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Smart Phone in 2013
1.
•SmartPhone Market in 2013 •Qualcomm BlackBerry Z10
Motorola Moto X HTC One SAMSUNG Galaxy S4 SAMSUNG Galaxy Note 3 XiaoMi 3 WCDMA •nVidia XiaoMi 3 TD‐SCDMA •SAMSUNG SAMSUNG Galaxy S4 SAMSUNG Galaxy Note 3 •Apple Apple iPhone 5s Apple iPhone 5c
2.
Source: IDC, Jan 2014
3.
Source: IDC, Jan 2014
4.
Source: IDC, Jan 2014
5.
Source: IDC, Jan 2014
6.
Source: Gartner, Feb 2014
7.
Source: Gartner, Feb 2014
8.
Source: Gartner, Feb 2014
9.
Source: Gartner, Feb 2014
11.
Option SnapDragon S4 Pro ALS Display MHL/SlimPort ISP MIPI‐CSI MSM8960 MHL/SlimPort Transmitter Touch Screen Controller Gyroscope MIPI I2C/SPI MIPI‐CSI HDMI LPDDR2 LPDDR2 I2C/SPI Dual‐channel LPDDR2 PoP Package eCompass eMMC I/O Hub processor Accelerator Barometer I2C/SPI SDIO I2C/SPI Rx/Tx
BB SLIMbus Qualcomm WCD9310 Audio Codec I2S eMMC Qualcomm WCN3660/ WCN3680 SDIO I/O Hub processor UART Either One USB Qualcomm Transceiver NFC controller WiFi/BT SoC Qualcomm PM8921 PMIC
13.
T H E N E W B L A C K B E R R Y Z 1 0 Built to keep you moving
14.
Inside BlackBerry Z10
15.
BlackBerry Z10 US STMicroelectrics LIS3DH Qualcomm WCD9310 audio codec SAMSUNG KLMAG2GE4A, 16GB eMMC Inside Secure , SECUREAD IC5C633I4, NFC controller Avago ACPM‐7051
16.
BlackBerry Z10 US Fujitsu MBG046C TriQuint TQP6M9017 Texas Instruments WL1273L Qualcomm MSM8960, PoP package; SAMSUNG K3PE0E000A‐XGC2, 16Gb LPDDR2, PoP
package Qualcomm PM8921, PMIC for MSM8960 Qualcomm RTR8600 transceiver RFMD RF7252 Avago ACPM‐5017
17.
BlackBerry Z10 US
18.
BlackBerry Z10 UK TriQuint TQP6M9017 Fujitsu MBG046C Texas Instruments WL1273L Qualcomm MSM8960, PoP package; SAMSUNG K3PE0E000A‐XGC2, 16Gb LPDDR2, PoP
package Qualcomm PM8921, PMIC for MSM8960 Qualcomm RTR8600 transceiver Avago ACPM‐5020 Avago ACPM‐5008
19.
BlackBerry Z10 UK Invensense ITG‐3050 STMicroelectrics LIS3DH Qualcomm WCD9310 audio codec SAMSUNG KLMAG2GE4A, 16GB eMMC Inside Secure , SECUREAD IC5C633I4, NFC controller Avago
ACPM‐5007 Avago ACPM‐7051 RFMD RF7303
20.
BlackBerry Z10 UK
21.
BlackBerry Z10 UK Manufacturer Device Function Qualcomm Qualcomm Snapdragon S4, MSM8960 1.5GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx, 28nm process SAMSUNG K3PE0E000A‐XGC2 Dual‐channel/x32, 16Gb LPDDR2, LPDDR2‐1066 KLMAG2GE4A 16GB eMMC WL1273L ‧802.11 a/b/g/n Wi‐Fi ‧Bluetooth 4.0 TQP6M9017 Wi‐Fi RF Module RTR8600 GSM / CDMA / W‐CDMA / LTE RxD
Transceiver + GPS SECUREAD IC5C633I4 NFC controller ACPM‐7051 Quad‐Band GSM / W‐CDMA Bands 1 & 5 Power Amplifier ACPM‐5017 LTE Band 12/17 Power Amplifier RF7252 CDMA/WCDMA BAND 2 Linear Power Amplifier Module RF7303 LTE/UMTS/CDMA BAND 3 Linear Power Amplifier Module SONY CXM3582UR SP10T Antenna Switch Avago ACPM‐7051 Quad‐Band GSM / W‐CDMA Bands 1 & 5 Power Amplifier ACPM‐5007 LTE Band 7 (2500‐2570 MHz) Power Amplifier Module ACPM‐5008 UMTS Band 8 (880‐915MHz) Power Amplifier Module ACPM‐5020 LTE Band 20 Power Amplifier Module RF7303 LINEAR PA MODULE . Multi‐Mode LTE/UMTS/CDMA . LTE/UMTS Bands 3, 4, 9, and 10 . CDMA Band Class 15 ▼Processor ▼Memory ▼Radio Frequency Texas Instruments TriQuint Qualcomm Inside Secure Z10 ‐ US Avago RF Micro Devices Z10 ‐ UK RF Micro Devices
22.
BlackBerry Z10 UK Manufacturer Device Function Qualcomm PM8921 PMIC for Qualcomm MSM8960 Qualcomm WCD9310 SLIMbus/I2S Audio codec; 6+ channel Synaptics S3203 Touch screen controller STMicroelectrics LIS3DH 3‐axis MEMS accelerometer Unknown 3‐axis MEMS gyroscope LIS3DH 3‐axis MEMS accelerometer ITG‐3050 3‐axis MEMS gyroscope MBG046C Image processor camera ▼PMIC ▼Audio ▼Touch Screen Controller ▼MEMs Z10 ‐ US Unknown Z10 ‐ UK STMicroelectrics Invensense ▼Video Fujitsu
23.
MOTO X
24.
MOTO X
25.
MOTO X X8 Mobile Computing System Divide and conquer with 8 cores How can a phone that’s able to do so much, still squeeze so much life out of the battery? With a proprietary Motorola system architecture and eight processor cores that only run when there’s work to be done. 4 graphics processor cores for stunning clarity 2 application processor cores for swift action 2 low‐power cores—awaiting your next command The Motorola X8 Mobile Computing System is comprised of a Qualcomm Snapdragon S4Pro family processor (1.7GHz Dual‐Core Krait CPU, Quad‐Core Adreno 320 GPU), a natural language processor and a contextual computing processor.
26.
MOTO X Texas Instruments TMS320C55 DSP
NXP 44701, NFC controller 16/32GB eMMC, 16GB: Toshiba THGBMAG7A2JBAIR Qualcomm MSM8960 Pro, PoP SK Hynix H9TKNNNBPDAR, 2GB LPDDR2, PoP Qualcomm WTR1605L Qualcomm PM8921 PMIC Texas Instruments MSP430F5259 mixed signal processor SKYWorks SKY77619 power amplifier
27.
MOTO X AKM AK8963
Qualcomm WCN3680 WiFi/BT SoC Qualcomm WCD9310 audio codec NXP TFA9890 Class‐D audio amplifier Unknown Bosch BMP180 STMicroelectronics LSM330D SKYWorks SKY77737 power amplifier Avago ACPM‐5007 power amplifier EPCOS 7959 wireless LAN/BT filters
28.
MOTO X Rear facing camera, Synaptics S3204B 4.7” 720x1280 ALS Front facing camera MIPI STM I2C LPDDR2 LSM330D SK Hynix LPDDR2 AKM H9TKNNNBPDAR 16Gb LPDDR2, PoP 2 IC AK8963 Texas Instruments eMMC MSP430F5259 Bosch 16/32GB eMMC 16GB: Toshiba THGBMAG7A2JBAIR I2C BMP180 Rx/Tx BB
Qualcomm NXP 2 WCN3680 IC 44701 I2C Qualcomm WCD9310 Texas Instruments TMS320C55 Qualcomm PM8921 USB Qualcomm WTR1605L Skyworks SKY77619 Avago A5507 Skyworks SKY77737 SWF GMD94
29.
MOTO X Manufacturer Device Function Qualcomm Snapdragon S4 Pro; MSM8960Pro . Dual Qualcomm Krait core/1MB L2, 1.7GHz . Qualcomm Adreno 320 GPU core . LTE Cat3; DC‐HSPA+; 1xAdv/DO, TD‐SCDMA, GSM/GPRS/EDGE SK Hynix H9TKNNNBPDAR Dual‐channel, x32, 16Gb LPDDR2, LPDDR2‐1066 Toshiba 16/32GB eMMC Toshiba 16/32GB eMMC 16GB: Toshiba THGBMAG7A2JBAIR Qualcomm WCN3680 . Dual‐band 2.4 GHz and 5 GHz wireless local area network (WLAN) compliant with the IEEE 802.11 a/b/g/n/ac
specification. . Bluetooth® (BT) compliant with the Bluetooth specification version 4.0 (BR/EDR+BLE) and ANT+ Support. Qualcomm WTR1605L . Multi‐band* plus 700/1500/2600/B41 . GPS+Glonass SKY77619 Multiband Multimode Power Amplifier Module for Quad‐Band GSM / EDGE and Penta‐ Band (Bands I, II, IV, V, VIII) WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE SKY77737 Power Amplifier Module for LTE Bands 12/17 (698‐716 MHz) Avago A5007 Power amplifiers for LTE Band 7 EPCOS 7959 Wireless LAN / Bluetooth Filters (IF) PM8921 PMIC for Qualcomm MSM8960Pro ▼Processor Qualcomm ▼Memory ▼Radio Frequency Skyworks ▼PMIC Qualcomm
30.
MOTO X Manufacturer Device Function WCD9310 SLIMbus/I2S Audio codec; 6+ channel TMS320C55 Digital Signal Processor NXP TFA9890 High Efficiency Class‐D Audio Amplifier Wolfson Microelectronics WM7121 Top Port Analogue Silicon Microphone WM7132 Bottom Port Analogue Silicon Microphone S3402B Touch screen controller AKM AKM8963 Electronic compass STMicroelectronics LSM330D 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine BMP180 Barometer MSP430F5259 Mixed Signal Microcontroller 44701 NFC controller 0V00660 A56G 1B unknown ▼Audio Qualcomm Texas Instruments ▼Touch Screen Controller Synaptics ▼MEMs Bosch ▼Others Texas Instruments NXP unknown
31.
Option SnapDragon 600 ALS Display MHL/SlimPort ISP MIPI‐CSI APQ8064 MHL/SlimPort Transmitter Touch Screen Controller Gyroscope HDMI MIPI I2C/SPI MIPI‐CSI LPDDR2/3 Dual‐channel LPDDR2/3 LPDDR2/3 PoP
Package I2C/SPI eCompass eMMC Humidity/ Temperature sensor I2C/SPI eMMC I/O Hub processor SDIO Accelerator I2C/SPI Rx/Tx BB I2C/SPI Barometer Voice Processor Qualcomm WCD9310 Qualcomm WCN3660/ WCN3680 SDIO SLIMbus UART Audio Codec WiFi/BT SoC Option Either One USB Qualcomm Transceiver Qualcomm PM8018 PMIC Qualcomm MDM9x15 Baseband Processor NFC controller Qualcomm PM8917 PMIC Qualcomm PM8821 PMIC
34.
Qualcomm PM8018 PMIC Qualcomm PM8821 PMIC
Qualcomm PM8921 PMIC Synaptics S32028 touch screen controller Silicon Image Sil9244 MHL transmitter Qualcomm SnapDragon Elpida 600, PoP package 16Gb LPDDR2, PoP package SAMSUNG eMMC, 16/32/64GB STMicroelectronics Package Marking: 0100 9QRV304 Qualcomm WCD9310 audio codec Bosch BMA200, Accelerometer AKM AK8963, compass STMicroelectronics H3G2, Gyroscope
35.
Qualcomm WTR‐1605L AVAGO ACPM‐5020 Avago ACPM‐5007 TriQuint TQM7M9023
SKYWORKS SKY77762 SKYWORKS SKY77764 AVAGO ACPM‐5508 Qualcomm MDM9215M Skyworks 85302‐11 Broadcom BCM4335 NXP PN544, NFC controller
37.
Manufacturer Device Function Qualcomm Snapdragon 600(Package Marking: APQ8064) 1.7GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx BA164B1PF‐1D‐F Dual‐channel, x32, 16Gb LPDDR2, LPDDR2‐1066 SAMSUNG THGBM5G6A2JBAIR SAMSUNG 16/32/64GB eMMC 32GB eMMC: KLMBG4GE2A Qualcomm PM8921 ▼Processor Qualcomm ▼Memory Elpida ▼PMIC PM8821 PMIC for Qualcomm APQ8064 PM8018 PMIC for Qualcomm MDM9215M WCD9310 SLIMbus/I2S Audio codec; 6+ channel Synaptics S32028 Touch screen controller AKM AK8963 Electronic compass Bosch BMA220 Accelerometer H3G2 Gyroscope IDG‐2021(Package markings: 1Y21 3009E1L1250) Gyroscope for motion stabilization for Rear camera SiI9244 HDMI‐to‐MHL™ Transmitter Package Marking: 0100 9QRV304 Unknown 58698A 4M pixel camera, rear camera OV2A9BA 2M pixel camera, front camera ▼Audio Qualcomm ▼Touch Screen Controller ▼MEMs STMicroelectronics Invensense ▼Video Silicon Image STMicroelectronics OmniVision
38.
Manufacturer Device Function Broadcom BCM4335 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0 ‧FM Receiver Skyworks 85302‐11 2.4 GHz, 256 QAM WLAN/Bluetooth® Front‐End Module MDM9215M Baseband processor ‧Rel
9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass TQM7M9023 Multi‐Mode, Multi‐Band Power Amplifier (MMPA) with Quad‐Band GMSK / EDGE and Dual‐Band WCDMA •Quad‐band Linear GSM / EDGE •UMTS B1 and B5/B8 •Input power controlled ‐ GMSK and 8PSK •GSM LB has 3 modes ‐ HP, MP, LP •GSM HB has 2 modes ‐ HP, LP •WCDMA has 3 modes ‐ HP, MP, LP •HBT / PHEMT / CuFlip™ PA Technology A5508 UMTS amd GSM/EDGE Power amplifiers for UMTS Band 5 A5020 Power amplifiers for LTE Band 20 A5007 Power amplifiers for LTE Band 7 SKY77764 Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE – Bands III, IV, IX (1710 MHz–1785 MHz) SKY77762 Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE – Band II (1850‐1910 MHz) PN544 NFC controller ▼Radio Frequency Qualcomm TriQuint Avago Skyworks NXP Semiconductor
40.
Rear facing camera,
13MP Galaxy S® 4 LTE Synaptics Fujitsu MBG965H Silicon Image ALS S5000B STM MHL 5",1920*1080 AMOLED Front facing camera, 2MP SiI8240 I2C/SPI HDMI LSM330DLC x32 LPDDR3 Yamaha I2C/SPI YAS532B x32 LPDDR3 IR sensors K3QF2F200E‐XGCE 16Gb LPDDR3 PoP Package ATMEL UC128L5 eMMC Sensirion SAMSUNG Snapdragon 600 I2C SHTC1 Toshiba 16/32/64GB eMMC SDIO Bosch Broadcom I2C UART BMP182 BCM4335 Qualcomm Audience eS325A Qualcomm WCD9310 MDM9215M SLIMBus USB Qualcomm WTR1605L SKYWORKS SKY77737 SDIO Qualcomm PM8018 RFMD RF7307 Broadcom BCM20794 NFC Qualcomm PM8917 Qualcomm PM8821 MAXIM MAX77803
41.
SnapDragon 800 MHL/SlimPort MIPI‐CSI MHL/SlimPort Transmitter ALS Display MIPI‐CSI MSM8974 Touch Screen Controller Gyroscope HDMI MIPI I2C/SPI LPDDR3 LPDDR3 I2C/SPI Dual‐channel LPDDR3 PoP Package eCompass eMMC Humidity/ Temperature sensor I2C/SPI eMMC I/O Hub processor SDIO Accelerator I2C/SPI Rx/Tx
BB I2C/SPI Barometer Voice Processor Qualcomm WCD9320 Qualcomm WCN3660/ WCN3680 SDIO SLIMbus UART Audio Codec WiFi/BT SoC Option Either One USB Qualcomm Transceiver Baseband Processor NFC controller Qualcomm PM8921 PMIC Qualcomm PM8821 PMIC
43.
MIPI‐CSI Model N9005 5.7” 1920x1080 Wacom W9010 Silicon Image Sil8240B MIPI‐CSI ALS Synaptics S5050A MIPI HDMI LPDDR3 InvenSense MPU‐6500 Bosch I2C LPDDR3 SAMSUNG K3QF7F70DM‐QGCE 3GB LPDDR3 PoP Package I2C e‐Compass STMicro eMMC 32F401B Sensirion SAMSUNG KLMBG4GEAC‐B001 I2C SHTC1 I2C Audience eS325 Qualcomm Qualcomm WCD9320 Maxim PM8941 Barometer MAX77804 SLIMbus Qualcomm PM8921 USB RF Micro ACPM‐7600 SDIO Avago RF1119 UART Qualcomm Avago QFE1100 ACMD‐6207 Qualcomm Broadcom Broadcom WTR1605L BCM20794 BCM4339
44.
Manufacture Device Function Qualcomm Qualcomm Snapdragon 800, MSM8974AB . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx . Rel 10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE SAMSUNG K3QF7F70DM‐QGCE Dual channel, 24Gb LPDDR3, PoP
Package KLMB4GEAC‐B0001 SAMSUNG 32GB eMMC WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass QFE1100 LTE Envelope Tracking IC BCM4339 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0 ‧FM Receiver BCM20794 NFC controller ACPM‐7600 Multi‐mode/Multi‐band power amplifier ACMD‐6207 LTE Band VII FBAR duplxer RF1119 Antenna control module PM8941 PMIC for Qualcomm MSM8974AB PM8921 PMIC for Qualcomm MSM8974AB WCD9320 SLIMbus/I2S Audio codec; 6+ channel ▼Processor ▼Memory ▼Radio Frequency Qualcomm Broadcom Avago RF Micro ▼PMIC Qualcomm ▼Audio Qualcomm
45.
Manufacture Device Function Synaptics S5050A Touch screen controller WACOM W9010 Controller for SAMSUNG S Pen MPU‐6050 3‐axis MEMS gyroscope and 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine SHTC1 Humidity and temperature sensor E5H eCompass Sil8240B MHL 2.0 transmitter with HDMI input IMX135 13MP, Main (rear) camera S5K6B2YX03 1.2MP Sub (front) camera MAX77804 Battery charger IC 32F401B Sensor Hub MCU CY8C20055 Capsense button controller chip ▼Touch Screen Controller ▼MEMs Invensense Sensirion Bosch ▼Video Silicon Image SONY SAMSUNG ▼Others MAXIM STMicroelectronics Cypress
46.
MIPI‐CSI China Mobile N9009 5.7” 1920x1080 Wacom W9010 Silicon Image Sil8240B MIPI‐CSI ALS Synaptics S5050A MIPI HDMI LPDDR3 Accelerometer & Gyroscope e‐Compass I2C LPDDR3 SAMSUNG KQF7F&0DM‐QGCE 3GB LPDDR3 PoP Package I2C STMicro eMMC 32F401B Toshiba THGBM5G7A4JBA4W Sensirion I2C SHTC1 I2C Audience eS325 Qualcomm WCD9320 Qualcomm Maxim PM8941 Barometer MAX77804 SLIMbus Qualcomm PM8921 USB Spreadtrum SC6500ES UART SDIO Qualcomm Broadcom Broadcom WTR1605L BCM20794 BCM4339
47.
nexus 5 Nexus 5. Made for what matters. Introducing the new 5” phone from Google.
48.
nexus 5 Qualcomm PM8941 PMIC Texas Instruments BQ24192 Avago A5805 Qualcomm QFE1100 Qualcomm SnapDragon
800, MSM8974, PoP Package SK Hynix, H9CKNNNBPTMRLR, Dual‐channel, 16Gb LPDDR3 Qualcomm WCD9320 audio Codec Analogix AX7808 SlimPort transmitter
49.
nexus 5 RFMD RF1119 Qualcomm PM8841 PMIC AKM AK8963 Invensense MPU‐6515 16GB/32GB storage 16GB: Sandisk
SDIK8DE4‐16G Qualcomm WTR1605L Avago RF1335 Broadcom BCM4339 WiFi/BT SoC
50.
nexus 5 Broadcom 20793M NFC controller Texas Instruments BQ51013B
51.
nexus 5 SlimPort 4.95” Analogix ANX7808 ALS Synaptics S3350B InvenSense IDG‐2020 1920 x 1080 MIPI LPDDR3 SK Hynix LPDDR3 H9CKNNNBPTMRLR 16Gb LPDDR3 PoP Package I2C AKM AK8963 InvenSense I2C eMMC MPU‐6515 Sandisk SDIN8DE4 16GB eMMC Barometer I2C Texas Qualcomm
Instruments PM8941 Qualcomm SLIMbus WCD9320 Texas Qualcomm Instruments PM8921 USB Qualcomm QFE1100 UART SDIO AVAGO RFI335 RFMD AVAGO 6093 A5805 BQ24192 AVAGO Qualcomm Broadcom Broadcom ACPM‐7600 WTR1605L BCM20793M BCM4339 BQ51013B
52.
nexus 5 Manufacture Device Function Qualcomm Snapdragon 800, MSM8974 . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx . Rel
10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE H9CKNNNBPTMRLR‐NTM Dual channel, 16Gb LPDDR3, PoP Package 16/32GB eMMC . 16GB/32GB eMMC . 16GB : Sandisk SDIN8DE4 WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass QDE1100 LTE Envelope Tracking IC BCM4339 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0 ‧FM Receiver BCM20793M NFC controller Avago ACPM‐7600 Multi Mode, Multi Band RF power amplifier RFMD RF1119 antenna control PM8941 PMIC for Qualcomm MSM8974 PM8921 PMIC for Qualcomm MSM8974 BQ24192 I2C controlled 4.5 A USB/adapter charger BQ51013B WPC 1.1 Compatible Fully Integrated Wireless Power Receiver ▼Processor Qualcomm ▼Memory SK Hynix Main Storage ▼Radio Frequency Qualcomm Broadcom ▼PMIC Qualcomm Texas Instruments
53.
nexus 5 Manufacture Device Function WCD9320 SLIMbus/I2S Audio codec; 6+ channel S3350B Touch Screen controller MPU‐6515 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine IDG‐2020 dual axis gyroscope for Optical Image Stabilization (OIS) AK8963 3‐axis electronic compass ANX7808 SlimPort transmitter ▼Audio Qualcomm ▼Touch Screen Controller Synaptics ▼MEMs Invensense AKM ▼Video Analogix
55.
Rear facing camera, 5” 1920x1080, IPS Front facing camera ALS MIPI LPDDR3 Atmel SAMSUNG K3QF2F20DA‐QGCF MXT540S LPDDR3 16Gb LPDDR3 PoP Package I2C STMicro LSM330 SanDisk eMMC SDIN8DE4‐16G 16GB eMMC I2C Compass I2C Barometer I2C Qualcomm PM8941 Qualcomm SLIMbus WCD9320 Qualcomm PM8841 USB UART Rx/Tx BB Qualcomm QFE1101 Qualcomm WTR1625 Avago ACPM‐7600 Oberthur
Broadcom 256111 BCM20793M Qualcomm SKYWorks WCN3680 SKY85702
56.
Manufacture Device Function Qualcomm Qualcomm Snapdragon 800, MSM8274AB . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx . DC‐HSPA+, HSPA+, TDSCDMA, GSM/GPRS/EDGE SAMSUNG K3QF2F20DA‐QGCF Dual‐channel LPDDR3, LPDDR3‐1866, 16Gb density, PoP Package i‐NAND eMMC; 16GB/32GB 16GB: SDIN8DE4‐16G WCN3680 . Dual‐band 2.4 GHz and 5 GHz wireless local area network (WLAN) compliant with the IEEE 802.11 a/b/g/n/ac
specification. . Bluetooth® (BT) compliant with the Bluetooth specification version 4.0 (BR/EDR+BLE) and ANT+ Support. SKY85702‐11 5 GHz WLAN Front‐End Module WTR1625 Multi‐band* plus 700/1500/2600/B41 GPS+Glonass ACPM‐7600 Multimode, multiband power amplifier module BCM20793M NFC controller 25611 Security chip for NFC PM8941 PMIC for Qualcomm MSM8974 PM8841 PMIC for Qualcomm MSM8974 WCD9320 SLIMbus/I2S Audio codec; 6+ channel ▼Processor ▼Memory SanDisk ▼Radio Frequency Qualcomm SKYWorks Qualcomm Avago Broadcom Oberthur ▼PMIC Qualcomm ▼Audio Qualcomm
57.
Manufacture Device Function Atmel MXT540S Touch screen controller Unknown Unknown Electronic compass Unknown Unknown Barometer LSM330 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine ▼Touch Screen Controller ▼MEMs STMicroelectronics
59.
MHL MIPI‐CSI MHL Transmitter ALS Display MIPI‐CSI SAMSUNG Exynos 5410 Touch Screen Controller MIPI Gyroscope HDMI I2C/SPI LPDDR3 LPDDR3 Dual‐channel LPDDR3 PoP Package I2C/SPI eCompass SDIO Humidity/ Temperature sensor Accelerator I2C/SPI I/O Hub processor eMMC eMMC MCP I2C/SPI Mobile DDR I2C/SPI Baseband Processor Barometer Voice Processor Audio Codec Option I2S UART USB GNSS Receiver NFC controller SAMSUNG S2MPS11 PMIC SDIO WiFi/BT SoC Baseband Processor
61.
Galaxy S® 4 3G SAMSUNG S2MPS11 PMIC
SAMSUNG Exynos 5 Octa SAMSUNG K3QF2F200C‐XGCE SAMSUNG KMV3W000LM Intel X‐Gold 636 AKM AK8963 Atmel UC128L5 Audience eS325B Wolfson WM5012E Broadcom BCM4335
62.
Galaxy S® 4 3G Broadcom BCM47521
Broadcom BCM20794 Silicon Image Sil8240 Intel SMARTi UE3 RF Transceiver Murata SWC GKF48 Skyworks SKY77615 MAXIM MAX77803
63.
Galaxy S® 4 3G MHL ALS Synaptics AKM Silicon Image Front‐facing camera: 2MP SiI8240 S5000B Gyro Accel Rear‐facing camera: 13MP 5",1920*1080 AMOLED HDMI I2C/SPI LPDDR3 LPDDR3 I2C/SPI SAMSUNG K3QF2F200C‐XGCE 8Gb LPDDR3 PoP Package AK8963 SAMSUNG IR sensors eMMC ATMEL UC128L5 Sensirion KMV3W000LM eMMC + Mobile DDR Mobile DDR I
2C SHTC1 Intel Bosch PMB5745 X‐GOLD™ 636 IC BMP182 Intel PMB9820 2 SMARTi™ UE3 SDIO Audience eS325B I 2S Wolfson I 2S UART Broadcom BCM4335 WM5102E UART Broadcom BCM20794 Broadcom BCM47521 USB SDIO I2C SAMSUNG S2MPS11 PMIC NFC GNSS MAXIM MAX77803
64.
Galaxy S® 4 3G Manufacturer Part Number Function Exynos 5 Octa, Exynos
5410 ‧1.8GHz ‧ARM big.LITTLE technology ‧Quad core CortexTM‐A15+Quad‐core CortexTM‐A7 ‧Imagination PowerVR SGX544MP3 ‧28nm manufacturing process ▼Processor SAMSUNG ▼Memory SAMSUNG K3QF2F200C‐XGCE ‧16Gb LPDDR3‐1066 ‧Dual Channel/32‐bit/QDP/PoP KMV3W000LM SAMSUNG eMMC Based MCP . eMMC(16GB)+MDDR(64MB) BCM4335 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0 ‧FM Receiver BCM20794 Near Field Communications (NFC) Controller Family BCM47521 GNSS receiver, GPS, GLONASS, QZSS and SBAS SKY85303‐11 2.4 GHz QAM WLAN/BT front end module. XG636(Package Marking: PMB9820) Baseband processor: ‧ ARM11™ architecture ‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second) in the downlink and category 7 (11.5 Mbit per second) in the uplink. ‧ EDGE multislot class 33 PMB5745(Package Marking: PMB5745) SMARTi UE3 RF Transceiver SKY77615 Multimode Multiband Power Amplifier Module for GSM, EGPRS, EDGE, and WCDMA modes ▼Radio Frequency Broadcom Skyworks Intel/Infineon Skyworks
65.
Galaxy S® 4 3G Manufacturer Part Number Function S2MPS11 PMIC for SAMSUNG Exynos 5 Octa WM5012E Audio Codec eS325B Voice processor Synaptics S5000B Touch screen controller STMicroelectronics LSM330 3D accelerometer and 3D gyroscope AKM8963 Electronic compass Bosch Sensortec BMP182 Barometer SONY IMX135 13 Mp, rear‐facing image sensor. S5K6B2YX03 2 MP sensor, front sensor SiI8240BO HDMI‐to‐MHL™
Transmitter SHTC1 Humidity and temperature sensor MAX77803 Battery charger IC ▼PMIC SAMSUNG ▼Audio Wolfson Microelectronics Audience ▼Touch Screen Controller ▼MEMs AKM ▼Video Samsung Silicon Image ▼Others Sensirion MAXIM
66.
Galaxy S® 4 China Unicom
67.
MHL MIPI‐CSI MHL Transmitter ALS Display MIPI‐CSI SAMSUNG Exynos 5420 Touch Screen Controller MIPI Gyroscope HDMI I2C/SPI LPDDR3 LPDDR3 Dual‐channel LPDDR3 PoP Package I2C/SPI eCompass SDIO Humidity/ Temperature sensor Accelerator I2C/SPI I/O Hub processor eMMC eMMC MCP I2C/SPI Mobile DDR I2C/SPI Baseband Processor Barometer Voice Processor Audio Codec Option I2S USB GNSS Receiver NFC controller UART SDIO WiFi/BT SoC Baseband Processor
69.
MIPI‐CSI Model N9000 5.7” 1920x1080 Wacom W9010 Silicon Image Sil8240B MIPI‐CSI ALS Synaptics S5050A MIPI HDMI LPDDR3 InvenSense MPU‐6500 AKM I2C LPDDR3 SAMSUNG KQF7F&0DM‐HGCE 3GB LPDDR3 PoP Package I2C AK9911 eMMC SAMSUNG KMV2W000LM‐B506 STMicro 32F401B Sensirion I2C SHTC1 Intel PMB9820 Barometer X‐GOLD™ 636 I2C YAMAHA Y831 Intel PMB5745 SMARTi™
UE3 Maxim I2S MAX77804 UART UART Broadcom Broadcom BCM20794 BCM47521 USB UART SDIO Broadcom BCM4339
70.
Manufacture Device Function Exynos 5 Octa, Exynos 5420 ‧1.9GHz ‧ARM big.LITTLE
technology Quad core CortexTM‐A15 + Quad‐core CortexTM‐A7 ‧ARM Mali‐T628 GPU ‧28nm manufacturing process ▼Processor SAMSUNG ▼Memory SAMSUNG K3QF7F70DM‐HGCE Dual channel, 24Gb LPDDR3, PoP Package (Customized PoP package for Exynos 5420, not standard package) KMV2W000LM‐B506 SAMSUNG eMMC MCP(eMMC+LPDDR) ▼Radio Frequency Intel X‐Gold 636(Package Marking: PMB9820) PMB5745(Package Marking: PMB5745) Baseband processor: ‧ ARM11™ architecture ‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second) in the downlink and category 7 (11.5 Mbit per second) in the uplink. ‧ EDGE multislot class 33 SMARTi UE3 RF Transceiver BCM4339 ‧802.11 ac/a/b/g/n Wi‐Fi ‧Bluetooth 4.0 ‧FM Receiver BCM47521 GNSS receiver BCM47521 NFC controller RF1119 Antenna control module Not necessary Not necessary Y831 Audio Codec Broadcom NXP RF Micro ▼PMIC Not necessary ▼Audio Yamaha
71.
Manufacture Device Function Synaptics S5050A Touch screen controller WACOM W9010 Controller for SAMSUNG S Pen MPU‐6050 3‐axis MEMS gyroscope and 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine SHTC1 Humidity and temperature sensor AK9911 eCompass Sil8240B MHL 2.0 transmitter with HDMI input IMX135 13MP, Main (rear) camera S5K6B2YX03 1.2MP Sub (front) camera MAX77804 Battery charger IC 32F401B Sensor Hub MCU CY8C20236A Capsense button controller chip ▼Touch Screen Controller ▼MEMs Invensense Sensirion AKM ▼Video Silicon Image SONY SAMSUNG ▼Others MAXIM STMicroelectronics Cypress
73.
Touch Screen Controller Gyro/ Accel MIPI‐CSI ALS Display MIPI‐CSI MIPI LPDDR3 I2C/SPI LPDDR3 Barometer Dual‐channel LPDDR3 I2C/SPI eMMC eCompass eMMC I2C/SPI Audio Codec Baseband Processor SDIO I2S I2S I2C Texas Instruments TPS65913 PMIC UART NFC Controller UART GNSS Receiver USB UART SDIO WiFi/BT SoC
75.
Rear facing camera, 5” 1920x1080, IPS Front facing camera ALS MIPI LPDDR3 Atmel MXT540S LPDDR3 InvenSense SK Hynix H9CCNNNBPTML 16Gb LPDDR3 I2C MPU‐6050 eMMC I2C SanDisk SDIN8DE4‐16G 16GB eMMC Compass I2C Barometer I2C Cirrus Logic TPS65913 PMIC I2S CS42L73 USB RF Micro RF9812 UART SDIO SPRD SR3500 Micron 2ZC27 D9LQQ Texas Instruments SPREADTRUM SC8803G5 Oberthur 211808 Broadcom BCM43341
76.
Manufacture Device Function nVidia NVIDIA® Tegra® 4 Quad core ARM CortexTM‐A15; nVidia
72‐cores GPU SK Hynix H9CCNNNBPTML Dual‐channel LPDDR3, LPDDR3‐1866, 16Gb density SanDisk 16/64GB eMMC eMMC 4.5; 16GB/64GB; 16GB: SanDisk SDIN8DE4‐16G Micron MT46H32M16LFBF‐5 512Mb LPDDR, for Spreadtrum basseband processor SC8803G TD‐SCDMA, EDGE, GPRS and GSM operation and supports TD‐HSDPA at 2.8Mbps and TD‐HSUPA at 2.2Mbps SR3500 FDD/TDD/LTE‐A, TD‐SCDMA, WCDMA HSPA+, GSM/EDGE (HEDGE) single‐chip radio transceivers, with support for quad‐band TD‐LTE, tri‐band FDD‐LTE, dual‐ band TD‐SCDMA, penta‐band WCMDA and quad‐band GSM BCM43341 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Bluetooth Version 4.0 ‧ FM radio receiver ‧ BCM2079X NFC controller RF9812 QUAD‐BAND GPRS/LINEAR EDGE +3.2V, TD‐SCDMA MULTI‐MODE TRANSMIT MODULE 211808 Security chip for NFC ▼Processor ▼Memory ▼Radio Frequency Spreadtrum Broadcom RF Micro Devices Oberthur
77.
Manufacture Device Function TPS65913 PMIC for NVIDIA® Tegra® 4 CS42L73 Audio codec Atmel MXT540S Touch screen controller Unknown Unknown Electronic compass Unknown Unknown Barometer MPU‐6050 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine MAX77665A Power Management ▼PMIC Texas Instruments ▼Audio Cirrus Logic ▼Touch Screen Controller ▼MEMs Invensense ▼Others MAXIM
79.
338S1216‐A2 PMIC 338S1201 Audio Codec 338S1202 Class‐D Amplifier
80.
Touch Screen Controller iSight Front camera Display ALS FaceTime camera I2C/SPI Gyroscope MIPI LPDDR3 I2C/SPI eCompass LPDDR3 Accelerator I2C/SPI Dual‐channel LPDDR3 NXP LPC18A1 NAND Flash 16/32/64GB NAND Flash NXP 6416A 338S1216‐A2 PMIC 338S1202 Class‐D Amplifier 338S1201 Audio Codec UART Qualcomm Transceiver Qualcomm MDM Modem Qualcomm PMIC NXP 1610A1 Lightning SDIO WiFi/BT SoC Broadcom
82.
Model A1533 Model A1530 PCB Photo Source:
Techinsights & iFixit
83.
PCB Photo Source:
Techinsights & iFixit Model A1533 Model A1530 Skyworks SKY77355 AVAGO A7900720 TriQuint TQM6M6224 Skyworks SKY77810 AVAGO A7900 Different model (different band support) has different PA design.
84.
Texas Instruments 36ATLC1 65730A0P; unknown function WiFi module from Murata. Broadcom BCM4334 WiFi/BT SoC Texas Instruments 37CCVHI 343S0645 Broadcom BCM5976A0KUB2G
Bosch Sensortech BMA220 3‐axis accelerometer SK Hynix E2NAND 3.0 STM 3‐axis gyroscope Apple 338S1216‐A2 PMIC (Dialog Semiconductor) Apple 338S1201 audio codec (Cirrus Logic) Apple 338S1202 Class D audio amplifier (Cirrus Logic) NXP 1610A1, unknown function Qualcomm PM8018, PMIC for MDM9615M PA chips for Model A1533 PCB Photo Source: Techinsights, iPhone 5S Model A1533
85.
AKM AK8963 compass Apple M7 coprocessor, NXP LPC1800 series micro processor Apple A7 application Processor, PoP package ElpidaF8164A1PD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb, PoP package
Qualcomm MDM9615M baseband processor Qualcomm WTR1605L transceiver PCB Photo Source: Techinsights, iPhone 5S Model A1533
86.
Touch Screen Texas Instruments 37CCVHI 343S0645 Broadcom BCM5976 Rear facing camera, 4.0” 1366x640 ALS MIPI I2C STM Front facing camera LPDDR3 Gyroscope Elpida AKM I2C/SPI AK8963 Bosch LPDDR3 NXP F8164A1PD‐GD‐F 8Gb LPDDR3, PoP LPC18A1 NAND Flash Apple M7 I2C/SPI BMP220 16/32/64GB NAND Flash Apple Apple Apple 338S1202 338S1216‐A2 PMIC 338S1201 Audio Codec Class D AMP NXP 6416A UART NXP PA chips Qualcomm WTR1605L Qualcomm PM8018 PA chips are model dependent Qualcomm 1610A1 MDM9615M Lightning SDIO Broadcom BCM4334
87.
Manufacturer Device Function Apple A7 Microprocessor (Apple APL0698) ‧Dual‐core, ARMv8 architecture, 1.3GHz ‧Imagination PowerVR 6 series GPU ‧Manufactured by SAMSUNG 28nm HKMG process ‧PoP package NXP LPC18A1 (Apple M7 Processor) ‧NXP LPC1800 series micro processor ‧ARM Cortex‐M3 F8164A1PD‐GD‐F ‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600 ‧PoP
package ▼Processor Apple NXP ▼Memory Elpida Storage ECC free NAND Flash Murata 339S00205 (BRCM BCM4334 SDIO WiFi/ High Speed UART BT SoC) ‧16GB/32GB/64GB ‧Supplier: SK Hynix E2NAND 3.0 ▼Radio Frequency Qualcomm Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications ‧ Bluetooth Class 1 transmitter operation MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonass
88.
Manufacturer Device Function Apple 338S1216 (Dialog D2045) PMIC for Apple A7 Processor PM8018 PMIC for Qualcomm MDM9615M baseband processor Apple 338S1201(Cirrus Logic) Audio Codec Apple 338S1202 (Cirrus Logic) Low Power Class‐D Audio Amplifiers 37CCVHI 343S0645 Line Driver BCM5976A0KUB2G Touch Screen Controller Package markings B329 MEMS motion sensor: three‐axis digital output gyroscope BMA220 Ultra small triaxial, low‐g acceleration sensor with digital interfaces AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output Exmor‐RS sensor Front Camera, 8 Mp CMOS Image Sensor 36ATLC1 65730A0P Unknown function 1610A1 Unknown function 6416A Unknown function ▼PMIC Apple Qualcomm ▼Audio Apple ▼Touch Screen Controller Texas Instruments Broadcom ▼MEMs STMicroelectronics Bosch Sensortech AKM ▼Camera SONY ▼Others Texas Instruments NXP
89.
338S1164‐B2 PMIC 338S1116 Audio Codec 338S1202 Class‐D Amplifier
90.
Touch Screen Controller iSight Front camera Display ALS FaceTime camera MIPI LPDDR2 Gyroscope I2C/SPI LPDDR2 eCompass Accelerator Dual‐channel LPDDR2 PoP
Package I2C/SPI NAND Flash I2C/SPI 16/32/64GB NAND Flash 338S1164‐B2 PMIC 338S1202 Class‐D Amplifier 338S1116 Audio Codec UART Qualcomm Transceiver Qualcomm MDM Modem Qualcomm PMIC NXP 1610A1 Lightning WiFi/BT SoC SDIO
92.
Model A1532 Model A1529 PCB Photo Source:
Techinsights & iFixit
93.
Skyworks SKY77810 Model A1532 AVAGO A792503 Skyworks SKY77572 PCB Photo Source:
Techinsights & iFixit RF Micro RF3763 Skyworks SKY77496 Model A1529 AVAGO A7900720 TriQuint TQF6414 TriQuint TQM6M6224 Skyworks SKY77355 Skyworks SKY77810 AVAGO A7900 Different model (different band support) has different PA design.
94.
Texas Instruments 36ATLC1 65730A0P; unknown function WiFi module from USI/Murata. Broadcom BCM4334 WiFi/BT SoC Texas Instruments 37CCVHI 343S0645 Broadcom BCM5976A0KUB2G
Bosch Sensortech BMA220 3‐axis accelerometer STM 3‐axis gyroscope SK Hynix E2NAND 3.0 Apple 338S1164 PMIC (Dialog Semiconductor) Apple 338S1116 audio codec (Cirrus Logic) Apple 338S1201 Class D audio amplifier (Cirrus Logic) NXP 1610A1, unknown function Qualcomm PM8018, PMIC for MDM9615M PA chips for Model A1532 PCB Photo Source: Techinsights, iPhone 5S Model A1532
95.
AKM AK8963 compass There is no NXP LPC1800 series microprocessor Apple A6 application Processor, PoP package Elpida/SK Hynix , Dual‐channel, LPDDR2‐1066, 8Gb, PoP
package Qualcomm MDM9615M baseband processor Qualcomm WTR1605L transceiver PCB Photo Source: Techinsights, iPhone 5S Model A1532
96.
Touch Screen Broadcom BCM5976 Texas Instruments 37CCVHI 343S0645 Rear facing camera, 4.0” 1366x640 ALS Front facing camera MIPI LPDDR2 I2C STM Gyroscope AKM LPDDR2 8Gb LPDDR2, PoP NAND Flash Toshiba/ SK Hynix I2C/SPI AK8963 Bosch Elpida/ SK Hynix 16/32GB NAND Flash I2C/SPI BMP220 Apple 338S1164 PMIC Apple Apple 338S1201 338S1116 Audio Codec Class D AMP UART NXP PA chips Qualcomm WTR1605L Qualcomm PM8018 PA chips are model dependent Qualcomm 1610A1 MDM9615M Lightning SDIO Broadcom BCM4334
97.
Manufacturer Device Function Apple A6 Microprocessor ‧1.26GHz, ARMv7, Dual‐core ‧Imagination PowerVR SGX 543MP3 ‧SAMSUNG 32nm HKMG process ▼Processor Apple ▼Memory System Memory 8Gb LPDDR2‐1066 Storage ‧32‐bit, Dual‐channel, 8Gb, LPDDR2‐1066 ‧Supplier: Elpida: B8164B3PM‐1D‐F SK Hynix: H9TKNNN8KDMRBR NAND Flash ‧16GB/32GB ‧Supplier: SK Hynix/Toshiba Murata: 339S0209 USI: 339S0204 (BRCM BCM4334 SDIO WiFi/ High Speed UART BT SoC) Broadcom BCM4334 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n
Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density ‧ parity check) options for improved range and power efficiency Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for ‧ supporting future specifications Bluetooth Class 1 transmitter operation ‧ MDM9615M Baseband Processor ‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps) ‧Rel 9 DCHSPA+(42/5.76Mbps) ‧TD‐SCDMA(4.2/2.2Mbps) ‧QICE ‧Integrated Memory WTR1605L Multi‐band plus 700/1500/2600/B41 GPS+Glonass ▼Radio Frequency Murata/USI Qualcomm
98.
Manufacturer Device Function Apple 338S1164 (Dialog Semiconductor D2013 ) PMIC for Apple A6 Processor PM8018 PMIC for Qualcomm MDM9615M baseband processor Apple 338S1116 (Cirrus Logic CLI1588B1 42L65) Audio Codec Apple 338S1202 (Cirrus Logic) Low Power Class‐D Audio Amplifiers 37CCVHI 343S0645 Line Driver BCM5976A0KUB2G Touch Screen Controller Package markings B329 MEMS motion sensor: three‐axis digital output gyroscope BMA220 Ultra small triaxial, low‐g acceleration sensor with digital interfaces AK8963 Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output Unknown Front Camera, 8 Mp CMOS Image Sensor 36ATLC1 65730A0P Unknown function 1610A1 Unknown function ▼PMIC Apple Qualcomm ▼Audio Apple ▼Touch Screen Controller Texas Instruments Broadcom ▼MEMs STMicroelectronics Bosch Sensortech AKM ▼Camera SONY ▼Others Texas Instruments NXP
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