1. curriculum vitae
Semiconductor with 4 year of Quality development experience and Battery with 2 year of operator development
experience.Both technically focused. I am looking for both career that is challenging and reward.
DETAILS EMPLOYMENT
Eternity technologies
Job Title: Machine Operator
25th
July 13 to Present
Overall responsibility for the company of eternity technologies.
Responsible for the paste mixing and oxide mills.
Negative Paste Mix
Every shift manual leak test and temperature checking.
Mixing using oxide temperature below 55degree Celsius.
Formulas using acid and water mix.
Only used for Sulfuric acid and Demineralised water.
Every batch check for Paste Density and Paste stiffness.
Positive Paste mix
Every shift manual leak test and temperature checking.
Mix using oxide temperature below 55degree Celsius.
Formulas using acid and water mix.
Only used for Sulfuric acid and Demineralised water.
Every batch check for Paste Density and Paste stiffness.
Positive mix used for grey Oxide and Red oxide.
Ball Mills and Oxide mills
Ball caster cooling temperature is 38-48degree Celsius.
Ball size is a height 18-20mm and weight is 60-70grams.
Feed line temperature is 390-440degree Celsius.
Lead pot temperature is 405-455degree Celsius.
Oxide mill is two types of mills 24 ton and 12 ton both mills are ball types use.
Oxide free lead maintain for 28-32 percentage.
Lead Monoxide 68-72 percentage.
Oxide minimum must be 15 hours storage for silo.
Oxide maximum storage 30days only.
P.GOPINATH
14Dec1988,India
Address No.79,GingeeyarNagar
Chekkadikuppan,Melmalaiyanur
Gingee,Villupuram,Tamil Nadu
Mobile 971552064516
E-Mail gopi_5055@yahoo.co.in
Passport J5228385
2. curriculum vitae
Spel Semiconductor
Job Title: Quality control
30th
Sep 09 to 23rd
Jul 13
Overall responsibility for the company of Spel Semiconductor.
Responsible for the FOL.
Quality Control
Maintaining quality standards for process assembly, ensuring stringent to quality standards,norms &
practice,identifying defect & taking corrective action.
Reducing the Process Rejection and Failures by QCTools, SPC and FMEA.
Ensuring IC contininuity and Fuction test and ensure Reliability test for Process.
Ensure ESD in assemble line.
Ensure Wire Pull,Die Shear and Ball shear test must be Die attach and Wire Bonding.
Setup Clearance and Conduction Buy-Off.
ACADEMIC BACKGROUND
Diploma Electronics &
Communication Engineering
Raja Desingh Polytechnic Year Complete:2009
Higher Secondary Goverment Higher Secondary Year Complete: 2007
PROFESSIONAL DEVELOPMENT
Displayed proficiency in analyzing existing process /procedures and conducting critical analysis for find
out short coming and suggesting improvements measures.
An effective communicator with good relationship.
Product quality must be strictly and more production.
Everyone wants to work for a Group.
DECLARATION
I do herebydeclare thatthe particularof informationandfactsstatedhereinabove are true,correctand
complete tothe bestof my Knowledgeandbelief.
Place:Dubai Signature
Date: P.Gopinath