940 500 MHz, Semiconductor Parameter Analyser 4156C / 4155B / 4145B, LCR Meter 4284A Physical Analysis • Preparation, observation . Delayering, Cross sectioning . SEM: XL40 +EDX • Physical Characterization . FIB for precise cross section or TEM lamella . TEM (available at the University) . Atomic Force Microscopy: VeecoD3000 + Electrical modes SCM, SSRM, EFM . SIMS, AUGER, … (subcontracted)
  12. 12. 10 August 2010 Some of the Semiconductor projects developed within the e-secure Transactions Cluster Secure Electronic Transactions are a combination of electronic, computing and data communication techniques enabling the reliable and secure exchange of information in a wide range of application domains. Changes in usage, the «electronisation» of certain daily gestures, together with the internationalisation of standards and legislation, are all factors bearing a strong influence on the field of Secure Electronic Transactions. Project Name Description Project Leader Partners New mould for the manufacture of contactless cards New mould for the manufacture of contactless cards Seropa MiniFab Industrialization of the manufacturing process for small and medium series smart cards Alios SEMOME Magnetoelectronic structure of magneto-electric oxydes CRISMAT lab CRISMAT lab FEMMES Ferro-electromagnetism for spin electronics CNRS/Thales CRISMAT lab, CEA Millesim New analysis and test method in SIP production Pertinence Inria, CNRS, NXP CUMIN 3D copper interconnects for silicon-based Sys- tem-in-Package (sbSIP) Rockwood Electronic Materials Alchimer, NXP, CNRS Mediasur Active security for CD/DVDs: insertion of an RFID tag in the optical disk and a reader in the disk drive Orange (France Telecom) Thomson, Greyc Laboratory Mastere M’SIP Executive Master in Microelectronics System Design and Technology EnsiCaen NXP, Oberthur, Stepmind, Silicon Laboratories, 6 engineering schools TEMPICAP Feasibility study, evaluation and clinical valida- tion of a prototype for measuring body tempera- ture by ingestion of an electronic capsule NXP Caen University, Nantes University, Expert Soft Technologies Normandy Living Lab Creation of the Normandy Living Lab dedicated to new uses of mobile phone TES cluster LSN/Novalog cluster Key Technologies Storage of digital information Secure Transactions Authentication technologies Conception tools and methods Man Machine Interface RFID Key Themes e-citizen (health, tourism, transportation, city) Contactless technologies e-administration/e-government TES Cluster
  13. 13. 11 August 2010 academic support ENSICAEN Research Labs • LAMIPS (Laboratoire de Microélectronique ENSICAEN/ NXP Semiconductors): Microelectronics Laboratory • GREYC (Groupe de Recherche en Informatique, Image, Automatique et Instrumentation de Caen): IT, Imaging and Instrumentation Laboratory • CIMAP (Centre de Recherche sur les Ions, les Maté- riaux et la Photonique): Centre for Research on Ions, Materials and Photonics • CRISMAT (Laboratoire de Cristallographie et Sciences des Matériaux): Laboratory of Christallogra- phy and Materials Science • LPC (Laboratoire de Physique Corpusculaire): Laboratory of Corpuscular Physics • LCMT (Laboratoire de Chimie Moléculaire et Thio-organique): Laboratory of Molecular and Thio- organics Chemistry Engineer Diplomas Master’s degree • Electronics and Applied Physics Options: Microelectronics - Telecommunications - Automatics and industrial computing - Nuclear engineering and instrumentation - Optics, sen- sors instrumentation • Computer science Options: digital imaging and multimedia - e-banking and computer science security - e-banking and systems security • Materials Science and Chemistry Options: Materials, Organic Chemistry - Materials for micro-electronics, micro-mechanics Executive Masters (considered as a 6-year university degree) • Microelectronics System Design & Technology Mixed Analog/Digital design, Analog/RF design, High level integrated systems, Advanced Tests Methods and Processes, Business Management • Electronic Payment E-secure payments and transactions, Authentication, E-commerce, smart cards • Business intelligence Master in Microelectronics System Design & Technology: a Master designed for junior and senior electronicians Unique in Europe, this degree is particularly orientated towards highly integrated Systems-on-Chip (SoC) and System-in-Package (SiP) design combined to the RFC MOS technology and is designed for both young engineers qualified in electronics/microelectronics and employees from the industry as part of their life-long learning programmes. This course will span the overall SiP system from the technological/design aspects to the promotion of the products. ENSICAEN (Caen) offers three main engineering degree courses in Computer Science, Electronics and Applied Physics, and Materials Science and Chemistry ENSICAEN Engineering School • Research laboratories including a joint laboratory with NXP • 3 specialized executive masters • Strong links with industry • Partnership with TES and Move’o Competitive Clusters • Member of the National Centre for Technological Research in Materials • A Department of IndustrialCooperation Driving and developing innovation is key in our industry. NXP Semiconductors is pionee- ring new miniaturized concepts for a broad range of applications. This Master is then very sui- table to understand the overall business and technical problematic when designing a complete integrated system. It will also speed up the knowledge acquisition of the Engineers. Dr Patrice Gamand, NXP Semiconductors - Caen, General Manager RF Innovation Center ” “
  14. 14. 12 August 2010 ESIGELEC Engineering School Majors • Optical Telecommunications Engineering (ITO) • Networks and Architecture Security (ASR) * • Information systems engineering (GSI) * • Business Engineer (IA) • Industrial Automation and Robotics (ARI) Automation and computer control, digital signal and microcontroller processing, instrumentation (real and the virtual), automated manufacturing and local industrial networks, modelling and robot control, image processing and quality control, power electronics and electrical engineering. • Embedded Systems Engineering (ISE) * Real-time OS, methodology, microcontrollers, programmable logic and VHDL, communications bus, instrumentation, electromagnetic compatibility. • Electronic and Telecommunications Systems Engineering (ISET)* Concepts specific to radio frequency sub-assemblies for telecommunications (such as digital signal processing) together with computer-aided design tools and measuring equipment. • Electrical Engineering and Transport (GET) * Energy (transport, networks, management), rotating machines, power electronics, order real time, instrumentation and communication networks, EMC, modelling. * Bilingual English-French Departments/Research labs • Electronics & Telecommunications • Computer & Communications Technology • Electronics Laboratory • Microwave Frequency Telecommunications Laboratory • Optical Telecommunications Laboratory • Electrical Engineering & Embedded Systems • Industrial Automation Laboratory • Electrical Engineering Laboratory • Embedded Systems and Signal • Processing Laboratory • Humanities & Languages 7 engineering careers • Research & Development Design Engineer • Project Manager Engineer • Business Engineer • International Engineer • Quality-Control Engineer • Engineer Entrepreneur • Consulting Engineer Esigelec (Rouen) trains engineers in the following fields: Networks, Data Processing, Information Technology, Telecommunications, Electronics, Embedded Systems, Electrical Engineering Transport, Automation & Industrial Robotics. • 4 training departments • 8 laboratories and IRSEEM Research Institute • 8 technological specialisations and introduction to 7 engineering careers • Strong cooperation with the automotive, aeronautical, electronic and telecommu- nications industries • Member of the National Centre for Technological Research in Materials • Partnership with TES, Move’o and Novalog Competitive Clusters
  15. 15. www.normandydev.com Normandy With support from Exclusive representative of Créditsphotos:RégionsHauteetBasseNormandie-GSK-Snecma-Renault-NormandieAménagement CMNYachts/GuillaumePlisson-IStock-Fotolia-DanielFondimare-X For further information, please contact: Sylvain DORRIERE Project Manager Normandie Développement Unicentre 12 rue Alfred Kastler 14000 Caen - France Tel. +33 (0)2 31 43 56 56 sdorriere@normandydev.com