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Inter-DCI and co-packaged optics

Benjamin Wohlfeil's presentation at the EPIC Online Technology Meeting explored how innovation in co-packaged optics is addressing key data center interconnect challenges.

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Inter-DCI and co-packaged optics

  1. 1. Inter-DCI and co-packaged optics March, 2021 EPIC Technology Meeting on Roadmap 2021 for Co-packaged Optics
  2. 2. © 2021 ADVA. All rights reserved. 2 Communication service provider Metro/core distribution and hosting Cloud interconnect Cloud access Synchronization and timing Service delivery and assurance Enterprise Business continuity Disaster recovery Internet content provider Cloud and OTT services Ensemble network management and control ADVA’s solutions
  3. 3. © 2021 ADVA. All rights reserved. 3 Data center architecture Tier 0 Tier 0 Tier 0 … Tier 1 Tier 1 Tier 1 … Tier 2 Tier 2 Tier 2 … Tier 3 Tier 3 … Tier 1 Tier 2 Tier 3 Long-haul: 1000s of km Metro: < 80km Copper cables Active optical cables ≤2km optics ≤2km optics Coherent optics Challenges in DCs • High-speed interface between silicon and optics • I/O power reduction • Faceplate density • Cost reduction So … when do we see CPOs? 25.6T? 51.2T? 102.4T? We see steps in this direction for inter-DCI …
  4. 4. © 2021 ADVA. All rights reserved. 4 Integrated coherent transmit-receive optical sub-assembly • 400Gbit/s coherent module • Solder reflow compatible (BGA) • Includes DP-IQ modulator, DP-Co-Rx, quad-driver, quad-TIA, MCU • 22.5x15x3.6mm footprint • Non-hermetic package • No laser included (yet) • Standardized in OIF OIF-IC-TROSA-01.0 The IC-TROSA – a coherent CPO module
  5. 5. © 2021 ADVA. All rights reserved. 5 How does it compare to the IC-TROSA? • Compact form factor • Need many modules close to switch ASIC (16x8 at 51.2T)1 • Exhaustive • Includes DSP, RF electronics, modulator, receiver, MCU, laser • External multi-λ laser source? • High RF bandwidth • BGA or LGA • Easy cooling • Avoiding thermal crosstalk • Low cost • Simplified assembly Co-packaged optics 116x8 400G Modules DR4 or FR4 for 51.2T switch generation (3.2 Tb/s Copackaged Optics Optical Module Product Requirements Document, OIF)
  6. 6. © 2021 ADVA. All rights reserved. 6 • “Monolithic” integration1 • Surface/edge coupled2 • Etched cavity3 External (FR4 implementation) Integrated Laser integration 1Norman, Justin C., et al. "Perspective: The future of quantum dot photonic integrated circuits." APL Photonics 3.3 (2018): 030901. 2Haglund, Erik, et al. "High-power single transverse and polarization mode VCSEL for silicon photonics integration." Optics express 27.13 (2019): 18892-18899. 3Juvert, Joan, et al. "Integration of etched facet, electrically pumped, C-band Fabry-Pérot lasers on a silicon photonic integrated circuit by transfer printing." Optics express 26.17 (2018): 21443-21454.
  7. 7. Thank you IMPORTANT NOTICE The content of this presentation is strictly confidential. ADVA is the exclusive owner or licensee of the content, material, and information in this presentation. Any reproduction, publication or reprint, in whole or in part, is strictly prohibited. The information in this presentation may not be accurate, complete or up to date, and is provided without warranties or representations of any kind, either express or implied. ADVA shall not be responsible for and disclaims any liability for any loss or damages, including without limitation, direct, indirect, incidental, consequential and special damages, alleged to have been caused by or in connection with using and/or relying on the information contained in this presentation. Copyright © for the entire content of this presentation: ADVA. bwohlfeil@adva.com