We are leading manufacturer and supplier of Computer Memory (DRAM / SDRAM) Modules having ISO 9001:2008 Certified Facility in India (Noida near Delhi). We are part of well-known "Om" group having Global Headquarters in Singapore with offices in USA, Singapore, Taiwan, China and India. We also have associates in Australia, UK, Switzerland, Korea, Malaysia, Indonesia and South Africa. Besides these countries the group also have customers in Brazil, Canada, Spain, Italy, Greece, Dubai, Saudi Arabia, Russia, Egypt, New Zealand, Nepal, Thailand etc. For more information please visit : http://www.om-nanotech.com

1. MICRON'S PRODUCT RANGE BY OM-NANO TECH. (WE ARE DIRECT WITH MICRON)

3. DRAM MODULES.

4. NAND FLASH.

5. NOR FLASH.

6. SOLID STATE STORAGE.

7. PHASE CHANGE MEMORY.

8. MULTI-MEDIA CHIPS.

9. DRAM

11. DDR SDRAM.

12. DDR2 SDRAM (DDRII SDRAM).

13. DDR3 SDRAM (DDRIII SDRAM).

14. RLD RAM

15. MOBILE LPSDR.

16. MOBILE LPDDR.

17. MOBILE LPDDR2.

18. PS RAM.

19. CELLULAR RAM

20. SDRAM

22. Micron is having one of the broadest SDRAM offerings in the industry. Several densities; extended operating temperatures; and various clock rates, cycle times, and package types make it easy to get just what you need—it’s a relatively simple, cost-effective, and easy-to-implement memory option for both new and existing designs.

23. Micron's SDRAM comes in different Packages,Density,Depth,Width type :-

24. Density :- 512Mb.256Mb,64Mb,128Mb.

25. Depth :- 128Mb,16Mb,2Mb,32Mb,4Mb and 8 Mb.

26. Width :- x4, x8 , x16 and x32.

27. Voltage :- 3.3V.

28. Package :- TSOP,VFBGA,FBGA.

29. Pin Configuration :- 54 Pin, 54 Ball,60 Ball,90 Ball,86 Pin.

30. PART NO. INFO.

31. DDR CHIPS

33. It is a revolutionary and pioneering technology—enabling applications to transfer data on both the rising and falling edges of a clock signal—and vastly improving performance over SDRAM. And because DDR continues to be an ideal choice for many new designs, we’re committed to supporting it for the long term.

34. Micron's DDR SDRAM comes in different Packages,Density,Depth,Width type :-

35. Density :- 512Mb,1GB,256Mb.

36. Depth :- 16Mb,32mb,64Mb,128Mb and 256Mb.

37. Width :- x4, x8 , x16.

38. Voltage :- 2.5V and 2.6V

39. Package :- TSOP,DIE,FBGA and wafer

40. Pin Configuration :- 60 Ball,66Ball,54Ball

41. PART NO. INFO.

42. DDR2 SDRAM

44. A wide array of capabilities makes our DDR2 an excellent memory choice for the diverse needs of many applications—from automotive and industrial to server, consumer, networking, and computing.

45. Micron's DDR2 SDRAM comes in different Packages,Density,Depth,Width type :-

46. Density :- 512Mb,1GB,256Mb,2GB,4GB.

47. Depth :- 16Mb,32mb,64Mb,128Mb and 256Mb and 512Mb.

48. Width :- x4, x8 , x16.

49. Voltage :- 1.5V and 1.8V

50. Package :- FBGA and V-FBGA

51. Pin Configuration :- 84Pin and 84 Bal, 60Ball, 63 Ball.

52. PART NO.INFO.

53. DDR3 SDRAM

55. DDR3 supports data rates of 1066 to 1600 MT/s, with clock frequencies of 533 to 800 MHz, respectively—effectively doubling the speed of DDR2. DDR3's standard 1.5V supply voltage cuts power consumption by up to 30% over DDR2.

56. Micron's DDR3 SDRAM comes in different Packages,Density,Depth,Width type :-

57. Density :- 1GB,2GB, and 4GB.

58. Depth :- 64Mb,128Mb and 256Mb and 512Mb AND 1 GB

59. Width :- x4, x8 , x16.

60. Voltage :- 1.35V and 1.5V

61. Package :- FBGA.

62. Pin Configuration :- 78 Ball, 82 Ball , 86 Pin, 96 Ball

63. PART NO. INFO.

64. RLDRAM

66. Our reduced-latency DRAM (RLDRAM- memory) is a high-performance, high-density memory solution that offers fast SRAM-like random access and outpaces even leading-edge DDR3 for sustained high bandwidth.

67. Micron's RLDRAM comes in different Packages,Density,Depth,Width type :-

68. Density :- 256Mb, 288Mb, 576Mb etc.

69. Depth :- 16Mb,32Mb,4Mb,8 Mb and 64Mb.

70. Width :- X9 , X18 , X16

71. Voltage :- 1.8V

72. Package :- FBGA and µ BGA.

73. Pin Configuration :- 144 Ball

74. PART NO. INFO.

75. LPDARM

77. Micron's Mobile LPDRAM is built to consume less power without sacrificing performance. It uses a JEDEC-standard 1.8V I/O power supply—1.2V for LPDDR2—which enables low standby current and low self refresh and extends battery life.

78. Micron's LPDRAM comes in different Packages,Density,Depth,Width type :-

79. Density :- 512Mb,256Mb,64Mb,128Mb,1GB,2GB,4GB.

80. Depth :- 128Mb,16Mb,32Mb,4Mb,64 Mb,8 Mb.

81. Width :- x16 , x32, x64

82. Voltage :- 1.2V,1.8V,2.5V,3.3V ,1.8V.

83. Package :- VFBGA,POP

84. PART NO. INFO.

85. PSRAM ( PSEUDO RAM )

87. This hybrid memory delivers the best of SRAM and DRAM Features, Combining low power consumption and high speed Read and Write Functions.

88. Because CellularRAM memory also offers synchronous operations, fast access, and variable latency initial burst access, you get high throughput and excellent performance. It's an ideal solution for low-power, space-limited designs like MCPs, as well as mobile and industrial applications.

89. Micron's PSRAM comes in different Packages,Density,Depth,Width type :-

90. Density :- 4Mb,8Mb,16Mb,32Mb,64Mb,128Mb.

91. Depth :- 256k,512k,1Mb,2Mb,4Mb,8Mb.

92. Width :- x16

93. Voltage :- 1.7V - 3.6V

94. Package :- VFBGA.

95. Pin Count :- 48 Ball and 54Ball.

96. PART NO. INFO.

97. DRAM MODULES

99. RDIMM.

100. VLPRDIMM

101. UDIMM.

102. SODIMM.

103. SOC DIMM.

104. SOR DIMM.

105. VLP SOR DIMM.

106. MINI RDIMM.

107. VLP MINI RDIMM.

108. FBDIMM

110. Fully Buffered DIMM Architecture introduces an Advanced Memory Buffer ( AMB ) between the memory controller and the memory module.

111. Micron's FBDIMM technology solves server challenges for you—and for your customers. Micron's high-speed, high-density FBDIMMs can give you virtually unlimited scalability of density and high-bandwidth solutions, all with an extremely reliable channel protocol.

112. Micron's FBDIMM MODULE comes in different Packages,Density,Depth,Width type :-

113. Density :- 512MB,1GB,2GB,4GB,8GB

114. Depth :- 128Mb,256Mb,512Mb,64Mb.

115. Width :- x72

116. Voltage :- 1.5V

117. Pin Count :- 240 Pin.

118. PART NO. INFO .

119. RDIMM

121. Micron's RDIMMs are built with what may be the industry’s most reliable memory components. RDIMM features like registers, buffers, and ECC help ensure data integrity at both the device and the system level.

122. Micron's RDIMM MODULE comes in different Packages,Density,Depth,Width type :-

123. Density :- 64Mb, 256Mb,512MB,1GB,2GB,3GB

124. Depth :- 128Mb,256Mb,512Mb,64Mb and 32Mb.

125. Width :- x72

126. Voltage :- 1.8V

127. Pin Count :- 240 Pin.

128. PART NO. INFO.

129. VLPRDIMM

131. Micron’s high density, DDR , DDR2, and DDR3 VLP RDIMMs significantly boost overall telecom, networking, and computing blade server memory capacities while remaining compatible with existing RDIMM sockets. These VLP RDIMMs are available in 512MB-to-8GB densities.

132. Micron's VLPRDIMM MODULE comes in different Packages,Density,Depth,Width type :-

133. Density :- 512MB,1GB,2GB,4Gb and 8Gb.

134. Depth :- 128Mb,256Mb,512Mb,64Mb.

135. Width :- x72

136. Voltage :- 1.8V, 1.35V, 2.5V

137. Pin Count :- 184 Pin and 240 Pin.

138. PART NO. INFO.

139. UDIMM

141. Our DDR2-1066 and DDR3-1333 memory boasts some of the fastest data rates in the business—easily meeting industry demand for increased speeds and improved bandwidth. And because of our manufacturing efficiencies, the DDR2 and DDR3 UDIMMs we build offer some of the most compelling value in the industry today.

142. Micron's UDIMM MODULE comes in different Packages,Density,Depth,Width type :-

143. Density :-32Mb,64Mb,128Mb, 512MB,1GB,2GB,4Gb.

144. Depth :- 4Mb,8Mb,32Mb,64Mb,128Mb,256Mb,512Mb.

145. Width :- x64

146. Voltage :- 1.5V,1.8V, 2.5V,2.6V,3.3V.

147. Pin Count :-100 Pin, 168Pin,184 Pin and 240 Pin.

148. PART NO.INFO.

149. SODIMM

151. We work with motherboard manufacturers to validate our SODIMMs and support a wide array of mobile computing platforms. In particular, Intel has certified us to run qualification tests for Intel-based motherboards, ensuring that a Micron memory solution like our DDR3 SODIMMs will work with the motherboard you select. These tests match Intel’s Full & Basic Functional Test Procedures.

152. Micron's SODIMM MODULE comes in different Packages,Density,Depth,Width type :-

153. Density :- 64Mb,128Mb, 512MB,1GB,2GB,4Gb.

154. Depth :- 4Mb,8Mb,16mB,32Mb,64Mb,128Mb,256Mb,512Mb.

155. Width :- x64

156. Voltage :- 1.5V,1.8V, 2.5V,2.6V,3.3V.

157. Pin Count :- 144 Pin, 200Pin, 204Pin

158. PART NO. INFO.

159. SORDIMM

161. Micron have developed our SORDIMMs with the networking and communications industries in mind. They understand that these applications demand low latency, small memory footprints, pristine signal integrity, and stringent thermal specifications. And our SORDIMMs deliver--the right specifications and great reliability in a compact form factor.

162. Micron's SORDIMM MODULE comes in different Packages,Density,Depth,Width type :-

163. Density :- 512MB,1GB,2GB,4Gb.

164. Depth :- 64Mb,128Mb,256Mb,512Mb.

165. Width :- x72

166. Voltage :- 1.8V

167. Pin Count :- 200Pin

168. PART NO. INFO.

169. MINI DIMM

171. With Micron's Mini-DIMMs, Customers get all the benefits of our DRAM design and manufacturing expertise plus the high-quality test methodology—enabling the clients to design smaller form factor routers, switches, bridges, and hubs that can deliver peak performance.

172. Micron's MINI-DIMM MODULE comes in different Packages,Density,Depth,Width type :-

173. Density :- 512MB,1GB,2GB,4Gb.

174. Depth :- 64Mb,128Mb,256Mb,512Mb.

175. Width :- x72

176. Voltage :- 1.8V

177. Pin Count :- 244Pin

178. PART NO. INFO.

179. VLP Mini - DIMM

181. At the heart of these modules is some of the world’s most advanced DRAM technology—designed so that your router, hub, switch, or bridge can be faster, smaller, and much more reliable. In fact, the VLP Mini-DIMM is specifically made for networking. And Micron was the first memory maker to offer the VLP Mini-DIMMs that are now an industry standard.

182. Micron's MINI-DIMM MODULE comes in different Packages,Density,Depth,Width type :-

183. Density :- 512MB,1GB,2GB,4Gb.

184. Depth :- 64Mb,128Mb,256Mb,512Mb.

185. Width :- x72

186. Voltage :- 1.8V

187. Pin Count :- 244Pin

188. PART NO. INFO.

189. NAND FLASH

191. SERIAL NAND

192. ENTERPRISE NAND

193. HIGH SPEED NAND

195. With Micron's High-Speed NAND Flash memory, Customers designs will achieve ultra-fast access times, transferring content between devices like computers, digital cameras, MP3 players, and cell phones much faster than standard SLC NAND.

196. Micron's High Speed NAND FLASH comes in different Packages,Density,,Width type :-

197. Density :- 8GB,16GB and 32GB.

198. Width :- x8

199. Voltage :- 3.3V

200. Package :- VFBGA

201. Pin Count :- 100 Pin

202. PART NO. INFO .

203. ENTERPRISE NAND

205. Enterprise NAND is a high-endurance NAND product family optimized for intensive enterprise applications. Breakthrough endurance, coupled with high capacity and high reliability (through low defect and high cycle rates), make Enterprise NAND an ideal storage solution for transaction-intensive data servers and enterprise SSDs

206. Micron's Enterprise NAND FLASH comes in different Packages,Density,,Width type :-

207. Density :- 64Mb,128Mb,256Mb..

208. Width :- x8

209. Voltage :- 3.3V

210. Package :- VBGA,TBGA,FBGA

211. Pin Count :- 100 Ball.

212. PART NO. INFO.

213. SERIAL NAND

215. With four times or more the density of SPI NOR, Serial NAND is a great alternative to NOR for many embedded designs. And since Serial NAND has the lowest cost-per-megabit of any serial Flash solution, it’s also a great way to lower your BOM cost.

216. Micron's Serial NAND FLASH comes in different Packages,Density,,Width type :-

217. Density :- 1GB

218. Width :- x1

219. Voltage :- 3.3V

220. Package :- VFBGA

221. Pin Count :- 63 Balls.

222. PART NO. INFO.

223. NOR FLASH

225. SERIAL NOR FLASH.

226. PARALLEL NOR FLASH

228. Today’s applications demand an unprecedented combination of features—high performance, high density, high reliability, and low-power operation. Strike a balance among performance needs, design requirements, and cost by equipping your demanding platforms with our reliable, high-performance parallel NOR.

229. Micron's parallel NOR solutions are constructed to meet the design requirements of consumer and mobile products such as cell phones, smart phones, e-readers, GPS/navigation, and other portable, hand-held multitasking applications

230. Micron's PARALLEL NOR comes in different Packages,Density,Width type :-

231. Density :- 1Mb,2Mb,4Mb,8Mb,16Mb,32Mb,64Mb,128Mb,256Mb,512Mb.

232. Package :- TSOP,TBGA,FBGA,TFBGA.

233. Width :- X8 and X16.

234. Voltage :- 2.7V,3.6V,1.7V,2.0V

235. Pin Count :- 44Pin,48Pin,56Pin,64Ball etc.

236. PART NO. INFO.

237. SERIAL NOR FLASH

239. Our serial NOR solutions are purpose-built to meet the needs of consumer electronics, industrial, wired communications, and computing applications. Our industry-standard packaging, pinouts, command sets, and chipset compatibility are easy to design in, saving valuable development time while ensuring compatibility with existing and future designs.

240. Micron's Serial NOR Flash comes in different Packages,Density,Width type :-

241. Density :- 1Mb,2Mb,4Mb,8Mb,16Mb,32Mb,64Mb,128Mb,256Mb,512Mb.

242. Package :- U-PDNF-8, SO-8 , V-PDNF-8,SO-16

243. Width :- X1, x2 , X4.

244. Voltage :- 2.7V,3.6V,1.7V,2.0V

245. Pin Count :- 44Pin,48Pin,56Pin,64Ball etc

246. PART NO. INFO.

247. SOLID STAGE STORAGE

249. ENTERPRISE SATA SSD

250. ENTERPRISE PCIe SSD.

251. EMBEDED SSD.

252. CLIENT SSD

254. Our C400 SSDs utilize the leading SATA 6 Gb/s interface and third-generation flash translation layer (controller NAND management algorithms). These highly sophisticated NAND management features enable our drives to deliver sequential read and write speeds of up to 500 MB/s and 260 MB/s, respectively.

255. Micron's CLIENT SSD comes in different Packages,Density,Voltage type :-

256. Density :- 64GB,128GB,256GBand 512GB.

257. Voltage :- 3.3V AND 5V

258. Package :- 1.8 SSD AND 2.5 SSD

259. Operating Temp :- 0 to 70 degrees.

260. PART NO. INFO.

261. ENTERPRISE SATA SSD

263. Micron's enterprise-class RealSSD™ drives leverage the SATA 6 Gb/s interface to provide outstanding performance for enterprise blade servers and system storage.

264. Micron's ENTERPRISE SSD comes in different Packages,Density,Voltage type :-

265. Density :- 50GB,100GB,200GBand 400GB.

266. Voltage :- 5V

267. Package :- 2.5 SSD

268. Operating Temp :- 0 to 70 degrees.

269. PART NO. INFO.

270. ENTERPRISE PCIe SSD

272. Micron's low-latency, high-IOPs RealSSD drive is a real overachiever, providing the highest READ throughput in the industry, combined with extended endurance, exceptional reliability, and remarkable power efficiency. It’s an ideal solution for optimizing applications with heavy READ access, from Web accelerators to media streaming and video-on-demand servers, as well as data warehousing.

273. Micron's ENTERPRISE PCIe SSD comes in different Packages,Density,Voltage type :-

274. Density :- 350GB AND 700GB.

275. Voltage :- 12V

276. Package :- HHHL PCIe

277. Operating Temp :- 0 to 50 degrees.

278. PART NO.INFO.

279. EMBEDED SSD'S

281. Rugged, reliable, cost-effective, and small, Micron's RealSSD devices are designed to give our customers a choice in embedded data storage. And these embedded USBs are a better choice than hard disk drives (HDDs)—for many reasons.

282. Micron's eUSBs are a lot smaller, more durable, and easier to design in than HDDs. They combine flexibility, performance, and fast time-to-market, and they cost less than traditional HDDs.

283. Micron is known for advanced and innovative technology, and our eUSBs are a great example of a better, faster, and less expensive NAND solution that offers distinct competitive advantages for solid state designs

284. Micron's EMBEDED SSD comes in different Packages,Density,Voltage type :-

285. Density :- 1GB,2GB,4GB,8GB,16GB.

286. Voltage :- 5V and 3.3V

287. Package :- eUSB

288. Operating Temp :- 0 to 70 degrees and -40 to +85 degrees..

289. PART NO. INFO.

290. MULTI CHIP PACKAGE

292. e-MMC.

293. MULTI MEDIA PACKAGES

295. Form factor, speed, power—your mobile customers want all three. With Micron's MCPs you can respond to customers' ever-increasing demands without compromising leading-edge performance.

296. Micron's MULTIMEDIA PACKAGES comes in different Packages,Density,Voltage type :-

297. Density :- 1GB,2GB,4GB,8GB,16GB.

298. Voltage :- 5V and 3.3V

299. Package :- eUSB

300. Operating Temp :- 0 to 70 degrees and -40 to +85 degrees..

301. PART NO. INFO.

302. eMMC

304. Micron's e·MMC embedded memory essentially transforms a program/erase/read device like NAND Flash into a simple write/read memory.

305. Micron's eMMC MCP comes in different Packages,Density,,Width type :-

306. Density :- 1GB,2GB,4GB,8GB,16GB,32GB.

307. Width :- x8

308. Voltage :- 3.3V

309. Package :- LFBGA,FBGA

310. Pin Count :- 169 Ball, 153Ball, 100Ball etc.

311. PART NO. INFO.

312. PHASE CHANGE MEMORY

314. Parallel PCM.

316. The Serial PCM is purpose-built to meet the memory requirements of embedded systems, delivering multiple I/O capability and compatibility via familiar SPI NOR interfaces.

317. Micron's Serial PCM comes in different Packages,Density,Depth,Width type :-

318. Density :- 512MB,1GB,2GB,4Gb.

319. Depth :- 64Mb,128Mb,256Mb,512Mb.

320. Width :- x72

321. Voltage :- 1.8V

322. Pin Count :- 200Pin

323. PART NO INFO

325. Now in its second generation, this device is designed specifically for performance-intensive embedded applications, combining the benefits of phase change memory with the compatibility of a NOR-like parallel interface.

326. Micron's Parallel PCM comes in different Packages,Density,Depth,Width type :-

327. Density :- 512MB,1GB,2GB,4Gb.

328. Depth :- 64Mb,128Mb,256Mb,512Mb.

329. Width :- x72

330. Voltage :- 1.8V

331. Pin Count :- 200Pin

332. PART NO. INFO.

334. Our product range includes::-

335. (1) Computer Memory Modules: (a) SDR -128MB, 256MB and 512MB, (b) DDR - 256MB, 512MB and 1GB.(c) DDR-II - 512MB, 1GB and 2GB.(d) DDR-III - 1GB and 2GB.

336. (2) Flash USB Pen Drive - 256MB, 512MB, 1GB, 2GB, 4GB, 8GB and 16GB.

337. (3) Memory Cards - Micro SD Cards, Camera Cards and Flash Cards.

338. (4) Industrial ICs/Chips: (a) SDRAM - 2x16, 4x16, 16 X 16, 8 X 32, 16 X 32, 64 X 8, (64mb, 128mb, 256mb, 512mb)

340. Please Visit :-

341. http:// www.micron.com

342. For more information about Om-Nano Tech :-

343. Please Visit :-

344. http://www.om-nanotech.com

346. Manish Tiwari.

347. OM-NANO TECH PVT. LTD.

348. 09999514354.

349. Email ID :- [email_address]

350. Background Design and Development by : -

351. Dheeraj Agrawal

352. OM-NANOTECH PVT. LTD.

353. 09999351037.

354. Email ID :- [email_address]