The document discusses the history and development of micro-optics manufacturing from the 19th century to present day. Key developments include the use of microlenses in color photography in the 1920s, the application of semiconductor manufacturing techniques to micro-optics starting in the 1960s, and the current trend toward wafer-level micro-optics processing and packaging. SUSS MicroOptics is highlighted as a leading supplier of high-quality micro-optics manufactured using 8-inch wafer technology.

1. Wafer-Level Micro-Optics:
Trends in Manufacturing,
Testing and Packaging
Reinhard Voelkel, Kenneth J. Weible, Martin Eisner
SUSS MicroOptics SA, Neuchâtel, Switzerland
voelkel@suss.ch, www.suss.ch
SPIE 8169-12

2. SUSS MicroOptics – We Set The Standards
 World leading supplier of high-quality Micro-Optics
 More than 200 active customers
 Part of the SUSS MicroTec Group (www.suss.com)
Neuchâtel, Switzerland
SUSS MicroOptics is “Preferred Supplier” for Carl Zeiss SMT
DUV Laser Beam Shaping Solutions for ASML Litho Stepper

3. Industrial optics manufacturing
started around 1840
Source: www.wikipedia.org

4. Microscopy and photography
were the technology drivers.
Cameras and binoculars were the
first optical consumer products.
Micro-Optics was not an issue.

5. Gabriel Lippmann (1845 – 1921)
1891 Interference Color Photography
 Wavelength-selective volume holograms
1908 Integral photography
 Auto-stereoscopic method to display 3D
images for observation with the naked eye
1908 Nobel Prize
Source: www.wikipedia.org, www.google.com/patents

6. Walter R. Hess: Stereoscope Images
1912 Parallax Panoramagrams
 Array of cylindrical microlenses for 3D displays
Working as a doctor (Ophthalmologist)
Nobel prize for Physiology
Source: www.google.com/patents

7. Microlens Arrays for Color Photography
1925 “Gaffered film” Paul Fournier
 Microlens arrays on film to separate the color
US Patent 1,746,584,
Source: www.google.com/patents

8. Köhler Integrator – Fly‘s Eye Illumination
Source: www.wikipedia.org, www.google.com/patents

9. Many Innovative Ideas for Micro-Optical Systems
US Patent 1762932, Mihalyi, Fly‘s Eye Condensor for Projector, 1927
US Patent 2018592, Arnulf, 1932 US 2351034 Garbor „Superlens“, 1940
Source: www.wikipedia.org, www.google.com/patents

10. How to
manufacture
Micro-Optics?
Source: www.google.com/patents

11. Maurice Bonnet (1907 – 1994)
ww2.cnam.fr
Maurice Bonnet and the lathe used to
engrave lenticular screens for integral
photography*
*Photo: Coll. Michèle Bonnet from Michel Frizot, “Lenticular screen systems and Maurice Bonnet’s process”, from catalog
of exhibition “Paris in 3D” at Musée Carnavalet, ISBN: 1861541627 (2000)
Source: www.wikipedia.org

12. Jean Hoerni (1924 – 1997): “Planar Process”
1959 Fairchild
Semiconductor
Jean Hoerni at Fairchild
1963 First Karl Süss
Mask Aligner
Source: www.wikipedia.org, www.google.com/patents

13. Computer Generated Holograms
Digital Optics
Planar Optics
Source: www.wikipedia.org

14. Micro-Optics Technology
1971 Josef Hanak, dry etching of holograms
1977 Mike Gale, multi-level diffractive optics
1982 Kenichi, stacked planar optics Stacked planar micro-optics
1985 Zoran Popovich, melting resist microlenses
Melting resist microlenses
Dry-etching of holograms in glass
Multi-Level DOE
Source: www.google.com/patents

15. Ideas and micro-structuring
technology developed in
Semiconductor industry enabled
Micro-Optics manufacturing.
Wafer-Level Micro-Optics!

16. Wafer: SEMI Standards
3-inch (76 mm)
4-inch (100 mm)
150 mm (referred to as "6 inch")
200 mm (referred to as "8 inch")
8’’ Wafer-Technology
300 mm (referred to as "12 inch")
Mask Aligner Coater Plasma Etch Wafer Bonder

17. PHOTORESIST PROCESSING
 A thick resist layer
 Photolithography
 Resist cylinders
 Melting at  150°C.

18. REACTIVE ION ETCHING
 Reactive Ion Etching (RIE)
 Profile shaping by changing etch ratio
 Aspherical profiles with high precision

19. Metrology for Micro-Optics
Manufacturing
Phase profile of a densely packed array of 16-level DOEs
measured in white light profilometer Wyko NT3300

20. Aspherical Microlenses in Fused Silica
Asphere, conic constant k = -1
Comparison of measured lens profile (blue line) to ideal lens profile (dotted line) for
a microlens of 1.08mm lens diameter and 93µm sag height etched in Fused Silica.

21. Aspherical Microlenses in Fused Silica
Deviation of measured lens profile, expressed by a 12th degree polynomial fit, versus
the ideal lens profile. A deviation of 154.8nm (rms) from ideal lens profile is obtained.

22. Uniformity of Photoresist ±0.61% (p-v)

23. High-Quality Diffractive Optical Elements (DOE)
 8‘‘ wafer scale
 190nm to 10µm wavelength range
 0.5 μm min feature size
 < 50nm overlay accuracy
 Binary, 8-level, 16-level
 Upto 98% diffraction efficiency

24. Hybrid Micro-Optics on Wafer-Level
 Refractive Microlens Arrays
 Diffractive Optical Elements (DOE)
 Trenches, posts, grooves, holes
 Full wafer-level integration

25. Hybrid Micro-Optics for Fiber Communication
 Micro-Optical Fiber Coupler for communication industry
(ROADM, WSS, Transceiver...)
 High-quality Micro-Optics for most competitive prices due to
8’’ wafer manufacturing

26. Packaging concepts for systems!
Wafer-Level Packaging (WLP)
Wafer-Level Camera (WLC)
Scheme: Patent WO 2007 030226
Source: Fraunhofer IOF (Jena), www.wikipedia.org, www.google.com/patents

27. Wafer-Level Camera (WLC)
Thin wafer handling
Lens Imprint Litho (SMILE)
Wafer-Level Packaging (WLP)
SUSS MicroTec Mask Aligner: MA/BA8 Gen3
© IOF
Lens Master Thin Wafer Handling Imprint Lithography Wafer-Level Packaging Wafer Dicing
Reinhard Voelkel, Martin Eisner, SUSS © Awaiba

28. Micro-Camera for CMOS imagers
Wafer-Level Packaging (WLC)
NanEye WLC Camera (Awaiba)
for disponible endoscopes
German Research Project COMIKA (2008-2011)
Source: COMIKA, www.awaiba.com

29. Ultra-Flat Cluster Cameras
WALORI (2002 – 2005)
?
Jacques W. Duparre, Peter Schreiber, Peter Dannberg, Toralf Scharf, Petri Pelli, Reinhard Voelkel, Hans-Peter Herzig and
Andreas Braeuer, "Artificial compound eyes: different concepts and their application for ultraflat image acquisition sensors",
Proc. SPIE 5346, 89 (2004); doi:10.1117/12.530208
Source: Fraunhofer IOF (Jena), www.wikipedia.org

30. Micro-Optics in Front-End Lithography
Customized Illumination
Pupil Shaping (DOE)
Now: FlexRay™
programmable illumination
technology from ASML
Customized Illumination
Excimer Laser (193nm)
Laser Beam Shaping
Laser Beam Homogenizing
Diffractive Optical Elements (DOE)
MEMS Mirror Arrays (FlexRay™)
Key Enabling Technology
Microlens Köhler Homogenizer
Source: ASML, Nikon, Canon; www.google.com/patents

31. Advanced Mask Aligner Lithography (AMALITH)
Library of
Illumination
Filter
Plates (IFP)
Microlens Array
MO Exposure Optics (patent pending)
Microlens Optical Integrators
Optical System MA 200

32. AMALITH: Pinhole Talbot Lithography
IFP
Simple pattern change with pixelated
Illumination Filter Plate (IFP)
SUSS Mask Aligner MA6
+ MO Exposure Optics
+ Customized Illumination
+ Pinhole Mask
+ Proximity Gap 66µm
Pinhole Lithography
Multiple „Camera Obscura“
Full-wafer proximity
lithography suitable for
periodic structures.
33

33. AMALITH: Pinhole-Talbot Lithography
Flowers 4 µm
Pitch 5 µm
Resist 2 µm thick
Etching RIE (Bosch) Silicon
Proximity Gap 102 µm
Mask Aligner MA8/BA6
0.8 µm
34

34. AMALITH: Half-Tone Lithography
SUSS Mask Aligner MA6 T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel,
“Half-tone proximity lithography”, Photonics Europe, Conf. on Micro-
+ MO Exposure Optics optics Fabrication Technologies, 7716-34, April 12-16, 2010
+ Customized Illumination
+ Half-tone photomask*
+ Proximity Litho, Gap 10µm
*Half-tone photomask (dot-size 450nm), E-Beam written

35. AMALITH: Blazed Gratings on Wafer-Level
T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel,
“Half-tone proximity lithography”, Photonics Europe, Conf. on Micro-
optics Fabrication Technologies, 7716-34, April 12-16, 2010

36. Solutions for
 Semiconductor Technology
 Industrial Optics & Vision
 Healthcare & Life Science
 Metrology
 Laser & Material Processing
 Optical Communication

37. High-Quality MicroOptics in Wafer-Technology
Refractive (ROE)
Key Enabling Equipment
Technology Semiconductor,
Microlens Arrays Photolithography,
Fiber Coupler Illumination Systems
Diffractive (DOE) Communication
Telecom, Datacom, Fiber
Beam-Shaping Elements Optics, Transceiver,
Mode Scrambler Switches, Camera, MEMS
Packaging Optics, Life Science
Optical Instruments,
8’’ Wafer Technology
Confocal Microscopy,
Wafer-Level Packaging Healthcare, Laser Systems,
Pin-Holes, Crosses, Marks Sensors, Metrology

38. SUSS.
Our Solutions
Set Standards
SUSS MicroOptics SA
Rue Jaquet-Droz 7
CH-2000 Neuchâtel
Switzerland
Tel +41-32-720-5104
Fax +41-32-720-5713
info@suss.ch