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18
STGB8NC60KD - STGD8NC60KD
STGF8NC60KD - STGP8NC60KD
600 V - 8 A - short circuit rugged IGBT
Features
■ Lower on voltage drop (VCE(sat))
■ Lower CRES / CIES ratio (no cross-conduction
susceptibility)
■ Very soft ultra fast recovery antiparallel diode
■ Short circuit withstand time 10 µs
Applications
■ High frequency motor controls
■ SMPS and PFC in both hard switch and
resonant topologies
■ Motor drivers
Description
This IGBT utilizes the advanced PowerMESH™
process resulting in an excellent trade-off
between switching performance and low on-state
behavior.
Figure 1. Internal schematic diagram
TO-220
D²
PAK
1
2
3
1
3
2
1
3
2
DPAK
1
2
3
TO-220FP
Table 1. Device summary
Order codes Marking Package Packaging
STGB8NC60KDT4 GB8NC60KD D²PAK Tape and reel
STGD8NC60KDT4 GD8NC60KD DPAK Tape and reel
STGF8NC60KD GF8NC60KD TO-220FP Tube
STGP8NC60KD GP8NC60KD TO-220 Tube
www.st.com
Contents STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
2/18
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical ratings
3/18
1 Electrical ratings
Table 2. Absolute maximum ratings
Symbol Parameter
Value
UnitD²PAK
TO-220
DPAK TO-220FP
VCES Collector-emitter voltage (VGE = 0) 600 V
IC
(1)
1. Calculated according to the iterative formula:
Collector current (continuous) at TC = 25 °C 15 7 A
IC
(1) Collector current (continuous) at TC = 100 °C 8 4 A
ICL
(2)
2. Vclamp = 80% (VCES), VGE=15 V, RG=10 Ω, TJ=150 °C
Turn-off latching current 30 A
ICP
(3)
3. Pulse width limited by max junction temperature allowed
Pulsed collector current 30 A
VGE Gate-emitter voltage ±20 V
IF Diode RMS forward current at TC = 25 °C 7 A
IFSM
Surge not repetitive forward current
tp = 10 ms sinusoidal
20 A
VISO
Insulation withstand voltage (RMS) from all
three leads to external hea sink
( t=1 s; TC = 25 °C)
-- -- 2500 V
PTOT Total dissipation at TC = 25 °C 65 62 24 W
Tj Operating junction temperature – 55 to 150 °C
Tscw
Short circuit withstand time
(VCE = 0.5 VBR(CES) , TC = 125 °C, RG = 10 Ω,
VGE = 12 V)
10 µs
Table 3. Thermal resistance
Symbol Parameter
Value
UnitD²PAK
TO-220
DPAK TO-220FP
Rthj-case
Thermal resistance junction-case max
IGBT
1.9 2.0 5.1 °C/W
Rthj-case
Thermal resistance junction-case max
diode
4 4.5 7 °C/W
Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W
I
C
T
C
( )
T
JMAX
T
C
–
R
THJ C–
V
CESAT MAX( )
T
C
I
C
,( )×
------------------------------------------------------------------------------------------------------=
Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
4/18
2 Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 4. Static
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)CES
Collector-emitter
breakdown voltage
(VGE= 0)
IC= 1 mA 600 V
VCE(sat)
Collector-emitter saturation
voltage
VGE= 15 V, IC = 3 A
VGE= 15 V, IC = 3 A, TC = 125°C
2.2
1.8
2.75 V
V
VGE(th) Gate threshold voltage VCE= VGE, IC= 250 µA 4.5 6.5 V
ICES
Collector cut-off current
(VGE = 0)
VCE = 600 V
VCE = 600 V, TC = 125 °C
150
1
µA
mA
IGES
Gate-emitter leakage
current (VCE = 0)
VGE= ±20 V ±100 nA
gfs
(1)
1. Pulse duration = 300 us, duty cycle 1.5 %
Forward transconductance VCE = 15 V, IC= 3 A 1.9 S
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Cies
Coes
Cres
Input capacitance
Output capacitance
Reverse transfer
capacitance
VCE = 25 V, f = 1 MHz,
VGE = 0
380
46
8.5
pF
pF
pF
Qg
Qge
Qgc
Total gate charge
Gate-emitter charge
Gate-collector charge
VCE = 390 V, IC = 3 A,
VGE = 15 V,
(see Figure 20)
19
5
9
nC
nC
nC
Table 6. Switching on/off (inductive load)
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on)
tr
(di/dt)on
Turn-on delay time
Current rise time
Turn-on current slope
VCC = 390 V, IC = 3 A
RG= 10 Ω, VGE= 15 V
(see Figure 21)
17
6
655
ns
ns
A/µs
td(on)
tr
(di/dt)on
Turn-on delay time
Current rise time
Turn-on current slope
VCC = 390 V, IC =3 A
RG= 10 Ω, VGE= 15 V,
TC = 125 °C
(see Figure 21)
16.5
6.5
575
ns
ns
A/µs
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics
5/18
Symbol Parameter Test conditions Min. Typ. Max. Unit
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
Vcc = 390 V, IC = 3 A,
RGE = 10 Ω, VGE =15 V
(see Figure 21)
33
72
82
ns
ns
ns
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
Vcc = 390 V, IC = 3 A,
RGE=10 Ω, VGE =15 V,
TC = 125 °C
(see Figure 21)
60
106
136
ns
ns
ns
Table 7. Switching energy (inductive load)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Eon
(1)
Eoff
(2)
Ets
1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in
a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the
same temperature (25°C and 125°C)
2. Turn-off losses include also the tail of the collector current
Turn-on switching losses
Turn-off switching losses
Total switching losses
VCC = 390 V, IC = 3 A
RG= 10 Ω, VGE=15 V
(see Figure 21)
55
85
140
µJ
µJ
µJ
Eon
(1)
Eoff
(2)
Ets
Turn-on switching losses
Turn-off switching losses
Total switching losses
VCC = 390 V, IC = 3 A
RG= 10 Ω, VGE= 15 V,
TC = 125 °C
(see Figure 21)
87
162
249
µJ
µJ
µJ
Table 8. Collector-emitter diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
VF Forward on-voltage
IF = 3 A
IF = 3 A, TC = 125 °C
1.6
1.3
2.1 V
V
trr
Qrr
Irrm
Reverse recovery time
Reverse recovery charge
Reverse recovery current
IF = 3 A, VR = 30 V,
di/dt = 100 A/µs
(see Figure 22)
23.5
16.5
1.4
ns
nC
A
trr
Qrr
Irrm
Reverse recovery time
Reverse recovery charge
Reverse recovery current
IF = 3 A,VR = 30 V,
TC =125 °C, di/dt = 100 A/µs
(see Figure 22)
39
39
2
ns
nC
A
Table 6. Switching on/off (inductive load) (continued)
Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
6/18
2.1 Electrical characteristics (curves)
Figure 2. Output characteristics Figure 3. Transfer characteristics
Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs
temperature
Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variations
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics
7/18
Figure 8. Normalized gate threshold voltage
vs temperature
Figure 9. Collector-emitter on voltage vs
collector current
Figure 10. Normalized breakdown voltage vs
temperature
Figure 11. Switching losses vs temperature
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current
Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
8/18
Figure 14. Thermal impedance for TO-220/
D²PAK
Figure 15. Turn-off SOA
Figure 16. Forward voltage drop versus
forward current
Figure 17. Thermal impedance for DPAK
Figure 18. Thermal impedance for TO-220FP
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Test circuit
9/18
3 Test circuit
Figure 19. Test circuit for inductive load
switching
Figure 20. Gate charge test circuit
Figure 21. Switching waveform Figure 22. Diode recovery time waveform
Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
10/18
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data
11/18
TO-220 mechanical data
Dim
mm inch
Min Typ Max Min Typ Max
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c 0.48 0.70 0.019 0.027
D 15.25 15.75 0.6 0.62
D1 1.27 0.050
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.051
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
∅P 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
12/18
DIM.
mm.
min. typ max.
A 2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
b 0.64 0.90
b4 5.20 5.40
c 0.45 0.60
c2 0.48 0.60
D 6.00 6.20
D1 5.10
E 6.40 6.60
E1 4.70
e 2.28
e1 4.40 4.60
H 9.35 10.10
L 1
L1 2.80
L2 0.80
L4 0.60 1
R 0.20
V2 0 o 8 o
TO-252 (DPAK) mechanical data
0068772_G
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data
13/18
D²PAK (TO-263) mechanical data
Dim
mm inch
Min Typ Max Min Typ Max
A 4.40 4.60 0.173 0.181
A1 0.03 0.23 0.001 0.009
b 0.70 0.93 0.027 0.037
b2 1.14 1.70 0.045 0.067
c 0.45 0.60 0.017 0.024
c2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 7.50 0.295
E 10 10.40 0.394 0.409
E1 8.50 0.334
e 2.54 0.1
e1 4.88 5.28 0.192 0.208
H 15 15.85 0.590 0.624
J1 2.49 2.69 0.099 0.106
L 2.29 2.79 0.090 0.110
L1 1.27 1.40 0.05 0.055
L2 1.30 1.75 0.051 0.069
R 0.4 0.016
V2 0° 8° 0° 8°
0079457_M
Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
14/18
Dim.
mm. inch
Min. Typ Max. Min. Typ. Max.
A 4.40 4.60 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.017 0.027
F 0.75 1.00 0.030 0.039
F1 1.15 1.50 0.045 0.067
F2 1.15 1.50 0.045 0.067
G 4.95 5.20 0.195 0.204
G1 2.40 2.70 0.094 0.106
H 10 10.40 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.80 10.60 0.385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.90 16.40 0.626 0.645
L7 9 9.30 0.354 0.366
Dia 3 3.2 0.118 0.126
TO-220FP mechanical data
L2
A
B
D
E
H
G
L6
F
L3
G1
1 2 3
F2
F1
L7
L4
L5
7012510-I
Dia
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Packaging mechanical data
15/18
5 Packaging mechanical data
TAPE AND REEL SHIPMENT
D2
PAK FOOTPRINT
* on sales type
DIM.
mm inch
MIN. MAX. MIN. MAX.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
BASE QTY BULK QTY
1000 1000
REEL MECHANICAL DATA
DIM.
mm inch
MIN. MAX. MIN. MAX.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
TAPE MECHANICAL DATA
Packaging mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
16/18
TAPE AND REEL SHIPMENT
DPAK FOOTPRINT
DIM.
mm inch
MIN. MAX. MIN. MAX.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0.795
G 16.4 18.4 0.645 0.724
N 50 1.968
T 22.4 0.881
BASE QTY BULK QTY
2500 2500
REEL MECHANICAL DATA
DIM.
mm inch
MIN. MAX. MIN. MAX.
A0 6.8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3.9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
TAPE MECHANICAL DATA
All dimensions are in millimeters
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Revision history
17/18
6 Revision history
Table 9. Document revision history
Date Revision Changes
02-Oct-2007 1 First release
01-Apr-2008 2 Updated Figure 14 and Figure 17
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
18/18
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Original N-CHANNEL MOSFET GP8NC60KD 8NC60KD 8NC60 15A 600V TO-220 New STMicroelectronics

  • 1. April 2008 Rev 2 1/18 18 STGB8NC60KD - STGD8NC60KD STGF8NC60KD - STGP8NC60KD 600 V - 8 A - short circuit rugged IGBT Features ■ Lower on voltage drop (VCE(sat)) ■ Lower CRES / CIES ratio (no cross-conduction susceptibility) ■ Very soft ultra fast recovery antiparallel diode ■ Short circuit withstand time 10 µs Applications ■ High frequency motor controls ■ SMPS and PFC in both hard switch and resonant topologies ■ Motor drivers Description This IGBT utilizes the advanced PowerMESH™ process resulting in an excellent trade-off between switching performance and low on-state behavior. Figure 1. Internal schematic diagram TO-220 D² PAK 1 2 3 1 3 2 1 3 2 DPAK 1 2 3 TO-220FP Table 1. Device summary Order codes Marking Package Packaging STGB8NC60KDT4 GB8NC60KD D²PAK Tape and reel STGD8NC60KDT4 GD8NC60KD DPAK Tape and reel STGF8NC60KD GF8NC60KD TO-220FP Tube STGP8NC60KD GP8NC60KD TO-220 Tube www.st.com
  • 2. Contents STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 2/18 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
  • 3. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical ratings 3/18 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value UnitD²PAK TO-220 DPAK TO-220FP VCES Collector-emitter voltage (VGE = 0) 600 V IC (1) 1. Calculated according to the iterative formula: Collector current (continuous) at TC = 25 °C 15 7 A IC (1) Collector current (continuous) at TC = 100 °C 8 4 A ICL (2) 2. Vclamp = 80% (VCES), VGE=15 V, RG=10 Ω, TJ=150 °C Turn-off latching current 30 A ICP (3) 3. Pulse width limited by max junction temperature allowed Pulsed collector current 30 A VGE Gate-emitter voltage ±20 V IF Diode RMS forward current at TC = 25 °C 7 A IFSM Surge not repetitive forward current tp = 10 ms sinusoidal 20 A VISO Insulation withstand voltage (RMS) from all three leads to external hea sink ( t=1 s; TC = 25 °C) -- -- 2500 V PTOT Total dissipation at TC = 25 °C 65 62 24 W Tj Operating junction temperature – 55 to 150 °C Tscw Short circuit withstand time (VCE = 0.5 VBR(CES) , TC = 125 °C, RG = 10 Ω, VGE = 12 V) 10 µs Table 3. Thermal resistance Symbol Parameter Value UnitD²PAK TO-220 DPAK TO-220FP Rthj-case Thermal resistance junction-case max IGBT 1.9 2.0 5.1 °C/W Rthj-case Thermal resistance junction-case max diode 4 4.5 7 °C/W Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W I C T C ( ) T JMAX T C – R THJ C– V CESAT MAX( ) T C I C ,( )× ------------------------------------------------------------------------------------------------------=
  • 4. Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 4/18 2 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Static Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)CES Collector-emitter breakdown voltage (VGE= 0) IC= 1 mA 600 V VCE(sat) Collector-emitter saturation voltage VGE= 15 V, IC = 3 A VGE= 15 V, IC = 3 A, TC = 125°C 2.2 1.8 2.75 V V VGE(th) Gate threshold voltage VCE= VGE, IC= 250 µA 4.5 6.5 V ICES Collector cut-off current (VGE = 0) VCE = 600 V VCE = 600 V, TC = 125 °C 150 1 µA mA IGES Gate-emitter leakage current (VCE = 0) VGE= ±20 V ±100 nA gfs (1) 1. Pulse duration = 300 us, duty cycle 1.5 % Forward transconductance VCE = 15 V, IC= 3 A 1.9 S Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Cies Coes Cres Input capacitance Output capacitance Reverse transfer capacitance VCE = 25 V, f = 1 MHz, VGE = 0 380 46 8.5 pF pF pF Qg Qge Qgc Total gate charge Gate-emitter charge Gate-collector charge VCE = 390 V, IC = 3 A, VGE = 15 V, (see Figure 20) 19 5 9 nC nC nC Table 6. Switching on/off (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) tr (di/dt)on Turn-on delay time Current rise time Turn-on current slope VCC = 390 V, IC = 3 A RG= 10 Ω, VGE= 15 V (see Figure 21) 17 6 655 ns ns A/µs td(on) tr (di/dt)on Turn-on delay time Current rise time Turn-on current slope VCC = 390 V, IC =3 A RG= 10 Ω, VGE= 15 V, TC = 125 °C (see Figure 21) 16.5 6.5 575 ns ns A/µs
  • 5. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics 5/18 Symbol Parameter Test conditions Min. Typ. Max. Unit tr(Voff) td(off) tf Off voltage rise time Turn-off delay time Current fall time Vcc = 390 V, IC = 3 A, RGE = 10 Ω, VGE =15 V (see Figure 21) 33 72 82 ns ns ns tr(Voff) td(off) tf Off voltage rise time Turn-off delay time Current fall time Vcc = 390 V, IC = 3 A, RGE=10 Ω, VGE =15 V, TC = 125 °C (see Figure 21) 60 106 136 ns ns ns Table 7. Switching energy (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit Eon (1) Eoff (2) Ets 1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25°C and 125°C) 2. Turn-off losses include also the tail of the collector current Turn-on switching losses Turn-off switching losses Total switching losses VCC = 390 V, IC = 3 A RG= 10 Ω, VGE=15 V (see Figure 21) 55 85 140 µJ µJ µJ Eon (1) Eoff (2) Ets Turn-on switching losses Turn-off switching losses Total switching losses VCC = 390 V, IC = 3 A RG= 10 Ω, VGE= 15 V, TC = 125 °C (see Figure 21) 87 162 249 µJ µJ µJ Table 8. Collector-emitter diode Symbol Parameter Test conditions Min. Typ. Max. Unit VF Forward on-voltage IF = 3 A IF = 3 A, TC = 125 °C 1.6 1.3 2.1 V V trr Qrr Irrm Reverse recovery time Reverse recovery charge Reverse recovery current IF = 3 A, VR = 30 V, di/dt = 100 A/µs (see Figure 22) 23.5 16.5 1.4 ns nC A trr Qrr Irrm Reverse recovery time Reverse recovery charge Reverse recovery current IF = 3 A,VR = 30 V, TC =125 °C, di/dt = 100 A/µs (see Figure 22) 39 39 2 ns nC A Table 6. Switching on/off (inductive load) (continued)
  • 6. Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 6/18 2.1 Electrical characteristics (curves) Figure 2. Output characteristics Figure 3. Transfer characteristics Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs temperature Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variations
  • 7. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics 7/18 Figure 8. Normalized gate threshold voltage vs temperature Figure 9. Collector-emitter on voltage vs collector current Figure 10. Normalized breakdown voltage vs temperature Figure 11. Switching losses vs temperature Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current
  • 8. Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 8/18 Figure 14. Thermal impedance for TO-220/ D²PAK Figure 15. Turn-off SOA Figure 16. Forward voltage drop versus forward current Figure 17. Thermal impedance for DPAK Figure 18. Thermal impedance for TO-220FP
  • 9. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Test circuit 9/18 3 Test circuit Figure 19. Test circuit for inductive load switching Figure 20. Gate charge test circuit Figure 21. Switching waveform Figure 22. Diode recovery time waveform
  • 10. Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 10/18 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
  • 11. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data 11/18 TO-220 mechanical data Dim mm inch Min Typ Max Min Typ Max A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.6 0.62 D1 1.27 0.050 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.051 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137 ∅P 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116
  • 12. Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 12/18 DIM. mm. min. typ max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 5.10 E 6.40 6.60 E1 4.70 e 2.28 e1 4.40 4.60 H 9.35 10.10 L 1 L1 2.80 L2 0.80 L4 0.60 1 R 0.20 V2 0 o 8 o TO-252 (DPAK) mechanical data 0068772_G
  • 13. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data 13/18 D²PAK (TO-263) mechanical data Dim mm inch Min Typ Max Min Typ Max A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 0.295 E 10 10.40 0.394 0.409 E1 8.50 0.334 e 2.54 0.1 e1 4.88 5.28 0.192 0.208 H 15 15.85 0.590 0.624 J1 2.49 2.69 0.099 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.05 0.055 L2 1.30 1.75 0.051 0.069 R 0.4 0.016 V2 0° 8° 0° 8° 0079457_M
  • 14. Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 14/18 Dim. mm. inch Min. Typ Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.017 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.50 0.045 0.067 F2 1.15 1.50 0.045 0.067 G 4.95 5.20 0.195 0.204 G1 2.40 2.70 0.094 0.106 H 10 10.40 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.80 10.60 0.385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.90 16.40 0.626 0.645 L7 9 9.30 0.354 0.366 Dia 3 3.2 0.118 0.126 TO-220FP mechanical data L2 A B D E H G L6 F L3 G1 1 2 3 F2 F1 L7 L4 L5 7012510-I Dia
  • 15. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Packaging mechanical data 15/18 5 Packaging mechanical data TAPE AND REEL SHIPMENT D2 PAK FOOTPRINT * on sales type DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197 BASE QTY BULK QTY 1000 1000 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 TAPE MECHANICAL DATA
  • 16. Packaging mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 16/18 TAPE AND REEL SHIPMENT DPAK FOOTPRINT DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881 BASE QTY BULK QTY 2500 2500 REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476 D 1.5 1.6 0.059 0.063 D1 1.5 0.059 E 1.65 1.85 0.065 0.073 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 1.574 W 15.7 16.3 0.618 0.641 TAPE MECHANICAL DATA All dimensions are in millimeters
  • 17. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Revision history 17/18 6 Revision history Table 9. Document revision history Date Revision Changes 02-Oct-2007 1 First release 01-Apr-2008 2 Updated Figure 14 and Figure 17
  • 18. STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD 18/18 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com