Semiconductor Market Update by SEMICON 2010/2011

1. Semiconductor Industry Outlook &
SEMICON Update
March 16, 2011

2. Agenda
• Semiconductor Industry Outlook
• SEMICON Show Update
- Taiwan & South East Asia
- Other Regions

3. Semiconductor Industry Outlook
Daniel Tracy, Sr. Director, Industry Research & Statistics
March 16, 2011

4. Overall Market Outlook

5. Semiconductor Industry Outlook:
2010 was a Record Year
$375 100%
Global Semiconductor Revenue US $B
$350 319
330
Annual Growth % (line graph)
$325 298 75%
$300
$275 248 256 249
$250 228 226 50%
213
$225 204
(bar graph)
$200 166 25%
$175 150
139 141
$150
$125 0%
$100
$75
-25%
$50
$25
$0 -50%
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011F
2012F
Semiconductor Revenue Annual Growth
Source: SIA/WSTS historical year end reports, SIA November 2010 Forecast

7. 2011 Semiconductor
Revenue Forecasts
11.0% Henderson Ventures (Mar 11)
10.0% IC Insights (Jan 11)
8.1% VLSI Research (Jan 11)
8.0% Semico Research (Jan 11)
6.0% Future Horizons (Dec 10)
6.0% SIA (Nov 10)
5.1% iSuppli (Oct 10)
4.6% Gartner (Dec 10)
4.5% WSTS (Nov 10)
0% 2% 4% 6% 8% 10% 12%
Source: SEMI

8. Semiconductor Investments

9. Worldwide Fab Capacity:
Expansion Rebounds
Taiwan
Worldwide Installed Capacity
In Millions (without Discretes) SE Asia
200mm Equivalent
wafers/month Change in % S. Korea
18 23% 26%
16 24% Japan
19% 22%
14 20% Europe &
12 14% 15% 18% Mideast
13% 16% China
10 14%
10%
8 8% 9% 7% 12%
7% 10% Americas
6 8%
4 3% 6% Change
1% 4%
2 2%
0 -4% 0%
-2 -2%
-4%
-4 -6%
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Source: SEMI World Fab Database Reports (February 25, 2011)

10. 300 mm Fab Investments:
Lead the Capacity Growth
300 mm Installed Capacity
Thousands
Wafers/month
1000
900
800
700
600
500
400
300
200
100 S.Korea
Taiwan
0 Japan
Americas
20 1
China
20 0
1
20 9
1
20
20 8
0
SE Asia
20 7
0
20 6
0
20 5
0
Eur&M.East
0
04
20 3
0
02
01
20
00
99
20
20
19
Source: SEMI World Fab Forecast November 2010

11. Equipping Fabs: Top Spenders
Companies that spend over $900M/Year on equipment
2006 2007 2008 2009 2010 2011 2012
9 10 6 3 9 9 9
Samsung Samsung Samsung Samsung Samsung Samsung Samsung
Intel Intel Intel Intel Intel Intel Intel
Hynix Hynix Hynix Hynix Hynix Hynix
TSMC TSMC TSMC TSMC TSMC TSMC
Powerchip Powerchip
Globalfoundries Globalfoundries Globalfoundries Globalfoundries Globalfoundries
Sony
Toshiba Toshiba Toshiba Toshiba Toshiba Toshiba
UMC UMC UMC
Elpida Elpida
Micron Micron Micron Micron Micron Micron
SMIC SMIC
NanYa NanYa
Share 65% 71% 60% 49% 73% 75% 79%
of total WW SEMI World Fab Forecast Database Reports (February 25, 2011
p spenders (including JVs, alliances and recent mergers), based on share of known contribut

12. SEMI® Equipment Forecast (update)
By Market Region
N. America Japan Taiwan Europe S.Korea China ROW
$50 $45.81 $47.14
US$ Billions
$45 $42.77
$40 $39.54
$35
$29.52
$30
$25
$20 $15.92
$15
$10
$5
$0
2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F)
ROW 3.05 2.61 1.44 3.85 4.31 4.89
China 2.92 1.89 0.94 3.64 4.12 5.30
S.Korea 7.35 4.89 2.60 8.33 8.05 9.54
Europe 2.94 2.45 0.97 2.32 3.24 4.37
Taiwan 10.65 5.01 4.35 11.20 11.60 10.34
Japan 9.31 7.04 2.23 4.45 5.28 4.88
N. America 6.55 5.63 3.39 5.75 9.21 7.82
Totals may not add due to rounding
Source: SEMI, March 2011

13. SEMI® Equipment Forecast (update)
By Segment
Wafer Process Assembly & Pack. Test Other
$50 $47.14
$45.81
$45 $42.77 $39.54
$40
$35
US$ Billions
$30 $29.52
$25
$20
$15.92
$15
$10
$5
$0
2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F)
Other 2.92 2.00 1.11 1.99 2.03 2.30
Test 5.05 3.45 1.55 4.15 3.76 4.08
Assembly & Pack. 2.84 2.04 1.41 3.88 2.97 3.31
Wafer Process 31.95 22.03 11.84 29.53 37.05 37.45
Totals may not add due to rounding
Source: SEMI, March 2011

14. Regional Silicon Forecast:
Asia-Pac’s share is >50%
Total Silicon Area Shipments
11,000
10,000
Millions of Square Inches
9,000
8,000
7,000
6,000
5,000
4,000
3,000
2,000
1,000
0
95
96
97
98
99
00
01
02
03
04
05
06
07
08
09
20 0
20 F
F
1
11
12
19
19
19
19
19
20
20
20
20
20
20
20
20
20
20
20
North America Japan Europe Asia Pacific
Includes polished and epi wafers. Excludes non-polish, reclaim and SOI.
Source: SEMI SMG through 2010; SEMI forecast

16. LED dedicated Fabs
Changing LED Landscape:
Year (begin operation) 2001 2006 2011 (est)
Count Volume fabs 35 63 137
Capacity in 2-inch EQs w/m 664,800 1,639,200 6,844,256
Americas Europe/Mideast
4 5 7 1 2 5 SKorea 4 9 14
Japan 7 10 13
China 6 15 57
Taiwan 13 22 39
SEAsia 0 0 2
Source: SEMI Opto/LED Fab Forecast, February 2011

17. Fab Investments and Activities

18. Taiwan Fab Capacity – Foundry to
drive capacity growth
Taiwan Fab Capacity - Foundry & DRAM
2,000
1,800
1,600
8" equiv wafer K/month
1,400
Analog
1,200 Discrete
Foundry
1,000
Logic
800 Memory
MEMS
600 Other
400
200
0
2007 2008 2009 2010 2011 2012
Source: SEMI World Fab Forecast, Feb. 2011

19. Foundry Capacity Trend – Taiwan
Leads the pack
Worldwide Foundry Capacity Trend
5,000,000
4,500,000
4,000,000
3,500,000 Taiwan
3,000,000 SE Asia
Korea
2,500,000 Japan
Europe & Mideast
2,000,000
China
1,500,000 Americas
1,000,000
500,000
0
2007 2008 2009 2010 2011 2012
Source: SEMI World Fab Forecast, Feb. 2011

20. Taiwan Fab Spending – Foundry &
DRAM-driven
Taiwan Fab Spending by Product Type
12000
10000 2320
3920 3155
8000 Other
US$ Million
8380 MEMS
Memory
6000 Logic
Foundry
8074
Discrete
4000 3641 1130 6237 6930
Analog
2000 2711 2777
1576
0
2007 2008 2009 2010 2011 2012
Source: SEMI World Fab Forecast, Feb. 2011

21. Taiwan Foundry: 2011 Spending
Remains Strong
• Taiwan foundries’ fab spending reached a record
level of $6.7B in 2010 and we expect overall
spending to exceed $8.7 billion this year.
• Aggressive capacity plan and technology roadmap
continue to drive foundry’s investment.
• With 28 nm/40 nm technology investment, foundry
sector is expected to outgrow overall
semiconductor market.
• Market dynamics: IDM’s fab-lite strategy and the
surging demand for mobile devices continue to drive
foundry business.

22. TSMC
CAPEX
• 2010 capex at $5.9 billion; $5.8B for foundry business and $100M for new business
(PV and LED)
• 2011 capex is planned at $7.8B (+32% YoY), while 81% of that will dedicate to
65nm/40nm/28nm technology and also 20nm/14nm development.
Production & Capacity
• Demand remains certain for specialty technology and advanced nodes.
• Strong capacity growth to continue in 2011, with 300mm capacity expected to
grow 35%.
• LED lab & fab is almost completed. PV fab will be completed in mid 2011.
Technology development
• 28 nm adoption is faster than 40nm at the similar stage.
• New projects in 2011 pipeline will include development of 28 nm, 20 nm, 14 nm,
10 nm and even 7 nm nodes.
• 450mm fab plan revealed with pilot line planned at Fab 12 P6 in 2013/2014 and
volume production line at Fab 15 P5 in 2015/2016.

23. UMC
Fab investments
• Similar capex level of $1.8B in 2010 and 2011
• Continue to add capacity for 65/55nm at Fab 12i
• Production has started at Fab 12A P3/P4
• Fab12A investment includes 40/45 capacity and 28 nm development.
Production ,Technology & Capacity
• 40/45nm revenue contribution will increase quarter by quarter to
reach 10% in second half of 2011.
• 28nm pilot will start in mid 2011 and mass production scheduled in
2012.
• Overall 12” capacity will grow 25% in 2011.

24. DRAM: 3x/4xnm Nodes Transition
• With the recent weakness of PC market and
cannibalization of tablet devices, DRAM sector
slows down in 2H10.
• Nodes transition plans to 40 nm class and below
are somehow disturbed by fast price erosion with
some accelerating their migration and others may
delaying.
• Taiwan DRAM sector would only show technology
buy rather than capacity buy in 2011.
• The availability of immersion tools remains the
bottleneck of technology migration and capacity
expansion plan.

25. Inotera
Production
• Wafer shipments reached 275K in 4Q10 (300mm-equiv.), up 20%
quarter over quarter
• Bit growth in 1Q11 is expected to be 40%-50% QoQ due to
42/50nm ramp.
Technology & Capex
• Capex to come down from $1.75B in 2010 to $560M in 2011.
• Majority of required immersion tools for 130K capacity (42 nm)
are installed and in production.
• Plan to fully convert the vast majority of wafer starts to 42nm by
around mid-2011.
• 3xnm pilot runs of 4Gb DDR3 DRAM are expected to commence
around mid-2011.

26. Nanya
Technology
• Capex to come down from $730M in 2010 to $400M in
2011.
• 42 nm mass production started in Oct. 2010.
– 42 nm will have 53% more die output per wafer than
50 nm.
• 3xnm pilot run to start in 2Q 2011.
Production
• Fab 3A: 50K wafer starts by the end of ’10, will reach
60K in mid 2011.
• Company to focus more on Server DRAM, Consumer
DRAM and Mobile DRAM products

27. Rexchip
• Capacity was expanded to 85K wpm and 45 nm
transition is on schedule with full conversion
completed in early 2011.
• 30 nm class node is expected to start pilot
production in 1H11 and mass production in
second half.
• R2 fab production schedule has be postponed to
2012.
• 2011 capex shall be less than half of that for 2010.

28. Taiwan LED Manufacturers: Growing Investments
Epistar
• Plans to ramp up capacity by 30% in 2011 after 30-40% capacity growth in 2010.
• Two new LED JV fabs in China (Changzhou and Xiamen) shall come on line in 2011.
• Capacity expansion in Pan-Epistar Group (including Huga, Tekcore and Nanya) will continue in 2011.
Lexstar
• Aggressive ramp of epi capacity from 30K/M to 130K/M in Hsinchu with the adoption of 6” MOCVD
reactors.
• New LED epi/chip fab in Suzhou, China is expected to come online in 1Q 2011.
TSMC
• Invest $175M to build a LED lighting R&D center in Hsinchu. Facility is almost completed. Production shall
start in 2Q 2011.
Tyntek
• Started to invest in LED epi capacity with two new lines in Taichung Taiwan and Fuzhou China.
Formosa Epitaxy
• Taiwan fab expansion plan is still ongoing.
• New fab in Yangzhou China has come on line in 4Q10 and plans to have 50 MOCVD installation by the
end of 2011.
Genesis Photonics
• New fab 3 in Tainan to commence construction in October 2010.
• New JV project in Kunshan, China will come online in 2H11 with 50 MOCVD installation plan.
Source: SEMI, Company announcements, and DigiTimes

29. Singapore/Southeast Asia Fabs
GlobalFoundries
• 300 mm Fab 7 upgrade and expansion
• 200 mm Fab3 and 5 upgrade and expansion
IM Flash
• Ramping production; key driver in Southeast Asia fab capex
TECH Semiconductor
• On-going upgrade to 42 nm
UMC
• Capacity expansion and upgrade of UMC Fab12i
Infineon
• Expansion of 200 mm fab in Kulim

30. Backend Investments and Activities

31. Taiwan Packaging: Strong growth
• High utilization rates, especially for advanced
packaging
• 2010 capex: record level for some companies
• 3D packaging and copper bonding wire are
key drivers in capital spending

32. ASE
Outlook
• Small unit shipment growth in 4Q
• Progress/activity with customers from Japan
CAPEX
• ~$820M through 3Q, 4Q= $60M to $70M
• 2011= ~$700M to $850M
– Majority for flip chip, copper wirebond, and low pin count
Technology
• See more European and U.S. customers “picking up pace”
with copper wirebonding in 2011
• TSV: investing R&D, waiting for mainstream

33. PowerTech
Outlook
- Expect 4Q to be slightly better than Q3
CAPEX
- 2010 Capex at NT$12B (approximate $400M)
- 2011 plan similar as 2010 and first NT$3B (approximate $100M) would be
released in Q1 for leading technology
Technology and 3D IC activities
PTI supports various types of 3D IC technologies, such as FC- C4,
copper pillar, wirebond stacking/MCP up to 16 chips, PoP, and TSV
- Equipment for TSV process development & pilot line for 3- 5K monthly
wafer capacity expect to be installed in Q1and Q2 2011
- Plans to build an advanced 3D IC backend factory in 2011

34. SPIL
CAPEX
– 2010 Capex at NT$17B,or ~$500M
– 2011 plan about NT$10B or ~$320M
– Added 48 wire bonders in Suzhou in 3Q
– 668 wirebonders pushed out from 4Q to 2011
Technology and 3D Activities
– 16-die stack for Flash
– Package-over-Package, F/C CSP with wirebond
– Very early stage TSV (logic + memory)
– 3D SIP F/C BGA with stacked die

35. Southeast Asia
Packaging Materials
• Largest regional market for packaging materials
• Forecasting about $5.6 billion in spending for 2011
Assembly & Test Equipment
• #1largest regional market
• 2011 outlook
– ~$600 million in spending for A&P equipment
– $850 million to $900 million for Test equipment

36. Regional Market Summary

37. SEMI® Equipment Forecast (update)
By Market Region
N. America Japan Taiwan Europe S.Korea China ROW
$50 $45.81 $47.14
US$ Billions
$45 $42.77
$40 $39.54
$35
$29.52
$30
$25
$20 $15.92
$15
$10
$5
$0
2007 (A) 2008 (A) 2009 (A) 2010 (A) 2011 (F) 2012 (F)
ROW 3.05 2.61 1.44 3.85 4.31 4.89
China 2.92 1.89 0.94 3.64 4.12 5.30
S.Korea 7.35 4.89 2.60 8.33 8.05 9.54
Europe 2.94 2.45 0.97 2.32 3.24 4.37
Taiwan 10.65 5.01 4.35 11.20 11.60 10.34
Japan 9.31 7.04 2.23 4.45 5.28 4.88
N. America 6.55 5.63 3.39 5.75 9.21 7.82
Totals may not add due to rounding
Source: SEMI, March 2011

38. SEMI® 2010 Materials Forecast
By Market Region
N. America Japan Taiwan Europe S.Korea China Southeast Asia
$50
$45
$40 $46.10
$42.67 $44.70
$42.52 $42.85
$35 $37.25
US$ Billions
$30 $34.51
$25 $28.82 $30.94
$20
$15
$10
$5
$0
2004 2005 2006 2007 2008 2009 2010F 2011F 2012F
Southeast Asia 4.55 5.03 6.18 6.79 6.90 5.97 7.15 7.28 7.44
China 1.28 1.64 2.38 3.31 3.57 3.24 4.03 4.53 4.94
S.Korea 3.10 3.78 4.88 6.10 5.90 4.68 6.01 6.41 6.69
Europe 2.80 2.88 3.39 3.68 3.32 2.51 3.11 3.19 3.24
Taiwan 4.85 5.31 6.74 8.34 7.87 6.76 8.88 9.34 9.68
Japan 7.61 7.58 8.57 9.19 9.96 7.60 9.22 9.36 9.41
N. America 4.63 4.72 5.11 5.25 4.99 3.76 4.46 4.61 4.70
Totals may not add due to rounding.
Source: SEMI Materials Market Data Subscription November 2010

39. Summary
• Semiconductor industry recovery
– Estimating 5% to 10% growth in 2011
• Taiwan market
– Strong investments in foundry and packaging continue in 2011
– Challenges for Taiwan’s DRAM makers.
– #1 market for foundry capacity; # 2 market for 300 mm capacity
– #1 region for equipment spending and currently # 2 largest market for
semiconductor materials
• Southeast Asia
– # 1 region in spending for backend equipment and materials
– +40% or more growth in fab equipment spending
– Strong double-digit growth in 300 mm fab capacity over the next two
years

40. Taiwan- Where great things happen

41. The Most Effective Semiconductor
Event in Taiwan & SEA!
Ana Li
March 17, 2011

42. Agenda
• SEMICON Taiwan & SEMICON Singapore 2010 Overview
• SEMICON Taiwan & SEMICON Singapore 2011 Features
- Technology Pavilions
- Programs & Events
- Marketing Promotion Opportunities
• SEMICON Taiwan & SEMICON Singapore 2011 Visitor
Promotion

43. Taipei World Trade Center
September 7 to 9, 2011

44. General Information
• Date:
10:00-17:00 Wed., Sept. 8
10:00-17:00 Thur., Sept. 9
10:00-16:00 Fri., Sept. 10
• Co-organizers:
Show Figures
2009 2010 Growth
Number of Exhibiting Companies 520 558 7%+
Booths 1020 1150 13%+
Visitors 19,956 24,365 22%+

45. Results of Visitors
• Visitors of SEMICON Taiwan 2010
- Inotera - Nanya - UMC
- KYEC - ProMos - SilTerra
- Maxchip - Powerchip - SPIL
- MXIC - Renesas - SSMC
- TSMC - AMAT, ASM, Disco, KLA,
Novellus, TEL, etc.
• Influential Visitors – 47% of attendees
were management level or higher
• Highly Qualified Audience – 49% of
attendees influence purchasing decisions
• High Visitor Satisfaction – 97% of
visitors would like to attend future SEMICON
Taiwan events

46. Why SEMICON Taiwan 2011?
• A Supply-Chain Exhibition
• A Technology-based Promotion Platform
• A Cost Effective Solution
• The Connection to the Largest
Semiconductor Community in Taiwan

47. Exhibition Highlights
• Technology Pavilions
– 3D IC & Advanced Packaging/Testing Pavilion
– Parts OEM Pavilion – New!
– LED Pavilion
– Green Management Pavilion
– MEMS Pavilion
– Secondary Market Pavilion
– Advanced Processing Gallery – New!
– Principal/ Representative Program – News!
– CMP Pavilion
– AOI Pavilion
– Compound Pavilion
• Country Pavilions
– Cross Strait Pavilion (starting from USD 2,600!!)
– Korea Pavilion
– Singapore Pavilion
– Scotland Pavilion

48. Technology Pavilions: All-in-One Package
• Ready Exhibit
+
• Innovative Technology
Center
+
• Exclusive Promotion
Programs
& Networking Events
• Connect with Global and
Local Business
Value more than USD 7,000
Have it all at only USD 3,300
each booth now!!
48 2011/3/18

49. Programs & Events
• Program • Networking Events
– Market Briefing – Gala Dinner
– IC Executive Forum – Golf Tournament
– MEMS Forum
– 3D IC Technology Forum • Supplier Search Program
– Green Manufacturing Forum Inviting TSMC, UMC & DRAM
– LED Forum companies in 2011!
More than 50 sessions in 2010!

50. Leadership Gala Dinner
Date: Wednesday, Sep 7, 2011
Location: Grand Hyatt Taipei
More than 400 industry leaders join the
biggest annual gala dinner. It is a great
platform for you to mingle with decision
makers and customers.

51. Gala Dinner Attendee (partial)
Company Guest Name Job Title
Ardentec Corporation Shaulong Chin CTO & Vice Chairman
ASE Ho-Min Tong General Manager & Chief R&D Officer
ASML Tony Chao Managing Director
CREE Inc. Walter Chen
KLA-Tencor Corporation Norman Chang President
KYEC Mike Liang President
Lam Research Corp. Daniel Liao President of Asia Pacific Operations
MACRONIX International Chih Yuan Lu President
Nanya Technology Corp. Steven Shih Director
Powerchip Technology Frank Huang Chairman
Qualcomm Nicholas Yu Vice President, Engineering
Renesas Electronics Takao Akiyama Senior Manager
SPIL Carl Chen Vice President
TOKYO ELECTRON LIMITED Tom Tsuneishi Vice Chairman of the Board
TSMC F. C. Tseng Vice Chairman
UMC Group John Hsuan Vice Chairman & CEO
VIS - Vanguard International Thomas Chang Vice President

52. Taiwan Foundry & DRAM Supplier Search Program
• International leading device
makers – SSMC, SilTerra and Renesas
locate their next new strategic
partners and service providers at
SEMICON Taiwan
• We target to invite TSMC, UMC &
DRAM companies to attend in 2011!

53. SEMICON Golf Tournament
Over 160 guests thumbed up cheerfully to initiate the annual golf
tournament with the mascot of SEMICON Taiwan-Jing Jing.

54. Tournament Player List
No. Name Job Title Company Name
1 R.T. You Director ASE GROUP Chung-Li
2 Lorenzo Hsu Director CHIMEI INNOLUX CORP.
3 Jason Chu Ph.D. INOTERA MEMORIES, INC.
4 Wen-Sen Pan Vice President MXIC
5 Max Lin RD Manager Nan Ya Printed Circuit Board Corporation
6 Pei Ing Lee Senior Vice President Nanya Technology Corp.
7 Alex Wang President Powerchip Technology Corporation
8 Ben Tseng Vice President ProMOS TECHNOLOGIES
9 Matt Nowak Director Qualcomm CDMA Technologies
10 Scott Huang Technical Manager Rexchip Electronics Corp.
11 Samuel Liao Manager Samsung Taiwan Corporation
12 Jerry Chiu Sec. Manager Siliconware Precision Industries Co., Ltd.
13 Steve Tso SVP Taiwan Semiconductor Manufacturing Company, Ltd.
14 Chao Ying-Cheng Senior Director Taiwan Semiconductor Manufacturing Company, Ltd.
15 T. S. Wu FAB Director UMC

55. Suntec Singapore International
Conventional & Exhibition Centre
11– 13 May 2011

56. Show Overview

57. Visitor Analysis - 2010
• 51% of visitors are management level
• 80% of visitors are involved in product selection
Visitors are global leading semiconductor companies including:
3M, AMD, Amkor, Applied Materials, ASE, ASM, A-Star, Fairchild Semiconductors,
Freescale Semiconductors, Globalfroundries, Infineon Technologies, Marvell,
Micron Semiconductors, National Semiconductor, NEC Semiconductors, ON
Semiconductor, Panasonic Semiconductor, PerkinElmer Singapore, Qualcomm,
Renesas Semiconductor, Seagate, Soitec Singapore, StatsChipPAC,
STMicroelectronics, SSMC, UMC, Unisem, UTAC

58. Why SEMICON Singapore
• Gateway to the Southeast Asian semiconductor
manufacturing industry
• World largest Semiconductor back-end
manufacturing
• Biggest Test, Assembly & Packaging (TAP)
market
• Growing Front-end and PV manufacturing

59. SEMICON Singapore 2011 Features
• Theme Pavilions • Networking Events
- Printed Electronics - Opening Ceremony
- LED - Exhibitor Reception
- Speaker’s Luncheon
- MEMS
- SOLARCON • Forum and Conference
– Market Trends Briefing
• Country Pavilions – MEMS
- France – SOLARCON
- Korea – Advanced Packaging
- Malaysia – Product Test Engineering
- Netherlands – Wafer Processing
- Singapore Technology

60. SEMICON Singapore 2011
Technical Conference Agenda
• 11 May 2011 • 12 May 2011
– Market Trends Briefing – SOLARCON – Market and
– MEMS Forum Applications
• Invited speakers: Morgan
Stanley, EDB, Sustainable
• 12 May 2011 Energy Development Authority
– Advanced Packaging – Copper (SEDA), Ministry of Energy
Wire and Mineral Resouces of
Republic Indonesia, Leonics,
• Invited Speakers: ASE, Singapore Intitute of
STMicroelectronics, SPT, Stats Architects, SERIS
Chippac
– Product Test Engineering
• Invited Speakers: IME, FormFactor, • 13 May 2011
Globalfoundries, Verigy, Advantest – Advanced Packaging –
– Wafer Processing Technology – Copper Wire
How to Improve Your Fab • Invited Speakers: Texas
• Invited Speakers: TECH Instruments, KNS, Hitachi,
Semiconductor, m+w Zander, KLA Hereaus, UTAC
Tencor, AMAT

61. Media Exposure
• EE Times Asia
• The Star Online
• Business Times.com
• AsiaOne.com
• Chip Scale Review
• EM Asia
• Advanced Packaging
• Asian Solar
• Compound Semiconductor
• Global SMT & Packaging
• Global SMT & Packaging India
• US Tech
• Recharge
• Business Times (Print Ad)
• Straits Times (Print Ad)

62. Marketing Promotion Opportunities
Various advertising opportunities to help you stand out from the
crowd!
Event Sponsorship -
Marketing Promotion and Advertisement -

63. Visitor Promotion
Visitor 22%
Web
Marketing
On-site Makers &
Attraction IC Design
Visiting
Press
Media
Conference

64. Summary: All-in-One Package
• Turn-Key Exhibit to showcase your solution
• Promotion Channels to enhance your branding
• Networking Events to broaden your connection
• Visitor Promotion to bring you the right customers

65. SEMICON West 2011
July 12-14, 2011
San Francisco, California, USA

66. SEMICON West 2011
• July 12-14, 2011
• Moscone Center, San
Francisco
• 600+ exhibitors
• 30,000+ expected attendance
– 29,423 in 2010
• Industries served:
– Semiconductor
– LED
– MEMS
– Photovoltaic
– Printed/flexible electronics
– Related micro- and nano-
electronics

67. SEMICON West Visitor Profile:
Attending Customers (sample list)
• Altera • Intel • Samsung
• Analog Devices • Intersil • SanDisk
• Atmel • LSI • Sony
• Broadcom • Marvell • STMicroelectronics
• Cypress Semiconductor • Maxim • Sun Microsytems
• Fairchild • Micron • Texas Instruments
• Freescale • National Semiconductor • Toshiba
• GLOBALFOUNDRIES • NEC • TSMC
• HP • Numonyx • UMC
• Hynix • nVidia • Vishay
• IBM • NXP • Xilinx
• Infineon • Qualcomm
• 80% of visitors influence buying decisions, including 37% with final purchasing authority
• 70% of visitors say that SEMICON West influences buying decisions over the next 12
months

68. SEMICON West 2011 Highlights
• Keynotes/Executive Panels
– Tien Wu, ASE
– Luc Van den hove, imec
– Executive Summit
– Investor Conference
• TechZONEs
– Specialized exhibit areas covering:
• 3D IC
• LED, MEMS, printed/flexible electronics
(Extreme Electronics)
• Semiconductor design, EDA, and
manufacturing services
• Secondary equipment and services
• Advanced materials
• Co-located with Intersolar North America

69. Program Highlights
SouthOne Extreme Electronics
• TechXPOTs
– Four stages: two South Hall, two
North Hall
• Keynotes/Executive Panels
• PV Fab Manager's Forum
• SEMI International Standards meetings
and workshops
• Partner Events South Hall
NorthOne NorthTwo
– Gartner/SEMI Market Symposium
– IMAPS/SEMI Packaging Workshops
– ATE Test Vision Workshop
– ITRS meetings
North Hall

70. Special Exhibiting Opportunities
• TechZONE Pavilions
– Design and Manufacturing Services
(Advanced Technology
Manufacturing)
– Advanced Materials
– 3D IC
– Secondary Equipment and Services
– "Extreme Electronics"
• LED
• MEMS
• Printed/Flexible Electronics

71. TechZONE Features/Benefits
Exclusive Features Benefits
• Dedicated pavilion exhibit area • High-traffic exhibit location to
• All-inclusive exhibit display/demo showcase your solutions and
station packages available services
• Company recognition/visibility in • All-inclusive, low cost
pre-show promotions • Identification with critical industry
• Additional company visibility issues and technologies
onsite (signs, advertising) • Inclusion in exclusive pre-show
• Access to exclusive sponsorships and at-show traffic-building
and exhibitor opportunities promotions

72. SEMICON Japan 2011
December 7-9, 2011
Makuhari Messe, Chiba, Japan

73. SEMICON Japan 2011
• December 7-9, 2011
• Makuhari Messe, Halls 1-8
• 1,000+ exhibitors, 2,500 booths
• 70,000+ expected attendance (3 days)

74. SEMICON Japan 2011 Facts
• 35th Year (2011)
• World's largest semiconductor equipment and materials trade show
• New: "Power of Asia"
Front-end Equipment & Parts
Special Exhibits Zone
Combined
Front-end Facility & Materials
Back-end Equipment , Facility & Materials

75. "Power of Asia"
• Exhibits and events focused on Asian markets and
cross-regional cooperation
– Showcase for Asian companies, delegations
– Networking, relationship-building events designed to
strengthen communications and connections between
Asian and Japanese companies
– Information exchange

76. "Power of Asia"
• Power of Asia Event Plans
– Asian Parts Suppliers Pavilion
– Asian Business Development Pavilion
– Asian Manufacturing Services Pavilion
– Power of Asia Presentation Stage
– Keynote
– Seminars/business programs
– "Asian Night" Networking Event

77. Asian Parts Suppliers Pavilion
• Dynamic new exhibiting opportunity connecting Asian parts and
component suppliers with Japanese equipment companies
• Benefits
– Meet with senior buyers from leading Japanese equipment companies
– Presentation stage time
– Private meeting rooms
– Networking lunch
– Open discussion tables
– SPECIAL BOOTH PRICING
Invited Equipment Customers include:

78. Asian Business Development Pavilion
• Exhibiting opportunity for regional government, trade, and
business development organizations to meet Japanese
companies looking to expand/build overseas operations
• Benefits
– Meet with leading Japanese companies
– Presentation stage time
– Private meeting rooms
– Networking party (Asian Night)
– SPECIAL BOOTH PRICING

79. Asian Manufacturing Services Pavilion
• Exhibiting opportunity for semiconductor manufacturing
services companies, including subcontractors, test/packaging
houses, fabless, and foundries to connect with Japanese
customers
• Benefits
– Meet with leading Japanese companies seeking manufacturing services
– Presentation stage time
– Private meeting rooms
– Networking party (Asian Night)
– SPECIAL BOOTH PRICING

80. Special Pricing for SEMICON Japan 2011
"Power of Asia" Pavilions

81. SEMICON Russia 2011
May 31-June 2, 2011
Moscow, Russia

82. Russian market Outlook
• Government initiatives to strengthen the semiconductor
industry in Russia
• Rusnano investing into Semiconductors, PV, Plastic
Electronics and LED
• Sitronics / Mikron to move to 90nm with STM and plans to go
to 65/45nm
• Skolkolov to be built as the Russian “Silicon Valley” near
Moscow
• LED given priority by the government. First fab (Octagon)
being built now.
• Several projects for PV grade polysilicon
• Build-up of a competitive PV industry in planning

83. Profile
• SEMICON Russia
– 1500+ professional attendees
– 30+ countries represented
– 69% of attendees are from the Russian Federation
– 72% represent Management Level
– 180+ exhibiting Companies
• Programs and Events
– Semiconductor Market Forum
– Photovoltaic Market Forum
– TechARENA

84. SEMICON Russia 2011 Focus
• Semiconductor Front-End
• More than Moore
• Packaging
• LED / Solid State Lighting
• SEMI-Grade Poly
• PV-Grade Poly
• PV-Crystalline
• PV-Thin Films
• PV-Modules
• Flexible, Printed, Plastic, Organic electronic and PV
• R&D Projects

85. SEMICON Europa 2011
October 11-13, 2011
Dresden, Germany

86. SEMICON Europe 2011
• Date: 11-13 Oct 2011
• Dresden, Germany
• Co-located with:
Plastic Electronics 2011
Conference and Exhibition
• SEMICON Europa continues to be the most important semiconductor
industry event in Europe
• European market Outlook:
– Investing in advanced technologies
– $6 billion per year to be spent on semiconductor equipment and
materials in both 2011 and 2012
– GLOBALFOUNDRIES and Infineon fabs and 240 related
semiconductor companies nearby

87. Profile
SEMICON Europa Programs are
• SEMICON Europa is an international and pan-European event supported by:
•Altis
– 6000+ professional attendees •Analog Devices
•Bosch
– 50+ countries represented •Colibrys
•CSR (Cambridge Silicon Radio)
– Buying teams and engineers from all major European Fabs •Freescale
•GLOBALFOUNDRIES
– 50% represent Management Level •Infineon
•Intel
– 65% are involved in Product Selection and Purchasing Decisions •IBM
•Lfoundry
•Micron
•Nanium
• 50+ Programs and Events scheduled •Nokia
•Numonyx
– Technology and Business Conferences •NXP
•Osram
– Executive and Networking Events •STMicroelectronics
•Texas
– Free Technology and Standardization Sessions •Instruments
•Thales
•X-Fab
– Educational Courses (CEI Europe)
– Emerging Technologies:
• Plastic Electronics Conference
• Fraunhofer Microelectronics Day

88. SEMICON Europa 2011 Focus
• MEMS/MST Applications / “More then Moore”
• Advanced Packaging and advanced Test
• LED / Solid State Lighting
• Foundries Manufacturing Challenges
• Fab Enhancement and Improvement
• Research and Development (Science Park)
• Country Pavilions (French, Saxony, Scottish and UK, US, …)
• New: Flexible, Organic and Large Area Electronics,
Photovoltaic, Display and Lighting

89. Plastic Electronics 2011
• This is the 7th edition of the Plastic Electronics Conference,
the leading International convention with focus on these new
application and technologies.
• 3 days conference with 600+ attendees from all regions of the
world.
• The leading global Conference and Exhibition for Flexible,
Organic and Large Area Electronics, Photovoltaic, Display and
Lighting.
• The co-location of the two events offer great synergies and
unique opportunities for business and collaboration between
this related disciplines.
• New: Dedicated Exhibition area for Plastic Electronics
Suppliers

90. TOGETHER
WE CAN MAKE A DIFFERENCE
Join Us Today!