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•SmartPhone Market in 2013
•Qualcomm
 BlackBerry Z10
 Motorola Moto X
 HTC One
 SAMSUNG Galaxy S4
 SAMSUNG Galaxy Note 3
 XiaoMi

3 WCDMA

•nVidia
 XiaoMi

3 TD‐SCDMA

•SAMSUNG
 SAMSUNG Galaxy S4
 SAMSUNG Galaxy Note 3

•Apple


Apple iPhone 5s



Apple iPhone 5c
Source: IDC, Jan 2014
Source: IDC, Jan 2014
Source: IDC, Jan 2014
Source: IDC, Jan 2014
Source: Gartner, Feb 2014
Source: Gartner, Feb 2014
Source: Gartner, Feb 2014
Source: Gartner, Feb 2014
Smart Phone in 2013
Option

SnapDragon S4 Pro

ALS

Display

MHL/SlimPort

ISP

MIPI‐CSI

MSM8960
MHL/SlimPort
Transmitter

Touch
Screen
Controller

Gyroscope

MIPI

I2C/SPI

MIPI‐CSI

HDMI
LPDDR2
LPDDR2

I2C/SPI

Dual‐channel
LPDDR2
PoP Package

eCompass

eMMC
I/O Hub 
processor
Accelerator

Barometer

I2C/SPI

SDIO

I2C/SPI

Rx/Tx BB
SLIMbus

Qualcomm
WCD9310
Audio Codec

I2S

eMMC

Qualcomm
WCN3660/
WCN3680

SDIO

I/O Hub 
processor

UART

Either One

USB

Qualcomm
Transceiver

NFC
controller

WiFi/BT
SoC

Qualcomm
PM8921
PMIC
Smart Phone in 2013
T H E N E W
B L A C K B E R R Y
Z 1 0
Built to keep you moving
Inside BlackBerry Z10
BlackBerry Z10 US

STMicroelectrics LIS3DH
Qualcomm WCD9310 audio codec

SAMSUNG KLMAG2GE4A, 16GB eMMC

Inside Secure , SECUREAD IC5C633I4, NFC controller

Avago ACPM‐7051
BlackBerry Z10 US

Fujitsu MBG046C
TriQuint TQP6M9017
Texas Instruments WL1273L
Qualcomm MSM8960, PoP package;
SAMSUNG K3PE0E000A‐XGC2, 16Gb LPDDR2, PoP package

Qualcomm PM8921, PMIC for MSM8960

Qualcomm RTR8600 transceiver

RFMD RF7252
Avago ACPM‐5017
BlackBerry Z10 US
BlackBerry Z10 UK

TriQuint TQP6M9017
Fujitsu MBG046C

Texas Instruments WL1273L
Qualcomm MSM8960, PoP package;
SAMSUNG K3PE0E000A‐XGC2, 16Gb LPDDR2, PoP package

Qualcomm PM8921, PMIC for MSM8960

Qualcomm RTR8600 transceiver

Avago ACPM‐5020
Avago ACPM‐5008
BlackBerry Z10 UK

Invensense ITG‐3050
STMicroelectrics LIS3DH
Qualcomm WCD9310 audio codec

SAMSUNG KLMAG2GE4A, 16GB eMMC

Inside Secure , SECUREAD IC5C633I4, NFC controller

Avago ACPM‐5007
Avago ACPM‐7051
RFMD RF7303
BlackBerry Z10 UK
BlackBerry Z10 UK
Manufacturer

Device

Function

Qualcomm

Qualcomm Snapdragon S4, MSM8960

1.5GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx, 28nm process

SAMSUNG

K3PE0E000A‐XGC2

Dual‐channel/x32, 16Gb LPDDR2, LPDDR2‐1066

KLMAG2GE4A

16GB eMMC

WL1273L

‧802.11 a/b/g/n Wi‐Fi
‧Bluetooth 4.0

TQP6M9017

Wi‐Fi RF Module

RTR8600

GSM / CDMA / W‐CDMA / LTE RxD Transceiver + GPS 

SECUREAD IC5C633I4

NFC controller

ACPM‐7051

Quad‐Band GSM / W‐CDMA Bands 1 & 5 Power Amplifier 

ACPM‐5017

LTE Band 12/17 Power Amplifier

RF7252

CDMA/WCDMA BAND 2 Linear Power Amplifier Module

RF7303

LTE/UMTS/CDMA BAND 3 Linear Power Amplifier Module

SONY

CXM3582UR

SP10T Antenna Switch

Avago

ACPM‐7051

Quad‐Band GSM / W‐CDMA Bands 1 & 5 Power Amplifier 

ACPM‐5007

LTE Band 7 (2500‐2570 MHz) Power Amplifier Module

ACPM‐5008

UMTS Band 8 (880‐915MHz) Power Amplifier Module

ACPM‐5020

LTE Band 20 Power Amplifier Module

RF7303

LINEAR PA MODULE
. Multi‐Mode LTE/UMTS/CDMA
. LTE/UMTS Bands 3, 4, 9, and 10
. CDMA Band Class 15

▼Processor

▼Memory

▼Radio Frequency
Texas Instruments
TriQuint
Qualcomm
Inside Secure
Z10 ‐ US
Avago

RF Micro Devices

Z10 ‐ UK

RF Micro Devices
BlackBerry Z10 UK
Manufacturer

Device

Function

Qualcomm

PM8921

PMIC for Qualcomm MSM8960

Qualcomm

WCD9310

SLIMbus/I2S Audio codec; 6+ channel

Synaptics

S3203 

Touch screen controller

STMicroelectrics

LIS3DH

3‐axis MEMS accelerometer

Unknown

3‐axis MEMS gyroscope

LIS3DH

3‐axis MEMS accelerometer

ITG‐3050

3‐axis MEMS gyroscope

MBG046C

Image processor camera

▼PMIC

▼Audio

▼Touch Screen Controller

▼MEMs
Z10 ‐ US

Unknown
Z10 ‐ UK
STMicroelectrics
Invensense
▼Video
Fujitsu
MOTO X
MOTO X
MOTO X

X8 Mobile 
Computing System
Divide and conquer 
with 8 cores
How can a phone that’s able to do so much, still squeeze so much life out of the 
battery? With a proprietary Motorola system architecture and eight processor cores 
that only run when there’s work to be done.
4 graphics processor cores for stunning clarity
2 application processor cores for swift action
 2 low‐power cores—awaiting your next command



The Motorola X8 Mobile Computing System is comprised of a Qualcomm 
Snapdragon S4Pro family processor (1.7GHz Dual‐Core Krait CPU, Quad‐Core Adreno
320 GPU), a natural language processor and a contextual computing processor.
MOTO X

 Texas Instruments TMS320C55 DSP
 NXP 44701, NFC controller
 16/32GB eMMC,
16GB: Toshiba THGBMAG7A2JBAIR
 Qualcomm MSM8960 Pro, PoP
SK Hynix H9TKNNNBPDAR, 2GB LPDDR2, PoP
 Qualcomm WTR1605L
 Qualcomm PM8921 PMIC
 Texas Instruments MSP430F5259 mixed signal processor
 SKYWorks SKY77619 power amplifier
MOTO X

 AKM AK8963

 Qualcomm WCN3680 WiFi/BT SoC
 Qualcomm WCD9310 audio codec
 NXP TFA9890 Class‐D audio amplifier
 Unknown

 Bosch BMP180
 STMicroelectronics LSM330D
 SKYWorks SKY77737 power amplifier
 Avago ACPM‐5007  power amplifier
 EPCOS 7959 wireless LAN/BT filters
MOTO X

Rear facing camera,
Synaptics
S3204B

4.7”
720x1280
ALS

Front facing camera

MIPI
STM

I2C

LPDDR2

LSM330D

SK Hynix
LPDDR2

AKM

H9TKNNNBPDAR
16Gb LPDDR2, PoP

2

IC

AK8963

Texas
Instruments

eMMC

MSP430F5259

Bosch

16/32GB eMMC
16GB: 
Toshiba
THGBMAG7A2JBAIR

I2C

BMP180

Rx/Tx BB Qualcomm
NXP

2

WCN3680

IC

44701

I2C

Qualcomm
WCD9310

Texas
Instruments
TMS320C55

Qualcomm
PM8921

USB

Qualcomm
WTR1605L

Skyworks
SKY77619

Avago
A5507

Skyworks
SKY77737

SWF
GMD94
MOTO X
Manufacturer

Device

Function

Qualcomm Snapdragon S4 Pro; 
MSM8960Pro

. Dual Qualcomm Krait core/1MB L2, 1.7GHz
. Qualcomm Adreno 320 GPU core
. LTE Cat3; DC‐HSPA+; 1xAdv/DO, TD‐SCDMA, GSM/GPRS/EDGE

SK Hynix

H9TKNNNBPDAR

Dual‐channel, x32, 16Gb LPDDR2, LPDDR2‐1066

Toshiba

16/32GB eMMC

Toshiba 16/32GB eMMC
16GB: Toshiba THGBMAG7A2JBAIR

Qualcomm

WCN3680

. Dual‐band 2.4 GHz and 5 GHz wireless local area network (WLAN) compliant with the 
IEEE 802.11 a/b/g/n/ac specification.
. Bluetooth® (BT) compliant with the Bluetooth specification version 4.0 (BR/EDR+BLE) 
and ANT+ Support.

Qualcomm

WTR1605L

. Multi‐band* plus 700/1500/2600/B41
. GPS+Glonass

SKY77619

Multiband Multimode Power Amplifier Module for Quad‐Band GSM / EDGE and Penta‐
Band (Bands I, II, IV, V, VIII) WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE

SKY77737

Power Amplifier Module for LTE Bands 12/17 (698‐716 MHz)

Avago

A5007

Power amplifiers for LTE Band 7

EPCOS

7959

Wireless LAN / Bluetooth Filters (IF)

PM8921

PMIC for Qualcomm MSM8960Pro

▼Processor
Qualcomm

▼Memory

▼Radio Frequency

Skyworks

▼PMIC
Qualcomm
MOTO X
Manufacturer

Device

Function

WCD9310

SLIMbus/I2S Audio codec; 6+ channel

TMS320C55

Digital Signal Processor

NXP

TFA9890

High Efficiency Class‐D Audio Amplifier

Wolfson Microelectronics

WM7121

Top Port Analogue Silicon Microphone

WM7132

Bottom Port Analogue Silicon Microphone

S3402B

Touch screen controller

AKM

AKM8963

Electronic compass

STMicroelectronics

LSM330D

3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. 
(DMP.) hardware accelerator engine

BMP180

Barometer

MSP430F5259

Mixed Signal Microcontroller

44701

NFC controller

0V00660 A56G 1B

unknown

▼Audio
Qualcomm
Texas Instruments

▼Touch Screen Controller
Synaptics
▼MEMs

Bosch
▼Others
Texas Instruments
NXP
unknown
Option

SnapDragon 600

ALS

Display

MHL/SlimPort

ISP

MIPI‐CSI

APQ8064
MHL/SlimPort
Transmitter

Touch
Screen
Controller

Gyroscope

HDMI

MIPI

I2C/SPI

MIPI‐CSI

LPDDR2/3

Dual‐channel
LPDDR2/3 LPDDR2/3
PoP Package

I2C/SPI
eCompass

eMMC
Humidity/
Temperature
sensor

I2C/SPI

eMMC

I/O Hub 
processor
SDIO

Accelerator

I2C/SPI

Rx/Tx BB

I2C/SPI
Barometer

Voice
Processor

Qualcomm
WCD9310

Qualcomm
WCN3660/
WCN3680

SDIO

SLIMbus

UART

Audio Codec

WiFi/BT
SoC

Option

Either One

USB

Qualcomm
Transceiver

Qualcomm
PM8018
PMIC

Qualcomm
MDM9x15

Baseband
Processor

NFC
controller

Qualcomm
PM8917
PMIC

Qualcomm
PM8821
PMIC
Smart Phone in 2013
Smart Phone in 2013
 Qualcomm PM8018 PMIC
 Qualcomm PM8821 PMIC
 Qualcomm PM8921 PMIC

 Synaptics S32028 touch screen controller
 Silicon Image Sil9244 MHL transmitter
 Qualcomm SnapDragon
 Elpida

600, PoP package

16Gb LPDDR2, PoP package

 SAMSUNG eMMC, 16/32/64GB
 STMicroelectronics Package Marking: 0100 9QRV304
 Qualcomm WCD9310 audio codec
 Bosch BMA200, Accelerometer

AKM AK8963, compass
 STMicroelectronics H3G2, Gyroscope 

 Qualcomm WTR‐1605L


AVAGO ACPM‐5020



Avago ACPM‐5007

TriQuint

TQM7M9023
 SKYWORKS SKY77762
 SKYWORKS SKY77764
 AVAGO ACPM‐5508
 Qualcomm MDM9215M

 Skyworks 85302‐11 
 Broadcom BCM4335
 NXP PN544, NFC controller
Smart Phone in 2013
Manufacturer

Device

Function

Qualcomm Snapdragon 600(Package Marking: 
APQ8064)

1.7GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx

BA164B1PF‐1D‐F

Dual‐channel, x32, 16Gb LPDDR2, LPDDR2‐1066

SAMSUNG

THGBM5G6A2JBAIR

SAMSUNG 16/32/64GB eMMC
32GB eMMC: KLMBG4GE2A 

Qualcomm

PM8921

▼Processor
Qualcomm
▼Memory
Elpida

▼PMIC

PM8821

PMIC for Qualcomm APQ8064

PM8018

PMIC for Qualcomm MDM9215M

WCD9310

SLIMbus/I2S Audio codec; 6+ channel

Synaptics

S32028

Touch screen controller

AKM

AK8963

Electronic compass

Bosch

BMA220

Accelerometer 

H3G2

Gyroscope 

IDG‐2021(Package markings: 1Y21 3009E1L1250)

Gyroscope for motion stabilization for Rear camera

SiI9244

HDMI‐to‐MHL™ Transmitter

Package Marking: 0100 9QRV304

Unknown

58698A

4M pixel camera, rear camera

OV2A9BA

2M pixel camera, front camera

▼Audio
Qualcomm
▼Touch Screen Controller

▼MEMs

STMicroelectronics
Invensense
▼Video
Silicon Image
STMicroelectronics

OmniVision
Manufacturer

Device

Function

Broadcom

BCM4335

‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver

Skyworks

85302‐11

2.4 GHz, 256 QAM WLAN/Bluetooth® Front‐End Module

MDM9215M

Baseband processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory

WTR1605L

Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

TQM7M9023

Multi‐Mode, Multi‐Band Power Amplifier (MMPA) with Quad‐Band 
GMSK / EDGE and Dual‐Band WCDMA
•Quad‐band Linear GSM / EDGE
•UMTS B1 and B5/B8
•Input power controlled ‐ GMSK and 8PSK
•GSM LB has 3 modes ‐ HP, MP, LP
•GSM HB has 2 modes ‐ HP, LP
•WCDMA has 3 modes ‐ HP, MP, LP
•HBT / PHEMT / CuFlip™ PA Technology

A5508

UMTS amd GSM/EDGE Power amplifiers for UMTS Band 5 

A5020

Power amplifiers for LTE Band 20

A5007

Power amplifiers for LTE Band 7

SKY77764

Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ 
LTE – Bands III, IV, IX (1710 MHz–1785 MHz)

SKY77762

Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ 
LTE – Band II (1850‐1910 MHz)

PN544

NFC controller

▼Radio Frequency

Qualcomm

TriQuint

Avago

Skyworks

NXP Semiconductor
Smart Phone in 2013
Rear facing camera, 13MP

Galaxy S® 4 LTE
Synaptics

Fujitsu
MBG965H

Silicon
Image

ALS

S5000B

STM

MHL

5",1920*1080
AMOLED

Front facing camera, 2MP

SiI8240

I2C/SPI

HDMI

LSM330DLC

x32 LPDDR3
Yamaha

I2C/SPI

YAS532B

x32 LPDDR3

IR sensors

K3QF2F200E‐XGCE
16Gb LPDDR3
PoP Package

ATMEL
UC128L5

eMMC
Sensirion

SAMSUNG

Snapdragon 600

I2C

SHTC1

Toshiba
16/32/64GB 
eMMC

SDIO
Bosch

Broadcom 

I2C
UART

BMP182

BCM4335

Qualcomm
Audience

eS325A

Qualcomm
WCD9310

MDM9215M

SLIMBus
USB

Qualcomm
WTR1605L

SKYWORKS
SKY77737

SDIO

Qualcomm
PM8018

RFMD
RF7307

Broadcom
BCM20794

NFC

Qualcomm
PM8917

Qualcomm
PM8821

MAXIM
MAX77803
SnapDragon 800

MHL/SlimPort

MIPI‐CSI

MHL/SlimPort
Transmitter

ALS

Display

MIPI‐CSI

MSM8974
Touch
Screen
Controller

Gyroscope

HDMI

MIPI

I2C/SPI

LPDDR3
LPDDR3

I2C/SPI

Dual‐channel
LPDDR3
PoP Package

eCompass

eMMC
Humidity/
Temperature
sensor

I2C/SPI

eMMC

I/O Hub 
processor
SDIO

Accelerator

I2C/SPI

Rx/Tx BB

I2C/SPI
Barometer

Voice
Processor

Qualcomm
WCD9320

Qualcomm
WCN3660/
WCN3680

SDIO

SLIMbus

UART

Audio Codec

WiFi/BT
SoC

Option

Either One

USB

Qualcomm
Transceiver

Baseband
Processor

NFC
controller

Qualcomm
PM8921
PMIC

Qualcomm
PM8821
PMIC
Smart Phone in 2013
MIPI‐CSI

Model N9005

5.7”
1920x1080

Wacom
W9010

Silicon
Image
Sil8240B

MIPI‐CSI

ALS
Synaptics
S5050A

MIPI

HDMI
LPDDR3

InvenSense
MPU‐6500

Bosch

I2C
LPDDR3

SAMSUNG
K3QF7F70DM‐QGCE
3GB LPDDR3
PoP Package

I2C

e‐Compass

STMicro

eMMC

32F401B

Sensirion

SAMSUNG
KLMBG4GEAC‐B001

I2C

SHTC1

I2C

Audience
eS325

Qualcomm

Qualcomm
WCD9320

Maxim

PM8941

Barometer

MAX77804

SLIMbus
Qualcomm
PM8921

USB
RF Micro

ACPM‐7600

SDIO

Avago

RF1119

UART

Qualcomm
Avago
QFE1100 ACMD‐6207

Qualcomm

Broadcom

Broadcom

WTR1605L

BCM20794

BCM4339
Manufacture

Device

Function

Qualcomm

Qualcomm Snapdragon 800, MSM8974AB

. 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx
. Rel 10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE

SAMSUNG

K3QF7F70DM‐QGCE

Dual channel, 24Gb LPDDR3, PoP Package

KLMB4GEAC‐B0001

SAMSUNG 32GB eMMC

WTR1605L

Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

QFE1100

LTE Envelope Tracking IC

BCM4339

‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver

BCM20794

NFC controller

ACPM‐7600

Multi‐mode/Multi‐band power amplifier

ACMD‐6207

LTE Band VII FBAR duplxer

RF1119

Antenna control module

PM8941

PMIC for Qualcomm MSM8974AB

PM8921

PMIC for Qualcomm MSM8974AB

WCD9320

SLIMbus/I2S Audio codec; 6+ channel

▼Processor

▼Memory

▼Radio Frequency
Qualcomm

Broadcom

Avago

RF Micro
▼PMIC
Qualcomm

▼Audio
Qualcomm
Manufacture

Device

Function

Synaptics

S5050A

Touch screen controller

WACOM

W9010

Controller for SAMSUNG S Pen

MPU‐6050

3‐axis MEMS gyroscope and 3‐axis MEMS accelerometer, and a Digital Motion 
Processor. (DMP.) hardware accelerator engine

SHTC1

Humidity and temperature sensor

E5H

eCompass

Sil8240B

MHL 2.0 transmitter with HDMI input

IMX135

13MP, Main (rear) camera

S5K6B2YX03

1.2MP Sub (front) camera

MAX77804

Battery charger IC

32F401B

Sensor Hub MCU

CY8C20055 

Capsense button controller chip 

▼Touch Screen Controller

▼MEMs
Invensense
Sensirion
Bosch
▼Video
Silicon Image
SONY
SAMSUNG
▼Others
MAXIM
STMicroelectronics
Cypress 
MIPI‐CSI

China Mobile 
N9009

5.7”
1920x1080

Wacom
W9010

Silicon
Image
Sil8240B

MIPI‐CSI

ALS
Synaptics
S5050A

MIPI

HDMI
LPDDR3

Accelerometer
&
Gyroscope

e‐Compass

I2C

LPDDR3

SAMSUNG
KQF7F&0DM‐QGCE
3GB LPDDR3
PoP Package

I2C

STMicro

eMMC

32F401B

Toshiba
THGBM5G7A4JBA4W

Sensirion

I2C

SHTC1

I2C

Audience
eS325

Qualcomm
WCD9320

Qualcomm

Maxim

PM8941

Barometer

MAX77804

SLIMbus
Qualcomm
PM8921

USB

Spreadtrum
SC6500ES

UART

SDIO

Qualcomm

Broadcom

Broadcom

WTR1605L

BCM20794

BCM4339
nexus 5

Nexus 5.
Made for
what matters.
Introducing the new
5” phone from Google.
nexus 5

Qualcomm PM8941 PMIC
Texas Instruments BQ24192
Avago A5805
Qualcomm QFE1100 
Qualcomm SnapDragon 800, MSM8974, PoP Package
SK Hynix, H9CKNNNBPTMRLR, Dual‐channel, 16Gb LPDDR3

Qualcomm WCD9320 audio Codec 
Analogix AX7808 SlimPort transmitter
nexus 5

RFMD RF1119
Qualcomm PM8841 PMIC
AKM AK8963
Invensense MPU‐6515 

16GB/32GB storage
16GB: Sandisk SDIK8DE4‐16G
Qualcomm WTR1605L 
Avago RF1335
Broadcom BCM4339 WiFi/BT SoC
nexus 5

Broadcom 20793M NFC controller

Texas Instruments BQ51013B
nexus 5

SlimPort

4.95”

Analogix
ANX7808

ALS
Synaptics
S3350B

InvenSense
IDG‐2020

1920 x 1080

MIPI
LPDDR3

SK Hynix

LPDDR3

H9CKNNNBPTMRLR
16Gb LPDDR3
PoP Package

I2C

AKM
AK8963

InvenSense

I2C
eMMC

MPU‐6515

Sandisk
SDIN8DE4

16GB eMMC

Barometer

I2C
Texas
Qualcomm Instruments

PM8941

Qualcomm SLIMbus
WCD9320

Texas
Qualcomm Instruments

PM8921

USB
Qualcomm
QFE1100

UART

SDIO

AVAGO
RFI335

RFMD

AVAGO

6093

A5805

BQ24192

AVAGO

Qualcomm

Broadcom

Broadcom

ACPM‐7600

WTR1605L

BCM20793M

BCM4339

BQ51013B
nexus 5

Manufacture

Device

Function

Qualcomm Snapdragon 800, MSM8974

. 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx
. Rel 10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE

H9CKNNNBPTMRLR‐NTM

Dual channel, 16Gb LPDDR3, PoP Package

16/32GB eMMC

. 16GB/32GB eMMC
. 16GB : Sandisk SDIN8DE4

WTR1605L

Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

QDE1100

LTE Envelope Tracking IC

BCM4339

‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver

BCM20793M

NFC controller

Avago

ACPM‐7600

Multi Mode, Multi Band RF power amplifier

RFMD

RF1119

antenna control 

PM8941

PMIC for Qualcomm MSM8974

PM8921

PMIC for Qualcomm MSM8974

BQ24192

I2C controlled 4.5 A USB/adapter charger

BQ51013B

WPC 1.1 Compatible Fully Integrated Wireless Power Receiver

▼Processor
Qualcomm
▼Memory
SK Hynix
Main Storage
▼Radio Frequency
Qualcomm

Broadcom

▼PMIC
Qualcomm

Texas Instruments
nexus 5

Manufacture

Device

Function

WCD9320

SLIMbus/I2S Audio codec; 6+ channel

S3350B

Touch Screen controller

MPU‐6515

3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion 
Processor. (DMP.) hardware accelerator engine

IDG‐2020 

dual axis gyroscope for Optical Image Stabilization (OIS)

AK8963

3‐axis electronic compass

ANX7808

SlimPort transmitter

▼Audio
Qualcomm
▼Touch Screen Controller
Synaptics
▼MEMs
Invensense

AKM
▼Video
Analogix
Smart Phone in 2013
Rear facing camera,

5”
1920x1080, IPS
Front facing camera

ALS
MIPI

LPDDR3

Atmel

SAMSUNG
K3QF2F20DA‐QGCF

MXT540S

LPDDR3

16Gb LPDDR3
PoP Package

I2C

STMicro
LSM330

SanDisk

eMMC

SDIN8DE4‐16G
16GB eMMC

I2C

Compass

I2C

Barometer

I2C

Qualcomm
PM8941

Qualcomm

SLIMbus

WCD9320

Qualcomm
PM8841

USB

UART

Rx/Tx BB

Qualcomm
QFE1101

Qualcomm
WTR1625

Avago
ACPM‐7600

Oberthur Broadcom
256111

BCM20793M

Qualcomm SKYWorks
WCN3680

SKY85702
Manufacture

Device

Function

Qualcomm

Qualcomm Snapdragon 800, MSM8274AB

. 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx
. DC‐HSPA+, HSPA+, TDSCDMA, GSM/GPRS/EDGE

SAMSUNG

K3QF2F20DA‐QGCF

Dual‐channel LPDDR3, LPDDR3‐1866, 16Gb density, PoP Package

i‐NAND

eMMC; 16GB/32GB
16GB: SDIN8DE4‐16G

WCN3680

. Dual‐band 2.4 GHz and 5 GHz wireless local area network (WLAN) compliant   
with the IEEE 802.11 a/b/g/n/ac specification.
. Bluetooth® (BT) compliant with the Bluetooth specification version 4.0
(BR/EDR+BLE) and ANT+ Support.

SKY85702‐11

5 GHz WLAN Front‐End Module

WTR1625

Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

ACPM‐7600

Multimode, multiband power amplifier module 

BCM20793M

NFC controller

25611

Security chip for NFC

PM8941

PMIC for Qualcomm MSM8974

PM8841

PMIC for Qualcomm MSM8974

WCD9320

SLIMbus/I2S Audio codec; 6+ channel

▼Processor

▼Memory

SanDisk
▼Radio Frequency
Qualcomm

SKYWorks
Qualcomm
Avago
Broadcom
Oberthur
▼PMIC
Qualcomm

▼Audio
Qualcomm
Manufacture

Device

Function

Atmel

MXT540S

Touch screen controller

Unknown

Unknown

Electronic compass

Unknown

Unknown

Barometer

LSM330

3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion 
Processor. (DMP.) hardware accelerator engine

▼Touch Screen Controller

▼MEMs

STMicroelectronics
Smart Phone in 2013
MHL

MIPI‐CSI

MHL
Transmitter

ALS

Display

MIPI‐CSI

SAMSUNG Exynos 5410
Touch
Screen
Controller

MIPI
Gyroscope

HDMI

I2C/SPI

LPDDR3
LPDDR3

Dual‐channel
LPDDR3
PoP Package

I2C/SPI
eCompass

SDIO

Humidity/
Temperature
sensor

Accelerator

I2C/SPI

I/O Hub 
processor

eMMC

eMMC
MCP

I2C/SPI
Mobile 
DDR
I2C/SPI

Baseband
Processor

Barometer

Voice
Processor

Audio
Codec

Option

I2S

UART

USB

GNSS
Receiver

NFC
controller

SAMSUNG
S2MPS11
PMIC

SDIO

WiFi/BT
SoC

Baseband
Processor
Smart Phone in 2013
Galaxy S® 4 3G
 SAMSUNG S2MPS11 PMIC
 SAMSUNG Exynos

5 Octa

SAMSUNG K3QF2F200C‐XGCE

 SAMSUNG KMV3W000LM

 Intel X‐Gold 636



AKM AK8963



Atmel UC128L5



Audience eS325B

 Wolfson WM5012E
 Broadcom BCM4335
Galaxy S® 4 3G

 Broadcom BCM47521
 Broadcom BCM20794
 Silicon Image Sil8240

 Intel SMARTi

UE3 RF Transceiver

 Murata SWC GKF48

 Skyworks SKY77615

 MAXIM MAX77803
Galaxy S® 4 3G

MHL

ALS

Synaptics

AKM

Silicon
Image

Front‐facing camera:
2MP

SiI8240

S5000B

Gyro
Accel

Rear‐facing camera:
13MP

5",1920*1080
AMOLED

HDMI

I2C/SPI

LPDDR3
LPDDR3

I2C/SPI

SAMSUNG
K3QF2F200C‐XGCE
8Gb LPDDR3

PoP Package

AK8963

SAMSUNG
IR sensors

eMMC

ATMEL
UC128L5

Sensirion

KMV3W000LM
eMMC
+
Mobile DDR

Mobile
DDR

I 2C

SHTC1

Intel
Bosch

PMB5745 

X‐GOLD™ 636

IC

BMP182

Intel

PMB9820

2

SMARTi™ UE3

SDIO
Audience
eS325B

I 2S

Wolfson 

I 2S

UART

Broadcom
BCM4335

WM5102E

UART

Broadcom
BCM20794

Broadcom
BCM47521

USB

SDIO

I2C

SAMSUNG
S2MPS11

PMIC

NFC

GNSS

MAXIM
MAX77803
Galaxy S® 4 3G
Manufacturer

Part Number

Function

Exynos 5 Octa, Exynos 5410

‧1.8GHz
‧ARM big.LITTLE technology
‧Quad core CortexTM‐A15+Quad‐core CortexTM‐A7
‧Imagination PowerVR SGX544MP3
‧28nm manufacturing process

▼Processor
SAMSUNG

▼Memory
SAMSUNG

K3QF2F200C‐XGCE

‧16Gb LPDDR3‐1066
‧Dual Channel/32‐bit/QDP/PoP

KMV3W000LM

SAMSUNG eMMC Based MCP
. eMMC(16GB)+MDDR(64MB)

BCM4335

‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver

BCM20794

Near Field Communications (NFC) Controller Family

BCM47521

GNSS receiver, GPS, GLONASS, QZSS and SBAS

SKY85303‐11

2.4 GHz QAM WLAN/BT front end module.

XG636(Package Marking: PMB9820)

Baseband processor:
‧ ARM11™ architecture
‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second) 
in the downlink and category 7 (11.5 Mbit per second) in the uplink.
‧ EDGE multislot class 33

PMB5745(Package Marking: PMB5745)

SMARTi UE3 RF Transceiver 

SKY77615

Multimode Multiband Power Amplifier Module for GSM, EGPRS, EDGE, and 
WCDMA modes

▼Radio Frequency
Broadcom

Skyworks
Intel/Infineon

Skyworks
Galaxy S® 4 3G
Manufacturer

Part Number

Function

S2MPS11

PMIC for SAMSUNG Exynos 5 Octa

WM5012E

Audio Codec

eS325B

Voice processor

Synaptics

S5000B

Touch screen controller

STMicroelectronics

LSM330

3D accelerometer and 3D gyroscope

AKM8963

Electronic compass

Bosch Sensortec

BMP182

Barometer

SONY

IMX135

13 Mp, rear‐facing image sensor.

S5K6B2YX03

2 MP sensor, front sensor

SiI8240BO

HDMI‐to‐MHL™ Transmitter

SHTC1

Humidity and temperature sensor

MAX77803

Battery charger IC

▼PMIC
SAMSUNG
▼Audio
Wolfson Microelectronics
Audience
▼Touch Screen Controller

▼MEMs

AKM

▼Video

Samsung
Silicon Image
▼Others
Sensirion
MAXIM
Galaxy S® 4 China Unicom
MHL

MIPI‐CSI

MHL
Transmitter

ALS

Display

MIPI‐CSI

SAMSUNG Exynos 5420
Touch
Screen
Controller

MIPI
Gyroscope

HDMI

I2C/SPI

LPDDR3
LPDDR3

Dual‐channel
LPDDR3
PoP Package

I2C/SPI
eCompass

SDIO

Humidity/
Temperature
sensor

Accelerator

I2C/SPI

I/O Hub 
processor

eMMC

eMMC
MCP

I2C/SPI
Mobile 
DDR
I2C/SPI

Baseband
Processor

Barometer

Voice
Processor

Audio
Codec

Option

I2S

USB

GNSS
Receiver

NFC
controller

UART

SDIO

WiFi/BT
SoC

Baseband
Processor
Smart Phone in 2013
MIPI‐CSI

Model N9000

5.7”
1920x1080

Wacom
W9010

Silicon
Image
Sil8240B

MIPI‐CSI

ALS
Synaptics
S5050A

MIPI

HDMI
LPDDR3

InvenSense
MPU‐6500

AKM

I2C
LPDDR3

SAMSUNG
KQF7F&0DM‐HGCE
3GB LPDDR3
PoP Package

I2C

AK9911

eMMC

SAMSUNG
KMV2W000LM‐B506

STMicro
32F401B

Sensirion

I2C

SHTC1

Intel
PMB9820
Barometer

X‐GOLD™ 636

I2C

YAMAHA
Y831

Intel
PMB5745
SMARTi™ UE3

Maxim

I2S

MAX77804

UART

UART

Broadcom

Broadcom

BCM20794

BCM47521

USB

UART

SDIO

Broadcom
BCM4339
Manufacture

Device

Function

Exynos 5 Octa, Exynos 5420

‧1.9GHz
‧ARM big.LITTLE technology
Quad core CortexTM‐A15 + Quad‐core CortexTM‐A7
‧ARM Mali‐T628 GPU
‧28nm manufacturing process

▼Processor
SAMSUNG

▼Memory
SAMSUNG

K3QF7F70DM‐HGCE

Dual channel, 24Gb LPDDR3, PoP Package
(Customized PoP package for Exynos 5420, not standard package)

KMV2W000LM‐B506

SAMSUNG eMMC MCP(eMMC+LPDDR)

▼Radio Frequency
Intel

X‐Gold 636(Package Marking: PMB9820)

PMB5745(Package Marking: PMB5745)

Baseband processor:
‧ ARM11™ architecture
‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per 
second) 
in the downlink and category 7 (11.5 Mbit per second) in the uplink.
‧ EDGE multislot class 33
SMARTi UE3 RF Transceiver 

BCM4339

‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.0
‧FM Receiver

BCM47521

GNSS receiver

BCM47521

NFC controller

RF1119

Antenna control module

Not necessary

Not necessary

Y831

Audio Codec

Broadcom

NXP
RF Micro
▼PMIC
Not necessary
▼Audio
Yamaha
Manufacture

Device

Function

Synaptics

S5050A

Touch screen controller

WACOM

W9010

Controller for SAMSUNG S Pen

MPU‐6050

3‐axis MEMS gyroscope and 3‐axis MEMS accelerometer, and a Digital Motion 
Processor. (DMP.) hardware accelerator engine

SHTC1

Humidity and temperature sensor

AK9911

eCompass

Sil8240B

MHL 2.0 transmitter with HDMI input

IMX135

13MP, Main (rear) camera

S5K6B2YX03

1.2MP Sub (front) camera

MAX77804

Battery charger IC

32F401B

Sensor Hub MCU

CY8C20236A

Capsense button controller chip 

▼Touch Screen Controller

▼MEMs
Invensense
Sensirion
AKM
▼Video
Silicon Image
SONY
SAMSUNG
▼Others
MAXIM
STMicroelectronics
Cypress 
Smart Phone in 2013
Touch
Screen
Controller

Gyro/
Accel

MIPI‐CSI

ALS

Display

MIPI‐CSI

MIPI

LPDDR3

I2C/SPI

LPDDR3
Barometer

Dual‐channel
LPDDR3

I2C/SPI
eMMC

eCompass

eMMC

I2C/SPI

Audio
Codec

Baseband
Processor

SDIO

I2S

I2S

I2C

Texas
Instruments
TPS65913
PMIC

UART

NFC
Controller

UART

GNSS
Receiver

USB

UART

SDIO

WiFi/BT
SoC
Smart Phone in 2013
Rear facing camera,

5”
1920x1080, IPS

Front facing camera

ALS

MIPI

LPDDR3

Atmel
MXT540S

LPDDR3
InvenSense

SK Hynix
H9CCNNNBPTML
16Gb LPDDR3

I2C

MPU‐6050

eMMC

I2C

SanDisk
SDIN8DE4‐16G
16GB eMMC

Compass

I2C
Barometer

I2C
Cirrus Logic

TPS65913
PMIC

I2S

CS42L73

USB
RF Micro
RF9812

UART

SDIO

SPRD
SR3500

Micron
2ZC27
D9LQQ

Texas
Instruments

SPREADTRUM
SC8803G5

Oberthur
211808

Broadcom
BCM43341
Manufacture

Device

Function

nVidia

NVIDIA® Tegra® 4

Quad core ARM CortexTM‐A15; nVidia 72‐cores GPU

SK Hynix

H9CCNNNBPTML

Dual‐channel LPDDR3, LPDDR3‐1866, 16Gb density

SanDisk

16/64GB eMMC

eMMC 4.5; 16GB/64GB; 16GB: SanDisk SDIN8DE4‐16G

Micron

MT46H32M16LFBF‐5

512Mb LPDDR, for Spreadtrum basseband processor

SC8803G

TD‐SCDMA, EDGE, GPRS and GSM operation and supports TD‐HSDPA at 
2.8Mbps and TD‐HSUPA at 2.2Mbps

SR3500

FDD/TDD/LTE‐A, TD‐SCDMA, WCDMA HSPA+, GSM/EDGE (HEDGE) single‐chip 
radio transceivers, with support for quad‐band TD‐LTE, tri‐band FDD‐LTE, dual‐
band TD‐SCDMA, penta‐band WCMDA and quad‐band GSM

BCM43341

‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity 
‧ Bluetooth Version 4.0
‧ FM radio receiver 
‧ BCM2079X NFC controller

RF9812

QUAD‐BAND GPRS/LINEAR EDGE +3.2V, TD‐SCDMA MULTI‐MODE TRANSMIT 
MODULE

211808

Security chip for NFC

▼Processor

▼Memory

▼Radio Frequency
Spreadtrum

Broadcom 

RF Micro Devices
Oberthur
Manufacture

Device

Function

TPS65913

PMIC for NVIDIA® Tegra® 4

CS42L73

Audio codec

Atmel

MXT540S

Touch screen controller

Unknown

Unknown

Electronic compass

Unknown

Unknown

Barometer

MPU‐6050

3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion 
Processor. (DMP.) hardware accelerator engine

MAX77665A

Power Management

▼PMIC
Texas Instruments
▼Audio
Cirrus Logic
▼Touch Screen Controller

▼MEMs

Invensense
▼Others
MAXIM
Smart Phone in 2013
338S1216‐A2
PMIC
338S1201
Audio Codec

338S1202
Class‐D Amplifier
Touch
Screen
Controller

iSight Front camera

Display
ALS

FaceTime camera

I2C/SPI
Gyroscope

MIPI
LPDDR3
I2C/SPI

eCompass

LPDDR3

Accelerator

I2C/SPI

Dual‐channel
LPDDR3

NXP 
LPC18A1
NAND 
Flash

16/32/64GB
NAND Flash

NXP
6416A

338S1216‐A2
PMIC
338S1202
Class‐D Amplifier

338S1201
Audio Codec

UART

Qualcomm
Transceiver

Qualcomm
MDM Modem

Qualcomm
PMIC

NXP
1610A1

Lightning

SDIO

WiFi/BT
SoC
Broadcom
Smart Phone in 2013
Model A1533

Model A1530

PCB Photo Source: Techinsights & iFixit
PCB Photo Source: Techinsights & iFixit

Model A1533

Model A1530

Skyworks
SKY77355
AVAGO
A7900720

TriQuint
TQM6M6224

Skyworks
SKY77810

AVAGO
A7900

Different model (different 
band support) has different 
PA design.


Texas Instruments 36ATLC1 65730A0P; unknown function

 WiFi


module from Murata. Broadcom BCM4334 WiFi/BT SoC

Texas Instruments 37CCVHI 343S0645

 Broadcom BCM5976A0KUB2G
 Bosch Sensortech BMA220 3‐axis accelerometer
 SK Hynix

E2NAND 3.0

 STM 3‐axis gyroscope



Apple 338S1216‐A2 PMIC (Dialog Semiconductor)



Apple 338S1201 audio codec (Cirrus Logic)



Apple 338S1202 Class D audio amplifier (Cirrus Logic)

NXP 1610A1, unknown function
 Qualcomm PM8018, PMIC for MDM9615M



PA chips for Model A1533

PCB Photo Source: Techinsights, iPhone 5S Model A1533


AKM AK8963 compass



Apple M7 coprocessor, NXP LPC1800 series micro processor



Apple A7 application Processor, PoP package

 ElpidaF8164A1PD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb, PoP

package

 Qualcomm MDM9615M baseband processor

 Qualcomm WTR1605L transceiver

PCB Photo Source: Techinsights, iPhone 5S Model A1533
Touch Screen
Texas
Instruments
37CCVHI
343S0645

Broadcom
BCM5976

Rear facing camera,

4.0”
1366x640
ALS
MIPI

I2C

STM

Front facing camera

LPDDR3

Gyroscope

Elpida
AKM

I2C/SPI

AK8963

Bosch

LPDDR3

NXP

F8164A1PD‐GD‐F
8Gb LPDDR3, PoP

LPC18A1
NAND 
Flash

Apple M7

I2C/SPI

BMP220

16/32/64GB
NAND Flash

Apple
Apple

Apple

338S1202

338S1216‐A2
PMIC

338S1201
Audio Codec

Class D AMP

NXP
6416A

UART

NXP
PA 
chips

Qualcomm
WTR1605L

Qualcomm
PM8018

PA chips are model dependent

Qualcomm

1610A1

MDM9615M
Lightning

SDIO

Broadcom
BCM4334
Manufacturer

Device

Function

Apple A7 Microprocessor
(Apple APL0698)

‧Dual‐core, ARMv8 architecture, 1.3GHz
‧Imagination PowerVR 6 series GPU
‧Manufactured by SAMSUNG 28nm HKMG process
‧PoP package

NXP LPC18A1
(Apple M7 Processor)

‧NXP LPC1800 series micro processor
‧ARM Cortex‐M3 

F8164A1PD‐GD‐F

‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600
‧PoP package

▼Processor
Apple

NXP
▼Memory
Elpida
Storage

ECC free NAND Flash

Murata

339S00205
(BRCM BCM4334 SDIO WiFi/ High 
Speed UART BT SoC)

‧16GB/32GB/64GB
‧Supplier: SK Hynix E2NAND 3.0

▼Radio Frequency

Qualcomm

Broadcom BCM4334
‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity 
‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY 
layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps 
‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density
parity check) options for improved range and power efficiency 
‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for
supporting future specifications 
‧ Bluetooth Class 1 transmitter operation

MDM9615M

Baseband Processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory

WTR1605L

Multi‐band plus 700/1500/2600/B41 GPS+Glonass
Manufacturer

Device

Function

Apple 338S1216 (Dialog D2045)

PMIC for Apple A7 Processor

PM8018

PMIC for Qualcomm MDM9615M baseband processor

Apple 338S1201(Cirrus Logic)

Audio Codec

Apple 338S1202 (Cirrus Logic)

Low Power Class‐D Audio Amplifiers

37CCVHI 343S0645

Line Driver

BCM5976A0KUB2G 

Touch Screen Controller

Package markings B329

MEMS motion sensor: three‐axis digital output gyroscope

BMA220

Ultra small triaxial, low‐g acceleration sensor with digital interfaces

AK8963

Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output

Exmor‐RS sensor

Front Camera, 8 Mp CMOS Image Sensor

36ATLC1 65730A0P

Unknown function

1610A1

Unknown function

6416A

Unknown function

▼PMIC
Apple
Qualcomm
▼Audio
Apple

▼Touch Screen Controller
Texas Instruments
Broadcom
▼MEMs
STMicroelectronics
Bosch Sensortech
AKM
▼Camera
SONY
▼Others
Texas Instruments
NXP
338S1164‐B2
PMIC

338S1116
Audio Codec

338S1202
Class‐D Amplifier
Touch
Screen
Controller

iSight Front camera

Display
ALS

FaceTime camera

MIPI
LPDDR2
Gyroscope

I2C/SPI
LPDDR2

eCompass

Accelerator

Dual‐channel
LPDDR2
PoP Package

I2C/SPI
NAND 
Flash
I2C/SPI

16/32/64GB
NAND Flash

338S1164‐B2
PMIC
338S1202
Class‐D Amplifier

338S1116
Audio Codec

UART

Qualcomm
Transceiver

Qualcomm
MDM Modem

Qualcomm
PMIC

NXP
1610A1

Lightning

WiFi/BT
SoC

SDIO
Smart Phone in 2013
Model A1532

Model A1529

PCB Photo Source: Techinsights & iFixit
Skyworks
SKY77810

Model A1532

AVAGO
A792503

Skyworks
SKY77572

PCB Photo Source: Techinsights & iFixit

RF Micro
RF3763

Skyworks
SKY77496

Model A1529

AVAGO
A7900720

TriQuint
TQF6414

TriQuint
TQM6M6224

Skyworks
SKY77355

Skyworks
SKY77810

AVAGO
A7900

Different model (different 
band support) has different 
PA design.


Texas Instruments 36ATLC1 65730A0P; unknown function

 WiFi


module from USI/Murata. Broadcom BCM4334 WiFi/BT SoC

Texas Instruments 37CCVHI 343S0645

 Broadcom BCM5976A0KUB2G
 Bosch Sensortech BMA220 3‐axis accelerometer
 STM 3‐axis gyroscope
 SK Hynix

E2NAND 3.0



Apple 338S1164 PMIC (Dialog Semiconductor)



Apple 338S1116 audio codec (Cirrus Logic)



Apple 338S1201 Class D audio amplifier (Cirrus Logic)

NXP 1610A1, unknown function
 Qualcomm PM8018, PMIC for MDM9615M



PA chips for Model A1532

PCB Photo Source: Techinsights, iPhone 5S Model A1532


AKM AK8963 compass

There is no NXP LPC1800 series microprocessor



Apple A6 application Processor, PoP package

 Elpida/SK Hynix

, Dual‐channel, LPDDR2‐1066, 8Gb, PoP package

 Qualcomm MDM9615M baseband processor

 Qualcomm WTR1605L transceiver

PCB Photo Source: Techinsights, iPhone 5S Model A1532
Touch Screen
Broadcom
BCM5976

Texas
Instruments
37CCVHI
343S0645

Rear facing camera,

4.0”
1366x640
ALS

Front facing camera

MIPI
LPDDR2
I2C

STM
Gyroscope

AKM

LPDDR2

8Gb LPDDR2, PoP

NAND 
Flash

Toshiba/
SK Hynix

I2C/SPI

AK8963

Bosch

Elpida/
SK Hynix

16/32GB
NAND Flash

I2C/SPI

BMP220

Apple
338S1164
PMIC

Apple

Apple

338S1201

338S1116
Audio Codec

Class D AMP

UART

NXP
PA 
chips

Qualcomm
WTR1605L

Qualcomm
PM8018

PA chips are model dependent

Qualcomm

1610A1

MDM9615M
Lightning

SDIO

Broadcom
BCM4334
Manufacturer

Device

Function

Apple A6 Microprocessor

‧1.26GHz, ARMv7, Dual‐core
‧Imagination PowerVR SGX 543MP3
‧SAMSUNG 32nm HKMG process

▼Processor
Apple

▼Memory
System Memory
8Gb LPDDR2‐1066

Storage

‧32‐bit, Dual‐channel, 8Gb, LPDDR2‐1066
‧Supplier: 
Elpida: B8164B3PM‐1D‐F
SK Hynix: H9TKNNN8KDMRBR

NAND Flash

‧16GB/32GB
‧Supplier: SK Hynix/Toshiba

Murata: 339S0209
USI: 339S0204
(BRCM BCM4334 SDIO WiFi/ High 
Speed UART BT SoC)

Broadcom BCM4334
‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity 
‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY 
layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps 
Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density
‧
parity check) options for improved range and power efficiency 
Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for
‧
supporting future specifications 
Bluetooth Class 1 transmitter operation
‧

MDM9615M

Baseband Processor
‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)
‧Rel 9 DCHSPA+(42/5.76Mbps)
‧TD‐SCDMA(4.2/2.2Mbps)
‧QICE
‧Integrated Memory

WTR1605L

Multi‐band plus 700/1500/2600/B41 GPS+Glonass

▼Radio Frequency
Murata/USI

Qualcomm
Manufacturer

Device

Function

Apple 338S1164
(Dialog Semiconductor D2013 )

PMIC for Apple A6 Processor

PM8018

PMIC for Qualcomm MDM9615M baseband processor

Apple 338S1116
(Cirrus Logic CLI1588B1 42L65)

Audio Codec

Apple 338S1202 (Cirrus Logic)

Low Power Class‐D Audio Amplifiers

37CCVHI 343S0645

Line Driver

BCM5976A0KUB2G 

Touch Screen Controller

Package markings B329

MEMS motion sensor: three‐axis digital output gyroscope

BMA220

Ultra small triaxial, low‐g acceleration sensor with digital interfaces

AK8963

Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital output

Unknown

Front Camera, 8 Mp CMOS Image Sensor

36ATLC1 65730A0P

Unknown function

1610A1

Unknown function

▼PMIC
Apple
Qualcomm
▼Audio
Apple

▼Touch Screen Controller
Texas Instruments
Broadcom
▼MEMs
STMicroelectronics
Bosch Sensortech
AKM
▼Camera
SONY
▼Others
Texas Instruments
NXP

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