6. Skyworks
STMicroelectronics
LSM6DS3
Broadcom BCM43342
WiFi/BT SoC
AMS AS3923
NFC booster chip
S y o s
WiFI LNA +Switch and
PA
3D digital gyroscope/
accelerometer
/
NXP 65V10(PN548)
NFC controller
Apple APL0778 processor
Dialog D2238A
(Apple 338S00046)
TI/NS LM3637
LED Backlight driver
Apple APL0778 processor
Elpida 4Gb system memory
Toshiba 8GB NAND flash
M i t
PMIC
ADI AD7149
Capacitance to digital
converter
Main storage
MAXIM MAX98730
NXP
Interface chip
MAXIM STMicroelectronics
IDT P9022
Wireless charger
MAXIM
Audio Codec
MAXIM
U k
STM32 MCU
Unknown MAXIM
Audio amplifier
7. 272x340
or
312x390
ADI
AD7166
4Gb
S t
ADI
AD7149
TAOS
ALS
8GB
NAND Fl h
System
Memory
Elpida
6‐axis
MEMs
ST32
MCU
I2C
APL0778
Processor
NAND Flash
Toshiba/SanDisk
TAPTIC
ENGINE
338S00046
PMIC
SDIO UART
P9022
Audio Audio
Broadcom
BCM43342
Codec AMP
AMS
AS3923
NXP
PN548
4BI SLZ
ALGJ
+MAX T
9873OEWJ
9 447 BP
+AAA
432
TI4BC56LI
OPA2376
8. Manufacturer Device Function
▼Processor
Apple Apple APL0778 Microprocessor
‧ Main processor
‧SAMSUNG 28nm LP process
‧ARM v7a architecture
‧Imagination PowerVR SGX543 GPU‧Imagination PowerVR SGX543 GPU
‧PoP package
▼Memory
Micron/Elpida
N/A
‧4Gb system memory
‧PoP package(die)p g ( )
Toshiba
N/A ‧8GB NAND Flash
‧Main storage
▼Radio Frequency
BCM43342MKWBG ‧802 11 a/b/g/n Wi‐Fi
Broadcom
BCM43342MKWBG 802.11 a/b/g/n Wi Fi
‧Bluetooth 4.0
Skyworks Unknown WiFi LNA + Switch
Unknown WiFI PA
NXP 65V10(PN548) NFC controllerNXP 65V10(PN548) NFC controller
AMS AS3923 NFC booster
▼MEMs
STMicroelectronics LSM6DS3 6‐Axis accelerometer and gyroscope
▼PMIC
Apple
Apple 338S00046
(Dialog D2238A)
PMIC for Apple APL0778 Processor
IDT P9022 Enhanced WPC 1.1 Wireless Power Receiver
▼Audio
MAXIM Unknown Audio Codec
Unknown Audio Amplifiers
9. Manufacturer Device Function
▼Touch Screen Controller
ADI AD7166‐202ACBZ ARM Cortex M3‐based Cap Touch
AD7149‐1ACBZ Capacitance to digital converter
▼O h▼Others
Texas Instruments OPA2376 Low‐Noise, Low Quiescent Current, Precision Operational Amplifier
TPS6125X TPS6125x 3.5‐MHz High Efficiency Step‐Up Converter In Chip Scale Packaging
MAXIM MAX2240 2.5GHz, +20dBm Power Amplifier
MAX98730EWJ Unknown
NXP Unknown Interface chip
National Semiconductor LM3637 LED backlight driver
STMi l i U k MCUSTMicroelectronics Unknown MCU
Unknown Optical encoder/sensor for digital crown
12. APL1022/APL0898APL1022/APL0898
‐ TSMC 16nm FinFET/SAMSUNG 14nm FinFET process
‐ Apple 3rd generation ARM v8a architectureApple 3 generation ARM v8a architecture
‐ M9 motion coprocessor integrated
‐ Imagination PowerVR Series 7 GPU
‐ 4‐channel 16‐bits LPDDR4
‐ MIPI‐DSI/MIPI‐CSI
CI I2C UA US
M9
‐ PCIe, I2C, UART, USB
‐ Fingerprint sensor controller
‐ Apple customized PoP packageApple customized PoP package
21. iPhone 6S Plus A1687
SKYWORKS RF1347
Apple A9 processor, Apple customized PoP package
h l b b d / /4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix
InvenSense EMS‐A
In the iPhone 6s, there is Bosch BMA280 here.
But, in the iPhone 6s Plus, there is no chip here but “PCB pad only”
Qualcomm MDM9635MQ
SKYWORKS SKY77812‐19
Qualcomm QFE1100
TriQuint TQF6405
Avago AFEM‐8030
22. iPhone 6S Plus A1687
USI 339S000043 WiFi/BT M d l
Skyworks SKY13701
ALPS HSCDTD007
USI 339S000043 WiFi/BT Module
Texas Instruments 57A6CVI 3539
NXP 66V10
Apple 338S00122‐A1
Apple 338S00105
Texas Instruments 57A6CVI 3539
Main storage, 16GB/64GB/128GB
SK Hynix : H230DG8UD1ACS 16GB
Bosch BMP280
SKYWORKS SKY77357‐8
SK Hynix : H230DG8UD1ACS, 16GB
Apple 338S1285
Qualcomm PMD9635
NXP1610A3
Qualcomm WTR3925
Murata 240 Front‐End Module
Af G54/Murata(?), RF Front‐End Module
Texas Instruments 57A5KXI
Af G54/Murata(?), RF Front End Module
Apple 338S1285
RFMD RF5150
23. Rear facing camera
5 5”
Front facing camera
ALS
5.5
1920x1080343S00014
LPDDR4
LPDDR4 4‐channel
16‐bit
16Gb LPDDR4
LPDDR4
TAPTIC
ENGINE
16Gb LPDDR4
16/64/128GB
NVMe SSD
LPDDR4
Invensense
EMS‐A
I2C
338S00122‐A1
I2C/SPI
I2C/SPI
ALPS
HSCDTD007
Bosch
BMP280
PMIC
M9M9
338S00105
Audio Codec
338S1285
Audio AMP
PCIeUARTPCIe
USIQualcomm
MDM9635M
Qualcomm
WTR3925
PA
Chips NXPNXP
66V10
Audio Codec
PA chips is model
dependent Lightning
339S00043
Qualcomm
QFE1100
MDM9635MWTR3925
Qualcomm
PMD9635
p
CBTL1610A366V10
24. Manufacturer Device Function
▼Processor
Apple
Apple A9 Microprocessor
(APL0898 & APL1022)
‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process
‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz
‧Imagination PowerVR 7 series GPU
‧A l t i d P P k‧Apple customized PoP package
▼Memory
Micron
SAMSUNG
SK Hynix
D9SND (MT53B256M64D2NL)
K3RG1G10BM‐BGCH
H9HKNNNBTUMUMR‐NLH
‧16‐bit, Quad‐channel, 16Gb LPDDR4
‧Apple customized PoP package
SK Hynix H9HKNNNBTUMUMR NLH
SK Hynix
Toshiba
‧NAND Flash‐based storage
‧Apple customized package
‧16GB/64GB/128GB
16GB: SK Hynix H230DG8UD1ACS
Toshiba THGBX5G7D2KLFXG
▼PMIC
Apple Apple 338S00120‐A1 PMIC for Apple A9 Processor (iPhone 6s)
Apple 338S00122‐A1 PMIC for Apple A9 Processor (iPhone 6s Plus)
Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor
▼Audio
Apple Apple 338S00105 Audio Codec
Apple 338S1285 Audio AMP
▼T h S C t ll▼Touch Screen Controller
Apple 343S00014 Touch screen controller for 3D Touch
▼Others
Texas Instruments 65730AOP Power management IC
57A6CVI 3539 LED backlight Retina display driver
57A5KXI Charger IC
NXP 1610A3 USB charging
25. Manufacturer Device Function
▼Sensors
InvenSense MPU‐6700(MP67B) (iPhone 6s) 6‐Axis Gyro and Accelerometer
Bosch Sensortech EMS‐A (iPhone 6s Plus) 6‐Axis Gyro and Accelerometer
A280(3 LA) (i h 6 ) 3 A i A lBMA280(3P 7LA) (iPhone 6s) 3‐Axis Accelerometer
BMP280 Barometer
ALPS HSCDTD007 Electronic Compass
AMS TSL2586 ALS
▼Radio Frequency
USI 339S000043 ‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.2
NXP 66V10 (PN66V?) NFC controller( )
Qualcomm MDM9635M baseband processor Baseband Processor:
‧20nm process
‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP
‧Rel 9 LTE Cat 6
‧DC‐HSPA
‧TD‐SCDMA
‧EVDO Rev. B, CDMA 1X
‧GSM
‧QICE, Envelope Tracking
‧Integrated Memory
WTR3925 ‧28nm process
‧ GSM/CDMA/W‐CDMA/LTE Transceiver
QFE1100 Envelope Power Tracker
26. Manufacturer Device Function
iPhone 6s Model A1688
Skyworks SKY77812‐19 Power Amplifier Module
SKY77357‐8 Power Amplifier Module
A AFEM 8030 P A lifi M d lAvago AFEM‐8030 Power Amplifier Module
RFMD RF5150 Antenna Switch
RF1347 Antenna Switch Module
TriQuint TQF6405 Power Amplifier Module
Murata 240 Front End module
Murata(?) Ne G98 RF Front End module
Rd G54 RF Front End module
iPh 6 Pl M d liPhone 6s Plus Model
A1687
Skyworks SKY77812‐19 Power Amplifier Module
SKY77357‐8 Power Amplifier Module
SKY13701‐17 WLAN front end module
Avago AFEM‐8030 Power Amplifier Module
RFMD RF5150 Antenna Switch
TriQuint TQF6405 Power Amplifier Module
Murata 240 Front End module
Murata(?) Af G54 RF Front End module
27. ▼Processor
Application Processor
‧Dual‐core
‧Apple 3rd generation ARM v8a architecture
‧Imagination PowerVR Series 7 GPUImagination PowerVR Series 7 GPU
‧SAMSUNG 14nm FinFET process
TSMC 16nm FinFET process
‧Apple M9 motion coprocessor
M9
Apple M9 Coprocessor
‧ Integrated in the Apple A9 processor
▼Memory
System Memory
‧ Quad‐Channel 16‐bits LPDDR4 controller
‧ 16Gb density LPDDR4
‧ Apple customized PoP package
System Storage
‧Apple NVMe controller inside Apple A9
‧16GB/64GB/128GB capacity NAND Flash
35. iPad Pro
Manufacturer Device Function
▼Others
Texas Instruments TPS65144 LCD Bias with Integrated Gamma
NXP CBTL1610A3 USB charging
L C11U3 C M0 i llLPC11U37 Cortex‐M0 microcontroller
NVT8416A1 Unknown
Parade DP695 LCD timing controller
Fresco Logic FL1100SX PCIe‐to‐USB 3.0 controller
Fairchild Semiconductor FDMC 6683 DC/DC Converter
FXMA2012 Translator
STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
36. iPad Pro
Manufacturer Device Function
▼Radio Frequency
USI 339S000045
(Boradcom BCM4350)
‧802.11 ac/a/b/g/n Wi‐Fi
‧Bluetooth 4.2
NXP 65V10 NFC controller
For Wi‐Fi + Cellular model
Qualcomm MDM9625M baseband processor Baseband Processor:
‧Rel 9 LTE Cat 4(150Mbps)
‧Rel 10 LTE‐FDD CA
‧Rel 10 3C HSDPA+ 63Mbps
‧DC HSUPA
‧TD‐SCDMA
‧DOrBDOrB
‧QICE, Envelope Tracking
‧Integrated Memory
WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver
WFR1620 GSM/CDMA/W‐CDMA/LTE ReceiverWFR1620 GSM/CDMA/W CDMA/LTE Receiver
QFE1100 Envelope Power Tracker
Avago A8020 Power Amplifier Module
TriQuint TQF6410 Power Amplifier Module
TQF6430 Power Amplifier Module
RFMD RF5159 Antenna Switch Module
RF5145 Antenna Switch
RF5147A Antenna SwitchRF5147A Antenna Switch
37. iPad Pro
ST Microelectronics AS5C Y533
ST Microelectronics STML151UCY6, ARM Cortex‐M3 MCU
L05286 QS4 VG Z SGP 528
EWX 01129
(STMicroelectronics STM32L052x6)
Bosch Sensortec BMA280
Cambridge Silicon Radio (Qualcomm)CSR1012A05
Bosch Sensortec BMA280
8529043 343S00008‐A1(Customized part for Apple?)
38. iPad Pro
Manufacturer Device Function
▼Apple Pencil
ST Microelectronics STML151UCy6 ARM Cortex‐M3 MCU
AS5C Y533 unknown
h S h 280 3 A i A lBosch Sensortech BMA280 3‐Axis Accelerometer
Qualcomm/CSR CSR1012A05 Bluetooth Smart chip
STMicroelectronics
L05286 QS4 VG Z SGP 528
(STM32L052x6)
Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
Unknown(MAXIM?) EWX 01129 unknown
Unknown
(Customized for Apple?)
8529043 343S00008‐A1
unknown
▼Smart Keyboard
ST Microelectronics STM32F103VB 72MHz ARM Cortex‐M3 MCU
51. iPad mini 4
iPad mini 4iPad mini 4
Mighty. Small.
There’s more to mini than meets the eye. The new iPad mini 4 putsThere s more to mini than meets the eye. The new iPad mini 4 puts
uncompromising performance and potential in your hand. It’s thinner and
lighter than ever before, yet powerful enough to help you take your ideas
even further.
52. iPad mini 4
Apple A8 Processor
AKM AK8963
This area is used for WWAN function
in Wi‐Fi + Cellular model,
1. Qualcomm MDM9625M
2. Qualcomm PM8019
3. Qualcomm WTR1625L
4. Qualcomm WFR1620
h
NAND Flash‐based storage, 16GB/64GB/128GB capacity
5. PA chips:
TriQuint, Avago, RF Micro, SKYWORKS
NXP 65V10 NFC Controller
NXP LPC18B1UK, Apple M8 motion coprocessor
Apple 338S1213 audio codec
Bosch Sensortec BMP280, Barometer
Bosch Sensortec BMA280, Accelerometer
Unknown part number,
PMIC for Apple A8 processor Dialog Semiconductor
Unknown part number,
Maxim Integrated MAX98721BEWV
NXP CBTL1610(1610A1)
PMIC for Apple A8 processor, Dialog Semiconductor
Broadcom BCM5976
Texas Instruments 51ACK0I 343S0583
USI 339S00045 WiFi/BT module
Apple A8 Processor, Dual‐Channel LPDDR3, 16Gb LPDDR3, SK Hynix
64. Manufacturer Device Function
▼Processor
Apple
Apple A8 Microprocessor
(Apple APL1011)
‧20nm process
‧Dual‐core, ARMv8 architecture, 1.4GHz
‧Imagination PowerVR 6 series GPU
‧A l t i d P P k‧Apple customized PoP package
▼Memory
SK Hynix
H9CKNNN8KTMRWR‐NTH
‧32‐bit, Dual‐channel, 16Gb LPDDR3
‧Apple customized PoP package
SK Hynix
H2JTEG8VD1BMR ‧Main storage
‧32GB/64GB
‧32GB: SK Hynix H2JTEG8VD1BMR
▼PMIC
Apple Apple 338S00057 AZ PMIC for Apple A8 Processor(?)Apple Apple 338S00057‐AZ PMIC for Apple A8 Processor(?)
▼Communication
Universal Scientific Industrial 339S00045 WiFi/BT module
SMSC LAN9730 USB 2.0 10/100 Ethernet controller
▼Display
MegaChips DP2700A1 DP‐to‐HDMI
▼Others
Texas Instruments TPS6213x 3V 17V 3A Step Down ConverterTexas Instruments TPS6213x 3V‐17V 3A Step‐Down Converter
Fairchild Semiconductor DF25AU 010D 030D
NXP 1112 0206 5271B4K Unknown
Unknown V301 F 57K C6XF G4 Unknown