This document provides information on sputtering machines and sources from CFR Management and Administration. It describes several prototype sputtering machines, including ones for depositing transition metal nitrides, multilayer films, and films on roll-to-roll substrates or 3D samples. The machines vary in size and capabilities but generally include magnetrons, power supplies, vacuum systems, gas flow controls, and interfaces for automated control of deposition processes.
2. CFR Management and Administration
Founded in 1993, the Consorzio Ferrara Ricerche (CFR – Ferrara Research Consortium) is a non‐profit organisation
with public and private participation, aimed at the promotion, development and exploitation of human, scientific,
technological and economic resources mainly of the territory of Ferrara. The mission of CFR is to promote and to
manage research, innovation and technology transfer, by offering itself as a decisive and preferential partner for
universities, research centres, public institutions and industrial companies in Italy and abroad, besides acting as a
link between the generators of know‐how, industrial organisations and the working world.
5. [ TRANSITION METAL NITRIDES ]
Sputtering Machine
This prototype is an easy and cheap solution to sputter small samples
to test and research new thin film coatings.
It is composed of two 2” DC planar magnetrons, and a 2” planar magnetron.
The deposition process is set and controlled through a touch screen panel.
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7. The High Vacuum system is composed of:
Stainless steel AISI 304 chamber (316 up on request)
ISO and KF flanges
Two doors for easy sample loading
500 l/s turbo pump and rotary pump
Three 100 sccm mass flow controller for Ar, N2 and other gases
Two 2” DC planar magnetrons
One 2” RF planar magnetron
A Resistive Heater up on request
Two DC power supplies
One RF power supply
Touch screen with customizable software to control and set all the machine processes
Rotating sample holder with 4 plates and one shutter
Operative Specifications (Min value/Max Value):
Power (0.2 kW / 25.0 kW)
Samples diameter (max 50 mm, more up on request)
Sample—shutter distance (10mm/ 100mm)
Sputtering pressure range (3∙10‐3 / 5∙10‐2 mbar)
Gas flow rate Ar and N2 (1.1 sccm / 100 sccm)
Heater temperature (50 °C / 600 °C)
Physical Specifications
Size: 2050mm (H) x 1343mm (W) x 1336mm (D)
Weight ≈ 600 kg
[ TRANSITION METAL NITRIDES ]
Sputtering Machine
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9. [ ROLL TO ROLL ]
Sputtering Machine
This UHV machine is designed for the deposition of getter films onto
alluminium ribbons 500 meters long for solar applications.
There are two 10” DC planar magnetrons of 12 kW total power in
roll to roll configuration.
The deposition process is controlled and set through touch screen panels
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10. UHV system with conflat flanges and bakeout system (up to 250 °C)
for extremely clean deposition conditions: 1∙10‐9 mbar vacuum limit
Completely closed machine: perfect for industrial applications
Extractable roll to roll mechanism for fast and easy ribbon charging
Full automatic process: only one click to empty the chamber
Automatic control of the ribbon: draft and speed are monitored
by load cell and lasers and feedback controlled
Rotating magnets for a uniform target erosion and low flakes production
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11. The Ultra High Vacuum system is composed by:
Stainless steel AISI 304 chamber (AISI 316 up on request)
200, 150, 100, 63, 35 Conflat flanges
Fast entry flange to change the ribbon rapidly
500 l/s turbo pump and rotary pump
100 sccm Argon Mass flow controller
Two 10” magnetrons with rotating magnets 12 kW total power
Two DC 6 kW power supplies
Touch screen with customizable software to control and set up all the machine processes
Roll to roll system composed by 8 rolls
2 lasers and a load cell (for diameter and ribbon draft measurement)
8 zones baking system composed of 32 heater elements
Physical Specifications:
Rack Size: 1900mm (H) x 1100mm (W) x 750mm (D)
Deposition system size: 1700mm (H) x 6000mm (W) x 1500mm (D)
Rack weight ≈ 200 kg
Deposition system weight ≈ 2000 kg
[ ROLL TO ROLL ]
Operative Specifications (Min value/Max Value): Sputtering Machine
Power (0.2 kW / 23.0 kW)
Baking temperature (50°C /300°C)
Pressure limit after baking process1 ( < 1∙10‐8)
Sputtering pressure range1 (4∙10‐3 / 5∙10‐2 )
Gas flow rate (1.1 sccm / 100 sccm)
Ribbon thickness (25 µm / 50 µm )
Ribbon lenght (25 µm: 20m/500m) (50 µm: 20m/250m)
Ribbon speed (0.01 m/min / 2.00 m/min)
Ribbon draft ‐read by load cell‐ (0.1 Kg (recommended 3 kg) / 9 kg (recommended 6 kg))
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This limit is without the ribbon inside the vacuum chamber.
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13. [ TITANIUM NITRIDE ]
Sputtering Machine
This UHV machine provides the deposition of Titanium Nitride films
onto 3D samples.
A sample holder with an epyciclide motion allows a uniform deposition
of the alumina cylinder.
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15.
The High Vacuum system is composed of:
Stainless steel AISI 304 chamber (AISI 316 up on request)
100 l/s turbo pump and scroll pump
100 sccm Argon, Nitrogen Mass flow controller
Two 10” DC planar magnetrons 12 kW total power
Two DC 6 kW power supplies
A RF 1 kW power supply for plasma etching
Rotating sample holder with RF contact for sample pre‐sputtering
Magnetrons are mounted on rails for an easy movimentation
Microbalance for thickness measurements
Operative Specifications (Min value/Max Value):
Power (0.2 kW / 15.0 kW)
Sputtering pressure range (3∙10‐3 / 5∙10‐2 mbar)
Gas flow rate Ar and N2 (1.3 sccm / 100 sccm)
Magnetron Power (max: 6 kW)
[ TITANIUM NITRIDE ]
Sputtering Machine
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17. [ MULTI‐CHAMBER ]
Sputtering Machine
This UHV machine provides the deposition of transition metal nitrides
and oxide coatings; multilayer and co‐sputtering depositions.
Two different deposition chambers allow two different sputtering
processes in the same vacuum process.
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18. Two process chamber
Cluster magnetron for multilayer film deposition
Lift for easy access to the sputtering chamber
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19.
The High Vacuum system is composed by:
Stainless steel AISI 304 chamber (AISI 316 up on request)
Two process chamber
100 l/s turbo pump and scroll pump
100 sccm Ar, N2, O2 mass flow controller
Six 2” DC planar magnetrons
Rotating sampleholder
Cluster with three 2” magnetrons
Magnetron cluster mounted on automatic lift
Operative Specifications (Min value/Max Value):
Power (0.2 kW / 25.0 kW)
Sputtering pressure range (3∙10‐3 / 5∙10‐2 mbar)
Gas flow rate Ar N2 and O2 (1.3 sccm / 100 sccm)
Magnetron Power (max 1000 W, extendible up on request)
[ MULTI CHAMBER ]
Sputtering Machine
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21. [ YBCO ]
Sputtering Machine
A UHV machine for the deposition of YBCO superconductive films on strip samples
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22.
The sputtering deposition is heater assisted for best results
Rectangular Diode Magnetron for uniform thickness deposition
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23.
The High Vacuum system is composed of:
Stainless steel AISI 304 chamber (AISI 316 up on request)
Two doors for easy sample loading
63 l/s turbo pump and scroll pump
100 sccm Argon, Oxigen Mass flow controller
Rectangular DC diode sputtering source 1kW max power
Heater
Operative Specifications (Min value/Max Value):
Pressure limit after vacuum process1 ( < 2∙10‐6 mbar)
Sputtering pressure range (10‐1 / 10 mbar)
Gas flow rate Ar and O2 (1.1 sccm / 100 sccm)
Magnetron Power (100W / 1000W)
[ YBCO ]
Sputtering Machine
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This limit is without samples and other external objects inside the vacuum chamber.
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30. High deposition rate
Excellent film adhesion
Magnetic Filter: no macroparticles on deposited films
Large deposition area
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31. Magnetic Filtered Source:
Target area: 220 cm2
Target fixing: directly on baseplate screwed or brazed
Utilization: up to 60%
Target magnetic confinement: 1 Solenoid
Utilization mode: DC or pulsed DC
Arc Current (max): 600 A
Deposition Rate: 35 nm/s (target SnO2, measured at the filter exit)
Mounting: Custom rectangular flange
Filter: Macroparticles magnetic filter with 2 Solenoids
(the filter can be removed)
[ RECTANGULAR CATHODIC ARC]
PVD Source
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33. [ TRIPLE MAGNETRON CLUSTER ]
Sputtering Source
Triple magnetron cluster is the most suitable system
to deposit compounds starting from two or three different targets
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34. Each magnetron is shuttered in order to deposit selectively from one or two
targets: in this way multilayer growth is possible
Suitable for co‐deposition magnetron sputtering
The three magnetrons are placed at 120 degree angle one to each other
in order to make the system axially symmetric
NdFeB magnets water free
DC or RF powered
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35. Cluster
Mounting: CF200 flange
Flanges: 3 CF100, 4 CF16
Material: Stainless steel AISI 316L
2 inch Planar Magnetron Sputtering Sources
Diameter: 2” (50,8 mm)
Target fixing: on copper baseplate by silver paint or metal eutectic
Utilization: up to 30%
Magnets: NdFeB Balanced or Unbalanced Magnetic field confinement
DC power (max): 1 kW
RF power (max): 500 W
Sputtering Current (max):
3 A
Sputtering voltage: 100‐1000V
Sputtering pressure: 1∙10‐3 mbar to 0,1 mbar
Mounting: CF100 flange
Electrical connector: Lemo type
[ TRIPLE MAGNETRON CLUSTER ]
Sputtering Sources
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37. [ RECTANGULAR MAGNETRON/DIODE ]
Sputtering Source
A cheap solution for strips and rectangular geometry
coatings that require high uniformity thickness
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39.
Rectangular Diode Sputtering Sources
Target size: 300 x 30 x 6 mm
Target fixing: on copper baseplate by silver paint or metal eutectic
Magnets: NdFeB Balanced Magnetic field confinement
Utilization: up to 80% in diode mode
DC power (max): 1 kW
Sputtering Current (max):
3 A
Sputtering voltage: 100‐1000V
Sputtering pressure: 1∙10‐3 mbar to 0,1 mbar
Mounting: CF100 flange
Electrical connector: Lemo type
[ RECTANGULAR MAGNETRON/DIODE ]
Sputtering Sources
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41. [ STANDARD MAGNETRON ]
Sputtering Source
2” diameter planar magnetron with a high
magnetic field provided by permanent magnets
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42. Water cooled
Mounted on a CF 100 flange
Variable target‐substrate distance
A shutter for the target can be optionally mounted
Works with any kind of conductive target
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43.
Rectangular Diode Sputtering Sources
Diameter: 2” (50,8 mm)
Target fixing: on copper baseplate by silver paint or metal eutectic
Utilization: up to 30%
Magnets: NdFeB Balanced or Unbalanced Magnetic field confinement
DC power (max): 1 kW
RF power (max): 500 W
Sputtering Current (max):
3 A
Sputtering voltage: 100‐1000V
Sputtering pressure: 1∙10‐3 mbar to 0,1 mbar
Mounting: CF100 flange
Electrical connector: Lemo type
[ STANDARD MAGNETRON ]
Sputtering Sources
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46. Hard coating and protective and anti‐friction
thin films for metallic pipes
Materials: DLC to transition metals carbides
Strong permanent magnets internal (Fig. on the center)
or external (Fig. on the right)
The cathode create a high plasma confinement along cylinder axis
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47.
Cylindrical Magnetrons
Diameter: from 10 mm to 1000 mm
Length: from 10 mm to 2000 mm
Utilization: up to 80%
Magnets: NdFeB permanent Magnets or solenoid
(Balanced Magnetic field confinement)
DC power (max): function of dimension
Sputtering Current (max):
function of dimension
Sputtering voltage: 100‐1000V
Sputtering pressure: 1∙10‐3 mbar to 0,1 mbar
Mounting: CF, KF or custom designed flange
[ CYLINDRICAL MAGNETRONS FOR OIL INDUSTRIES ]
Sputtering Sources
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49. [ HEATERS ]
IR heater lamp for annealing process
and high temperature coating process
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50. Cylindrical and rectangular geometry
Mounted on a CF 100 flange
Fast heating response
Maximum temperature achievable 800°C
Very low degassing rate during heating
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51.
Circular heater
Sample Diameter (max): 2” (50,8 mm)
Max temperature: 800 °C
Power (max): 500 W
Voltage: 230 V AC
Working pressure: atmospheric pressure to 1∙10‐9 mbar
Mounting: CF100 flange
Termocouple: k type
Rectangular heater
Sample size: 60 x 350 mm
Max temperature: 800 °C
Power (max): 4 kW
Voltage: 230 V AC
Working pressure: atmospheric pressure to 1∙10‐9 mbar
Mounting: CF100 flange
Termocouple: k type
[ HEATERS ]
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53. [ BAKING CONTROLLER ]
3 zone UHV Baking Control
3 independent heating zones
3.3 kW maximum power for each zone
99 hours timer
Thermoresistivity probe PT100 for temperature control
Over‐temperature alarm
Timer/manual operation mode
U.H.V. Baking Control is a complete and easy to use system
to control the baking processes in vacuum chambers
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