1. Pringles Chip Challenge
By: Sidath Wanigasinghe and Kevin Kubis

2. Problem Definition
 We need send the chip to our contact at
Conant without the chip breaking
 The package needs to be small in size

3. Brainstorming Process
Possible Ideas
 Wrap chip in aluminum foil and place in jello
 Wrap chip in aluminum foil, with a layer of
petroleum jelly inside a box
 Wrap chip in aluminum foil and a layer of
plaster/paper mache
 Make styrofoam molding of the chip and pad the
outside of the box

4. First Primary Idea
 Styrofoam mold

5. Second Primary Idea
 Paper Mache mold around the chip

6. Third Primary Idea
 Placing the chip inside Jello

7. Design Brief
Client Company: Pringles Department of Procter & Gamble.
Target Consumer: PLTW students and teachers at J. B. Conant High
School and William Fremd High School.
Designers: Sidath Wanigasinghe, Eric Killian, and Kevin Kubis.
Problem Statement: Ship a single Pringle’s chip from one high school to
the other without it breaking using the United States Postal Service.
Design Statement: We want to be able to successfully ship a single chip
using the most cost-effective method possible, yet keeping the chip in one
piece.
Constraints: Use the United States Postal Service flat rate boxes.
Keep the chip in one piece.
The chip must be edible when it arrives.

9. Decision Matrix
Durability Safety Size Totals
Paper 4 4 4 12
Mache Mold
Chip in Jello 3 4 3 10
Styrofoam 5 4 5 14
Mold
Bad Average Good
3 4 5
Durability: How much force the package can resist
-Scale 3-5
Safety: Will the chip be safe and snug?
-Scale 3-5
Size: How large is the package, ideally it should be small.
-Scale 3-5

13. Package Opening

14. Testing
•The pringles chip container was
wrapped in a layer of bubble
wrap and polyester cotton. It
turned out to be a very effective
padding/cushioning system.
•I dropped it three times from
my room window, which is 11
feet off the ground. Each time
the pringles chip came out of the
box unscathed.

15. Conclusion
 After doing all the steps of the design
process, we successfully made a
sufficient package that could send the
chip over to Conant