ALPHA® OM-350 lead-free solder paste delivers high throughput, while minimizing defects. In today’s competitive electronic assembly marketplace, it’s good to know that ALPHA’s technical expertise is there to help you make the best decision for your SMT application. Contact your local ALPHA representative for more information.

1. ALPHA® OM-350
Lead-Free Solder Paste
What choices are
you making between
throughput and defects?
Pass Fail Have you ever experienced any of
these operational issues in your
assembly process?
OM-350 Competitor • Cold solder joints with
BGA components?
Deposit
Volume
mil3
OM-350 Type 4 Competitive Paste
• Variations in print 500
volume over a 400
range of print 300
200 Min Vol.
speeds? Avg Vol.
100
Max Vol.
0
25mm/sec 100mm/sec
• Paste unable to
withstand high
Soak 150-190°C; 100 sec. air reflow soak reflow
alpha
profiles?
• Paste dripping when used
in paste-in-through-hole
applications?

2. ALPHA® OM-350
Lead-Free Solder Paste
What choices are
you making between
throughput and defects?
100
Tombstone defect (%)
90 OM-350
80 Traditional
70
60 • Passive component
50
40 Tombstones?
30
20
10
High Soak
Components with MCSB (%)
0
x axis y axis x axis y axis
0.2mm shift 0.3mm shift • Mid-chip solder balls? 25 1005 1608 2012
20 0402 0603 0805
15
ALPHA® OM-350 lead-free solder paste delivers high 10
throughput, while minimizing defects. In today’s competitive 5
electronic assembly marketplace, it’s good to know that 0
0.0mm 0.1mm 0.0mm 0.1mm
ALPHA’s technical expertise is there to help you make the Competitor OM-350
best decision for your SMT application. Contact your local
ALPHA representative for more information.
Performance Summary
PROCESS ALPHA OM-350
PERFORMANCE CAPABILITY
STEP ATTRIBUTES
Fine Feature Print Excellent print definition and consistent volumetric performance to 0.3mm (12 mil)
Definition circles and 0.4mm (16 mil) pitch rectangular QFP pads
PRINTING
Stencil Life Excellent Print Volume Repeatability after 4 hours at 33% RH and 66% RH
Print Consistency Repeatable volume deposition and low volume variability (Cp > 2.0) on 12 mil circles
25mm/second to 100mm./second (1 inch/second to 4 inches/second down to
Fine Print Speed Range
PRINT CYCLE 0.3mm (12 mil) circles across 0.10mm to 0.15mm (4 mil to 6 mil) thick stencils
TIME Wet Bridging Up to 5 prints per wipe at 0.4mm (16 mil) pitch with 0.125 mm (5 mil) thick stencil
Resistance >20 prints/wipe at 0.5mm (20 mil) pitch with 0.125mm (5 mil) thick stencil
Vertical Wetting Wetting force stability coefficient > 0.95
Resistance to Defects Resists tombstones and mid-chip solderballs with 0.2 and 0.3mm print/placement shifts
Post Reflow Tackiness Passes JIS Z 3197 Talc Test
Flux Residue Cosmetics No Observed Flux Burn on OSP Copper Finish
REFLOW
YIELD Solder Spread Full coverage of OSP coated pads after exposure to 2 previous reflow cycles
Reduced BGA Pillows after multiple reflow cycles
Random Solderballs Passes IPC TM650 extended test from 4 hours to 24 hours
Resistance to Voids Exceeds requirements of IPC 7095 Class III for low voiding
Slump Resistance Exceeds requirements of IPC J-STD-005 and JIS Z 3284 for hot and cold slump
IPC SIR Pass (7 days 85°C / 85% RH)
Bellcore SIR Pass (96 hours @ 35°C / 85% RH)
ELECTRICAL Bellcore Electromigration Pass (500 hours @ 65°C / 85% RH)
RELIABILITY JIS Electromigration Pass (1000 hours @ 85°C / 85% RH)
HP Electromigration Pass
Worldwide Headquarters • 600 Route 440 • Jersey City, NJ 07304 • USA • +1-800-367-5460 • www.alphametals.com
European Headquarters • Forsyth Road • Sheerwater • Woking GU215RZ • United Kingdom • +44-1483-758-400
Asia-Pacific Headquarters • 1/F, Block A • 21 Tung Yuen Street • Yau Tong Bay • Kowloon, Hong Kong • +852-3190-3100
SM904
© 2006 Cookson Electronics