The IIC's Smart Manufacturing Connectivity for Brown-field Sensors testbed has completed its first phase, releasing a new white paper and looking onward to further progress and success.

1. SMART MANUFACTURING CONNECTIVITY
FOR BROWN-FIELD SENSORS
Presenter Name
Date

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Testbed at a Glance
For operators of a brown-field manufacturing facility
for discrete goods
who aim at increasing operational efficiencies by
making sensor data available to their upper-level IT
systems and performing advanced analytics
our Smart Manufacturing Connectivity for Brown-
field Sensors Testbed provides a connectivity
solution consisting of a retrofittable hardware and a
consistent sensor data conversion
that allow for quick and easy integration with
existing control systems and IT platforms.
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The Connectivity Challenge (Physical Integration)
Discrete manufacturing systems of today are typically strictly
hierarchically structured with sensors and actuators at their lowest
level. However, performing analytics in the enterprise IT systems
requires the availability of a high volume of data and thus,
transferring sensor all the way up without interfering with normal
operations.
Limitations of the local control units (legacy PLC)
Any sensor data provided to the upper-level IT systems need
to pass the governing local control unit (Programmable Logic
Controllers, PLC). In brown-field facilities, such PLC are often
far from modern and not capable of performing additional
computational tasks on top of the original automation
functions they were intended and programmed to operate.
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Upper-level
IT systems
Control Level
Device Level
PLC
Remote
I/O
Sensors/
Actuators
Remote
I/O
Sensors/
Actuators

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The Connectivity Challenge (Physical Integration)
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Fieldbus /
Industrial Ethernet
How to provide
a high volume* of
sensor data
to the
enterprise IT system?
Option 1 Option 2Discrete Manufacturing Automation System
Source: IO-Link System Description (modified)
Make all data available
though local control unit
 Preferred option for
greenfield installations
(with modern PLC)
 Limited data processing
capabilities of PLC in
brownfield installations
(PLC selected and
programmed to operate
original automation task
only)
Integrate additional
communication into
sensors
 Connect sensors directly
to Ethernet, preferably
wireless and low-energy
 Additional costs are
unacceptable for
low-cost sensors
 Additional space required
is unfavorable for small
sensors
Enterprise
IT System
Ethernet
Local
Control Unit
(PLC)
Actuators &
Sensors
I/O Modules
*as required by
advanced analytics,
machine learning, etc.
Option 3 (Testbed)
Integrate additional
communication into
first aggregation level
 Wired or wireless
connection to Ethernet
 Possible integration of
pre-processing
capabilities, incl.
combination of data from
connected sensors
 Retrofit-able hardware
solution (“Y-Gateway”)
replaces original I/O
module and re-uses
existing cabling

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The Interoperability Challenge (Semantics)
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The lack of standard data models for sensors leads to
a high effort to integrate sensor data within
enterprise IT systems. Plug and play solutions require
a standardized semantics.
Separate data models
Retrieving information from sensors requires converting the
measured values into actual data by applying the specification or a
configuration file delivered by the manufacturer. This mapping needs
to be performed for each type of sensor due to the lack of a common
semantics providing interoperability throughout all levels.

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The Interoperability Challenge (Semantics)
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Fieldbus /
Industrial Ethernet
Discrete Manufacturing Automation System
Source: IO-Link System Description (modified)
Enterprise
IT System
Ethernet
Local
Control Unit
(PLC)
Actuators &
Sensors
I/O Module
Solution
How to deliver
the metadata via
the additional
communication?
Y-Gateway
Define, implement and standardize OPC UA information model extensions
 Additional communication provides data via OPC UA (over TCP/IP)
 Y-gateway runs an OPC UA server
 OPC UA clients can discover the OPC UA server and browse through its interface functions
 IO-Link sensors are delivered with IO-Link Device Description files (IODD), originally intended for
configuration purposes, enabling consistent IODD/OPC UA mappings
 Joint elaboration of OPC UA for IO-Link Companion Standard by IO-Link Community and OPC
Foundation, publication in November 2018
 Testbed delivered input to the standards work and a reference implementation at the same time

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Technical Challenges
Security
Additional
communication path
opens the door to
unauthorized access
and cyber attacks
Real-time
Performance
Spitting data flows
and IO-Link/OPC UA
conversion must not
impact normal
operations
Platform Integration
Implementation of
standardized data
model, consistent
interface with data
source
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The Solution
Connect sensors to the IT systems
• Additional connection between control level and enterprise
IT system by retrofit-able hardware (“Y-Gateway”)
• Re-use available infra-structure (cabling)
• Real-time operations must not be disturbed
Enable easy integration of sensor data with IT
• Consistent mapping from sensor data/configuration to
generic data model
• Communications preserving semantics and thus, sematic
interoperability from the sensor to the IT
Standardized sensor data conversion
• Apply available smart sensor and communications
standards
• Drive standardization of consistent sensor data conversion
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Solution Details
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Edge Tier Enterprise TierPlatform Tier
Sensor
Programmable
Logic Controller
(PLC) Industrial Ethernet
(IE)
Cloud Platform /
Manufacturing Integration
and Intelligence
Applications
• Asset management
• Resource management
• Condition monitoring
• …
Plant Connectivity
(PCo)
IO-Link
OPC UA
Client
API
Visualization
Y-Gateway
IO-Link
Interface
OPC UA
Server
IE
Interface
1. Retrofit-able HW
2. IO-Link/IE
conversion
3. IO-Link/
OPC UA
conversion
Virtual representation
(device data model)
Enterprise Level
Device & Control Level
• Asset management
• Resource management
• Condition monitoring
• …4. Secure
OT/IT connectivity
5. Digital Twin
6. Usage Scenario

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Validation Usage Scenario
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Setup
Monitoring the consumption of compressed
air by a machine or facility, and assessing the
efficiency
• Precise measurement of flow, consumption and
medium temperature by IO-Link compressed air
meter (ifm SD6000)
• Determination of produced volumes by counting
pieces with a laser distance IO-Link sensor (ifm
O5D100)
Compressed air
Produced
pieces
Piece counter
(position sensor)Compressed air meter
1. Y-Gateway/PCo connection via OPC UA
2. Device model implementations in SAP
Cloud and SAP MII
3. Implementation of usage scenario
• Position sensor signal used as trigger for “next
part produced”
• Consumed compressed air is monitored over
time and assigned to produced parts
4. Visualization of results
Implementation Results

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Progress Report
Testbed Approval
Q2/2016
Prototype Completion
Q1/2017
IO-Link/OPC UA Standard Kick-off
Q2/2017
Provision of Deliverables I
Q3/2017
Platform Model & Plugfest
Q4/2017
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Implementation Completion
Q1/2018
Phase I Completion
Q4/2018
• Approval by the IIC Steering Committee
• Y-Gateway prototype available in industrial form factor
• IO-Link/OPC UA conversion specified and implemented
• Specification of requirements by OPC UA Marketing WG under the IO-Link Community
• Establishment of joint Technical WG of the IO-Link Community and the OPC Foundation
• Description of the IO-Link/OPC UA conversion
• Gateway endpoint security threat analysis
• Definition of validation usage scenario
• Implementation of sensor data model in SAP Cloud
• Implementation of validation usage scenario
• Integration with SAP MII
• Provision of final deliverables, release of JoI article and white paper
• Completion of IO-Link/OPC UA Companion Specification
• Latency measurement specification
• OPC UA performance & security considerations

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What’s Next?
Have questions about this
testbed?
Send an email to
Michael.Hilgner@te.com
Completion of Phase I – Initial Implementation (Q4/2018)
• Development of Y-Gateway prototype
• Specification and implementation of IO-Link/OPC UA conversion
• Implementation of validation usage scenario
• Provision of final deliverable (white paper)
Commercialization of Y-Gateway (2019)
• Identification of customer usage scenarios and customers
• Definition of product portfolio and feature sets
• Evolving from prototype level to product delivery
Testbed Phase II – Real Industry Scenario Implementations
• Co-operation with end-use partners
• Multiple instantiations of the proposed solution
• Operation for at least 6 months
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

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The Team
TE Connectivity
Lead
SAP
Sponsor
ifm electronic
Supporting
company
OPC Foundation
Supporting
company
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“Existing automation systems in particular need
retrofittable solutions that minimize downtime,
and increase productivity and thus save costs. The
Smart Manufacturing Connectivity for Brown-field
Sensors Testbed demonstrates the application of a
new connectivity technology, bypassing the local
control unit and transferring a high volume of
sensor data to an enterprise IT system to enable
advanced analytics at platform level.”
Dr. Michael Hilgner, Manager Consortia & Standards,
TE Connectivity
Making a high volume of sensor data
from discrete manufacturing systems
available to the upper-level IT systems
is difficult in brown-field facilities
where the local control units (PLC)
governing the sensors may not be
burdened with additional tasks.
The Problem
Smart Manufacturing Connectivity
for Brown-field Sensors
The Solution
This testbed provides a retrofittable
hardware to facilitate the easy
physical integration with low effort
and low cost and implements a
consistent conversion from IO-Link
to OPC UA which defines a common
semantics to allow for the quick
integration with IT systems.
Key Benefits
• Availability of a high volume of
sensor data at IT level advanced
analytics
• Quick, easy and cost-efficient
retrofit of existing control system
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Key Challenges
• Real-time operations must not be
affected by the retrofit
• Retrofitted hardware and
connection thereto need to
provide appropriate level of
security

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