Dynamic & Proto Circuits Corporate Presentation.

1. Dynamic & Proto Circuits Inc.
Corporate
Presentation
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2. DAPC Facility
54,000 Sq.ft./6,000 Sq.M
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3. Multilayer Process
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4. Solder Mask Options
BLUE
BLACK
RED GREEN
DRY FILM
CLEAR
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5. Investing in Technology
New equipment to optimize our
production and delivery
capabilities
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6. HASL Machine
The HAL5224 Hot Air Solder Leveling
System is designed to provide the
highest quality solder leveling at high
throughput rates while preserving the
highest reliability and serviceability
standards available.
Argus International has been designing,
building and operating HASL systems
for over a decade. The experience
earned in a decade of dedication to
engineering the HASL process is
evident by the high quality work
produced.
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7. High Speed / Small Hole N/C Drilling Equipment
The Schmoll Drilling
machines have 6 (six)
stations per drilling
machine and allow DAPC
to be more efficient in
drilling panels with a large
volume of vias at a rapid
speed and accuracy. We
are able to mechanically
drill holes as small as 6
mil. This greatly enhances
the efficiency of high mix
low volume production and
mass production quantities
of printed circuit boards.
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8. Mass VCP-5001
Via Plugging
Machine
This machine is designed to
fill holes in printed circuit
boards with conductive or
non-conductive paste. The
hole filling can be performed
with through-hole vias and
blind vias. The machine is
equipped with a full vacuum
chamber and heated heads
to ensure reliable via filling
for the most demanding
aspect ratios and a glass
cover for visual quality
control on both panel sides.
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9. Soldermask Coater
The DP-1500 applies all
types of liquid
photoimageable
coatings, including
soldermask, primary
image, dielectric, and
legend. This versatile
machine incorporates
more than eight years of
experience of dual-sided
coating with many new
features designed to
reduce cycle time,
increase yields and
improve process
reliability.
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10. Technology Roadmaps
Materials and Manufacturing
Capabilities
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11. Technology Roadmap
Attribute Standard Advanced 2012
Minimum Line Spacing, Internal Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”
Minimum Line/Spacing, External Layer 0.005”/.005” 0.003”/0.003” 0.003”/0.003”
Minimum drilled hole size 0.008” 0.006” 0.004”
Aspect Ratio (Thickness to Drill) 8:1 16:1 25:1
Land Size Internal (Diameter over Drill) 0.012” 0.010” 0.010”
Land size External (Diameter over Drill) 0.012” 0.008” 0.008”
No Connect (Diameter over Drill) 0.020 0.016 0.015
Plated Hole Tolerance ± .003” ± 0.002” ± 0.002”
Minimum Laser Via Hole N/A N/A .004”
Laser Via Aspect Ratio N/A N/A 1.5:1
Laser Via Land Size (Diameter Over Drill) N/A N/A 0.008”
Minimum Dielectric Thickness 0.004” 0.003” 0.002”
Minimum core Thickness 0.004” 0.003” 0.002”
Maximum PCB Thickness 0.125” 0.256” 0.256”
Thickness Tolerance (%) 10 7 6
Maximum Board Dimensions 16.5”x22.5” 19.5”x22.5” 19.5”x22.5”
Bow And Twist (Through Hole) % 1.50 1.25 1.00
Bow And Twist (SMT) % 0.75 0.75 0.75
Minimum Conductor to Edge 0.012 0.010 0.008
Layer-To-Layer Registration Tolerance 0.005” 0.004” 0.003”
Component Pitch 0.020” 0.016” 0.010”
Soldermask Clearance 0.005” 0.003” 0.002”
Soldermask Dams 0.004” 0.003” 0.002”
Impedance Tolerance (>50 Ohms) % ± 10 ±5 ±3
Maximum layers 22 36 36
Maximum Copper Weight Internal (oz.) 3 3 3
Maximum Copper Weight External (oz.) 4 5 5
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12. Technology Roadmap continued
Attribute Standard Advanced 2012
Materials
FR4 Yes Yes Yes
High Tg FR4 – (170C..) Yes Yes Yes
BT Epoxy Yes Yes Yes
Polyimide Yes Yes Yes
Teflon Yes Yes Yes
Duroid Yes Yes Yes
RoHS Compliant Materials Yes Yes Yes
Isola FR408 Yes Yes Yes
Nelco N4000-13 Yes Yes Yes
Heatsink Manufacturing and Lamination Yes Yes Yes
Via Construction
Through Hole Yes Yes Yes
Blind (Mechanical) Sequential Lamination Yes Yes Yes
Buried (Mechanical) Yes Yes Yes
Blind Laser No No Yes
Surface Finish
ENIG Yes Yes Yes
OSP Yes Yes Yes
White Tin Yes Yes Yes
HASL Yes Yes Yes
Electrolytic Nickel/Gold Yes Yes Yes
Silver Yes Yes Yes
Quality System
MIL-P-55110 Yes Yes Yes
MIL-PRF-31032 Yes Yes Yes
ISO-9001:2000 Yes Yes Yes
AS9100B Yes Yes Yes
Electrical Test Method
Flying Probe Yes Yes Yes
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13. Substrate Materials
Standard
Dielectric
Constant
Supplier/Material @ Dissipation
Material Type Tg (° .C) 1 MHZ Factor CTE-Z Axis CTE-X & Y Axis
FR-4 Nelco N4000-2 140 4.4 0.027 45 PPM 12-16 PPM
Hi-Temp FR-4 Nelco N4000-6 180 4.4 0.023 37 PPM 10-14 PPM
Modified FR-4 Isola FR408 175-185 3.8 Typ. 0.01-0.015 <55 PPM 13-14 PPM
Modified FR-4 Nelco N4000-13 200 3.9 0.009 35 PPM 10-14 PPM
Hi-Temp FR4 Matsushita R-1755V 180 4.4 0.015-0.022 45 PPM 10-14 PPM
Hi-Temp FR4 Isola IS410 180 4.0 0.015-0.023 65 PPM 11-13 PPM
High Temperature Materials
Dielectric
Supplier/Material Constant @ Dissipation
Material Type Tg (° .C) 1 MHZ Factor CTE-Z Axis CTE-X & Y Axis
BT-Epoxy Isola G200 185 4.1 0.013 140 PPM 15-18 PPM
Cyanate Ester Nelco N8000 250 3.8 0.009 55 PPM 12 PPM
Polyimide Nelco N7000-2V0 260 4.3 0.013 70 PPM 13 PPM
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14. Substrate Materials
High Frequency Materials (core material only)
Supplier/Material Dielectric Dissipation CTE-X HASL Immersion
Material Type Constant Factor CTE-Z Axis & Y Axis Finish? Gold/Tin Finish?
2.75-3.20 +/- 0.0030 @ 10 Yes
TLC Taconic 0.05 @ 10 GHz GHz 70 9-12 Yes
Taconic 2.45-2.65 +/- 0.0019 @ 10 Yes Yes
TLX 0.04 @ 10 GHz GHz 130-145 9-12
Taconic 0.0018 @ 1.9 Yes Yes
RF-35 3.50 @ 1.9 GHz GHz 64 19/24
2.94 +/- 0.04 @ 0.0012 @ 10 No Yes
RT/duroid 6002 Rogers 10 GHz GHz 24 16/16
No Yes
Rogers
RT/duroid 5880 2.20 +/- 0.020 0.0009 237 31/48
3.38 +/- 0.05 @ 0.0022 @ 10 Yes Yes
RO4003 Rogers 10 GHz GHz 46 14/16
3.48 +/- 0.05 0.0040 @ 10 Yes Yes
RO4350 Rogers @10 GHz GHz 50 14/16
6.15 +/- 0.15 @ 0.0025 @ 10
RO3006 Rogers 10 GHz GHz 24 17/17 Yes Yes
2.40-2.60 +/- 0.001 typ @
Ultralam 2000 Rogers 0.04 10 GHz 120 9.5/9.5 Yes Yes
2.50-3.20 @ 10 0.0018-0.0038
AD Series Arlon GHz @ 10 GHz 95 12/15 Yes Yes
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15. North American
Top Tier Customers
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16. Let the DAPC team get started
on your project today!
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