Design For Innovation in Manufacturing (DFIM)

The Strategy + Innovation Group LLC | Author: Richard Platt | All Rights Reserved

DFIM™
(Design For Innovation in Manufacturing™)
&
“Innovation Agility”™
Methods
Next Generation Best Practices
in
New Product Development

Presenter:
Richard Platt
[Formerly] Intel - Global Innovation PM & Senior Instructor for Innovation Methods
[Currently] The Strategy + Innovation Group LLC – Principal 1


Agenda Overview
Issues: The Data and Why

The Solution: Renewal NOT Revolution

A Modified Framework for Action

Case Study: Application

2

The Cost of NOT Managing
Variation

100
Proactive Vs Reactive
$
Engineering
Exponential
Change
Notification 10 Cost Growth
[in $1000’s]

1

n
Product Life
n

io

Re eld
g

pe
tio
in

ll
rif n

ct

ca
ty
Ve esig

Fi
Cycle
aw

du
ica

to

o
Dr

o
D

Pr
Pr

Source: Confidential
3

Project Efficiency vs. Effectiveness

Want
to be
Here

4

Most Problems Are Designed In

Manufacturing
Defects 20-30%

Designed in Relative Cost and/or Difficulty
Quality to Correct a Problem
Problems
70-80%

Relative Cost

Concept Design Prototyping Production

The Engineering Functions Have the Biggest Opportunity
To Reduce Quality Problems and Achieve the Lowest Costs
Through the Application of DFSS
5

DFSS Leverage In Product Design
5%
Overhead Cost
Actual 5%
Cost 30% Influence
20%
Labor
15%

Material

50%
70%

5% Design

6

What Methods Enable an Increase in
Speed and Growth?
New Product Development (NPD) investments
should impact:
Speed to market
Profitability

Accelerating NPD
Study of 233 Manufacturing firms
9 different NPD Acceleration approaches

7

Key Results:
Pioneers and Market Creators
Pioneers have emphasis on either speed or profitability,
NPD teams must choose their approach carefully if pioneering
SCI LUI AST DFA TRE SST XFC VOC SOS

1.2 Listening to the
customer / user is
1
both speedy and
0.8 more profitable

0.6
Profitability Beta

No structure for Anything that
0.4
innovation, reduced increases speed
profitability 0.2 is goodness
0
-1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1
-0.2

The Missed -0.4
Opportunity -0.6 Increase speed of
Bureaucratic structures supplier response
-0.8
can’t get speed
-1 Matrixed groups help but still
won’t overcome internal politics
Speed Beta which slows speed 8

How These Tools Compress Costs or
Shorten Innovation Cycles
CE: Concurrent Engineering, tears down the wall between design and
manufacturing, enabling effective communication, even if the design
team is external to the manufacturing group
DFM/A: Product and Process cost reductions
Lean: Process cost reductions
Six Sigma / DFSS: Focus on the right problems to solve, design in more
value to the customer, statistical design employed for more predictable
quality, performance and reliability
Systematic Innovation Methods / TRIZ: Solves the tough problems, the
contradictions that no one else has solved, leaping up the S-curve or
across to another s-curve altogether
Rapid Prototyping: Check your hypothesis’ / concept during NPI, and
sort out via testing and Lead User Involvement
Lead User Involvement: Initial feedback on early product performance
Customer Emphasis (VOC / MOC): Know this information and you setup
your testing during the NPI phase to proactively address potential
opportunities
9

Limits of Continuous Improvement
Methods as Core Competencies
Commoditization of Product and Services is a constant
downward pressure in most businesses
Continued High Risk when your company and your
competitors have stable, repeatable and reliable mfg
processes
Lowest Cost to produce is still an issue, margins at risk
New product features / functionality needed to maintain profitability,
which may be outside of current mfg envelope

Differentiation between different company’s products by
being a customer facing advocate in design
Effective and typical strategy, BUT NOT a long term competitive
advantage, assuming most competitors do the same, or just copy
your features 10

# of Increasing product performance and lower cost to produce
innovations

High

Process Innovation curve

Demand
Driven

Cost
Driven

Low
Product Innovation curve
Time 11

Getting In Front of Your Competitors
# of
innovations

High Process Innovation curve
Demand
Driven Cost
Driven

Pulling-In the development of the
Process Innovation curve to coincide
with the Product Innovation Curve
increases margin sooner, TTP,
shortens TTM, and lowers product
cost with greater performance,
reliability, and functionality than
competitors products or processes
that don’t use this methodology

Low
Product Innovation curve Time 12

The Big Unspoken Issue for
Corporate Managers
Risk and Uncertainty Still Reign
Cost Risk
Market Adoption / Acceptance Risk
Technology Risk
Manufacturing Risk
Design Risk
Test Risk
Integration Risk
Risk De Jour……
CONCLUSION: Decision Making MUST be driven to
the lowest level, and held accountable for
managing the risk and uncertainty
13

Impact of Corp. Infrastructure
Corporate Infrastructure the Impact on Speed, Effectiveness &
Efficiency is degraded, since it:
Slows Down Speed of decision making
Builds in Inefficiencies hamper significant process improvements
Lowers the Effectiveness of Innovation management
Corporation’s Typically are NOT setup to Integrate or Effectively
Exploit Innovation Opportunities
Even profitable ideas don’t make the cut
Political element enters into decision making (away from data driven
decision making – not focused on ROI of current resources)
Inadequate / Insufficient / No resourcing or Training
Momentum and Speed of implementation slowed or stopped
Siloed efforts (not-holistic)
RESULT: Few new Strategies to enable corporation into new markets and
profitability, bureaucracy rules, if the top people, or the processes used
in the middle are allowed to prevail in maintaining the “status quo”

14

Risks and Issues Summarized
Variation between Design intent, the limitations of manufacturing
process envelope and the actual result (output = quality and reliability)
is an exponential cost over time
Individual Project Effectiveness and Efficiency is a balancing act, that
directly impacts speed and profitability
Problems that show up in the field are ‘designed in’ and the cost
contribution is exponential in impact
Continuous Improvement Methods provide benefit, assuming effective
cultural integration / use (Pioneer vs. Market Creator)
Continuous Improvement Methods lose competitive value over time
Coinciding Product and Process Innovation Life Cycles is still
“Undiscovered Country”
Risk and Uncertainty still reigns, continuous improvement or innovation
methods DO NOT fundamentally address this significant gap
Corporate infrastructures and it’s intrinsic decision making, negatively
impacts selection of innovative concepts, starving beneficial projects of
needing funding
15

Are You
Overwhelmed Yet?
If You Aren’t, Then…

YOU ARE NOT
PAYING ATTENTION
16

Sane Responses to the Economic
and Competitive Challenges
Invest in cutting-edge product, capabilities, and
technology initiatives that enhance market share and
market cap.
Deliver products that consistently meet customer,
regulatory, and environmental demands
Translate intellectual property into revenue generating
products quickly.
Monetization of patents is the key metric for measuring
return on innovation.

The Usual Response; “Yeah But…How?”
17


What is Needed Is….
Business and Engineering Processes needs a Renewal NOT a
Revolution- build on strengths that are (for most anyway)
This is not about cultural change that many make the mistake
on, it is about augmenting the product and process engineering
teams with what they already know.
Current Economic conditions dictate need for an agility
framework to overcome the tradeoff of speed, efficiency,
accuracy and effectiveness tying in only the necessary methods
of Lean, TQM, 6 Sigma, Systematic Innovation Methods, and any
other relevant methods that achieve near term results.
Deployed in a fashion that does not overwhelm the receiving
organization. Not a complete Lean, 6 Sigma, or Systematic
Innovation deployment but a phased-in approach

18


Risks and Issues Addressed
Return on Assets (ROA) management of current BU staff, resources and processes
used to achieve results is a MUST do. (ROI of what you have now)
Agile Innovation™ methods streamline the NPI process, “debugging” design and
manufacturing issues. Combining Lean, TQM, 6-sigma and systematic-innovation
methods breaks the tradeoff between Project effectiveness and efficiency
Problems showing up in the field are better addressed real time when using stage
gate After Action Reviews w/ team members during NPI phases, creating solutions to
gaps in the rapid proto-typing phase and regression analysis testing
Virtual Prototyping Tools MUST be used to “test” limits of the manufacturing
envelope and then drive manufacturing and design engineering work as needed
Continuous Improvement Methods MUST be applied intelligently based on the type
of volume and variability of your business.
Rapid Prototyping of new concepts is a MUST do in the virtual space + involving
Lead Users (LUI) getting critical feedback to improve product before market release.
Managing Risk and Uncertainty MUST be managed at the point of occurrence, at the
engineering level; rapid proto-typing in the virtual space, and communication
feedback loops by key team members is required for effective management
BU management, 1-2 layers above design and manufacturing teams are REQUIRED
to be involved in the strategic play of the team, (maximizing resource utilization)
Review and accountability at the BU level of projects and programs, then feeds
Corporate goals and directives. BU management provides “air cover”, not “duck and
cover”

19

Manufacturing: Cost Center or
“Competitive Weapon”?
Common viewpoint of Manufacturing is that it is
cost center, however…
• Both Dell and Intel have demonstrated the advantage of
“manufacturing and design excellence” as a “competitive
weapon”. [author’s experience]
• In the case of BMW turning manufacturing into a profit center.
[author’s research]
• Specifically it has been repeatedly demonstrated that
using DFM/A tools are used as Rapid Prototyping tools,
enabling manufacturing and design to work effectively,
shortening the time to market and lowering product risk and
uncertainty. [author’s experience]

20

21

22


The O-O-D-A “Loop”
Quickly
An Agility Framework
understand
Know what And be able
what’s going
to do to do it
on

Observe Orient Decide Act
Implicit Implicit
Unfolding Guidance Cultural Guidance
& Control Traditions & Control
Circumstances
Genetic
Heritage Analyses &
Feed Synthesis Decision
Observations Feed Feed Action
Forward Forward Forward
(Hypothesis) (Test)
New
Previous
Information
Experience

Outside Unfolding
Information Interaction
With
Unfolding
Environment
Interaction Feedback
With
Environment Feedback
While learning
from the
experience
23


Tying It Together - Observe
OODA DFSS or Lean DFSS or Lean
key concepts taught or level of
Phase OODA aspect Tool Key Purpose Phase depth
Measure competing alternatives,
Environmental Check external Concept
Unfolding watch for changes.  What is the
Observe Scan & Takt Time environments, Development &
Circumstances necessary cycle time to keep up with
/ Cycle time likely demand Set‐Up
demand? Concepts only…
Separate real
Measurement
signal data from Measurement error vs reality,
Systems &
Outside Measurement Concept sample size, probability theory.
Process
Information Error .  Are we Development Variation, mean versus Targets.  Z‐
Capability
capable of hitting Score, Cpk
Analysis
the targets?
Align strengths with opportunities,
Outside Competitive Concept
SWOT Analysis Mitigate weaknesses aligned to
Information Analysis Development
threats
Actions planned
when key metric
Implicit Guidance SPC & Control exceeds action common vs special cause, choose
Control Phase
and Control /Reaction Plans limits.. Test for right reaction!
acceptable
variation

24
The Strategy + Innovation Group LLC | Author: Richard Platt


Tying It Together - Orient
DFSS or Lean
OODA Phase OODA aspect DFSS or Lean Tool Key Purpose Phase key concepts taught or level of depth
Analyze key product
Simplify to key value propositions, list
or service for
them always! Create ordered &
Orient Analysis/Synthesis DFMA & 5S complexity and Design/Analyze
appropriate work areas, only what is
reduce it. Orient
needed
work areas
Analyze potential
product/service risks id & prioritize risks, work to reduce/
Analysis DFMEA Design/Analyze
and plan course of eliminate causes, effects (by redesign)
action
Analyze long term This is a determination of robustness
Analysis Reliability Analysis conformance Design/Analyze looking for a competitive edge over
potential alternatives (competition)
Update expand Y=f(x) power of knowledge, taught only
Regression &
model between at a concept level, most engineers know
Synthesis ANOVA Model Design/Analyze
continuous & this already. batch to batch variability,
Building
discrete variables quick ID of special cause batches
Model Just teach concepts of Sequential DOE,
DOE & Reliability Building/Testing, RSM DOE to find optimums or sweet
Synthesis Design/Analyze
Model Building Model long term spots in the processes / products… quick
conformance finds for operating and destruct limits
Critical Parameter Store and categorize Introduction and show them Cockpit by
Synthesis Design/Analyze
Mgmt system relationships Cognition software

25


Tying It Together - Decide
OODA DFSS or DFSS or Lean key concepts taught or
Phase OODA aspect Lean Tool Key Purpose Phase level of depth
common vs special
SPC & Range of cause, choose right
Hypothesis
Decide Confidence acceptable Design/Analyze reaction!  probability
Test
Intervals variation theory, 67% vs 95% vs
99.7%
Are Means
equal ?  Is
Hypothesis
slope non‐ Tests of significance,
Testing ‐
zero between probability of being
Hypothesis Tools
two Design/Analyze right when deciding.
Test (ANOVA,
variables? Probablistic Decision
Regression,
Are Discrete Making.
Chi‐Square)
variables
independent?

26


Tying It Together - Act
OODA DFSS or Lean DFSS or Lean key concepts taught or level of
Phase OODA aspect Tool Key Purpose Phase depth
Cell design & Cell Designs, pods, efficient supply
Re‐Set for
Act Implement Monument Improve lines, re‐supply, dealing with
maximum value
Management unmovable items

Standard Work Set‐up & Pull
Implement Improve Limits wasted inventory, WIP, etc
& Kan Ban value as needed

Mass customization isn't possible
Shrink without these tools. The more
changeover flexible you want to be, the more
Implement SMED & OEE Improve
downtimes & changeovers you need… Keeping
Optimize Uptime production machinery at
maximum or needed uptimes

In detail but only if they need it.
Test for input‐
DOE, Robust Many companies have in‐house
output
Design, DOE courses, tied to rel. Model
Action/Test Relationships, Optimize/Verify
Reliability Building, find operating and
Durability, Long
Testing destruct limits relative to
Term Durability
competition

27


Key Points:
Key Points:
When you’re doing OODA “loops” right, accuracy
When you’re doing OODA “loops” right, accuracy
and speed improve together; they don’t trade off.
and speed improve together; they don’t trade off.
A primary function of management is to build an
A primary function of management is to build an
organization that gets better and better at these
organization that gets better and better at these
things.
things.

28


Design For Innovation in Manufacturing
(DFIM) Case Study:
Integrated System Level Solution:
Embedded Silicon within a Rigid Heat-pipe Core
Technology

Richard Platt
[Former] SAL (Server Architecture Lab)
Technology Development Program Manager
For Server Board & System’s Technology
All Logo’s and Trademarks are the property of their respective owners 29

DFIM Case Study Example
Background and Trends
A Practical Method for Designing For Innovation in
Manufacturing (DFIM)
Step 1: Issues, Contradictions & Principles
Use DMASI or Template (available w/ proceedings)

Our Step 2: ”Game Changing” Concept Selection
Focus Rapid Proto-Typing Tools Validating Concepts
Today Step 3: S-Curve & TESE
Crossing the Chasm and Moving Up the S-Curve
Step 4: Trends of Evolution Analysis
Comparing Competing Engineering Systems
Step 5: Patent Strength Analysis
Determining Next Steps in development
Step 6: Patent Level Analysis
Determine the Level of contribution to the State of the Art
Summary Conclusion and Q & A
30

The Law of Ideality in Action

Clear Functionality
and Performance
increases

10,000x the performance of a
$1M mainframe in a
$1K desktop in
45 years

1/1,000,000 the size; 1/10,000,000 the weight
1/1,000,000 the cost
10,000,000 X the performance and reliability 31
Courtesy of Intel The Strategy + Innovation Group LLC | Author: Richard Platt | All Rights Reserved

Computational Power

“Moore’s
Law”

32
Courtesy of Hans Moravec The Strategy + Innovation Group LLC | Author: Richard Platt | All Rights Reserved

Moore’s Law & the Law of Ideality
S-Curves are located at every process change & successive generation (from 200mm to 300mm
wafers, from 1.0u to 0.8u, and so on)
MIPS $/MIPS
10000 Pentium® 4 100
Silicon Technology Processor
0.13µ
Pentium ® III

Processor 0.18µ
Pentium® Pro 0.4µ
1000 Processor
0.25µ 10
Pentium® II
Pentium®
0.6µ Processor
Processor
100 1
0.8µ
1.0µ
Intel486TM DX CPU
Microprocessor
10 1.5µ 0.1
Intel386TM DX
Microprocessor MIPS
$/MIPS
1 0.01
1985 1989 1993 1995 1997 1999 2001
“Moore’s Law” correlates to the ‘Law of Ideality’ in TRIZ; Law of Ideality = All engineering systems,
evolve over time, providing greater performance, functionality and benefit at lower cost and have less
detrimental or negative aspects as a part of their design and manufacture.
33
Courtesy of Intel The Strategy + Innovation Group LLC | Author: Richard Platt | All Rights Reserved

Step 1:
Identify Your Gaps and Solve

The Way of Innovation
34

Technology Trend Drivers
#1 TREND: The Increasing # of I/O in Intel
Architecture; according to “Moore’s Law” which
states that the # of transistors doubles on silicon
devices every 18-24 months.
This trend is driving the need for a enabling technologies
to be developed for the individual device, (i.e. wafer
level), as well as at the component level, board level and
system levels to address the scaling challenges.
INVENTIVE SOLUTION NEEDED TO ADDRESS:
Increasing complexity & decrease in size vs. Thermal
management and Manufacturability
(I): Device Complexity vs. (W): Use of energy by stationary Object
And
(I): Area of Stationary Object vs. (W): Object Generated Harmful
Factors

35

Technology Trends Driving the Market
#2 TREND: With the increase in the # of I/O in IA; there are
greater demands for more power for supporting the devices,
especially in the Server and Desktop product spaces
(inventor’s background), as well as in the mobile and
networking product spaces.
Increase in speed vs. Increased need to dissipate thermal energy
(I): Speed vs. (W): Temperature
Increase in thermal energy dissipation vs. small volumetric area.
(I): Use of energy by a Stationary Object vs. (W): Area of Stationary Object

#3 TREND: With the increase in the # of I/O in IA; the pitch
of I/O balls both from die-to-package and package-to-board
is shrinking
Decrease in size vs. Manufacturability
(I): Area of Stationary Object vs. (W): Manufacturing Precision or Ease of
Manufacture
(I): Quantity of a substance vs. (W): Ease of Manufacture or Manufacturing
Precision 36

Getting Over the Limitations
Step 1: Contradictions and Principles = Solutions Do the one thing that
other typical companies can’t do, solve the contradictions, generate concepts, and
then rapid prototype the concepts in the virtual space

Systematic Innovation – http://www.systematic-innovation.com/ 37

Step 1: 1st Set of Contradictions Defined

Matrix+® Software | www.systematic-innovation.com All Logo’s and Trademarks are the property of their respective owners

38

Step 1: 1st Set of Principles Suggested

39

Step 1(cont.): 2nd Set of Contradictions Defined

40

Step 1(cont.): 2nd Set of Principles Suggested

41

Step 1(cont.): 3rd Set of Contradictions Defined

42

Step 1(cont.): 3rd Set of Principles Suggested

43

Step 2: “Game Changing” Concept Selection

略法
The Way of Strategy
44

Companies Use DFM&A to
Achieve 4 Main Goals:
1. Improve their products while reducing cost. Simplifying their
products, improve quality, reduce manufacturing and assembly
costs, and quantify improvements.
2. Increase competitive advantage. They study competitive
products, determine quality and quantify manufacturing and
assembly difficulties, and create superior products.
3. Hold suppliers accountable. They use DFMA as a “should-cost”
tool to predict costs, analyze and discuss supplier bids, and hold
outside suppliers to best practices.
4. Utilize their DFM / A tools as Virtual Rapid-Prototyping
Tools. By taking a slightly more aggressive angle on these tools
they challenge their own notions of what works, what doesn’t, and
where the design actually breaks the mfg / design envelope.
CRITICAL Note: You can redefine the capabilities of a mfg
envelope. But you can only properly evaluate the
envelope’s capability by purposefully and consciously
breaking the DFM & A rules.

45

The Value Add of a VPT
(Virtual Proto-Typing) Tool
"Customers often ask ‘what value does a re-work have for me’,
‘what costs can it save me to follow the findings of your
analysis’
Three different categories:
1. Critical - Impacts product reliability/cost significantly
2. Recommended - Impacts product cost
3. Design Improvement - Impacts product efficiency / documentation
issues

In this way the customer knows exactly what an improvement
or change can help him to achieve"
Source: http://www.evertiq.com/news/14609
46

Profitability of DFM/A
DFM/A manages the mismatch between
design and mfg process envelope, lowering
overall product cost
Proof of DFM/A: (source: Boothroyd Dewhurst Inc)
+100 case studies, actual results of DFMA methods
and software. Taken in composite, these show
how companies have used DFMA to achieve:
Labor costs cut by 42%
Parts reduced by 54%
Assembly time cut by 60%
Product development cycle time reduced by 45%
Cost reduced by 50%

Whitepaper on DFM/A case study benefits, click here

47

Electronics Manufacturing VPT
(Virtual Proto-typing Tool)
Flextronics uses Valor® as a
BKM in managing the
designs that they get from
their customers

Even Flextronics calls it Virtual Rapid
Proto-Typing See Article:
http://www.evertiq.com/news/14609

48

The Key to VPT with Valor®
http://www.valor.com/en/Products/CAM%20-%20Assembly%20(Trilogy).aspx

Valor’s has 2 tools known as
Trilogy®, and Enterprise 3000
software suites

Important to get the Valor
Parts Library, it is the
strongest part of the Rapid
Proto-Typing (RPT) tool kit
provided
It’s an option, thus costs more,
but the overall value you get,
when using the methods
outlined here far outweighs
the costs from an ROI
standpoint
49

Double-Sided Silicon Devices-In-Board (DSSDIB)
– Embedded processors (current component designs
using gold bumps or gold wire) in PCBA’s
w/ rigid cores
MLB: Multi-Layer Board
Bump contact pads
Std Via (10mil drill/ 13mil fin)
Embedded Thermal
µ-Via (4-6mil buried & blind) Heat-pipe
Cu thermal transfer plate

Silicon Device (Processor)

Silicon Device (Processor)

Rigid Core
– Al ?

Silicon device Thermal conductive Adhesive/Grease
Conductive Adhesive
Silver filled Resin or Epoxy
Standard trace for routing on outer layer
Intel Patent Holder: Richard Platt
Technology Development Program Manager
50

Rigid Core
2 Plates A & B > Aligned with Pins > R.C. Through Holes Drilled or molded
> Heat Pipe Cavity > Retainer Rails > Silicon Device cavities

Through Holes Drilled into
Rigid Core

Silicon Cavity

Alignment Pins

Retainer Rails

Note: NOT TO SCALE -- R.C. Thickness TBD
Heat Pipe Cavity Cutaway Drawing Set—Not a manufacturing Flow!
51

Embedded Components
Cu Thermal Plate > Silver Epoxy > Silicon Device
Silicon Device
(Gold Bumped)
Silver Epoxy

Cu Thermal

52

High Density Interconnect Printed
Circuit Board (HDI PCB)
PCB Constructed > PCB mounted to respective half of Rigid Core via alignment
Pins and PCB registration holes

Note: Surface Mount Components Only (includes I/O Connectors)

Bare HDI Foil PCB mounts to
Rigid Core

53

Final Assembly
All Components are S.M.T. > Heat Pipe & Condenser > Side A/B Joined

S.M. Connectors w/
Attachment into R.C.
Side A/B Join
(Registration Apparatus TBD)

Heat Pipe / Condenser
Assembled into core

S.M. I/O Connectors
54

Final Assembled Unit
PCBA and thermal solution are an integrated package
Enhanced electrical performance
Efficient thermal solution
Increased reliability
Low Profile
Lowest Total Cost product

Total Solution space =
70% Mfg & Assy process technologies + 30% product technology

55

Step 3 and 4:
System Evolution and
NEXT step Analysis

The Way of Innovation
56

Chasm Crossing?
Ea

Ea

La
In

La
r

r

te
ly
no

ly

gg
ad

m
m
va

ar
aj
aj
op
to

or

ds
or
rs

te

ity
ity
s r

From the Book “Crossing the Chasm” by Jeffrey Moore

57

Step 3: Advanced TRIZ Methods Used
for Selecting the Best Strategies
S-curve analysis helps to identify an idea’s potential and to match it with
business objectives and available resources

S-curve analysis allows one to understand what to do with a good idea –
it gives recommendations for its strategic development

S-curve analysis and Trends of Engineering System Evolution allow one
to compare alternative ideas and to choose which one is better for the
current environment and resources (analysis of the supersystem)

Trends of Evolutions allows to compare alternative ideas and see what
their strong and weak sides are

58

System Dynamics
The overriding importance of Evolutionary S-curves
Good Measured or Main Parameter of Value

Target
Altered system
Fundamental Limit of Capability

Getting to the Target Requires a
Change to the Eng. System
Solve a contradiction
Use another means
Current system Evolve to other trend stages
Poor
Time

59

1st Stage of the S-Curve: Indicators and Recommendations
Indicators
New system, not yet on market
Components from other systems, rather than custom components
Integrates with super-system elements. The new system must change/adapt to the super-system
Consumes resources not intended for it
Number and magnitude of system modifications increase and then decrease almost to zero (like
Darwin's Law – only the strongest systems win)
System integrates with leading alternative systems
Recommendations
One should work with existing infrastructure and resources
It makes sense to integrate the ES with systems that are leading at the moment
Main efforts should be concentrated on identifying and eliminating bottlenecks that prevent the
system from entering the market
A forecast for supersystem development is required for systems that are in the 1st stage of
evolution
Profound changes in system composition and its components (up to switching to another principle
of operation) are allowed
It makes sense to develop the system with the intention of using it in one specific field - where
the ratio of its advantages and disadvantages that are the most acceptable
It is necessary to analyze physical and super-system limitations of development with the aim of
finding out the degree of promise of an ES 60
60

General Structure of the TESE
Trend of S-curve evolution

Trend of Increasing
Ideality

Trend of Increasing
Trend of Trend of
Completeness of Trend of Increasing
Transition to the Optimization
System Degree of Trimming
Supersystem of Flows
Components

Trend of Uneven
Trend of Elimination Trend of Increasing
Development of
of Human Coordination
System Components
Involvement
Trend of Increasing
Controllability

Trend of Increasing
Dynamicity
61

Risk Assessment of Technology Effort
Technology Evaluation
Criteria Me tric Multiplie r Ra nking Notes / Comments
need to bring in New Processes, such as
HDI-PCB capability, rigid core technology
w/ integrated heat pipes, all SMT solutions
Ease of Manufacturability
for connectors would need to be developed.
Specialty Manufacturing (I have new IP I am generating for that.)
Process Yes = 1; No = 10 1 1
would need to develop a prototype line 1st
Materials stage: lab,
lab = 1, prototype = 3, in house to get the capability up and
prototype, development or
development = 5, production = determine what the costs and issues would
production?
7 1 1 be to dev elop into a HVM line.
HDI is standard technology readily available
Is material specialty or today. Aluminum rigid core can be done
commodity? specialty = 5, commodity = outside --outsourced in the short term.
10 1 10
Comaparitive against one Do not personnaly know of any other
project versus another. approach that attempts a higher level of
Practical (least amount of
Multiplier of other metrics w/in integration with the exception of Sun and
effort for gain achieved)
the technology evaluation IBM as comparitive systems
criteria 1 1
Vendor known yes = 10, no = Grohmann Engineering
known vendor - sole supplier 5. Sole supplier = 5, multiple
suppliers = 10 1 10
Intel IP Y = 10; N = 1. Have IDF's already submitted last year
to x-license from someone
licensing or legal issues
else = 5 Ability to x-license to
others = 10 1 20
Total system cost would be lower and
POR cost = 5, more than enables a more efficient thermal x-fer
cost
POR cost = 1, less than POR mechanism than what is used today. No
cost = 10 1 10 need to entertain refrigeration as a solution
Grohmann Engineering, Fraunhofer Insititute
availability of engineering and others have seen this and believ that it
e
know-how (internal /external / is a viable approach with the manufacturing
none av ailale) internal = 10, external = 5, capabilities that exist today.
none available = 0 1 5
This would have to be a path pursued for a
integration w/ VF
Y = 10, No = 5 1 10 FOF model
R&D resources av ailable Extremely controversial approach, and
(internal/external/none internal = 10, external = 5, requires an new perspective on architecture
available) none available = 0 1 0 and business model
Characteristics of Disruptive
Technology are: simpler,
Is it disruptive technology? cheaper & lower perfoming.
(Will this prov ide signifcant Yes = 1; No = 0, Generally
competitiv e promise lower margins, not
advantage/compelling value higher profits. Yes = 1; No =
add to feature set) 0, Intel's main customer's
can't use the technology and
don't want it Yes = 1; No = 0, 5 X 5 25
IDF submitted Yes = 10; No = 1 1 10 62

EvPot+® Software | www.systematic-innovation.com All Logo’s and Trademarks are the property of their respective owners

Step 4: Current S-O-A of PCBA Technology

Current State – Of the – Art for PCBA Technology

63


Step 4: New S-O-A of PCBA Technology

New State – Of the – Art for PCBA Technology

64

Trend Interaction Effects – Key Rule
Customer Expectation
Knowledge Segmentation
Sense Controllability
System X
Winner-Takes-All Dimensionality
Evolving the
MBP(Var) Human Involvement
system at the
MBP(Sim) Rhythm
highest level… Action
Dynamization

Sub A Sub B Sub C
1
Sub D etc
1 1 1
10 2
10 2 10 2 10 2

9 3 9 3 9 3 9 3

8 4 8 4 8 4 8 4

7 5 7 5 7 5
7 5
6 6 6
6
…may require something to ‘get worse’
Source: Darrell Mann at a lower hierarchical level 65
65
The Strategy + Innovation Group LLC | Author: Richard Platt Richard Platt
The Strategy + Innovation Group LLC | Author: | All Rights Reserved


Step 4:Side By Side Comparison

Current State – Of the – Art for PCBA Technology New State – Of the – Art for PCBA Technology

Showing significant value add using proposed technology
There are clearly more Innovation Trends utilized in the new technology
(EvoPot+ Rating: 40% Old vs. 70% New)
Visual representation aids managers, engineers and end users in decision
making by showing the value-add from a mfg process standpoint, & by
extension potential quality impact issues, product performance and
robustness

66

Conclusions and Results on DFIM™ and
Innovation Agility™
(Systematic Innovation Methods Applied in Design and Manufacturing)

Systematic Innovation methods continue to be
successfully applied in the manufacturing and
process industry
Samsung claims $1B in savings and benefits
Intel results (2002 – 2006) est. $62M - $212M in manufacturing cost
savings and benefits
Process improvements that DFM/A (and other tools)
integrated with Innovation methods provides the
Greatest Unrealized High ROI opportunities for minimizing
risk and uncertainty and helping to attain / sustain true
competitive advantage
CAI (Computer Aided Innovation) Tools alone DO NOT
address the myriad issues of Risk, Uncertainty, or Resource
Management challenges of NPI and market acceptance or
adoption 67

Author’s Bios Program Manager and the
Richard Platt: His previous role was as Intel’s Global Innovation
Senior Instructor for Innovation Methods. He worked for Intel for 10 years in the Design,
Operations, Manufacturing, R&D, Technology Development and IT organizations of Intel. While
at Intel he was awarded an Intel Manufacturing Excellence Award, and 5 Intel Divisional
Recognition Awards, achieving certification as a TRIZ Expert®, a TEN3 Business Coach and as a
Innovation Master® . He’s currently the Principal for The Strategy + Innovation Group LLC, a
Corporate Privateering company, focusing on aiding SME’s (Small & Medium sized Enterprises),
and selected OEM’s using his organization’s competencies in Innovation Management,
Intellectual Property development, Change Agency and conducting Market Insurgencies.
Dr. Sergei Ikovenko: Is one of leading consultants and project facilitators in innovation
technology of design. He has conducted more than 700 courses on innovation and TRIZ
(Theory for Inventive Problem Solving) topics for Fortune 500 companies worldwide. Dr.
Ikovenko was the primary instructor to deliver corporate TRIZ training programs at Procter &
Gamble (about 1,500 engineers trained during 3 years), Mitsubishi Research Institute (300
engineers), Samsung (300 engineers), Intel (200 people) and other companies. He is a primary
Innovation instructor of Siemens Innovation Tool Academy, General Electric Global Research
and TRIZ Innovation Initiative of Hyundai Motor.
Joe Ficalora: is currently the principal of Joe Ficalora & Associates, serving DFSS and Lean Six
Sigma client needs around the globe. He serves as deployment advisor, instructor and DFSS
Master Black Belt at key clients including Medtronics, Fairchild Semiconductor, Boston
Scientific, 3M, Osram-Sylvania, Tyco Electronics, and J & J. Mr. Ficalora was a partner/owner
at SBTI, serving on the Board of Directors for SBTI, Inc., SBTI International, LLC, and
Chairman of the Board for SBTI-China, their most successful global partner in growth and
return on investment. His prior role was Architect and Program Manager for the Master Black
Belt Program, the most profitable service offering for 10 years. He managed instructor
coordination, program and course design, and was also responsible for personal mentoring and
development for each Master Black Belt 68

Who We Are:
The Strategy + Innovation Group LLC
www.sig-hq.com
Sole Proprietorship: A confederation of Innovation and Strategy
Specialists, with expertise in Semiconductor and Electronics assemblies,
systems, processes, technology and physical architecture
Established: September 2006 – Present
A Corporate Privateering company specializing in Innovation Management
and Strategy
Strategy + Innovation Group, LLC (S+I G) works with partner organizations
in business and government to establish, execute, and sustain programs
involving innovation, intellectual property, rapid proto-typing, process
improvement, and organizational change via Change Agents.
S+IG leads identification and selection of innovation projects and
opportunities within and without the client organization to drive both
short and long term business and innovation objectives that result in the
materialization of real ROI.

69

Specific Services Include:
Innovation Infrastructure Development: Corporate and Industrial Innovation as a core
competency is built, cultivated and sustained not hired or bought.
Innovation Instructor “train the trainer” training
Innovation Methods Instruction, Coaching and Mentoring
Innovation Pipeline and Systems Development
Key operational indicators for improving success; “It’s not Failure, it’s Rapid Proto-Typing”
Processes and procedures for Innovation and Intellectual Property Development
Performance management systems

“Change Agency”: Think “Under Cover Boss” who isn’t the boss, but the bosses personal
undercover investigator and advisor who does the same thing.
Change Agent Training: (Executive coaching, training and leadership development, 1:1 and Team
based)
M&A support: (investigation of issues, challenges, obstacles and barriers)
Key Human-resource Investigation: (managing the internal iceberg of resistance to corporate
change initiatives)
Workforce optimization; (Skill analysis, retention and development of both informal and formal
leadership A-list key players for transition in growth or contraction- Development of Corp. Samurai
mind set)
Mediation and Dispute Resolutions (Investigation, Analysis and Advice of root cause issues to assist
teams when and where conflict is seen and unseen )

Corporate Privateering Operations for Hire: Guns for Hire in High-Tech, next generation
alternative to “Red and Blue Ocean” Strategies
Options and Opportunities ONLY discussed with clients on a Need-To-Know basis

70

Thank You For Your Time

71

References
F. Langerak & E.J. Hultnick – IEEE Tr. Engg Mgmt, Feb. 2005
A. Griffin – J. Proc. Innov. Manage., vol. 14, no. 6, 1997b

Contributing Authors:
Joe Ficalora - Joe Ficalora & Associates
Dr. Sergei Ikovenko - GEN3 Partners

72

Appendix
Additional Steps and
Reference Material

73

Summary OF The Issues of NPD
Variation must be managed successfully
Waste must be removed in design and continually in production
Must balance each project to optimize efficiency and effectiveness
You cannot succeed in product or process without innovation
Successful Product Innovation hits the targets, requiring VOC, LUI
Not every tool works in every situation
Success in Markets require speed in decisions & knowledge
Apply the Right tools
To the Right Projects
At the Right Time…

74

Tying It Together: Observe
OODA Phase OODA aspect DFSS or Lean Tool Key Purpose
Unfolding Check external
Observe Circumstances Environmental Scan environments
Separate
Measurement Measurement Error
Outside Information Systems Analysis from real signal data

Outside Information SWOT Analysis Competitive Analysis
Baseline analysis,
Outside Information VSM ID Waste !
Outside Information Time/Motion Study ID Waste !
Actions planned when
Unfolding Interaction Control /Reaction key metric exceeds
with Environment Plans action limits
Actions planned when
Implicit Guidance and Control /Reaction key metric exceeds
Control Plans action limits
75

Tying It Together: Orient
Analyze key product or service for
Orient Analysis DFMA complexity and reduce it

Analyze potential product/service
Analysis DFMEA risks and plan course of action
Analyze long term conformance
Analysis Reliability Analysis potential

Analysis Spaghetti maps analyze transport/travel waste

Takt Time / Cycle time Supply vs demand times
Update expand model between
Synthesis Regression Model Building variables
Update discrete model between
Synthesis ANOVA Model Building variables

Synthesis DOE Model Building/Testing

Synthesis Reliability Model Building Model long term conformance
Synthesis 5S Orient work areas
Store and categorize system
Synthesis Critical Parameter Mgmt relationships

76

Tying It Together: Decide

Decide Hypothesis Test Confidence Intervals Range of acceptable variation

Hypothesis Test SPC Range of acceptable variation

Hypothesis Test ‐ Means
Hypothesis Test ANOVA Are Means equal ?

Hypothesis Test ‐ Slope Is slope non‐zero between two
Hypothesis Test Regession variables?

Are Discrete variables
Hypothesis Test Hypothesis Test ‐ Chi Square independent

77

Tying It Together: Act

Act implement Cell design Re‐Set for maximum value
implement Kan Ban Pull value as needed
implement Monument managing Production Mgmt

shrink changeover
implement SMED downtimes

implement OEE optimum uptime
Test for input‐output
Action/Test DOE Relationships
Determine Durability
outside expected
Action/Test Robust Design environments
Action/Test Reliability Testing Test long term durability
Test for acceptable
Action/Test SPC variation
Validate performance to
Action/Test Capability Assessment expected requirements
Measurement Systems screen validate incoming
ALL ALL Analysis info for validity

78

Criteria Metric Multiplier Ranking Notes / Comments
No cost benefit to BOM,
process, test, silicon or
platform costs = 1 Potential
Unit Cost Impact cost reduction to BOM,
process, test, silicon or
platform costs = 5 Clear cost
benefit to BOM, process, test,
silicon or platform costs = 10 1 10
Technology dramtically
changes the way Intel does
business or introduces more
business risk = 1
Implication to Business Manageable risks and
Model changes to business model =
5 Technology lev erage or
improv es business model or
represetns low / mitigateable
business risk =10 1 1
Technology does not Unknown. W ould need a full in depth
demonstrate a return on finance analyst to investigate this. No
inv estment = 1 Technology resources currently allocated to support
demonstrates a potential
Return on Investment
return on inv estment = 5
Technology demonstrates a
clear return on investment =
10
Yes, since you would dev elop this in-house
and only select one of your customersw to
work with on this to develop the prototypes
Reasonable business risk to prov out the business model and the
e
technology. Business model now mov es to
entire PCB being deliv ered to OEM, end-
Yes = 10; No = 1 1 10 user,

Technology is limited to 1 or
2 products and/or market
segments = 1 ; Technology
can be applied across market
Applicability
segments but is limited to
either cpu or non cpu.= 5
Technology can be applied
across market segments and
cpu and non cpu.= 10 1 10
Technology is limited to 1
generation = 1 ; Technology
can be applied across multiple
generations but limited
Scaleability
segments = 5 ; Technology
can be applied across multiple
generations and segments =
10 1 10
Intel has v ery little control of
I/P = 1 Intel will share
I/P control
technology I/P with supplier =
5 Intel owns I/P = 10 1 10
79

Risk Assessment of Technology Effort
Criteria Metric Multiplier Ranking Notes / Comments
Technology will take 3 to 5
years to develop = 1
Technology maturity/ Time to Technology will take 2 to 4
development years to develop = 5
Technology will take 1 to 3
years to develop = 10 1 1
Technology will have limited
benefit and is really an
extension of existing
technology =1 Technology
Potential benefit
will provide performance or
cost benefit = 5 Technology
will provide performance and
cost benefit = 10 1 10
Technology may have
significant reliable issues.
Will require significant effort
and >4 years develop = 1
Technology may have some
Risk
reliable issues. Will require
moderate effort and 2 to 4
years to develop = 5
Technology may has no
apparent reliable 1 1
52

80

Steps 5 and 6
For Strength & Value

81

Design For Innovation in Manufacturing (DFIM)

Design For Innovation in Manufacturing (DFIM)

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